JP2014189001A - 樹脂凸部形成方法及び配線板製造方法 - Google Patents
樹脂凸部形成方法及び配線板製造方法 Download PDFInfo
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- JP2014189001A JP2014189001A JP2013069447A JP2013069447A JP2014189001A JP 2014189001 A JP2014189001 A JP 2014189001A JP 2013069447 A JP2013069447 A JP 2013069447A JP 2013069447 A JP2013069447 A JP 2013069447A JP 2014189001 A JP2014189001 A JP 2014189001A
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- thermosetting resin
- wiring board
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- plating
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- 229920005989 resin Polymers 0.000 title claims abstract description 139
- 239000011347 resin Substances 0.000 title claims abstract description 139
- 238000000034 method Methods 0.000 title claims description 90
- 238000004519 manufacturing process Methods 0.000 title claims description 71
- 238000007747 plating Methods 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 59
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 42
- 239000010410 layer Substances 0.000 description 33
- 239000007789 gas Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Mechanical Engineering (AREA)
Abstract
【解決手段】基材14上に未硬化状態の熱硬化性樹脂16で形成された凸部24に対し、凸部24の少なくとも側面24Bを保持材で保持した状態で、未硬化状態の熱硬化性樹脂16を加熱して硬化させる。保持材は、凸部24及び基材への鍍金の下地となる鍍金下地層30であって、凸部24を覆うように形成するとともに、形成された保持材に貫通孔46を形成する。
【選択図】図1E
Description
(付記1)
基材上に未硬化状態の熱硬化性樹脂層を形成し、
成形型を前記熱硬化性樹脂層に押し当てることにより、凸部を形成し、
前記凸部の少なくとも側面を保持する保持材を形成し、
前記凸部及び前記保持材を形成した前記基材を加熱することを特徴とする樹脂凸部形成方法。
(付記2)
前記保持材が、前記凸部及び前記基材への鍍金の下地となる鍍金下地層であることを特徴とする付記1に記載の樹脂凸部形成方法。
(付記3)
前記保持材は、前記未硬化状態の前記凸部を覆うように形成するとともに、
形成された前記保持材に、貫通孔を形成することを特徴とする付記2に記載の樹脂凸部形成方法。
(付記4)
前記凸部の形成は、複数の微小凹部が形成された前記成形型を押し当てる事によって、複数の突出部が形成された凸部を形成し、
前記加熱前に、前記突出部上の前記鍍金下地層を研磨し、前記貫通孔を形成することを特徴とする付記3に記載の樹脂凸部形成方法。
(付記5)
前記突出部は、先端に向かって細い先細り状であることを特徴とする付記4に記載の樹脂凸部形成方法。
(付記6)
前記保持材が、感光性熱硬化樹脂であり、前記硬化の工程前に前記感光性熱硬化樹脂を露光し硬化させることを特徴とする付記1記載の樹脂凸部形成方法
(付記7)
付記1〜付記6のいずれか1つに記載の樹脂凸部形成方法によって前記凸部が形成された前記基材に対し、前記凸部が形成されていない部分に配線を形成し配線板を製造する配線板製造方法。
14 基材
16 熱硬化性樹脂
24 凸部
24A 頂面
24B 側面
30 鍍金ベース(保持材)
32 鍍金
44 凸部
44M 微小凸部(突出部)
46 貫通孔
60 保持樹脂層(保持材)
Claims (5)
- 基材上に未硬化状態の熱硬化性樹脂層を形成し、
成形型を前記熱硬化性樹脂層に押し当てることにより、凸部を形成し、
前記凸部の少なくとも側面を保持する保持材を形成し、
前記凸部及び前記保持材を形成した前記基材を加熱することを特徴とする樹脂凸部形成方法。 - 前記保持材が、前記凸部及び前記基材への鍍金の下地となる鍍金下地層であることを特徴とする請求項1に記載の樹脂凸部形成方法。
- 前記保持材は、前記未硬化状態の前記凸部を覆うように形成するとともに、
形成された前記保持材に、貫通孔を形成することを特徴とする請求項2に記載の樹脂凸部形成方法。 - 前記凸部の形成は、複数の微小凹部が形成された前記成形型を押し当てる事によって、複数の突出部が形成された凸部を形成し、
前記加熱前に、前記突出部上の前記鍍金下地層を研磨し、前記貫通孔を形成することを特徴とする請求項3に記載の樹脂凸部形成方法。 - 請求項1〜請求項4のいずれか1項に記載の樹脂凸部形成方法によって前記凸部が形成された前記基材に対し、前記凸部が形成されていない部分に配線を形成し配線板を製造する配線板製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013069447A JP6040834B2 (ja) | 2013-03-28 | 2013-03-28 | 樹脂凸部形成方法及び配線板製造方法 |
US14/194,835 US20140295065A1 (en) | 2013-03-28 | 2014-03-03 | Resin protrusion forming method and wiring board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013069447A JP6040834B2 (ja) | 2013-03-28 | 2013-03-28 | 樹脂凸部形成方法及び配線板製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014189001A true JP2014189001A (ja) | 2014-10-06 |
JP6040834B2 JP6040834B2 (ja) | 2016-12-07 |
Family
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JP2013069447A Expired - Fee Related JP6040834B2 (ja) | 2013-03-28 | 2013-03-28 | 樹脂凸部形成方法及び配線板製造方法 |
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US (1) | US20140295065A1 (ja) |
JP (1) | JP6040834B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007243181A (ja) * | 2006-03-06 | 2007-09-20 | Samsung Electro-Mechanics Co Ltd | インプリンティングによる基板の製造方法 |
JP2009221498A (ja) * | 2008-03-13 | 2009-10-01 | Seiko Epson Corp | めっき膜、めっき膜の製造方法、配線基板、配線基板の製造方法 |
JP2009272486A (ja) * | 2008-05-08 | 2009-11-19 | Nitto Denko Corp | 配線回路基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021748B2 (en) * | 2003-09-29 | 2011-09-20 | Ibiden Co., Ltd. | Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
JP2006339365A (ja) * | 2005-06-01 | 2006-12-14 | Mitsui Mining & Smelting Co Ltd | 配線基板およびその製造方法、多層積層配線基板の製造方法並びにビアホールの形成方法 |
-
2013
- 2013-03-28 JP JP2013069447A patent/JP6040834B2/ja not_active Expired - Fee Related
-
2014
- 2014-03-03 US US14/194,835 patent/US20140295065A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007243181A (ja) * | 2006-03-06 | 2007-09-20 | Samsung Electro-Mechanics Co Ltd | インプリンティングによる基板の製造方法 |
JP2009221498A (ja) * | 2008-03-13 | 2009-10-01 | Seiko Epson Corp | めっき膜、めっき膜の製造方法、配線基板、配線基板の製造方法 |
JP2009272486A (ja) * | 2008-05-08 | 2009-11-19 | Nitto Denko Corp | 配線回路基板の製造方法 |
Also Published As
Publication number | Publication date |
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JP6040834B2 (ja) | 2016-12-07 |
US20140295065A1 (en) | 2014-10-02 |
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