JP2014112666A - 封止体及び封止体の作製方法 - Google Patents
封止体及び封止体の作製方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- G—PHYSICS
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
【解決手段】対向する2枚の基板間に少なくとも配線層が設けられ、該2枚の基板がガラスフリットを材料として含む封止層によって封止された封止体であって、配線層と封止層とが重畳する領域に選択的に金属層を有する封止体を提供する。該金属層は、レーザ光の照射工程において、レーザ光の反射膜として機能し、配線層と重畳する領域のシール部材に過剰なエネルギーが加えられることを抑制する。
【選択図】図1
Description
本実施の形態では、封止体及び封止体の作製方法の一態様を、図1及び図2を用いて説明する。
本実施の形態では、実施の形態1に示した封止体の内部に半導体素子を有する半導体装置の例として、表示素子を含む半導体装置(表示装置とも表記する)について図3を用いて説明する。
本実施の形態では、上記実施の形態で示す半導体装置を適用した電子機器や照明装置の例について、図4および図5を用いて説明する。
110 素子形成基板
112 配線層
114 半導体素子
120 対向基板
122 金属層
123 シール部材
124 封止層
150 レーザ光
200 素子形成基板
202 対向基板
204 FPC
205 外部接続電極
206 配線層
208 接続層
211 画素部
212 ソース駆動回路
213 ゲート駆動回路
220 発光素子
221 電極
222 EL層
223 電極
231 トランジスタ
232 トランジスタ
233 トランジスタ
234 トランジスタ
235 絶縁層
236 スペーサ
237 絶縁層
238 絶縁層
239 絶縁層
241 絶縁層
242 ブラックマトリクス
243 カラーフィルタ
245 封止層
248 金属層
250 液晶素子
251 電極
252 液晶
253 電極
254 スペーサ
255 オーバーコート
256 トランジスタ
257 絶縁層
300 領域
302 領域
7100 テレビジョン装置
7101 筐体
7103 表示部
7105 スタンド
7107 表示部
7109 操作キー
7110 リモコン操作機
7201 本体
7202 筐体
7203 表示部
7204 キーボード
7205 外部接続ポート
7206 ポインティングデバイス
7301 筐体
7302 筐体
7303 連結部
7304 表示部
7305 表示部
7306 スピーカ部
7307 記録媒体挿入部
7308 LEDランプ
7309 操作キー
7310 接続端子
7311 センサ
7312 マイクロフォン
7400 携帯電話機
7401 筐体
7402 表示部
7403 操作ボタン
7404 外部接続ポート
7405 スピーカ
7406 マイク
7500 照明装置
7501 筐体
7503a 半導体装置
7503b 半導体装置
7503c 半導体装置
7503d 半導体装置
9033 留め具
9034 スイッチ
9035 電源スイッチ
9036 スイッチ
9038 操作スイッチ
9630 筐体
9631 表示部
9631a 表示部
9631b 表示部
9632a 領域
9632b 領域
9633 太陽電池
9634 充放電制御回路
9635 バッテリー
9636 DCDCコンバータ
9637 操作キー
9638 コンバータ
9639 ボタン
Claims (6)
- 配線層が設けられた第1の基板と、
前記第1の基板と対向し、且つ前記第1の基板と対向する面に金属層が設けられた第2の基板と、
前記配線層の一部の領域と重なるように閉環状に形成され、前記第1の基板と前記第2の基板とを一定の間隙を有して接着する封止層と、を有し、
前記配線層は、前記閉環状の封止層の内側から外側へと延在し、
前記金属層は、前記配線層と前記封止層とが重畳する領域に選択的に設けられている封止体。 - 配線層が設けられた第1の基板と、
前記第1の基板と対向し、且つ前記第1の基板と対向する面に金属層が設けられた第2の基板と、
前記配線層の一部の領域と重なるように閉環状に形成され、前記第1の基板と前記第2の基板とを一定の間隙を有して接着する封止層と、を有し、
前記配線層は、前記閉環状の封止層の内側から外側へと延在し、
前記金属層は、前記配線層と前記封止層とが重畳する領域に選択的に設けられ、且つ、前記第2の基板より光透過率が低い層である封止体。 - 請求項1又は2において、
前記閉環状の封止層の内側に、液晶素子を含む封止体。 - 請求項1又は2において、
前記閉環状の封止層の内側に、発光素子を含む封止体。 - 第1の基板上に金属層を形成し、
前記金属層及び前記第1の基板上に接して、閉環状に低融点ガラス及びバインダを含有するシール部材を配置し、
前記シール部材に第1の加熱処理を行い、含有される前記バインダを低減させ、
配線層を有する第2の基板を準備し、
前記配線層と前記金属層とが重畳するように、前記第1の基板と前記第2の基板を重ね、
前記シール部材に第2の加熱処理を行うことで、前記低融点ガラスを溶融させて、前記第1の基板と前記第2の基板とを溶着する封止体の作製方法。 - 請求項5において、前記第2の加熱処理として、レーザ光の照射処理を行う封止体の作製方法。
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- 2013-10-31 US US14/068,694 patent/US9568776B2/en active Active
- 2013-11-01 CN CN201310534882.5A patent/CN103811528B/zh active Active
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2018
- 2018-11-26 JP JP2018219962A patent/JP6626183B2/ja active Active
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JP7261796B2 (ja) | 2018-01-19 | 2023-04-20 | 昆山国顕光電有限公司 | パッケージ構造 |
Also Published As
Publication number | Publication date |
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US9568776B2 (en) | 2017-02-14 |
JP6626183B2 (ja) | 2019-12-25 |
KR20140057164A (ko) | 2014-05-12 |
JP2019047133A (ja) | 2019-03-22 |
US20140125935A1 (en) | 2014-05-08 |
JP2020057004A (ja) | 2020-04-09 |
CN103811528B (zh) | 2018-04-06 |
KR102160829B1 (ko) | 2020-09-28 |
CN103811528A (zh) | 2014-05-21 |
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