JP2015005687A - 樹脂パッケージとこの樹脂パッケージを用いた電子機器 - Google Patents
樹脂パッケージとこの樹脂パッケージを用いた電子機器 Download PDFInfo
- Publication number
- JP2015005687A JP2015005687A JP2013131368A JP2013131368A JP2015005687A JP 2015005687 A JP2015005687 A JP 2015005687A JP 2013131368 A JP2013131368 A JP 2013131368A JP 2013131368 A JP2013131368 A JP 2013131368A JP 2015005687 A JP2015005687 A JP 2015005687A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal plate
- external terminal
- resin package
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
以下、実施の形態1における樹脂パッケージについて図面を参照しながら説明する。実施の形態1における樹脂パッケージは、図1に示すごとく、金属板11と、この金属板11に組み合わされた樹脂からなる枠体12と、枠体12の側部に設けられ、且つ金属板11と電気的に接続された外部端子11Aと、を備えている。外部端子11Aの第1の側面を第1の樹脂部15Aが覆い、外部端子11Aの第2の側面を第2の樹脂部15Bが覆っている。
12 枠体
11A 外部端子
15A 第1の樹脂部
15B 第2の樹脂部
23 電子部品
Claims (4)
- 金属板と、
前記金属板に組み合わされた樹脂からなる枠体と、
前記枠体の側部に設けられ前記金属板と電気的に接続された外部端子と、を備え
前記外部端子の第1の側面を第1の樹脂部が覆い、
前記外部端子の第2の側面を第2の樹脂部が覆う、
樹脂パッケージ。 - 前記外部端子は、
前記枠体から露出した前記金属板の一部により構成した
請求項1に記載の樹脂パッケージ。 - 前記第1の樹脂部と前記第2の樹脂部が
前記枠体と一体と成っている
請求項1に記載の樹脂パッケージ。 - 金属板と、
前記金属板に組み合わされた樹脂からなる枠体と、を備え、
前記枠体から前記金属板の一部が露出して外部端子を構成し、
前記外部端子の第1の側面を第1の樹脂部が覆い、
前記外部端子の第2の側面を第2の樹脂部が覆い、
前記枠体内に配置された前記金属板に電気的に接続された電子部品を有する
電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013131368A JP2015005687A (ja) | 2013-06-24 | 2013-06-24 | 樹脂パッケージとこの樹脂パッケージを用いた電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013131368A JP2015005687A (ja) | 2013-06-24 | 2013-06-24 | 樹脂パッケージとこの樹脂パッケージを用いた電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015005687A true JP2015005687A (ja) | 2015-01-08 |
Family
ID=52301329
Family Applications (1)
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JP2013131368A Pending JP2015005687A (ja) | 2013-06-24 | 2013-06-24 | 樹脂パッケージとこの樹脂パッケージを用いた電子機器 |
Country Status (1)
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JP (1) | JP2015005687A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017037917A (ja) * | 2015-08-07 | 2017-02-16 | 日亜化学工業株式会社 | リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011181819A (ja) * | 2010-03-03 | 2011-09-15 | Stanley Electric Co Ltd | 光半導体素子および光半導体装置 |
JP2011222602A (ja) * | 2010-04-06 | 2011-11-04 | Panasonic Corp | 半導体発光装置用パッケージ及び半導体発光装置並びに半導体発光装置用パッケージの製造方法 |
JP2012231115A (ja) * | 2010-10-22 | 2012-11-22 | Panasonic Corp | 表面実装型発光装置とその製造に用いられる乾式不飽和ポリエステル樹脂組成物、粒状物、ペレット、および粉砕加工物 |
-
2013
- 2013-06-24 JP JP2013131368A patent/JP2015005687A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011181819A (ja) * | 2010-03-03 | 2011-09-15 | Stanley Electric Co Ltd | 光半導体素子および光半導体装置 |
JP2011222602A (ja) * | 2010-04-06 | 2011-11-04 | Panasonic Corp | 半導体発光装置用パッケージ及び半導体発光装置並びに半導体発光装置用パッケージの製造方法 |
JP2012231115A (ja) * | 2010-10-22 | 2012-11-22 | Panasonic Corp | 表面実装型発光装置とその製造に用いられる乾式不飽和ポリエステル樹脂組成物、粒状物、ペレット、および粉砕加工物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017037917A (ja) * | 2015-08-07 | 2017-02-16 | 日亜化学工業株式会社 | リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法 |
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