JP2014236209A - 電気デバイス、その製造方法及び放射線検査装置 - Google Patents
電気デバイス、その製造方法及び放射線検査装置 Download PDFInfo
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Abstract
Description
図1を参照しながら、第1実施形態にかかる放射線撮像装置10(以下、「装置10」)を説明する。図1は、装置10の構成例を模式的に示している。図1(a)は、装置10の全体構成の上面図を示している。図1(b)は、図1(a)におけるカットラインA−A’の断面構造を示している。図1(c)は、図1(a)におけるカットラインB−B’の断面構造を示している。図1(d)は、図1(a)における領域Cの拡大図を示している。
図2を参照しながら、第2実施形態にかかる放射線撮像装置20を説明する。図2は、放射線撮像装置20(以下、「装置20」)の構成例を模式的に示しており、図2(a)乃至(d)のそれぞれは、図1(a)乃至(d)のそれぞれに、それぞれ対応させて示している。本実施形態は、フレキ230に折り曲げ部Kが設けられていない点で第1実施形態と異なる。
以下では、図3を参照しながら、上述の各実施形態で述べた装置10ないし20を用いて、大型のセンサパネルを形成する実施形態を述べる。ここでは、複数の装置10を用いて大型のセンサパネルを形成する場合を例示するが、装置20を用いる場合も同様である。
上述の放射線撮像装置は、放射線検査装置等に代表される撮像システムに適用されうる。撮像システムは、例えば、撮像装置と、イメージプロセッサ等を含む信号処理部と、ディスプレイ等を含む表示部と、放射線を発生させるための放射線源と、を備える。なお、放射線は、X線、α線、β線、γ線、宇宙線等の粒子線や電磁波を含む。
Claims (9)
- 基板の外周に沿うように前記基板の上に設けられた導電性のガードリングと、前記基板の上において前記ガードリングよりも内側に設けられた電極と、前記電極の上方に設けられ、外部装置と前記電極とを接続するための接続部と、を備え、
前記接続部は、前記外部装置と前記電極とを電気的に接続するための導電部材と、前記導電部材の下面に設けられた絶縁部材と、を有し、
前記絶縁部材は、前記導電部材のうちの前記電極の直上の部分を露出させており、前記導電部材と前記ガードリングとが接触しないように、前記絶縁部材の端が、平面視において前記ガードリングよりも内側に位置している、
ことを特徴とする電気デバイス。 - 前記基板と前記接続部との間に配された異方導電性の部材をさらに備え、
前記導電部材と前記電極とは、前記異方導電性の部材のうち前記電極の直上の部分が圧着されて電気的に接続されている、
ことを特徴とする請求項1に記載の電気デバイス。 - 前記接続部は、前記導電部材のうち前記電極の直上の部分の下面が前記絶縁部材の下面よりも下に位置するように、平面視における前記ガードリングと前記電極との間に折り曲げ部を有する、
ことを特徴とする請求項1または請求項2に記載の電気デバイス。 - 前記絶縁部材の端は、前記折り曲げ部に位置している、
ことを特徴とする請求項3に記載の電気デバイス。 - 前記絶縁部材は開口を有しており、前記導電部材のうちの前記電極の直上の部分は、当該開口から前記絶縁部材の下面よりも下側に突出して形成されている、
ことを特徴とする請求項1または請求項2に記載の電気デバイス。 - 前記接続部は、前記絶縁部材の下に設けられた第2の導電部材をさらに有しており、前記第2の導電部材は前記ガードリングに電気的に接続されている、
ことを特徴とする請求項1乃至5のいずれか1項に記載の電気デバイス。 - 前記電気デバイスは、放射線撮像装置を含み、
前記基板は、放射線を検知する複数のセンサが配列されたセンサアレイを有し、前記接続部は、前記電極を介して前記センサアレイに接続されている、
ことを特徴とする請求項1乃至6のいずれか1項に記載の電気デバイス。 - 放射線撮像装置を含む請求項7に記載の電気デバイスと、
放射線を発生する放射線源と、備える、
ことを特徴とする放射線検査装置。 - 基板の外周に沿うように前記基板の上に設けられた導電性のガードリングと、前記基板の上において前記ガードリングよりも内側に設けられた電極と、を備える電気デバイスの製造方法であって、
導電部材の下面に前記導電部材の一部が露出されるように絶縁部材を設けて、外部装置と前記電極とを接続するための接続部を形成する第1工程と、
前記接続部を前記基板に取り付ける第2工程と、を有し、
前記第2工程では、前記接続部は、前記露出された前記導電部材の一部と前記電極とが電気的に接続され、かつ、前記絶縁部材の端が平面視における前記ガードリングよりも内側に位置することにより前記導電部材と前記ガードリングとが接触しないように、前記基板に取り付けられる、
ことを特徴とする電気デバイスの製造方法。
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