JP2013235883A - 電子部品モジュールおよびその製造方法 - Google Patents
電子部品モジュールおよびその製造方法 Download PDFInfo
- Publication number
- JP2013235883A JP2013235883A JP2012105655A JP2012105655A JP2013235883A JP 2013235883 A JP2013235883 A JP 2013235883A JP 2012105655 A JP2012105655 A JP 2012105655A JP 2012105655 A JP2012105655 A JP 2012105655A JP 2013235883 A JP2013235883 A JP 2013235883A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component module
- marking
- sealing member
- traceability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
【解決手段】基板1と、基板1の一方の面上に実装された複数の電子部品2と、電子部品2を封止する封止部材3と、封止部材3の表面を覆うように塗布される保護部材4を備えた電子部品モジュール100において、封止部材3の表面に第1の刻印5を行ない、保護部材4は第1の刻印5を覆うよう塗布されるとともに、保護部材4の表面に第2の刻印6を行なうので、限られた領域を有効に利用してトレーサビリティに必要な製品情報を記録することができ、部品表面のマーキングが損なわれた場合でも保護部材4の一部または全部を除去することで第1の刻印5を認識することができるので、トレーサビリティを確保することができる。
【選択図】図1
Description
以下に本発明の第1実施形態における電子部品モジュール100について説明する。
図2(b)に示すように、電子部品モジュール100の表面を覆う保護部材4を封止部材3の凸部が露出する高さまで除去した場合、封止部材3の凹部には保護部材4が残留するので、封止部材3の色と保護部材4の色との違いによって、封止部材3の表面に施した第1の刻印5に記録された製品情報を可視光で容易に認識することができる。
以下に本発明の第2実施形態として電子部品モジュール100の製造方法について図3を用いて説明する。
2 電子部品
2a チップ部品
2b IC
3 封止部材
4 保護部材
5 第1の刻印
6 第2の刻印
6a 方向指示
6b 製品型名
6c ロット番号
100 電子部品モジュール
Claims (4)
- 基板と、前記基板の一方の面上に実装された複数の電子部品と、前記電子部品を封止する封止部材と、前記封止部材の表面を覆うように塗布される保護部材を備えた電子部品モジュールにおいて、前記封止部材の表面に第1の刻印を行ない、前記保護部材は前記第1の刻印を覆うよう塗布されるとともに、前記保護部材の表面に第2の刻印を行なうことを特徴とする電子部品モジュール。
- 請求項1に記載の電子部品モジュールにおいて、前記封止部材の色と、前記保護部材の色とが異なることを特徴とする電子部品モジュール。
- 請求項2記載の電子部品モジュールにおいて、前記保護部材が不透明であることを特徴とする電子部品モジュール。
- 基板と、前記基板の一方の面上に実装された複数の電子部品と、前記電子部品を封止する封止部材と、前記封止部材の表面を覆うように塗布される保護部材を備えた電子部品モジュールの製造方法において、前記封止部材の表面に第1の刻印を行ない、前記保護部材は前記第1の刻印を覆うよう塗布されるとともに、前記保護部材の表面に第2の刻印を行なうことを特徴とする電子部品モジュールの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012105655A JP5885342B2 (ja) | 2012-05-07 | 2012-05-07 | 電子部品モジュールおよびその製造方法 |
CN201310114467.4A CN103390610B (zh) | 2012-05-07 | 2013-04-03 | 电子零件模组及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012105655A JP5885342B2 (ja) | 2012-05-07 | 2012-05-07 | 電子部品モジュールおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013235883A true JP2013235883A (ja) | 2013-11-21 |
JP5885342B2 JP5885342B2 (ja) | 2016-03-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012105655A Expired - Fee Related JP5885342B2 (ja) | 2012-05-07 | 2012-05-07 | 電子部品モジュールおよびその製造方法 |
Country Status (2)
Country | Link |
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JP (1) | JP5885342B2 (ja) |
CN (1) | CN103390610B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020021981A1 (ja) * | 2018-07-24 | 2020-01-30 | タツタ電線株式会社 | シールドパッケージ、及び、シールドパッケージの製造方法 |
JP2020035820A (ja) * | 2018-08-28 | 2020-03-05 | 太陽誘電株式会社 | モジュールおよびその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010161095A (ja) * | 2009-01-06 | 2010-07-22 | Rohm Co Ltd | 半導体装置の印字方法およびその印字方法が用いられて作製された半導体装置 |
JP2011054606A (ja) * | 2009-08-31 | 2011-03-17 | Yamaha Corp | 半導体パッケージ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07106103A (ja) * | 1993-10-07 | 1995-04-21 | Rohm Co Ltd | チップ抵抗器の製造方法 |
JP2007109750A (ja) * | 2005-10-12 | 2007-04-26 | Hitachi Metals Ltd | 電気・電子部品およびその製造方法 |
CN101894763B (zh) * | 2009-05-19 | 2011-09-07 | 中芯国际集成电路制造(上海)有限公司 | 一种芯片装配方法 |
-
2012
- 2012-05-07 JP JP2012105655A patent/JP5885342B2/ja not_active Expired - Fee Related
-
2013
- 2013-04-03 CN CN201310114467.4A patent/CN103390610B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010161095A (ja) * | 2009-01-06 | 2010-07-22 | Rohm Co Ltd | 半導体装置の印字方法およびその印字方法が用いられて作製された半導体装置 |
JP2011054606A (ja) * | 2009-08-31 | 2011-03-17 | Yamaha Corp | 半導体パッケージ |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020021981A1 (ja) * | 2018-07-24 | 2020-01-30 | タツタ電線株式会社 | シールドパッケージ、及び、シールドパッケージの製造方法 |
JP6675524B1 (ja) * | 2018-07-24 | 2020-04-01 | タツタ電線株式会社 | シールドパッケージ、及び、シールドパッケージの製造方法 |
KR20200125748A (ko) * | 2018-07-24 | 2020-11-04 | 타츠타 전선 주식회사 | 차폐 패키지, 및 차폐 패키지의 제조 방법 |
KR102231055B1 (ko) | 2018-07-24 | 2021-03-22 | 타츠타 전선 주식회사 | 차폐 패키지, 및 차폐 패키지의 제조 방법 |
US11510349B2 (en) | 2018-07-24 | 2022-11-22 | Tatsuta Electric Wire & Cable Co., Ltd. | Shield package and method of manufacturing shield package |
JP2020035820A (ja) * | 2018-08-28 | 2020-03-05 | 太陽誘電株式会社 | モジュールおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5885342B2 (ja) | 2016-03-15 |
CN103390610B (zh) | 2016-04-13 |
CN103390610A (zh) | 2013-11-13 |
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