JP2014501185A5 - - Google Patents
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- Publication number
- JP2014501185A5 JP2014501185A5 JP2013543491A JP2013543491A JP2014501185A5 JP 2014501185 A5 JP2014501185 A5 JP 2014501185A5 JP 2013543491 A JP2013543491 A JP 2013543491A JP 2013543491 A JP2013543491 A JP 2013543491A JP 2014501185 A5 JP2014501185 A5 JP 2014501185A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- intermediate layer
- layer
- vinyl acetate
- heat seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001577 copolymer Polymers 0.000 claims 4
- 239000000969 carrier Substances 0.000 claims 3
- 229920001940 conductive polymer Polymers 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229920002225 poly(styrene-co-butadiene) Polymers 0.000 claims 2
- XTXRWKRVRITETP-UHFFFAOYSA-N vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2010/079964 WO2012079258A1 (en) | 2010-12-17 | 2010-12-17 | Heat-sealing film and cover tape for packaging electronic components |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014501185A JP2014501185A (ja) | 2014-01-20 |
| JP2014501185A5 true JP2014501185A5 (zh) | 2014-02-27 |
| JP5762556B2 JP5762556B2 (ja) | 2015-08-12 |
Family
ID=46244000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013543491A Expired - Fee Related JP5762556B2 (ja) | 2010-12-17 | 2010-12-17 | ヒートシール、及び電子部品をパッケージングするためのカバーテープ |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5762556B2 (zh) |
| CN (1) | CN103260873B (zh) |
| MY (1) | MY190586A (zh) |
| TW (1) | TWI584951B (zh) |
| WO (1) | WO2012079258A1 (zh) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5762884B2 (ja) * | 2011-08-26 | 2015-08-12 | 昭和電工パッケージング株式会社 | 自動包装適性に優れた無塵包装袋 |
| CN103466195A (zh) * | 2013-03-19 | 2013-12-25 | 上海吉景包装制品有限公司 | 一种防静电上盖带 |
| JP6325859B2 (ja) * | 2014-03-20 | 2018-05-16 | リンテック株式会社 | 導電性樹脂シート |
| JP6429824B2 (ja) * | 2016-03-31 | 2018-11-28 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
| CN110683208A (zh) * | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | 多层盖带构造 |
| US20200017266A1 (en) * | 2018-07-12 | 2020-01-16 | Advantek, Inc. | Carbon nanotubes in carrier tape, cover tape and static shielding bags |
| CN113646242B (zh) * | 2019-04-03 | 2023-04-21 | 大日本印刷株式会社 | 电子部件包装用覆盖带以及包装体 |
| JP7164485B2 (ja) * | 2019-04-26 | 2022-11-01 | デンカ株式会社 | カバーフィルムおよびそれを用いた電子部品包装体 |
| WO2022210158A1 (ja) * | 2021-03-31 | 2022-10-06 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| JP2022158849A (ja) * | 2021-03-31 | 2022-10-17 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| CN114801401A (zh) * | 2022-03-23 | 2022-07-29 | 毕玛时软包装（苏州）有限公司 | 一种用于液体包装的洁净易揭封口盖膜 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129075A (en) * | 1978-03-30 | 1979-10-06 | Denki Kagaku Kogyo Kk | Film for heat-seal package |
| JPS5920557B2 (ja) * | 1978-06-29 | 1984-05-14 | 電気化学工業株式会社 | 包装体 |
| JP2609779B2 (ja) * | 1991-02-28 | 1997-05-14 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
| JPH0796585A (ja) * | 1993-08-04 | 1995-04-11 | Dainippon Printing Co Ltd | 蓋 材 |
| JPH08295001A (ja) * | 1995-04-27 | 1996-11-12 | Dainippon Printing Co Ltd | 蓋材とキャリアテープおよびこれらを用いたテーピング |
| JPH09111207A (ja) * | 1995-10-19 | 1997-04-28 | Dainippon Printing Co Ltd | キャリアテープ用カバーテープ |
| JPH1095448A (ja) * | 1996-09-18 | 1998-04-14 | Dainippon Printing Co Ltd | キャリアテープ用蓋材 |
| AU6734000A (en) * | 1999-08-31 | 2001-03-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Transparent heat-sealing film |
| WO2001075905A1 (fr) * | 2000-04-03 | 2001-10-11 | Dai Nippon Printing Co., Ltd. | Matiere transparente thermoscellable electroconductrice et recipient a couvercle pour ruban porteur, faisant appel audit materiau |
| JP4544563B2 (ja) * | 2001-03-23 | 2010-09-15 | 大日本印刷株式会社 | ヒートシール積層体およびキャリアテープ包装体 |
| DE60213914T2 (de) * | 2001-06-26 | 2007-02-22 | Sumitomo Bakelite Co. Ltd. | Abdeckband zum Verpacken von elektronischen Komponenten |
| JP2003200990A (ja) * | 2002-01-09 | 2003-07-15 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP2008273602A (ja) * | 2007-05-02 | 2008-11-13 | Denki Kagaku Kogyo Kk | カバーフィルム |
-
2010
- 2010-12-17 JP JP2013543491A patent/JP5762556B2/ja not_active Expired - Fee Related
- 2010-12-17 WO PCT/CN2010/079964 patent/WO2012079258A1/en active Application Filing
- 2010-12-17 CN CN201080070735.1A patent/CN103260873B/zh active Active
- 2010-12-17 MY MYPI2013002143A patent/MY190586A/en unknown
-
2011
- 2011-12-16 TW TW100146984A patent/TWI584951B/zh not_active IP Right Cessation
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