TWI602481B - Electronic component embedded printed circuit board and method of manufacturing the same - Google Patents
Electronic component embedded printed circuit board and method of manufacturing the same Download PDFInfo
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- TWI602481B TWI602481B TW101140277A TW101140277A TWI602481B TW I602481 B TWI602481 B TW I602481B TW 101140277 A TW101140277 A TW 101140277A TW 101140277 A TW101140277 A TW 101140277A TW I602481 B TWI602481 B TW I602481B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
本發明是有關於一種嵌入電子元件之印刷電路板及其製造方法，且特別是一種能夠改善熱擴散特性及翹曲之嵌入電子元件之印刷電路板及其製造方法。 The present invention relates to a printed circuit board in which an electronic component is embedded and a method of manufacturing the same, and more particularly to a printed circuit board in which an electronic component can be improved in thermal diffusion characteristics and warpage, and a method of manufacturing the same.
有鑑於對資訊科技電子產品(包括手機)之小型化及多功能的技術要求，產生將積體電路(ICs)、半導體晶片、主動元件或被動元件等電子元件嵌入基板技術的需求。近期已發展以不同方法於基板內嵌入電子元件之技術。 In view of the miniaturization and versatile technical requirements for information technology electronic products (including mobile phones), there is a need to embed electronic components such as integrated circuits (ICs), semiconductor wafers, active components or passive components into the substrate technology. Techniques for embedding electronic components in substrates in different ways have recently been developed.
一般來說，傳統嵌入電子元件之印刷電路板於基板之絕緣層內形成凹處並嵌入電子元件(例如積體電路及半導體晶片等不同元件)於凹處中。接著，塗佈黏著樹脂(如：預浸材料)於凹處內及絕緣層上，以使電子元件嵌入其內而形成絕緣層並固定電子元件。形成通孔(via hole)或貫孔(through hole)於絕緣層內以使電子元件連接至外部裝置。 Generally, a printed circuit board in which an electronic component is embedded is formed in a recess in an insulating layer of a substrate and embedded in an electronic component (for example, an integrated circuit and a semiconductor chip or the like) in a recess. Next, an adhesive resin (for example, a prepreg) is applied to the recess and the insulating layer to embed the electronic component therein to form an insulating layer and fix the electronic component. A via hole or a through hole is formed in the insulating layer to connect the electronic component to the external device.
此時，電鍍層及圖案形成於通孔或貫孔之內部及上方，以做為嵌入於基板之電子元件的電性連接手段。藉由連續層壓絕緣層於基板之上表面及下表面來製造嵌入電子元件之多層印刷電路板。 At this time, the plating layer and the pattern are formed inside and above the through hole or the through hole as an electrical connection means for the electronic component embedded in the substrate. A multilayer printed circuit board in which electronic components are embedded is manufactured by continuously laminating an insulating layer on the upper surface and the lower surface of the substrate.
於嵌入電子元件之印刷電路板中，由於電子元件之外 部被絕緣層所圍繞，因此想要有效率地擴散電子元件所產生的熱是相當困難的。 In printed circuit boards embedded in electronic components, due to electronic components The portion is surrounded by the insulating layer, so it is quite difficult to efficiently diffuse the heat generated by the electronic component.
為了克服此問題，藉由形成電子元件嵌入之金屬材料核心，能夠改善電子元件之熱擴散效率。然而，一般來說，在採用金屬核心之情況下，由於貫孔係形成於由金屬材料製成之核心基板內，且電子元件嵌入於貫孔內，當嵌入電子元件於貫孔內時，必須採用分離式載板來支撐電子元件。使用載板來製作印刷電路板之流程是複雜地，且增加了製程步驟。 In order to overcome this problem, the heat diffusion efficiency of the electronic component can be improved by forming the core of the metal material in which the electronic component is embedded. However, in general, in the case of using a metal core, since the through hole is formed in the core substrate made of a metal material, and the electronic component is embedded in the through hole, when the embedded electronic component is inserted into the through hole, it is necessary to A separate carrier is used to support the electronic components. The process of using a carrier board to make a printed circuit board is complicated and adds process steps.
本發明是為了克服傳統嵌入電子元件之印刷電路板之製造方法所發生之上述缺點及問題。因此本發明之目的係提供藉由形成金屬核心而能夠有效地擴散內部熱能之一種嵌入電子元件之印刷電路板及其製造方法。其中，凹處以電鍍方式形成於金屬核心內。電子元件嵌入於凹處中。金屬核心及電子元件藉由通孔電性連接至外部金屬圖案。 SUMMARY OF THE INVENTION The present invention is to overcome the above-mentioned disadvantages and problems of the conventional method of manufacturing a printed circuit board in which electronic components are embedded. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a printed circuit board embedded in an electronic component capable of efficiently diffusing internal thermal energy by forming a metal core, and a method of manufacturing the same. Wherein, the recess is formed in the metal core by electroplating. The electronic component is embedded in the recess. The metal core and the electronic component are electrically connected to the external metal pattern through the via.
再者，本發明之另一目的係為提供一種嵌入電子元件之印刷電路板及其製造方法。嵌入電子元件之印刷電路板及其製造方法能夠於製造印刷電路板之製程中，藉由控制層壓於金屬核心之上、下表面的絕緣層之厚度為相等，以改善翹曲。 Furthermore, another object of the present invention is to provide a printed circuit board in which an electronic component is embedded and a method of manufacturing the same. The printed circuit board in which the electronic component is embedded and the manufacturing method thereof can improve the warpage by controlling the thickness of the insulating layer laminated on the lower surface of the metal core to be equal in the process of manufacturing the printed circuit board.
根據達成本發明目的之一方面，提供一種嵌入電子元件之印刷電路板之製造方法，包括以下步驟：準備一銅箔 基板(Copper Clad Laminate,CCL)；以電鍍之方式形成一金屬核心於銅箔基板之上表面上，金屬核心具有一凹處；嵌入電子元件於凹處內；形成絕緣層於電子元件之上表面及金屬核心上；以及形成金屬層於絕緣層上，並藉由蝕刻金屬層及銅箔層以形成數個圖案，銅箔層形成於金屬核心之下表面。 According to an aspect of achieving the object of the present invention, a method of manufacturing a printed circuit board embedded in an electronic component is provided, comprising the steps of: preparing a copper foil a substrate (Copper Clad Laminate, CCL); forming a metal core on the upper surface of the copper foil substrate by electroplating, the metal core has a recess; embedding the electronic component in the recess; forming an insulating layer on the upper surface of the electronic component And forming a metal layer on the insulating layer, and forming a plurality of patterns by etching the metal layer and the copper foil layer, the copper foil layer being formed on the lower surface of the metal core.
形成金屬核心之步驟更包括以下步驟：層壓乾膜(dry films,D/Fs)於銅箔基板之上表面及下表面；藉由曝光、顯影此些乾膜之上部，以移除凹處形成區域以外之一區域；成長(growing)一電鍍層於除了凹處形成區域以外之區域內；以及藉由移除位於凹處形成區域之乾膜以形成凹處。 The step of forming a metal core further comprises the steps of: laminating dry films (D/Fs) on the upper surface and the lower surface of the copper foil substrate; and removing the recesses by exposing and developing the upper portions of the dry films Forming a region other than the region; growing a plating layer in a region other than the recess forming region; and forming a recess by removing the dry film at the recess forming region.
在此情況下，於層壓乾膜之步驟中，乾膜可以只形成於銅箔基板之上表面。 In this case, in the step of laminating the dry film, the dry film may be formed only on the upper surface of the copper foil substrate.
於嵌入電子元件於凹處之步驟中，電子元件可以被固定於凹處之底部，黏著件(adhesive means)設置於凹處之底部與電子元件之間。黏著件可以是黏著膠及黏著薄膜。 再者，黏著件可以是包括熱傳導填充物之黏著膠或由熱傳導材料製成之黏著薄膜。 In the step of embedding the electronic component in the recess, the electronic component may be fixed to the bottom of the recess, and the adhesive means is disposed between the bottom of the recess and the electronic component. The adhesive member can be an adhesive and an adhesive film. Further, the adhesive member may be an adhesive including a heat conductive filler or an adhesive film made of a heat conductive material.
再者，於形成絕緣層於金屬核心之步驟中，可以形成具有相同厚度之絕緣層做為一絕緣體，絕緣體構成形成於電子元件所嵌入之金屬核心之下表面的銅箔基板。 Further, in the step of forming the insulating layer on the metal core, an insulating layer having the same thickness may be formed as an insulator, and the insulator constitutes a copper foil substrate formed on a lower surface of the metal core in which the electronic component is embedded.
本發明嵌入電子元件之印刷電路板及其製造方法之 操作效果與之技術設置目的，將透過以下附圖式之較佳實施例做詳細描述。 Printed circuit board embedding electronic component of the present invention and manufacturing method thereof The operational effects and technical settings will be described in detail through the preferred embodiments of the following drawings.
本發明之嵌入電子元件之印刷電路板之製造方法藉由使用雙面具有銅薄層之銅箔基板、以電鍍方式成長金屬層於銅箔基板上以形成金屬核心，及嵌入電子元件於金屬核心內，可以製造具有改善熱擴散特性之嵌入電子元件之印刷電路板。 A method of manufacturing a printed circuit board with embedded electronic components according to the present invention comprises: forming a metal core on a copper foil substrate by electroplating using a copper foil substrate having a thin copper layer on both sides to form a metal core, and embedding the electronic component in the metal core Inside, a printed circuit board having embedded electronic components with improved thermal diffusion characteristics can be fabricated.
首先，第1圖至第7圖繪示根據本發明嵌入電子元件之印刷電路板的製造方法之流程圖。 First, FIG. 1 to FIG. 7 are flowcharts showing a method of manufacturing a printed circuit board in which an electronic component is embedded according to the present invention.
第1圖繪示根據本發明印刷電路板製造製程中準備一銅箔基板之步驟的剖面圖。如圖所示，本發明嵌入電子元件之印刷電路板中，準備銅箔基板100，銅箔層102塗佈於絕緣體101之二面，。 1 is a cross-sectional view showing a step of preparing a copper foil substrate in a manufacturing process of a printed circuit board according to the present invention. As shown in the figure, in the printed circuit board of the electronic component of the present invention, the copper foil substrate 100 is prepared, and the copper foil layer 102 is applied to both sides of the insulator 101.
接著，第2圖繪示根據本發明印刷電路板製造製程中於銅箔基板上層壓一乾膜之步驟的剖面圖。層壓乾膜110於具有預先決定厚度之銅箔基板100之上表面及下表面。 在此情況下，乾膜110可以只被層壓於銅箔基板100之上表面。理由是因為金屬核心具有電子元件被嵌入之凹處。 於下述製程中，金屬核心藉由(through)乾膜110以電鍍之方式形成於銅箔基板100上。 Next, FIG. 2 is a cross-sectional view showing the step of laminating a dry film on a copper foil substrate in the manufacturing process of the printed circuit board according to the present invention. The laminated dry film 110 is on the upper surface and the lower surface of the copper foil substrate 100 having a predetermined thickness. In this case, the dry film 110 may be laminated only on the upper surface of the copper foil substrate 100. The reason is because the metal core has a recess in which the electronic component is embedded. In the following process, the metal core is formed on the copper foil substrate 100 by electroplating through the dry film 110.
根據圖案形狀製造之遮罩111可以層壓於乾膜110之上表面，乾磨110層壓於銅箔基板100上。遮罩111可以形成具有指定固定區域之尺寸及範圍之凹處，凹處將被形成於下述步驟中。 The mask 111 manufactured according to the pattern shape may be laminated on the upper surface of the dry film 110, and the dry mill 110 is laminated on the copper foil substrate 100. The mask 111 can be formed with a recess having a size and a range of specified fixed areas, and the recesses will be formed in the following steps.
然後，第3圖繪示本發明中於印刷電路板製造製程中 移除部分乾膜之步驟的剖面圖。於此製程中，藉由曝光及顯影移除層壓於銅箔基板100上之乾膜110的一部份。在此情況下，除了由遮罩111覆蓋之區域以外的乾膜110區域可以藉由曝光及顯影製程來移除。根據凹處尺寸可以決定被遮罩111所覆蓋之停留於銅箔基板100上乾膜110之寬度。 Then, FIG. 3 illustrates the manufacturing process of the printed circuit board in the present invention. A cross-sectional view of the step of removing a portion of the dry film. In this process, a portion of the dry film 110 laminated on the copper foil substrate 100 is removed by exposure and development. In this case, the area of the dry film 110 other than the area covered by the mask 111 can be removed by an exposure and development process. The width of the dry film 110 on the copper foil substrate 100 covered by the mask 111 can be determined according to the size of the recess.
接著，第4圖繪示本發明中於印刷電路板製造製程中形成一金屬核心之步驟的剖面圖。於此製程中，金屬核心120可以藉由於乾膜110自銅箔基板100中被移除之區域進行電鍍製程來形成。也就是說，藉由在乾膜110自銅箔基板100移除之處，成長電鍍層102a於銅箔基板100之銅箔層102上，金屬核心120可以與銅箔基板100之銅箔層102整合。 Next, FIG. 4 is a cross-sectional view showing the steps of forming a metal core in the manufacturing process of the printed circuit board in the present invention. In this process, the metal core 120 can be formed by an electroplating process in which the dry film 110 is removed from the copper foil substrate 100. That is, by removing the dry film 110 from the copper foil substrate 100, the plating layer 102a is grown on the copper foil layer 102 of the copper foil substrate 100, and the metal core 120 may be bonded to the copper foil layer 102 of the copper foil substrate 100. Integration.
在此情況下，電鍍層102a較佳地與乾膜110相同。 電鍍層102a較佳地形成具有30至40微米之厚度，以便於嵌入電子元件於薄基板內時，符合薄基板特性。 In this case, the plating layer 102a is preferably the same as the dry film 110. The plating layer 102a is preferably formed to have a thickness of 30 to 40 μm in order to conform to the characteristics of the thin substrate when the electronic component is embedded in the thin substrate.
如此，當金屬核心120形成於藉由曝光及顯影移除乾膜110之區域時，能夠更容易透過電鍍製程控制來電鍍厚度之優勢。這樣，如果傳統嵌入電子元件之印刷電路板包括金屬核心，當嵌入電子元件於一般使用具有30至40微米厚度之金屬核心時，甚至難以處理支撐電子元件之金屬核心底部，印刷電路板之製造製程應處理於嵌入電子元件於金屬核心部分之通孔中之情況下，及黏著分別支撐電子元件之載體至金屬核心下表面，及當嵌入電子元件完成時執行移除載體之製程。因此，完成使用金屬核心之傳統嵌 入電子元件之印刷電路板之製造製程且因而降低生產力。 Thus, when the metal core 120 is formed in the region where the dry film 110 is removed by exposure and development, the advantage of plating thickness can be more easily transmitted through the plating process control. Thus, if a conventional printed circuit board in which an electronic component is embedded includes a metal core, when a metal component having a thickness of 30 to 40 μm is generally used for embedding an electronic component, it is even difficult to handle the bottom of a metal core supporting the electronic component, and a manufacturing process of the printed circuit board is performed. It should be processed in the case where the electronic component is embedded in the through hole of the metal core portion, and the carrier supporting the electronic component is respectively attached to the lower surface of the metal core, and the process of removing the carrier is performed when the embedded electronic component is completed. Therefore, the traditional inlay using the metal core is completed. The manufacturing process of printed circuit boards into electronic components and thus reduced productivity.
然而，在本發明中，由於結合於銅箔層102之金屬核心120藉由電鍍形成於銅箔基板100之上表面，因此銅箔基板100之銅箔層102扮演支撐電子元件之角色，而不需要分離的載體。並且由於嵌入於金屬核心120之電子元件之下表面連接於銅箔層102，因此能夠改善熱擴散效率。 However, in the present invention, since the metal core 120 bonded to the copper foil layer 102 is formed on the upper surface of the copper foil substrate 100 by electroplating, the copper foil layer 102 of the copper foil substrate 100 plays the role of supporting electronic components without A vector that requires isolation. And since the lower surface of the electronic component embedded in the metal core 120 is connected to the copper foil layer 102, the heat diffusion efficiency can be improved.
在此情況下，形成於銅箔基板100之銅箔層102上之電鍍層102a可以是由銅材料製成。 In this case, the plating layer 102a formed on the copper foil layer 102 of the copper foil substrate 100 may be made of a copper material.
以及，於銅箔基板100上進行電鍍之製程可藉由電鍍或無電電鍍來進行。 And, the process of performing electroplating on the copper foil substrate 100 can be performed by electroplating or electroless plating.
如此，當以電鍍方式形成金屬核心120於銅箔基板100上時，藉由移除形成於銅箔基板100之上表面及下表面之乾膜110，金屬核心120可以提供於銅箔基板100上，凹處121形成於金屬核心120內。 As such, when the metal core 120 is formed on the copper foil substrate 100 by electroplating, the metal core 120 can be provided on the copper foil substrate 100 by removing the dry film 110 formed on the upper surface and the lower surface of the copper foil substrate 100. The recess 121 is formed in the metal core 120.
同時，移除乾膜之步驟及形成金屬核心之步驟可以執行於單元印刷電路板聚集於面板上之情況下。也就是說，乾膜完全層疊於面板狀之銅箔基板上表面及下表面上。藉由曝光顯影一遮罩來移除部份之乾膜，遮罩覆蓋凹處以預定間隔形成之區域。並且，由於乾膜移除之區域被由銅材料製成之電鍍層102a所填充，於製造面板後，能夠減少製程成本及藉由製造大量單元電路板來改善生產量。 Meanwhile, the step of removing the dry film and the step of forming the metal core may be performed in the case where the unit printed circuit board is gathered on the panel. That is, the dry film is completely laminated on the upper surface and the lower surface of the panel-shaped copper foil substrate. A portion of the dry film is removed by exposure developing a mask, and the mask covers the area where the recess is formed at a predetermined interval. Moreover, since the dry film removal region is filled with the plating layer 102a made of a copper material, after the panel is manufactured, the process cost can be reduced and the throughput can be improved by manufacturing a large number of unit circuit boards.
接著，第5圖繪示本發明中於印刷電路板製造製程中嵌入一電子元件於金屬核心中之步驟的剖面圖。凹處121可以藉由移除於金屬核心120中之乾膜110來形成。 Next, FIG. 5 is a cross-sectional view showing the steps of embedding an electronic component in a metal core in the manufacturing process of the printed circuit board of the present invention. The recess 121 can be formed by being removed from the dry film 110 in the metal core 120.
再者，嵌入電子元件130於凹處121中並藉由緊密結 合於凹處121底部來固定，也就是銅箔基板100之上銅箔層102。電子元件130可以藉由黏著件(adhesive means)140固定於凹處121之底部。 Furthermore, the embedded electronic component 130 is in the recess 121 and is tightly bonded It is fixed to the bottom of the recess 121, that is, the copper foil layer 102 on the copper foil substrate 100. The electronic component 130 can be secured to the bottom of the recess 121 by an adhesive means 140.
在此情況下，電子元件130可以是不同形態之晶片，包括積體電路、半導體晶片、被動元件及主動元件。 In this case, the electronic component 130 may be a wafer of a different form, including an integrated circuit, a semiconductor wafer, a passive component, and an active component.
黏著件140可以是黏著膠或黏著薄膜。在此情況下，當使用液狀黏著膠為黏著件140時，可以採用導電膏，且更可以採用具有高熱傳導之材料。並且，可採用含有熱傳導填充物之導電膏。 The adhesive member 140 may be an adhesive or an adhesive film. In this case, when the liquid adhesive is used as the adhesive member 140, a conductive paste can be used, and a material having high heat conduction can be more preferably used. Also, a conductive paste containing a heat conductive filler can be used.
以及，當使用黏著薄膜為黏著件140時，較佳地採用由熱傳導材料製成之黏著薄膜。 And, when the adhesive film is used as the adhesive member 140, an adhesive film made of a heat conductive material is preferably used.
黏著件140使用熱傳導材料或包含熱傳薄填充物之導電膏的理由是改善從電子元件產生高溫通過金屬底部及金屬核心120之熱擴散效率，以及當電子元件130固定於凹處121內時，增加金屬核心120底部及電子元件130之連接區域。 The reason why the adhesive member 140 uses a heat conductive material or a conductive paste containing a heat transfer filler is to improve the heat diffusion efficiency of the high temperature from the electronic component through the metal base and the metal core 120, and when the electronic component 130 is fixed in the recess 121. The connection area of the bottom of the metal core 120 and the electronic component 130 is increased.
接著，第6圖繪示本發明中於印刷電路板製造製程中於組裝金屬核心之步驟的剖面圖。形成絕緣層150於電子元件130嵌入之凹處121內及金屬核心120之上表面。並且可以進一步設置金屬層160於絕緣層150上。在此情況下，金屬層160可與銅箔層102具有相同的銅材料。銅箔層102形成於銅箔基板100下表面。以及，絕緣層150可與銅箔基板100之絕緣體101具有相同厚度。銅箔基板100之絕緣體101位於金屬核心120之下表面。因此，藉由製造形成於金屬核心120上表面及下表面均等之絕緣材料厚 度，能夠於印刷電路板製造過程中抑制翹曲之發生。 Next, FIG. 6 is a cross-sectional view showing the steps of assembling a metal core in the manufacturing process of the printed circuit board of the present invention. The insulating layer 150 is formed in the recess 121 in which the electronic component 130 is embedded and the upper surface of the metal core 120. And the metal layer 160 may be further disposed on the insulating layer 150. In this case, the metal layer 160 may have the same copper material as the copper foil layer 102. The copper foil layer 102 is formed on the lower surface of the copper foil substrate 100. And, the insulating layer 150 may have the same thickness as the insulator 101 of the copper foil substrate 100. The insulator 101 of the copper foil substrate 100 is located on the lower surface of the metal core 120. Therefore, the thickness of the insulating material formed on the upper surface and the lower surface of the metal core 120 is made thick. Degrees can suppress the occurrence of warpage during the manufacturing process of printed circuit boards.
在此情況下，絕緣層150藉由也注入填充於電子元件130嵌入於凹處121內之周圍部分之凹處121內，來固定嵌入於凹處121內之電子元件130。 In this case, the insulating layer 150 is fixed to the electronic component 130 embedded in the recess 121 by also filling the recess 121 filled in the peripheral portion of the electronic component 130 embedded in the recess 121.
最後，第7圖繪示本發明中於印刷電路板製造製程中形成一圖案於一絕緣層上之步驟的剖面圖。如圖所示，形成通孔170以貫穿絕緣層150及絕緣體101。通孔170形成於金屬核心120之上表面及下表面。在此情況下，可以藉由不同方法形成通孔170，但一般藉由雷射之製程使得電子元件130的底部及金屬核心120之上表面透過通孔170之底部而暴露。 Finally, FIG. 7 is a cross-sectional view showing the steps of forming a pattern on an insulating layer in the manufacturing process of the printed circuit board of the present invention. As shown, a via 170 is formed to penetrate the insulating layer 150 and the insulator 101. The through holes 170 are formed on the upper surface and the lower surface of the metal core 120. In this case, the via hole 170 may be formed by different methods, but the bottom of the electronic component 130 and the upper surface of the metal core 120 are generally exposed through the bottom of the via hole 170 by a laser process.
再者，金屬核心120及嵌入於金屬核心120之電子元件130可以電性連接至銅箔層102及金屬層160，以藉由填充電鍍通孔170內部而形成介層連接。 Furthermore, the metal core 120 and the electronic component 130 embedded in the metal core 120 can be electrically connected to the copper foil layer 102 and the metal layer 160 to form a via connection by filling the inside of the plating via 170.
以及，各金屬層160及各銅箔層102形成於絕緣層150及絕緣體101上，以電性連接至通孔170。通孔170形成於絕緣層150及絕緣體101內，且位於金屬核心120的上表面與下表面。圖案化各金屬層160及銅箔層102為預定形狀之電路圖案180。 The metal layer 160 and each of the copper foil layers 102 are formed on the insulating layer 150 and the insulator 101 to be electrically connected to the through holes 170. The through hole 170 is formed in the insulating layer 150 and the insulator 101 and is located on the upper surface and the lower surface of the metal core 120. Each of the metal layer 160 and the copper foil layer 102 is patterned into a circuit pattern 180 of a predetermined shape.
在此情況下，形成金屬層160及銅箔層102之電路圖案180的步驟可以藉由蝕刻或改良式半加成製程(modified semi-additive process，MSAP)來形成。其中，圖案是於薄銅箔上之化學鍍銅後，透過一乾膜來形成。 In this case, the step of forming the circuit pattern 180 of the metal layer 160 and the copper foil layer 102 may be formed by etching or a modified semi-additive process (MSAP). Among them, the pattern is formed by electroless copper plating on a thin copper foil through a dry film.
再者，如另一製程，電路圖案180可以藉由電鍍之半加成製程(semi-additive process，SAP)來形成。其中， 圖案是於絕緣層上之化學鍍銅後，透過一乾膜來形成。 Furthermore, as another process, the circuit pattern 180 can be formed by a semi-additive process (SAP) of electroplating. among them, The pattern is formed by electroless copper plating on the insulating layer through a dry film.
如上所述，根據本發明中嵌入電子元件之印刷電路板及其製造方法具有能夠藉由形成電子元件嵌入之核心以明顯改善電子元件之熱擴散效率之優點，其中核心具有金屬材料，且透過通孔電性連接電子元件及金屬核心。 As described above, the printed circuit board in which the electronic component is embedded and the method of manufacturing the same according to the present invention have the advantage of being able to significantly improve the thermal diffusion efficiency of the electronic component by forming the core in which the electronic component is embedded, wherein the core has a metallic material and is transparent. The holes are electrically connected to the electronic components and the metal core.
再者，本發明於基板之製造期間，藉由使用金屬核心可以提供避免翹曲發生之運作效果，金屬核心與形成層疊於金屬核心之上表面及下表面之絕緣層具有相同之厚度。 Furthermore, the present invention can provide an operational effect of avoiding warpage by using a metal core during the manufacture of the substrate, and the metal core has the same thickness as the insulating layer formed on the upper surface and the lower surface of the metal core.
再者，本發明具有減少製作程序及改善生產量之優點。金屬核心藉由電鍍形成於銅箔基板之銅箔層上。當嵌入電子元件於形成金屬核心之凹處內時，電子元件支撐於銅箔層上。因此，並於嵌入電子元件之印刷電路板製造期間，用以支撐電子元件之分離載體可以被移除。 Furthermore, the present invention has the advantages of reducing the production process and improving the throughput. The metal core is formed on the copper foil layer of the copper foil substrate by electroplating. The electronic component is supported on the copper foil layer when the embedded electronic component is formed in the recess of the metal core. Therefore, during the manufacture of the printed circuit board in which the electronic component is embedded, the separation carrier for supporting the electronic component can be removed.
綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
100‧‧‧銅箔基板 100‧‧‧ copper foil substrate
101‧‧‧絕緣體 101‧‧‧Insulator
102‧‧‧銅箔層 102‧‧‧copper layer
102a‧‧‧電鍍層 102a‧‧‧Electroplating
110‧‧‧乾膜 110‧‧‧Dry film
111‧‧‧遮罩 111‧‧‧ mask
120‧‧‧金屬核心 120‧‧‧Metal core
121‧‧‧凹處 121‧‧‧ recess
130‧‧‧電子元件 130‧‧‧Electronic components
140‧‧‧黏著件 140‧‧‧Adhesive parts
150‧‧‧絕緣層 150‧‧‧Insulation
160‧‧‧金屬層 160‧‧‧metal layer
170‧‧‧通孔 170‧‧‧through hole
180‧‧‧迴路圖案 180‧‧‧Circuit pattern
從以下實施例之描述並結合所圖示，本發明概念之這些或其他方面及優點將更清楚且易於理解。 These and other aspects and advantages of the present invention will be more apparent from the following description of the embodiments.
第1圖至第7圖繪示本發明中嵌入電子元件之印刷電路板的製造方法之流程圖。其中： 第1圖繪示本發明中於印刷電路板製造製程中準備銅箔基板之步驟的剖面圖。 1 to 7 are flow charts showing a method of manufacturing a printed circuit board in which an electronic component is embedded in the present invention. among them: 1 is a cross-sectional view showing the steps of preparing a copper foil substrate in a manufacturing process of a printed circuit board in the present invention.
第2圖繪示本發明中於印刷電路板製造製程中於銅箔基板上層壓乾膜之步驟的剖面圖。 2 is a cross-sectional view showing the steps of laminating a dry film on a copper foil substrate in a printed circuit board manufacturing process of the present invention.
第3圖繪示本發明中於印刷電路板製造製程中移除部分乾膜之步驟的剖面圖。 Figure 3 is a cross-sectional view showing the steps of removing a portion of the dry film in the manufacturing process of the printed circuit board in the present invention.
第4圖繪示本發明中於印刷電路板製造製程中形成一金屬核心之步驟的剖面圖。 Figure 4 is a cross-sectional view showing the steps of forming a metal core in a printed circuit board manufacturing process of the present invention.
第5圖繪示本發明中於印刷電路板製造製程中嵌入電子元件於金屬核心中之步驟的剖面圖。 Figure 5 is a cross-sectional view showing the steps of embedding electronic components in a metal core in a printed circuit board manufacturing process of the present invention.
第6圖繪示本發明中於印刷電路板製造製程中於金屬核心上組裝之步驟的剖面圖。 Figure 6 is a cross-sectional view showing the steps of assembling the metal core in the manufacturing process of the printed circuit board of the present invention.
第7圖繪示本發明中於印刷電路板製造製程中形成圖案於絕緣層上之步驟的剖面圖。 Figure 7 is a cross-sectional view showing the steps of forming a pattern on the insulating layer in the manufacturing process of the printed circuit board in the present invention.
101‧‧‧絕緣體 101‧‧‧Insulator
102‧‧‧銅箔層 102‧‧‧copper layer
102a‧‧‧電鍍層 102a‧‧‧Electroplating
120‧‧‧金屬核心 120‧‧‧Metal core
130‧‧‧電子元件 130‧‧‧Electronic components
140‧‧‧黏著件 140‧‧‧Adhesive parts
150‧‧‧絕緣層 150‧‧‧Insulation
170‧‧‧通孔 170‧‧‧through hole
180‧‧‧迴路圖案 180‧‧‧Circuit pattern
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| KR102439483B1 (en) * | 2015-10-08 | 2022-09-02 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
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| JP2001274034A (en) * | 2000-01-20 | 2001-10-05 | Shinko Electric Ind Co Ltd | Electronic parts package |
| JP2007227586A (en) * | 2006-02-23 | 2007-09-06 | Cmk Corp | Substrate incorporating semiconductor element, and method of manufacturing same |
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