JP2013140955A - Printed circuit board with built-in component and manufacturing method thereof - Google Patents

Printed circuit board with built-in component and manufacturing method thereof Download PDF

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JP2013140955A
JP2013140955A JP2012266910A JP2012266910A JP2013140955A JP 2013140955 A JP2013140955 A JP 2013140955A JP 2012266910 A JP2012266910 A JP 2012266910A JP 2012266910 A JP2012266910 A JP 2012266910A JP 2013140955 A JP2013140955 A JP 2013140955A
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component
printed circuit
circuit board
metal core
board according
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JP6189592B2 (en
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Jin Won Lee
イ・ジン・ウォン
Yul Kyo Chung
ジョン・ユル・キュ
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide: a printed circuit board with a built-in component and a manufacturing method thereof which efficiently radiate internal heat by: forming a metal core with a cavity formed by plating; inserting an electronic component inside; and electrically connecting the metal core with the electronic component through external metal patterns and vias.SOLUTION: The method includes: preparing a copper clad laminate (CCL) 100; forming a metal core 120 with a cavity 121 formed by plating on the top face of the copper clad laminate 100; inserting an electronic component 130 into the cavity 121; forming an insulating layer 150 on the top face of the electronic component 130 and on the top of the metal core 120; forming a metal layer 160 on the top of the insulating layer 150; and patterning a copper clad layer 103 formed on the bottom face side of the metal layer 160 and the metal core 120 in order to form patterns 180.

Description

本発明は、部品組込み型印刷回路基板及びその製造方法に関し、特に、防熱特性を向上すると共に反り現象を改善した、部品組込み型印刷回路基板及びその製造方法に関する。   The present invention relates to a component-embedded printed circuit board and a manufacturing method thereof, and more particularly, to a component-embedded printed circuit board and a method of manufacturing the same, which have improved heat resistance and improved warpage.

携帯電話を始めたＩＴ分野における電子機器は多機能化及び軽薄短小化されている。これに応じて、ＩＣ、半導体チップまたは能動素子及び受動素子などの電子部品が基板内に組み込まれるような技術が要求されている。最近では、多様な方式で基板内に部品を組み込む技術が開発されている。   Electronic devices such as mobile phones in the IT field are becoming multifunctional and light and thin. In response to this, there is a demand for a technique in which an electronic component such as an IC, a semiconductor chip, or an active element and a passive element is incorporated in a substrate. Recently, techniques for incorporating components into a substrate by various methods have been developed.

一般的な部品組込み型印刷回路基板は、通常、基板の絶縁層にキャビティを形成し、該キャビティ内に各種素子、ＩＣ及び半導体チップなどの電子部品を挿入する。その後、該キャビティ内部と電子部品の挿入された絶縁層上とにプリプレグなどの接着性樹脂を塗布し、電子部品が固定されると共に絶縁層を形成し、該絶縁層にビアホールまたは貫通ホールが形成され、電子部品が外部機器と導通するようにする。   In general component-embedded printed circuit boards, a cavity is usually formed in an insulating layer of the substrate, and electronic components such as various elements, ICs, and semiconductor chips are inserted into the cavity. After that, an adhesive resin such as a prepreg is applied to the inside of the cavity and the insulating layer in which the electronic component is inserted, and the electronic component is fixed and the insulating layer is formed, and a via hole or a through hole is formed in the insulating layer. The electronic component is connected to an external device.

ビアホールまたは貫通ホールの内部及び上部には、めっき層及びパターンが形成され、基板に内蔵された電子部品との電気的接続手段として利用される。絶縁層を基板の上下面に順次積層することによって、電子部品の内蔵された多層印刷回路基板が製作される。   A plating layer and a pattern are formed in and above the via hole or the through hole, and are used as an electrical connection means with an electronic component built in the substrate. By sequentially laminating insulating layers on the upper and lower surfaces of the substrate, a multilayer printed circuit board with built-in electronic components is manufactured.

韓国公開特許第２００８-００７９３８８号公報Korean Published Patent No. 2008-0079388

このような電子部品組込み型印刷回路基板は、電子部品の外部が主に絶縁層によって取り囲まれているため、電子部品で発生する熱を効果よく逃しにくいという不都合がある。   Such an electronic component-embedded printed circuit board has a disadvantage that heat generated in the electronic component is not easily released because the outside of the electronic component is mainly surrounded by an insulating layer.

このような問題点を解決するために、電子部品の内蔵されるコアをメタル材料で形成しているが、通常、メタルコアを用いる場合、メタル材料のコア基板に貫通ホールを形成し、その内部に電子部品が挿入されるため、該貫通ホールに電子部品を挿入する時、電子部品を支持するための別途のキャリアが必要になり、該キャリアを用いる印刷回路基板の製作時に製作工程が難しく、工数が増加するという不都合がある。   In order to solve such problems, the core in which the electronic component is built is formed of a metal material. Normally, when a metal core is used, a through hole is formed in the core substrate of the metal material and the inside is formed. Since an electronic component is inserted, when an electronic component is inserted into the through-hole, a separate carrier for supporting the electronic component is required, and the manufacturing process is difficult when manufacturing a printed circuit board using the carrier. There is a disadvantage that increases.

本発明は上記の問題に鑑みて成されたものであって、めっきによってキャビティが形成されたメタルコアを形成し、内部に電子部品を挿入し、該メタルコアと電子部品とが外部の金属パターン及びビアを通じて電気的に接続されることによって、内部の熱が効率よく排出されるような部品組込み型印刷回路基板及びその製造方法を提供することに、その目的がある。   The present invention has been made in view of the above problems, and forms a metal core having a cavity formed by plating, inserts an electronic component therein, and the metal core and the electronic component are external metal patterns and vias. It is an object of the present invention to provide a component-embedded printed circuit board and a method for manufacturing the same, in which the internal heat is efficiently discharged by being electrically connected to each other.

また、本発明の他の目的は、メタルコアの上下部に積層される絶縁層の厚さを同じくすることによって、印刷回路基板の製作工程時に反り現象を改善することができる、部品組込み型印刷回路基板及びその製造方法を提供することにある。   Another object of the present invention is to provide a component-embedded printed circuit that can improve the warping phenomenon during the manufacturing process of the printed circuit board by using the same thickness of the insulating layer laminated on the upper and lower parts of the metal core. It is providing a board | substrate and its manufacturing method.

上記課題を解決するために、本発明によれば、銅箔積層板（ＣＣＬ）を準備するステップと、該銅箔積層板の上面にめっきによってキャビティが設けられたメタルコアを形成するステップと、前記キャビティに電子部品を挿入するステップと、前記電子部品の上面及び前記メタルコアの上部に絶縁層を形成するステップと、前記絶縁層の上部に金属層を形成し、前記金属層と前記メタルコアの下面側に形成された銅箔層をエッチングしてパターンを形成するステップと、を含む部品組込み型印刷回路基板の製造方法が提供される。   In order to solve the above problems, according to the present invention, a step of preparing a copper foil laminate (CCL), a step of forming a metal core having a cavity provided by plating on the upper surface of the copper foil laminate, Inserting an electronic component into the cavity; forming an insulating layer on the upper surface of the electronic component and the upper portion of the metal core; forming a metal layer on the upper portion of the insulating layer; and lower side of the metal layer and the metal core Etching the copper foil layer formed on the substrate to form a pattern, and a method of manufacturing a component-embedded printed circuit board.

前記メタルコアを形成するステップは、前記銅箔積層板の上下面にドライフィルム（Ｄ／Ｆ）をラミネーションするステップと、上部ドライフィルムを露光／現像してキャビティ形成領域以外の領域を除去するステップと、前記キャビティ形成領域以外の領域にめっき層を成長させるステップと、前記キャビティ形成領域のドライフィルムを除去して前記キャビティを形成するステップと、をさらに含む。   The step of forming the metal core includes laminating a dry film (D / F) on the upper and lower surfaces of the copper foil laminate, and exposing / developing the upper dry film to remove regions other than the cavity forming region. And a step of growing a plating layer in a region other than the cavity forming region, and removing the dry film in the cavity forming region to form the cavity.

前記ドライフィルムをラミネーションするステップにて、前記ドライフィルムは、前記銅箔積層板の上面のみに形成される。   In the step of laminating the dry film, the dry film is formed only on the upper surface of the copper foil laminate.

前記キャビティに電子部品を挿入するステップにて、前記電子部品は、接着手段を介して前記キャビティの底面に固定される。該接着手段には、接着剤または接着フィルムが挙げられる。また、該接着手段は、熱伝導性フィラーが含まれた接着剤で構成されてもよく、熱伝導性材料の接着フィルムで構成されてもよい。   In the step of inserting the electronic component into the cavity, the electronic component is fixed to the bottom surface of the cavity via an adhesive means. The adhesive means includes an adhesive or an adhesive film. Moreover, this adhesion | attachment means may be comprised with the adhesive agent in which the heat conductive filler was contained, and may be comprised with the adhesive film of a heat conductive material.

また、前記メタルコアの上部に絶縁層を形成するステップにて、前記絶縁層は、電子部品の挿入される前記メタルコアの下面に形成された前記銅箔積層板を構成する絶縁材と同じ厚さで形成される。   Further, in the step of forming an insulating layer on the metal core, the insulating layer has the same thickness as the insulating material constituting the copper foil laminate formed on the lower surface of the metal core into which the electronic component is inserted. It is formed.

前述のように、本発明の部品組込み型印刷回路基板及びその製造方法によれば、電子部品の挿入されるコアがメタル材料で構成され、電子部品とメタル材料のコアとがビアなどを通じて電気的に接続されることによって、該電子部品の防熱特性をより一層向上することができるという効果を奏する。   As described above, according to the component-embedded printed circuit board and the manufacturing method thereof of the present invention, the core into which the electronic component is inserted is made of a metal material, and the electronic component and the core of the metal material are electrically connected via vias or the like. By being connected to, there is an effect that the heat-insulating property of the electronic component can be further improved.

また、本発明によれば、メタルコアの上下部に積層された絶縁層の厚さを同じく形成すると共にメタルコアを使うことによって、基板製作時に反り（ｗａｒｐａｇｅ）が発生することを防止することができるという効果を奏する。   In addition, according to the present invention, it is possible to prevent warpage from occurring during the manufacture of a substrate by forming the insulating layers stacked on the upper and lower portions of the metal core in the same manner and using the metal core. There is an effect.

また、本発明によれば、電子部品の内蔵された印刷回路基板の製作時に銅箔積層板（ＣＣＬ）の上部の銅箔層上にめっきによってメタルコアを形成することによって、該メタルコアに形成されたキャビティ内に電子部品を挿入する時、銅箔層上に電子部品が支持されるようにすることによって、電子部品を支持する別途のキャリアと該キャリアを用いる電子部品挿入工程及びキャリア除去工程を略することができるため、製造工程を縮め、生産性を向上させることができるという効果を奏する。   Also, according to the present invention, the metal core is formed by plating on the copper foil layer on the upper part of the copper foil laminate (CCL) at the time of manufacturing the printed circuit board in which the electronic component is embedded. When an electronic component is inserted into the cavity, the electronic component is supported on the copper foil layer, so that an additional carrier for supporting the electronic component and an electronic component inserting step and a carrier removing step using the carrier are omitted. Therefore, the manufacturing process can be shortened and the productivity can be improved.

本発明による印刷回路基板の製造工程における、銅箔積層板が用意されたステップを示す断面図である。It is sectional drawing which shows the step in which the copper foil laminated board was prepared in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、銅箔積層板にドライフィルムが積層されたステップを示す断面図である。It is sectional drawing which shows the step by which the dry film was laminated | stacked on the copper foil laminated board in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、ドライフィルムの一部が除去されたステップを示す断面図である。It is sectional drawing which shows the step in which a part of dry film was removed in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、メタルコアを形成するステップを示す断面図である。It is sectional drawing which shows the step which forms a metal core in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、メタルコアに電子部品が挿入されるステップを示す断面図である。It is sectional drawing which shows the step in which an electronic component is inserted in a metal core in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、メタルコアの上部にビルドアップするステップを示す断面図である。It is sectional drawing which shows the step built up on the upper part of a metal core in the manufacturing process of the printed circuit board by this invention. 本発明による印刷回路基板の製造工程における、絶縁層上にパターンを形成するステップを示す断面図である。It is sectional drawing which shows the step which forms a pattern on an insulating layer in the manufacturing process of the printed circuit board by this invention.

以下、本発明の好適な実施の形態は図面を参考にして詳細に説明する。次に示される各実施の形態は当業者にとって本発明の思想が十分に伝達されることができるようにするために例として挙げられるものである。従って、本発明は以下に示している各実施の形態に限定されることなく他の形態で具体化されることができる。そして、図面において、装置の大きさ及び厚さなどは便宜上誇張して表現されることができる。明細書全体に渡って同一の参照符号は同一の構成要素を示している。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Each embodiment shown below is given as an example so that those skilled in the art can sufficiently communicate the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, but can be embodied in other forms. In the drawings, the size and thickness of the device can be exaggerated for convenience. Like reference numerals refer to like elements throughout the specification.

本明細書で使われた用語は、実施形態を説明するためのものであって、本発明を制限しようとするものではない。本明細書において、単数形は文句で特別に言及しない限り複数形も含む。明細書で使われる「含む」とは、言及された構成要素、ステップ、動作及び/又は素子は、一つ以上の他の構成要素、ステップ、動作及び／又は素子の存在または追加を排除しないことに理解されたい。   The terminology used herein is for the purpose of describing embodiments and is not intended to limit the invention. In this specification, the singular includes the plural unless specifically stated otherwise. As used herein, “includes” a stated component, step, action, and / or element does not exclude the presence or addition of one or more other components, steps, actions, and / or elements. Want to be understood.

本発明による部品組込み型印刷回路基板の製造方法は、両面に銅箔層が形成された銅箔積層板を用いて、該銅箔積層板上にめっきによって金属層を成長させてメタルコアを形成し、該メタルコア内に電子部品を挿入し、防熱特性が向上された部品組込み型印刷回路基板を製造する。   A method of manufacturing a component-embedded printed circuit board according to the present invention uses a copper foil laminate having a copper foil layer formed on both sides, and a metal layer is grown on the copper foil laminate by plating to form a metal core. Then, an electronic component is inserted into the metal core to manufacture a component-embedded printed circuit board with improved heat resistance.

図１〜図７は各々、本発明による部品組込み型印刷回路基板の製造方法を示す工程図である。   1 to 7 are process diagrams illustrating a method of manufacturing a component-embedded printed circuit board according to the present invention.

まず、図１は、本発明による印刷回路基板の製造工程における、銅箔積層板が用意したステップを示す断面図である。同図の如く、本発明による部品組込み型印刷回路基板は、まず、絶縁材１０１の両面に銅箔層１０２，１０３が被覆された銅箔積層板１００（ＣＣＬ：Ｃｏｐｐｅｒ Ｃｌａｄｄｅｄ Ｌａｙｅｒ）を準備する。   First, FIG. 1 is a cross-sectional view showing steps prepared by a copper foil laminate in a manufacturing process of a printed circuit board according to the present invention. As shown in the figure, the component-embedded printed circuit board according to the present invention first prepares a copper clad laminate 100 (CCL: Copper Cladded Layer) in which copper foil layers 102 and 103 are coated on both surfaces of an insulating material 101.

図２は、本発明による印刷回路基板の製造工程における、銅箔積層板にドライフィルムを積層するステップを示す断面図である。同図の如く、銅箔積層板１００の上下面に所定の厚さでドライフィルム１１０をラミネーションする。該ドライフィルム１１０は、銅箔積層板１００の上面のみに積層されてもよい。ドライフィルム１００が銅箔積層板１００上のみに積層可能な理由は、ドライフィルム１１０を通じて後続工程で電子部品の内蔵されるキャビティが形成されたメタルコアが、銅箔積層板１００上でめっきによって形成されるからである。   FIG. 2 is a cross-sectional view showing a step of laminating a dry film on a copper foil laminate in a process for producing a printed circuit board according to the present invention. As shown in the figure, a dry film 110 is laminated on the upper and lower surfaces of the copper foil laminate 100 with a predetermined thickness. The dry film 110 may be laminated only on the upper surface of the copper foil laminate 100. The reason why the dry film 100 can be laminated only on the copper foil laminate 100 is that a metal core having a cavity in which an electronic component is built in a subsequent process through the dry film 110 is formed on the copper foil laminate 100 by plating. This is because that.

前記銅箔積層板１００上にライネーションされたドライフィルム１１０の上面には、パターン形状によって製作されるマスク１１１が積層される。このマスク１１１は、後続工程で形成されるべきキャビティ形成領域を指定する大きさ及び面積で設けられる。   A mask 111 manufactured according to a pattern shape is laminated on the upper surface of the dry film 110 lined on the copper foil laminate 100. The mask 111 is provided with a size and an area that specify a cavity forming region to be formed in a subsequent process.

図３は、本発明による印刷回路基板の製造工程における、ドライフィルムの一部を除去するステップを示す断面図である。同図の如く、銅箔積層板１００に積層されたドライフィルム１１０の一部を露光／現象によって除去する。ドライフィルム１１０は、マスク１１１が覆われた領域を除いた箇所が露光・現象工程によって除去される。マスク１１１が覆われて銅箔積層板１００上に残っているドライフィルム１１０の幅は、後に形成されるべきキャビティ及び該キャビティ内部に挿入される電子部品の大きさによって決まる。   FIG. 3 is a cross-sectional view showing a step of removing a part of the dry film in the manufacturing process of the printed circuit board according to the present invention. As shown in the figure, a part of the dry film 110 laminated on the copper foil laminate 100 is removed by exposure / phenomenon. The dry film 110 is removed by the exposure / phenomenon process except for the area where the mask 111 is covered. The width of the dry film 110 that is covered with the mask 111 and remains on the copper foil laminate 100 is determined by the size of the cavity to be formed later and the electronic components inserted into the cavity.

図４は、本発明による印刷回路基板の製造工程における、メタルコアを形成するステップを示す断面図である。同図の如く、銅箔積層板１００のドライフィルム１１０が除去された領域にめっき工程を行ってメタルコア１２０を形成する。詳しくは、ドライフィルム１１０が除去された銅箔積層板１００の銅箔層１０２上にめっき層１０２ａを成長させ、該銅箔積層板１００の銅箔層１０２と一体を成すメタルコア１２０を形成する。   FIG. 4 is a cross-sectional view showing steps of forming a metal core in the manufacturing process of the printed circuit board according to the present invention. As shown in the figure, a metal core 120 is formed by performing a plating process on the area of the copper foil laminate 100 from which the dry film 110 has been removed. Specifically, a plating layer 102a is grown on the copper foil layer 102 of the copper foil laminate 100 from which the dry film 110 has been removed, and a metal core 120 that is integrated with the copper foil layer 102 of the copper foil laminate 100 is formed.

前記めっき層１０２ａは、望ましくは、ドライフィルム１１０の高さと同じ高さで形成される。望ましくは、めっき層１０２ａは、電子部品が内蔵され、且つ薄型の基板特性を満足するように３０〜４０μｍの厚さで形成される。   The plating layer 102a is preferably formed at the same height as the dry film 110. Desirably, the plating layer 102a is formed with a thickness of 30 to 40 [mu] m so that electronic components are incorporated and a thin substrate characteristic is satisfied.

このようにドライフィルム１１０が露光／現象によって除去された領域にめっき工程によってメタルコア１２０を形成すると、該めっき工程によってめっき厚さを容易に制御することができるという長所がある。即ち、従来のメタルコアを含む部品組込み型印刷回路基板の場合には、その製作工程で通常３０〜４０μｍ厚さのメタルコアを用いる電子部品を挿入する時、該電子部品を支持する底面を有するようにメタルコアを加工することが難しい。そのため、メタルコアの一部分に貫通孔を形成し、該貫通孔を通じて電子部品を挿入し、該電子部品を別に支持するキャリアをメタルコアの下面に付着した状態で基板製造工程を行わなければならない。また、電子部品の挿入が完了すると、キャリアを除去する工程を経らなければならない。そのため、従来のメタルコアを用いる部品組込み型印刷回路基板は、その製造工程が複雑で、生産性が低下するという不都合がある。   As described above, when the metal core 120 is formed in the region where the dry film 110 is removed by exposure / phenomenon by the plating process, the plating thickness can be easily controlled by the plating process. That is, in the case of a printed circuit board with a built-in component including a conventional metal core, when an electronic component using a metal core with a thickness of typically 30 to 40 μm is inserted in the manufacturing process, it has a bottom surface that supports the electronic component. It is difficult to process a metal core. Therefore, a substrate manufacturing process must be performed in a state where a through hole is formed in a part of the metal core, an electronic component is inserted through the through hole, and a carrier that supports the electronic component is attached to the lower surface of the metal core. Further, when the insertion of the electronic component is completed, a process for removing the carrier must be performed. Therefore, the conventional component-embedded printed circuit board using a metal core has a disadvantage that its manufacturing process is complicated and productivity is lowered.

しかし、本発明では、銅箔積層板１００の上面にめっきによって銅箔層１０２と一体を成すメタルコア１２０を形成することによって、銅箔積層板１００の銅箔層１０２が電子部品を支持する役割をして、別途のキャリアを具備しなくても良い。また、メタルコア１２０に挿入された電子部品の下面が銅箔層１０２に接触支持されることによって、防熱効率を向上させることができる。   However, in the present invention, by forming the metal core 120 integrally formed with the copper foil layer 102 by plating on the upper surface of the copper foil laminate 100, the copper foil layer 102 of the copper foil laminate 100 plays a role of supporting electronic components. Thus, it is not necessary to provide a separate carrier. In addition, since the lower surface of the electronic component inserted into the metal core 120 is supported by contact with the copper foil layer 102, the heat insulation efficiency can be improved.

前記銅箔積層板１００の銅箔層１０２に形成されためっき層１０２ａは、銅（Ｃｕ）材料で形成される。   The plating layer 102a formed on the copper foil layer 102 of the copper foil laminate 100 is formed of a copper (Cu) material.

前記銅箔積層板１００上にめっきが行われる工程は、電解めっきまたは無電解めっきによって行われてもよい。   The step of plating on the copper foil laminate 100 may be performed by electrolytic plating or electroless plating.

このように、前記銅箔積層板１００上にめっきによるメタルコア１２０が形成されれば、銅箔積層板１００の上下面に形成されたドライフィルム１１０を除去し、銅箔積層板１００上にキャビティ１２１が形成されたメタルコア１２０が提供される。   As described above, when the metal core 120 is formed by plating on the copper foil laminate 100, the dry film 110 formed on the upper and lower surfaces of the copper foil laminate 100 is removed, and the cavity 121 is formed on the copper foil laminate 100. A metal core 120 is provided.

一方、前記ドライフィルムを除去するステップと前記メタルコアを形成するステップとは、単位印刷回路基板がグループをなすパネル形態で行われる。即ち、パネル形態で提供される銅箔積層板の上下面に全体としてドライフィルムを積層し、一定間隔でキャビティが形成されるべき領域にマスクを設けて、ドライフィルムを露光／現像することによって、一部のドライフィルムを除去する。続いて、ドライフィルムの除去された領域に、めっき工程によって銅材料のめっき層１０２ａを満たすことによってパネルで製作する。その結果、工程処理に伴う加工費を節減し、パネル方式で製作後大量の単位印刷回路基板で製作可能になって、生産性が向上する。   Meanwhile, the step of removing the dry film and the step of forming the metal core are performed in a panel form in which unit printed circuit boards form a group. That is, by laminating a dry film as a whole on the upper and lower surfaces of a copper foil laminate provided in a panel form, providing a mask in a region where cavities should be formed at regular intervals, and exposing / developing the dry film, Remove some dry film. Subsequently, the area from which the dry film is removed is made of a panel by filling the plated layer 102a of the copper material by a plating process. As a result, the processing cost associated with the process processing is reduced, and it becomes possible to manufacture with a large number of unit printed circuit boards after manufacturing by the panel method, thereby improving productivity.

図５は、本発明による印刷回路基板の製造工程における、メタルコアに電子部品を挿入するステップを示す断面図である。同図の如く、前記メタルコア１２０内のドライフィルム１１０を除去してキャビティ１２１を形成する。   FIG. 5 is a cross-sectional view showing a step of inserting an electronic component into the metal core in the manufacturing process of the printed circuit board according to the present invention. As shown in the figure, the cavity 121 is formed by removing the dry film 110 in the metal core 120.

また、前記キャビティ１２１内に電子部品１３０を挿入し、該電子部品１３０をキャビティ１２１内の底面、即ち銅箔積層板１００の上部銅箔層１０２上に密着結合して固定させることができる。電子部品１３０は、キャビティ１２１内の底面に接着手段１４０を介して固定される。   Further, the electronic component 130 can be inserted into the cavity 121, and the electronic component 130 can be tightly coupled and fixed onto the bottom surface of the cavity 121, that is, the upper copper foil layer 102 of the copper foil laminate 100. The electronic component 130 is fixed to the bottom surface in the cavity 121 through the bonding means 140.

前記電子部品１３０は、ＩＣ、半導体チップ、受動素子及び能動素子を含む多様な形態のチップで構成されてもよい。   The electronic component 130 may be formed of various types of chips including an IC, a semiconductor chip, a passive element, and an active element.

前記接着手段１４０には、接着剤、接着フィルムなどが挙げられる。接着手段１４０として液相の接着剤を使う場合、伝導性ペーストが用いられてもよく、この他に熱伝導性の優秀な材料で形成されてもよい。また、前記伝導性ペースト内に熱伝導フィラーが含まれたペーストが適用されてもよい。   Examples of the bonding means 140 include an adhesive and an adhesive film. In the case where a liquid phase adhesive is used as the bonding means 140, a conductive paste may be used, or a material having excellent heat conductivity may be used. Moreover, the paste in which the heat conductive filler was contained in the said conductive paste may be applied.

また、前記接着手段１４０として接着フィルムを使う場合、望ましくは、熱伝導性材料の接着フィルムが適用される。   When an adhesive film is used as the adhesive means 140, an adhesive film made of a heat conductive material is preferably used.

前記接着手段１４０として熱伝導性材料または熱伝導フィラーの含まれるペーストを用いる理由は、電子部品１４０のキャビティ１２１内への固定時、メタルコア１２０の底面と電子部品１４０との接触面積を増やすと共に、電子部品で発生する熱を金属材料の底面及びメタルコア１２０を通じて防熱させる効果を高めるためである。   The reason for using a paste containing a heat conductive material or a heat conductive filler as the bonding means 140 is to increase the contact area between the bottom surface of the metal core 120 and the electronic component 140 when the electronic component 140 is fixed in the cavity 121, and This is to enhance the effect of preventing heat generated in the electronic component through the bottom surface of the metal material and the metal core 120.

図６は、本発明による印刷回路基板の製造工程における、メタルコアの上部にビルドアップするステップを示す断面図である。同図の如く、電子部品１３０の挿入されたキャビティ１２１とメタルコア１２０の上面に絶縁層１５０を形成し、この絶縁層１５０の上部に金属層１６０をさらに形成する。この金属層１６０は、銅箔積層板１００の下面に形成された銅箔層１０３と同じ銅材料で形成される。そして、前記絶縁層１５０は、メタルコア１２０の下面の銅箔積層板１００に形成された絶縁材１０１と同じ厚さで形成される。よって、前記メタルコア１２０の上下部に形成された絶縁材料の厚さを同じくすることによって、印刷回路基板の製作工程において反りの発生を抑制することができる。   FIG. 6 is a cross-sectional view showing a build-up step on the upper part of the metal core in the manufacturing process of the printed circuit board according to the present invention. As shown in the figure, an insulating layer 150 is formed on the upper surface of the cavity 121 and the metal core 120 into which the electronic component 130 is inserted, and a metal layer 160 is further formed on the insulating layer 150. The metal layer 160 is formed of the same copper material as the copper foil layer 103 formed on the lower surface of the copper foil laminate 100. The insulating layer 150 is formed with the same thickness as the insulating material 101 formed on the copper foil laminate 100 on the lower surface of the metal core 120. Therefore, by making the thickness of the insulating material formed on the upper and lower portions of the metal core 120 the same, it is possible to suppress the occurrence of warpage in the printed circuit board manufacturing process.

前記絶縁層１５０は、キャビティ１２１の内部にも流れ込まれ、キャビティ１２１内に挿入された電子部品１３０の周辺部に満たされることによって、該キャビティ１２１内に挿入された電子部品１３０が固定されることができる。   The insulating layer 150 also flows into the cavity 121 and fills the periphery of the electronic component 130 inserted into the cavity 121, thereby fixing the electronic component 130 inserted into the cavity 121. Can do.

図７は、本発明による印刷回路基板の製造工程における、絶縁層上に回路パターンを形成するステップを示す断面図である。同図の如く、メタルコア１２０の上下面に形成された絶縁層１５０及び絶縁材１０１を貫くビア１７０を形成する。このビア１７０を形成する方法は、多様な方式が適用されるが、代表的には、絶縁層１５０と絶縁材１０１とを貫いてビア１７０の底面を通じて電子部品１３０の電極及びメタルコア１２０の上面が露出するようなレーザー加工が用いられる。   FIG. 7 is a cross-sectional view showing a step of forming a circuit pattern on an insulating layer in the manufacturing process of the printed circuit board according to the present invention. As shown in the figure, vias 170 are formed through the insulating layer 150 and the insulating material 101 formed on the upper and lower surfaces of the metal core 120. Various methods can be used to form the via 170, but typically, the electrode of the electronic component 130 and the upper surface of the metal core 120 pass through the bottom surface of the via 170 through the insulating layer 150 and the insulating material 101. Exposed laser processing is used.

また、ビア１７０の内部は、フィル（ｆｉｌｌ）めっきによってメタルコア１２０及び該メタルコア１２０の内部に挿入された電子部品１３０が、銅箔層１０３及び金属層１６０に電気的に接続され、層間接続が構成されることができる。   In addition, in the via 170, the metal core 120 and the electronic component 130 inserted into the metal core 120 by fill plating are electrically connected to the copper foil layer 103 and the metal layer 160, thereby forming an interlayer connection. Can be done.

また、メタルコア１２０の上下面の絶縁層１５０及び絶縁材１０１に形成されたビア１７０に電気的に接続されるように、絶縁層１５０及び絶縁材１０１上に形成された金属層１６０及び銅箔層１０３を各々パターニングし、所定形態の回路パターン１８０を形成する。   In addition, the metal layer 160 and the copper foil layer formed on the insulating layer 150 and the insulating material 101 so as to be electrically connected to the insulating layer 150 on the upper and lower surfaces of the metal core 120 and the via 170 formed in the insulating material 101. Each pattern 103 is patterned to form a circuit pattern 180 having a predetermined form.

前記金属層１６０及び銅箔層１０３の回路パターン１８０を形成する工程は、エッチングによるテンティング（ｔｅｎｔｉｎｇ）工程によって行われてもよく、薄い銅フォイル上に化学銅処理後にドライフィルムを通じてパターンが形成されるべき部分をオープンさせて電解めっきが行われるＭＳＡＰ（Ｍｏｄｉｆｉｅｄ Ｓｅｍｉ-Ａｄｄｉｔｉｖｅ Ｐｒｏｃｅｓｓ）工程によって行われてもよい。   The step of forming the circuit pattern 180 of the metal layer 160 and the copper foil layer 103 may be performed by a tenting process by etching, and a pattern is formed on a thin copper foil through a dry film after chemical copper treatment. It may be performed by an MSAP (Modified Semi-Additive Process) process in which electrolytic plating is performed by opening a portion to be formed.

また、他の工程として、絶縁層上に直接化学銅処理後にドライフィルムを通じてパターンが形成されるべき部分をオープンさせて電解めっきが行われるＳＡＰ（Ｓｅｍｉ-Ａｄｄｉｔｉｖｅ Ｐｒｏｃｅｓｓ）工程によって行われてもよい。   In addition, as another process, it may be performed by a SAP (Semi-Additive Process) process in which electrolytic plating is performed by opening a portion where a pattern is to be formed through a dry film directly after chemical copper treatment on the insulating layer.

今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、前記した実施の形態の説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。   The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

１００ 銅箔積層板
１０１ 絶縁材
１０２，１０３ 銅箔層
１１０ ドライフィルム
１２０ メタルコア
１２１ キャビティ
１３０ 電子部品
１４０ 接着手段
１５０ 絶縁層
１６０ 金属層
１７０ ビア
１８０ 回路パターン DESCRIPTION OF SYMBOLS 100 Copper foil laminated board 101 Insulating material 102,103 Copper foil layer 110 Dry film 120 Metal core 121 Cavity 130 Electronic component 140 Adhesive means 150 Insulating layer 160 Metal layer 170 Via 180 Circuit pattern

Claims (22)

銅箔積層板（ＣＣＬ）を準備するステップと、
銅箔積層板の上面にめっきによってキャビティが設けられたメタルコアを形成するステップと、
前記キャビティに電子部品を挿入するステップと、
前記電子部品の上面及び前記メタルコアの上部に絶縁層を形成するステップと、
前記絶縁層の上部に金属層を形成し、前記金属層と前記メタルコアの下面側に形成された銅箔層とをパターニングしてパターンを形成するステップと
を含む部品組込み型印刷回路基板の製造方法。 Preparing a copper foil laminate (CCL);
Forming a metal core provided with a cavity by plating on the upper surface of the copper foil laminate;
Inserting an electronic component into the cavity;
Forming an insulating layer on the top surface of the electronic component and the top of the metal core;
Forming a metal layer on the insulating layer; and patterning the metal layer and a copper foil layer formed on the lower surface side of the metal core to form a pattern. . 前記メタルコアを形成するステップは、
前記銅箔積層板の上下面にドライフィルム（Ｄ／Ｆ）をラミネーションするステップと、
上部ドライフィルムを露光／現像してキャビティ形成領域以外の領域を除去するステップと、
前記キャビティ形成領域以外の領域にめっき層を成長させるステップと、
前記キャビティ形成領域のドライフィルムを除去して前記キャビティを形成するステップと
をさらに含む請求項１に記載の部品組込み型印刷回路基板の製造方法。 The step of forming the metal core includes:
Laminating a dry film (D / F) on the upper and lower surfaces of the copper foil laminate;
Exposing / developing the upper dry film to remove areas other than the cavity forming area;
Growing a plating layer in a region other than the cavity forming region;
The method of manufacturing a component-embedded printed circuit board according to claim 1, further comprising: removing the dry film in the cavity forming region to form the cavity. 前記ドライフィルムをラミネーションするステップにて、
前記ドライフィルムは、前記銅箔積層板の上面のみに形成される請求項２に記載の部品組込み型印刷回路基板の製造方法。 In the step of laminating the dry film,
The method for manufacturing a component-embedded printed circuit board according to claim 2, wherein the dry film is formed only on an upper surface of the copper foil laminate. 前記キャビティ形成領域以外の領域にめっき層を成長させるステップにて、
前記めっき層は、電解めっきまたは無電解めっきによって形成される請求項２に記載の部品組込み型印刷回路基板の製造方法。 In the step of growing a plating layer in a region other than the cavity forming region,
The method for manufacturing a component-embedded printed circuit board according to claim 2, wherein the plating layer is formed by electrolytic plating or electroless plating. 前記銅箔積層板上に形成される前記めっき層は、銅材料で形成される請求項２に記載の部品組込み型印刷回路基板の製造方法。   The method for manufacturing a component-embedded printed circuit board according to claim 2, wherein the plating layer formed on the copper foil laminate is formed of a copper material. 前記キャビティに電子部品を挿入するステップにて、
前記電子部品は、接着手段が介して前記キャビティの底面に固定される請求項１に記載の部品組込み型印刷回路基板の製造方法。 In the step of inserting an electronic component into the cavity,
The method of manufacturing a component-embedded printed circuit board according to claim 1, wherein the electronic component is fixed to a bottom surface of the cavity via an adhesive unit. 前記接着手段は、接着剤または接着フィルムのうちのいずれか一つで構成された請求項６に記載の部品組込み型印刷回路基板の製造方法。   The method for manufacturing a component-embedded printed circuit board according to claim 6, wherein the bonding means is formed of any one of an adhesive and an adhesive film. 前記接着剤は、熱伝導フィラーの含まれた伝導性ペーストで構成された請求項７に記載の部品組込み型印刷回路基板の製造方法。   The method of manufacturing a component-embedded printed circuit board according to claim 7, wherein the adhesive is made of a conductive paste containing a heat conductive filler. 前記接着フィルムは、熱伝導性材料で構成される請求項７に記載の部品組込み型印刷回路基板の製造方法。   The method for manufacturing a component-embedded printed circuit board according to claim 7, wherein the adhesive film is made of a heat conductive material. 前記メタルコアの上部に絶縁層を形成するステップにて、
前記絶縁層は、前記電子部品の挿入される前記メタルコアの下面に形成された前記銅箔積層板を構成する絶縁材と同じ厚さで形成される請求項１に記載の部品組込み型印刷回路基板の製造方法。 In the step of forming an insulating layer on the metal core,
2. The component-embedded printed circuit board according to claim 1, wherein the insulating layer is formed with the same thickness as an insulating material constituting the copper foil laminate formed on a lower surface of the metal core into which the electronic component is inserted. Manufacturing method. キャビティを設けるメタルコアと、
前記キャビティ内の下面上に支持されるように組み込まれる電子部品と、
前記電子部品が覆われるように前記メタルコアの上面に積層される絶縁層と、
前記絶縁層上に形成されたパターンと、
前記メタルコアの下面に積層された絶縁材上に形成されたパターンと
を含む部品組込み型印刷回路基板。 A metal core providing a cavity;
An electronic component incorporated to be supported on a lower surface in the cavity;
An insulating layer laminated on the upper surface of the metal core so that the electronic component is covered;
A pattern formed on the insulating layer;
A component-embedded printed circuit board including a pattern formed on an insulating material laminated on a lower surface of the metal core. 前記メタルコアは、
前記電子部品が取り付けられ支持される銅箔層と、
前記銅箔層上のめっき層と
を含む請求項１１に記載の部品組込み型印刷回路基板。 The metal core is
A copper foil layer on which the electronic component is mounted and supported;
The component-embedded printed circuit board according to claim 11, further comprising a plating layer on the copper foil layer. 前記メタルコアは、前記絶縁材上に形成された前記銅箔層の上面に前記めっき層の成長によって形成された請求項１１に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 11, wherein the metal core is formed by growing the plating layer on an upper surface of the copper foil layer formed on the insulating material. 前記メタルコアは、前記銅箔層上に前記キャビティの形成領域を除いた領域に前記めっき層の成長によって形成された請求項１３に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 13, wherein the metal core is formed on the copper foil layer by growing the plating layer in a region excluding the formation region of the cavity. 前記めっき層は、銅材料で形成される請求項１３に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 13, wherein the plating layer is formed of a copper material. 前記メタルコアの前記めっき層の成長高さは、前記電子部品の上面の高さ以上である請求項１３に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 13, wherein a growth height of the plating layer of the metal core is equal to or higher than a height of an upper surface of the electronic component. 前記めっき層は、電解めっきまたは無電解めっきによって形成される請求項１３に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 13, wherein the plating layer is formed by electrolytic plating or electroless plating. 前記電子部品は、接着手段が介して前記キャビティの底面の前記銅箔層上に固定される請求項１１に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 11, wherein the electronic component is fixed on the copper foil layer on a bottom surface of the cavity through an adhesive unit. 前記接着手段は、接着剤または接着フィルムのうちのいずれか一つで構成される請求項１８に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 18, wherein the adhering means is formed of any one of an adhesive and an adhesive film. 前記接着剤は、熱伝導フィラーの含まれた伝導性ペーストで構成される請求項１９に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 19, wherein the adhesive is made of a conductive paste containing a heat conductive filler. 前記接着フィルムは、熱伝導性材料で構成される請求項１９に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 19, wherein the adhesive film is made of a heat conductive material. 前記絶縁層は、前記メタルコアの下面に設けられた前記絶縁材と同じ厚さで形成される請求項１１に記載の部品組込み型印刷回路基板。   The component-embedded printed circuit board according to claim 11, wherein the insulating layer is formed with the same thickness as the insulating material provided on a lower surface of the metal core.
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