JP2013102315A5 - - Google Patents

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JP2013102315A5
JP2013102315A5 JP2011244214A JP2011244214A JP2013102315A5 JP 2013102315 A5 JP2013102315 A5 JP 2013102315A5 JP 2011244214 A JP2011244214 A JP 2011244214A JP 2011244214 A JP2011244214 A JP 2011244214A JP 2013102315 A5 JP2013102315 A5 JP 2013102315A5
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axis
piezoelectric
conductive portion
piezoelectric device
heat conductive
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JP2011244214A
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JP2013102315A (en
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Priority to JP2011244214A priority Critical patent/JP2013102315A/en
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Claims (10)

圧電振動素子と、
温度を検出する感温部品と
平面視で前記感温部品を囲んでおり且つ底部に複数の実装端子を備えた第1の絶縁基板、前記第1の絶縁基板の前記底部とは反対側の面に裏面が配置されている第2の絶縁基板、及び前記第2の絶縁基板の前記裏面とは反対側の表面上に配置されており平面視で前記圧電振動素子を囲んでいる第3の基板を有するとともに少なくとも前記第1の絶縁基板の前記底部と前記反対側の面とを繋いでいる複数のキャスタレーションを備えている側面部、第1の熱伝導部、及び第2の熱伝導部を有している容器と、を備え、
前記第2の絶縁基板は、前記表面に前記圧電振動素子搭載用の第1の電極パッドを備えるとともに、前記裏面に前記実装端子と前記第1の電極パッドとを導通させる第1の配線パターン、前記実装端子と前記感温部品とを導通させる第2の配線パターン、及び前記感温部品搭載用の第2の電極パッドを備え、
少なくとも1つの前記実装端子と前記第1の電極パッドとは、前記第1の熱伝導部及び前記第1の配線パターンにより電気的に接続され、
他の少なくとも1つの前記実装端子と前記第2の電極パッドとは、前記第2の熱伝導部及び前記第2の配線パターンにより電気的に接続されていることを特徴とする圧電デバイス。
A piezoelectric vibration element;
A temperature sensitive component that detects the temperature ,
A first insulating substrate that surrounds the temperature-sensitive component in a plan view and includes a plurality of mounting terminals at the bottom, and a back surface is disposed on the surface of the first insulating substrate opposite to the bottom. 2 of the insulating substrate, and together with said and said rear surface of the second insulating substrate to have a third substrate surrounding the piezoelectric vibrating element in a plan view are arranged on a surface of the opposite, at least the first side portion is provided with a plurality of castellations which connects the said bottom and the opposite surface of the first insulating substrate, and the container having first heat conductive portion, and a second heat conducting unit With
Said second insulating substrate is provided with a first electrode pad for the piezoelectric vibrating element mounted on the table surface, a first wiring for conducting the one with the mounting terminal on the back side first electrode pad pattern A second wiring pattern for conducting the mounting terminal and the temperature-sensitive component, and a second electrode pad for mounting the temperature-sensitive component ,
Wherein at least one of the mounting terminal and the first electrode pad are electrically connected by the first heat conductive portion and the first wiring pattern,
Other at least one of the mounting terminal and the second electrode pad, a piezoelectric device which is characterized by being electrically connected by the second heat conductive portion and the second wiring pattern.
前記第1の熱伝導部及び前記第2の熱伝導部の少なくとも何れか一方の少なくとも一部は、前記キャスタレーション内に配置されていることを特徴とする請求項1に記載の圧電デバイス。2. The piezoelectric device according to claim 1, wherein at least a part of at least one of the first heat conducting unit and the second heat conducting unit is disposed in the castellation. 前記第1の熱伝導部及び前記第2の熱伝導部の少なくとも何れか一方の少なくとも一部は、前記第1の絶縁基板の内部に貫通配置されていることを特徴とする請求項1又は2に記載の圧電デバイス。 The first heat conductive portion and one of the at least a portion of at least one of said second heat conductive portion, claim 1 or, characterized in that is penetrated disposed inside of the first insulating substrate 2. The piezoelectric device according to 2. 前記第1の熱伝導部及び前記第2の熱伝導部のうちの一方の少なくとも一部は、前記第1の絶縁基板の内部に貫通配置され、他方の少なくとも一部は前記キャスタレーション内に配置されていることを特徴とする請求項1乃至3の何れか一項に記載の圧電デバイス。 Wherein at least a portion of one of the first heat conductive portion and the second heat conductive portion, is penetrated disposed inside the first insulating substrate, the other at least in part before crisis catcher constellation the piezoelectric device according to any one of claims 1 to 3, characterized in that it is arranged within. 前記第1の熱伝導部及び前記第2の熱伝導部の少なくとも何れか一方は、前記第1の絶縁基板の内部に貫通配置された熱伝導部と、前記キャスタレーション内に配置された熱伝導部と、が連結していることを特徴とする請求項に記載の圧電デバイス。 The first heat conductive portion and one second heat-conducting part of at least one of the said first insulating heat conductive portion which penetrates disposed inside the substrate, is placed before crisis catcher in Constellation The piezoelectric device according to claim 4 , wherein the heat conduction unit is connected to the piezoelectric device. 前記第3の基板の前記上部に配置され前記圧電振動素子を封止している蓋部材を備え、
前記蓋部材は、前記容器の内部を貫通する第3の熱伝導部により、前記感温部品と接続する実装端子と電気的に接続されていることを特徴とする請求項1乃至5の何れか一項に記載の圧電デバイス。
A lid member disposed on the upper portion of the third substrate and sealing the piezoelectric vibration element ;
The lid member, the third conductive portion penetrating through the interior of said container, characterized in that the mounting is terminal electrically connected to be connected to the temperature sensitive component according to claim 1 to 5 what Re of The piezoelectric device according to claim 1.
前記圧電振動素子の圧電基板は、水晶の結晶軸である電気軸としてのX軸と、機械軸としてのY軸と、光学軸としてのZ軸と、からなる直交座標系の前記X軸を中心として、
前記Z軸を前記Y軸の−Y方向へ所定の角度だけ傾けた軸をZ’軸とし、
前記Y軸を前記Z軸の+Z方向へ前記所定の角度だけ傾けた軸をY’軸とし、
前記X軸と前記Z’軸に平行な面で構成され、
前記Y’軸に平行な方向を厚みとする水晶基板であり、
前記X軸に平行な辺を長辺とし、
前記Z’軸に平行な辺を短辺とした水晶基板を用いたATカット水晶振動素子であることを特徴とする請求項1乃至6の何れか一項に記載の圧電デバイス。
The piezoelectric substrate of the piezoelectric vibration element is centered on the X axis of an orthogonal coordinate system including an X axis as an electric axis which is a crystal axis of quartz, a Y axis as a mechanical axis, and a Z axis as an optical axis. As
An axis obtained by inclining the Z axis by a predetermined angle in the −Y direction of the Y axis is defined as a Z ′ axis.
An axis obtained by inclining the Y axis by the predetermined angle in the + Z direction of the Z axis is a Y ′ axis,
It is composed of a plane parallel to the X axis and the Z ′ axis,
A quartz substrate having a thickness in a direction parallel to the Y ′ axis,
The side parallel to the X axis is the long side,
The piezoelectric device according to what Re one of claims 1 to 6, characterized in that the AT cut quartz crystal resonator element using a quartz substrate having a short side of the sides parallel to the Z 'axis.
前記圧電振動素子は、音叉型水晶振動素子であることを特徴とする請求項1乃至6の何れか一項に記載の圧電デバイス。 The piezoelectric vibrating element is a piezoelectric device according to what Re one of claims 1 to 6, characterized in that a tuning-fork type crystal vibrating element. 前記圧電振動素子は、ATカット水晶振動素子と音叉型水晶振動素子とが併置されていることを特徴とする請求項1乃至6の何れか一項に記載の圧電デバイス。 The piezoelectric vibrating element is a piezoelectric device according to what Re one of claims 1 to 6 AT and cut crystal vibrating element tuning fork type crystal vibrating element, characterized in that it is location. 請求項1乃至9の何れか一項に記載の圧電デバイスを備えたことを特徴とする電子機器。 An electronic apparatus comprising the piezoelectric device according to what Re one of claims 1 to 9.
JP2011244214A 2011-11-08 2011-11-08 Piezoelectric device and electronic apparatus Pending JP2013102315A (en)

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