JP2014192292A - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- JP2014192292A JP2014192292A JP2013065628A JP2013065628A JP2014192292A JP 2014192292 A JP2014192292 A JP 2014192292A JP 2013065628 A JP2013065628 A JP 2013065628A JP 2013065628 A JP2013065628 A JP 2013065628A JP 2014192292 A JP2014192292 A JP 2014192292A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 179
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
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- 239000000463 material Substances 0.000 claims description 14
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- 229910000679 solder Inorganic materials 0.000 abstract description 40
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Abstract
【解決手段】 z方向を向く上面電極410を有する半導体素子400と、上面電極410に対向しかつ導通する先端面110、およびこの先端面110に繋がり上面電極410から離間するように起立した起立部120を有する第1リード100と、半導体素子400の上面電極410と第1リード100の先端面110とを接合するはんだ510と、半導体素子400、第1リード100の少なくとも一部、およびはんだ510を覆う封止樹脂600と、を備える。
【選択図】 図2
Description
10 リードフレーム
11 フレーム
12 保持部
13 連結部
100 第1リード
110 先端面
120 起立部
130 横行部
131 等幅部
132 広幅部
140 段差部
150 延伸部
160 迂回部
170 端子部
181 開口
182 溝
191 バリ
192 ダレ
200 第2リード
210 ダイパッド部
230 延伸部
260 迂回部
270 端子部
281 開口
282,283 溝
291 バリ
292 ダレ
300 第3リード
350 延伸部
360 迂回部
370 端子部
381 開口
382 溝
400 半導体素子
410 上面電極
420 下面電極
430 絶縁層
510,520,530 はんだ(導電性接合材)
600 封止樹脂
Claims (30)
- 第1方向を向く電極を有する半導体素子と、
上記電極に対向しかつ導通する先端面、およびこの先端面に繋がり上記電極から離間するように起立した起立部を有する第1リードと、
上記半導体素子の上記電極と上記第1リードの上記先端面とを接合する導電性接合材と、
上記半導体素子、上記第1リードの少なくとも一部、および上記導電性接合材を覆う封止樹脂と、
を備えることを特徴とする、半導体装置。 - 上記第1方向視において、上記先端面は上記半導体素子の上記電極よりも小である、請求項1に記載の半導体装置。
- 上記第1方向視において、上記先端面は上記半導体素子の上記電極の中心に重なっている、請求項2に記載の半導体装置。
- 上記第1方向視において、上記導電性接合材は、上記電極に内包されている、請求項2または3に記載の半導体装置。
- 上記第1方向視において、上記半導体素子の外形と上記電極とは相似形である、請求項2ないし4のいずれかに記載の半導体装置。
- 上記先端面は、正方形である、請求項2ないし5のいずれかに記載の半導体装置。
- 上記第1リードは、上記起立部に繋がり、かつ上記第1方向視において上記起立部から離間する方向に延びる横行部を有する、請求項1ないし6のいずれかに記載の半導体装置。
- 上記第1方向における上記横行部と上記半導体素子の上記電極との距離は、上記第1方向における上記横行部と上記封止樹脂の外面との距離よりも大である、請求項7に記載の半導体装置。
- 上記第1リードは、一端が上記横行部に対して上記起立部とは反対側に繋がり、かつ他端が上記一端よりも上記第1方向において上記半導体素子側に位置する段差部を有する、請求項7または8に記載の半導体装置。
- 上記第1リードは、上記段差部に繋がり、かつ上記第1方向視において上記段差部から離間する方向に延びるとともに、その一部が上記封止樹脂から突出する延伸部を有する、請求項9に記載の半導体装置。
- 上記第1リードは、一端が上記延伸部に対して上記段差部とは反対側に繋がり、かつ他端が上記一端よりも上記第1方向において上記段差部から離間した位置にある迂回部を有する、請求項10に記載の半導体装置。
- 上記第1リードは、上記延伸部と上記迂回部とが繋がる部分である折り曲げ部分に、その折り曲げ方向に延びるとともに、折り曲げ内側に位置する溝を有する、請求項11に記載の半導体装置。
- 上記溝は、上記折り曲げ方向において上記折り曲げ部分よりも短い、請求項12に記載の半導体装置。
- 上記第1リードは、上記迂回部に繋がる端子部を有する、請求項11ないし13のいずれかに記載の半導体装置。
- 上記横行部は、上記起立部に繋がる側の部分の幅が上記起立部の幅と同じである等幅部を有する、請求項7ないし14のいずれかに記載の半導体装置。
- 上記横行部は、上記等幅部に対して上記起立部と反対側に繋がり、上記等幅部よりも幅が広い広幅部を有する、請求項15に記載の半導体装置。
- 上記横行部は、上記起立部に繋がる側の部分の幅が上記起立部の幅と同じである等幅部とこの等幅部に対して上記起立部と反対側に繋がり、上記等幅部よりも幅が広い広幅部とを有し、
上記延伸部は、上記広幅部よりも幅が広い、請求項10ないし14のいずれかに記載の半導体装置。 - 上記起立部は、上記第1方向に対して傾いており、
上記先端面のうち上記起立部が傾く側とは反対側の部分に、バリが形成されている、請求項1ないし17のいずれかに記載の半導体装置。 - 上記半導体素子に対して上記第1リードの上記先端面とは反対側から接合されたダイパッド部を有する第2リードをさらに備える、請求項1ないし18のいずれかに記載の半導体装置。
- 上記ダイパッド部に繋がり、第1方向視において上記封止樹脂の外部へと延びる延伸部を有する、請求項19に記載の半導体装置。
- 上記第2リードの上記延伸部は、上記ダイパッド部に繋がる部分が上記封止樹脂から突出する部分よりも上記第1方向において上記第1リードの上記先端面に対して離間した位置にある、請求項20に記載の半導体装置。
- 上記延伸部は、上記ダイパッド部よりも幅が狭い、請求項20または21に記載の半導体装置。
- 上記第2リードは、一端が上記延伸部に対して上記ダイパッド部とは反対側に繋がり、かつ他端が上記一端よりも上記第1方向において上記延伸部から離間した位置にある迂回部を有する、請求項20ないし22のいずれかに記載の半導体装置。
- 上記第2リードは、上記延伸部と上記迂回部とが繋がる部分である折り曲げ部分に、その折り曲げ方向に延びるとともに、折り曲げ内側に位置する溝を有する、請求項23に記載の半導体装置。
- 上記溝は、上記折り曲げ方向において上記折り曲げ部分よりも短い、請求項24に記載の半導体装置。
- 上記第2リードは、上記迂回部に繋がる端子部を有する、請求項23ないし25のいずれかに記載の半導体装置。
- 第1方向を向く電極を有する半導体素子および先端面を有する第1リードを用意し、
上記電極に対して上記先端面が対向するように上記第1リードを配置する工程と、
上記電極と上記先端面とを接合する工程と、
を備えることを特徴とする、半導体装置の製造方法。 - 上記第1リードを配置する工程においては、上記先端面が上記第1方向において上記電極と同じ側を向く姿勢から上記先端面が上記電極と対向する姿勢へと上記第1リードを回転させる、請求項27に記載の半導体装置の製造方法。
- 上記第1リードを配置する工程においては、上記第1リードに繋がり、かつ上記回転の軸方向に延びる連結部を捻ることにより上記第1リードを回転させ、
上記第1リードを配置する工程の後に、上記連結部を除去する工程を備える、請求項28に記載の半導体装置の製造方法。 - 上記連結部を除去する工程は、打ち抜きによって行う、請求項29に記載の半導体装置の製造方法。
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US20140291828A1 (en) | 2014-10-02 |
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