JP5073868B1 - 転写金型の製造方法及びその転写金型 - Google Patents
転写金型の製造方法及びその転写金型 Download PDFInfo
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- JP5073868B1 JP5073868B1 JP2012166204A JP2012166204A JP5073868B1 JP 5073868 B1 JP5073868 B1 JP 5073868B1 JP 2012166204 A JP2012166204 A JP 2012166204A JP 2012166204 A JP2012166204 A JP 2012166204A JP 5073868 B1 JP5073868 B1 JP 5073868B1
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 11
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000005323 electroforming Methods 0.000 abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 22
- 239000010410 layer Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 5
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- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000002054 transplantation Methods 0.000 description 1
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Abstract
【選択図】 図3
Description
15 レジスト補強溝
20 パターン化されたフォトレジスト
30 レジスト補強部
35 絶縁層
40 粗面層
50 部品
60 接着剤
70 部品基板
α 側壁の傾斜角度
β 側壁の傾斜角度
Claims (4)
- 金属基板に、レジスト補強溝を形成するステップと、
前記レジスト補強溝上に、前記溝を覆いかつ前記溝の深さを超える高さを有し、その側壁が所望の角度αを有する部品形状の反転レジストパターンを形成するステップと、
前記反転レジストパターンを熱硬化させるステップと、を含み、前記レジスト補強溝により前記反転レジストパターンのエッジを補強することにより前記反転レジストパターンのエッジの剥がれを防止することを特徴とする転写金型の製造方法。 - 請求項1に記載の転写金型の製造方法において、
部品が形成される場所と前記反転レジストパターン上を除く前記金属基板上に絶縁層を形成するステップをさらに含むことを特徴とする転写金型の製造方法。 - 請求項1又は2に記載の転写金型の製造方法により作製されたことを特徴とする転写金型。
- 請求項3に記載の転写金型を用いて電気鋳造により転写製造された部品。
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JP2012166204A JP5073868B1 (ja) | 2012-07-26 | 2012-07-26 | 転写金型の製造方法及びその転写金型 |
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JP2012166204A JP5073868B1 (ja) | 2012-07-26 | 2012-07-26 | 転写金型の製造方法及びその転写金型 |
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JP2012518646A Division JP5073880B1 (ja) | 2011-11-17 | 2011-11-17 | 転写金型の製造方法及びその転写金型 |
Publications (2)
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JP5073868B1 true JP5073868B1 (ja) | 2012-11-14 |
JP2013108169A JP2013108169A (ja) | 2013-06-06 |
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JP2012166204A Active JP5073868B1 (ja) | 2012-07-26 | 2012-07-26 | 転写金型の製造方法及びその転写金型 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6995712B2 (ja) | 2017-03-29 | 2022-02-04 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3208081A1 (de) * | 1982-03-06 | 1983-09-08 | Braun Ag, 6000 Frankfurt | Verfahren zur herstellung einer siebartigen scherfolie fuer einen elektrisch betriebenen trockenrasierapparat mit erhebungen auf ihrer der haut zugewandten flaeche |
JPH05339778A (ja) * | 1992-06-05 | 1993-12-21 | Mitsuboshi Belting Ltd | 電鋳成形型及びその製造方法 |
JP2005163076A (ja) * | 2003-12-01 | 2005-06-23 | Alps Electric Co Ltd | メッキ層の製造方法、及び前記メッキ層の製造方法を用いた接続装置の製造方法 |
JP4785481B2 (ja) * | 2005-09-27 | 2011-10-05 | セイコーインスツル株式会社 | 電鋳型とその製造方法及び電鋳部品の製造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6995712B2 (ja) | 2017-03-29 | 2022-02-04 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
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