JP2014060281A - 導電性部材と回路電極との接続構造、及び、導電性部材と回路電極との接続方法 - Google Patents
導電性部材と回路電極との接続構造、及び、導電性部材と回路電極との接続方法 Download PDFInfo
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- JP2014060281A JP2014060281A JP2012204764A JP2012204764A JP2014060281A JP 2014060281 A JP2014060281 A JP 2014060281A JP 2012204764 A JP2012204764 A JP 2012204764A JP 2012204764 A JP2012204764 A JP 2012204764A JP 2014060281 A JP2014060281 A JP 2014060281A
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Abstract
【解決手段】この導電性部材11,12と回路電極5,9との接続方法は、導電性部材11,12と回路電極5,9とを当接させた状態で、陽イオン性耐熱性樹脂前駆体とめっき金属イオンとを含有するめっき液に浸漬して電解めっきを行う複合電解めっき工程と、複合電解めっき工程で形成された複合電解めっき層を加熱処理して陽イオン性耐熱性樹脂前駆体を反応硬化させる加熱工程とを含む。こうして、導電性部材11,12と回路電極5,9とが、めっき金属の粒界に耐熱性樹脂が分散した複合電解めっき層17を含む接合層15a,15b,15cで接合されて電気的に接続している導電性部材と回路電極との接続構造を形成する。
【選択図】図1
Description
2:樹脂ケース
3:配線基板
4:絶縁基板
5:回路パターン部
6:金属層
7a、7b:接合層
8:半導体チップ
9:チップ電極
10:マスク
11:リードフレーム
12:リードワイヤ
15a,15b,15c,15d,15e:接合層
16:無電解めっき層
17:複合電解めっき層
20:外部電極用端子
25:封止樹脂
30:インプラント基板
31:絶縁基板
32,33:金属層
34:ビアホール
35:金属ピン
Claims (18)
- 導電性部材と回路電極との接続構造において、
前記導電性部材と前記回路電極とが、めっき金属の粒界に耐熱性樹脂が分散した複合電解めっき層を含む接合層で接合されて電気的に接続していることを特徴とする導電性部材と回路電極との接続構造。 - 前記導電性部材が、リードワイヤ、リードフレーム及び金属ピンから選ばれる1種以上であり、
前記回路電極が、絶縁基板に回路パターンが形成された配線基板上に半導体チップが配置された半導体装置の、前記配線基板の回路パターン及び/又は前記半導体チップのチップ電極である請求項1に記載の導電性部材と回路電極との接続構造。 - 前記耐熱性樹脂の熱分解温度が、150℃以上である請求項1又は2に記載の導電性部材と回路電極との接続構造。
- 前記耐熱性樹脂が、ポリイミド樹脂である請求項1〜3のいずれか1項に記載の導電性部材と回路電極との接続構造。
- 前記めっき金属が、Cu、Ag、Au、Ni、Pd及びこれらの合金から選ばれる1種以上である請求項1〜4のいずれか1項に記載の導電性部材と回路電極との接続構造。
- 前記複合電解めっき層が、前記耐熱性樹脂を1〜40vol%含有する請求項1〜5のいずれか1項に導電性部材と回路電極との接続構造。
- 前記接合層が、前記回路電極上に形成された無電解めっき層と、該無電解めっき層上に形成された前記複合電解めっき層とで構成されている、請求項1〜6のいずれか1項に記載の導電性部材と回路電極との接続構造。
- 前記無電解めっき層が無電解Niめっき層である請求項7に記載の導電性部材と回路電極との接続構造。
- 前記回路電極が、Al、Cu及びこれらの合金から選ばれる1種で形成されている請求項1〜8のいずれか1項に記載の導電性部材と回路電極との接続構造。
- 導電性部材と回路電極との接続方法において、
前記導電性部材と前記回路電極とを当接させた状態で、陽イオン性耐熱性樹脂前駆体とめっき金属イオンとを含有するめっき液に浸漬して電解めっきを行う複合電解めっき工程と、
前記複合電解めっき工程で形成された複合電解めっき層を加熱処理して前記陽イオン性耐熱性樹脂前駆体を反応硬化させる加熱工程とを含むことを特徴とする導電性部材と回路電極との接続方法。 - 前記導電性部材が、リードワイヤ、リードフレーム及び金属ピンから選ばれる1種以上であり、
前記回路電極が、絶縁基板に回路パターンが形成された配線基板上に、半導体チップが配置された半導体装置の、前記配線基板の回路パターン及び/又は前記半導体チップのチップ電極である請求項10に記載の導電性部材と回路電極との接続方法。 - 前記陽イオン性耐熱性樹脂前駆体として、反応硬化後の樹脂の熱分解温度が150℃以上となるものを用いる請求項10又は11に記載の導電性部材と回路電極との接続方法。
- 前記陽イオン性耐熱性樹脂前駆体として、陽イオン性官能基を有するポリアミック酸を用い、
前記加熱工程において、前記複合電解めっき層を100〜250℃に加熱する請求項10〜12のいずれか1項に記載の導電性部材と回路電極との接続方法。 - 前記めっき金属イオンが、Cuイオン、Agイオン、Auイオン、Niイオン、Pdイオンから選ばれる1種以上である請求項10〜13のいずれか1項に記載の導電性部材と回路電極との接続方法。
- 前記めっき液として、前記陽イオン性耐熱性樹脂前駆体を1〜40vol%含有するものを用いる請求項10〜14のいずれか1項に記載の導電性部材と回路電極との接続方法。
- 前記電極上に無電解めっき層を形成した後、前記複合電解めっき工程を行う請求項10〜15のいずれか1項に記載の導電性部材と回路電極との接続方法。
- 前記無電解めっき層として、無電解Niめっき層を形成する請求項16に記載の導電性部材と回路電極との接続方法。
- 前記回路電極が、Al、Cu及びこれらの合金から選ばれる1種で形成されている請求項10〜17のいずれか1項に記載の導電性部材と回路電極との接続方法。
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