JP2013154406A - ロボットハンドおよびロボット - Google Patents
ロボットハンドおよびロボット Download PDFInfo
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- JP2013154406A JP2013154406A JP2012014387A JP2012014387A JP2013154406A JP 2013154406 A JP2013154406 A JP 2013154406A JP 2012014387 A JP2012014387 A JP 2012014387A JP 2012014387 A JP2012014387 A JP 2012014387A JP 2013154406 A JP2013154406 A JP 2013154406A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
【解決手段】上記の課題を解決するために、保持部と、基端部と、光センサと、反射部材とを備えるようにロボットハンドを構成する。保持部は、薄板状のワークを保持する。基端部は、先端部分に上記保持部を有し、末端部分はアームへ旋回可能に連結される。光センサは、上記基端部に設けられ、投光部および受光部を有する。反射部材は、上記保持部に設けられ、上記投光部からの光を反射することによってワークの保持領域を通過させて上記受光部へ至らせる光路を形成する。
【選択図】図3A
Description
まず、実施形態に係るロボットを備える搬送システムの全体構成について図1を用いて説明する。図1は、実施形態に係るロボットを備える搬送システム1の全体構成を示す模式図である。
図5Aは、ウェハW1,W2の保持状態を示す図である。また、図5B〜図5Dは、第2の実施形態に係るハンド11Aの模式側面図である。
図6は、第3の実施形態に係るハンド11Bの模式上面図である。図6に示すように、ハンド11Bは、反射部材(図示略)を有する先端側突起部113RAを備える点が、上述した各実施形態のハンド11およびハンド11Aとは異なる。
図7Aに光路V5として示すように、投光部115aから投出された光は、たとえば、途中で鉛直方向に沿ってその向きを変えつつ、受光部115bへ至ることとしてもよい。
2 基板搬送部
3 基板供給部
4 基板処理部
10 ロボット
11、11A、11B、11C ハンド
11a 上段ハンド
11b 下段ハンド
12 アーム部
12a 昇降部
12b 関節部
12c 第1アーム
12d 関節部
12e 第2アーム
12f 関節部
13 基台
20 筐体
21、22 側面
23 基台設置フレーム
24 フィルタユニット
25 脚具
26 プリアライナ装置
30 フープ
31 テーブル
40 処理装置
50 制御装置
60 上位装置
100 設置面
111 プレート
111L、111R 反射部材
112 基端部
113L、113R 先端側突起部
113LA、113RA 先端側突起部
114L、114R 基端側突起部
114LA、114RA 基端側突起部
114LB、114RB 基端側突起部
114LC、114RC 基端側突起部
114LD、114RD 基端側突起部
114LE、114RE 基端側突起部
114La、114Lb、114Ra、114Rb 開口部
114Lc、114Rc 光路孔
114Ld、114Rd 反射部材
115 光センサ
115a 投光部
115b 受光部
116 把持機構
116a 押圧部
Claims (10)
- 薄板状のワークを保持する保持部と、
先端部分に前記保持部を有し、末端部分がアームへ旋回可能に連結される基端部と、
前記基端部に設けられ、投光部および受光部を有する光センサと、
前記保持部に設けられ、前記投光部からの光を反射することによって前記ワークの保持領域を通過させて前記受光部へ至らせる光路を形成する反射部材と
を備えることを特徴とするロボットハンド。 - 前記反射部材は、
前記投光部からの光が前記ワークの側面から入射する前記光路を形成するように設けられること
を特徴とする請求項1に記載のロボットハンド。 - 前記反射部材は、
耐熱性を有する素材を含むこと
を特徴とする請求項1または2に記載のロボットハンド。 - 前記保持部は、
前記ワークへ接して該ワークを保持する複数の突起部を有しており、
前記反射部材は、
前記突起部のうち少なくとも2つに設けられること
を特徴とする請求項1、2または3に記載のロボットハンド。 - 前記反射部材は、
前記ワークの保持領域を通過する光路が、前記ワークの主面と平行となるように設けられること
を特徴とする請求項1〜4のいずれか一つに記載のロボットハンド。 - 前記反射部材は、
前記ワークの保持領域を通過する光路が、前記ワークの主面と非平行となるように設けられること
を特徴とする請求項1〜4のいずれか一つに記載のロボットハンド。 - 前記反射部材は、
前記ワークの保持領域を通過する光路が、前記ワークを上面視した場合の中心近傍を通過するように設けられること
を特徴とする請求項1〜6のいずれか一つに記載のロボットハンド。 - 前記突起部は、
該突起部の内部で連通する2つの開口部を側面に有するとともに、前記保持部の基端側の対称位置に1対が設けられ、
前記反射部材は、
前記光路が前記保持部の延在方向と垂直となるように前記開口部の連通する部位へ設けられること
を特徴とする請求項4、5または6に記載のロボットハンド。 - 前記突起部は、
前記保持部の先端側に少なくとも1つと、該保持部の基端側に1対とが設けられ、
前記反射部材は、
前記基端側の前記突起部の一方から前記先端側の前記突起部を経て前記基端側の前記突起部の他方へ至る順に前記光路が通過するように設けられること
を特徴とする請求項7に記載のロボットハンド。 - 請求項1〜9のいずれか一つに記載のロボットハンド
を備えることを特徴とするロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012014387A JP5601331B2 (ja) | 2012-01-26 | 2012-01-26 | ロボットハンドおよびロボット |
US13/606,024 US8820809B2 (en) | 2012-01-26 | 2012-09-07 | Robot hand and robot |
TW101136670A TW201334932A (zh) | 2012-01-26 | 2012-10-04 | 機械手及機械人 |
CN201210417437.6A CN103227129B (zh) | 2012-01-26 | 2012-10-26 | 机器人手和机器人 |
KR20120120313A KR101495960B1 (ko) | 2012-01-26 | 2012-10-29 | 로봇 핸드 및 로봇 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012014387A JP5601331B2 (ja) | 2012-01-26 | 2012-01-26 | ロボットハンドおよびロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013154406A true JP2013154406A (ja) | 2013-08-15 |
JP5601331B2 JP5601331B2 (ja) | 2014-10-08 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012014387A Expired - Fee Related JP5601331B2 (ja) | 2012-01-26 | 2012-01-26 | ロボットハンドおよびロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US8820809B2 (ja) |
JP (1) | JP5601331B2 (ja) |
KR (1) | KR101495960B1 (ja) |
CN (1) | CN103227129B (ja) |
TW (1) | TW201334932A (ja) |
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Also Published As
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TW201334932A (zh) | 2013-09-01 |
US8820809B2 (en) | 2014-09-02 |
US20130193703A1 (en) | 2013-08-01 |
KR101495960B1 (ko) | 2015-02-25 |
JP5601331B2 (ja) | 2014-10-08 |
KR20130086914A (ko) | 2013-08-05 |
CN103227129A (zh) | 2013-07-31 |
CN103227129B (zh) | 2015-10-14 |
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