JP2013098416A - 発光モジュール、および照明器具 - Google Patents
発光モジュール、および照明器具 Download PDFInfo
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- JP2013098416A JP2013098416A JP2011241236A JP2011241236A JP2013098416A JP 2013098416 A JP2013098416 A JP 2013098416A JP 2011241236 A JP2011241236 A JP 2011241236A JP 2011241236 A JP2011241236 A JP 2011241236A JP 2013098416 A JP2013098416 A JP 2013098416A
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- light emitting
- sealing member
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- emitting module
- power supply
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/66—Details of globes or covers forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
【解決手段】実施形態に係る発光モジュールは、同じ発光特性を有する複数個の半導体発光素子を密集させて基板に実装し、これら密集した複数個の半導体発光素子をドーム状の封止部材でまとめて封止することで構成される。
【選択図】 図7
Description
Claims (10)
- 同じ発光特性を有する複数個の半導体発光素子と、
これら複数個の半導体発光素子を密集させて実装する基板と、
この基板に実装した上記複数個の半導体発光素子をまとめて封止するドーム状の封止部材と、
を具備することを特徴とする発光モジュール。 - 上記ドーム状の封止部材で封止された上記複数個の半導体発光素子は、互いに近接して一列に並んで配置されていることを特徴とする請求項1の発光モジュール。
- 上記一列に並んで配置された複数個の半導体発光素子は、上記ドーム状の封止部材の封止領域の径の2/3以下の径の実装領域内に配置されていることを特徴とする請求項2の発光モジュール。
- 上記一列に並んで配置された複数個の半導体発光素子は、その並び方向に沿って長軸を有する楕円形状或いは長円形状の上記封止部材で封止されていることを特徴とする請求項2の発光モジュール。
- 上記ドーム状の封止部材で封止された上記複数個の半導体発光素子は、環状に配置されていることを特徴とする請求項1の発光モジュール。
- 上記環状に配置された複数個の半導体発光素子は、上記ドーム状の封止部材の封止領域の径の1/2以下の径の実装領域内に配置されていることを特徴とする請求項5の発光モジュール。
- 上記基板の実装面に設けられた光反射層と、
この光反射層と別体で上記実装面に設けられた上記光反射層より面積の小さい給電パッドと、
をさらに有することを特徴とする請求項1の発光モジュール。 - 上記各半導体発光素子と上記給電パッドを接続するボンディングワイヤーは、上記給電パッドに向けて収束することを特徴とする請求項7の発光モジュール。
- 上記給電パッドは、上記ドーム状の封止部材で封止された上記複数個の半導体発光素子それぞれに個別に給電する複数の部分に分割されており、
上記各半導体発光素子と上記給電バッドの上記複数の部分を接続するボンディングワイヤーは、上記複数の部分に向けて拡がっていることを特徴とする請求項7の発光モジュール。 - 請求項1乃至請求項9のいずれか1項の発光モジュールを備えたことを特徴とする照明器具。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011241236A JP2013098416A (ja) | 2011-11-02 | 2011-11-02 | 発光モジュール、および照明器具 |
US13/591,617 US8766536B2 (en) | 2011-11-02 | 2012-08-22 | Light-emitting module having light-emitting elements sealed with sealing member and luminaire having same |
EP12181464.4A EP2590214A3 (en) | 2011-11-02 | 2012-08-23 | Light-emitting module and luminaire |
CN2012103532805A CN103094265A (zh) | 2011-11-02 | 2012-09-20 | 发光模块及照明设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011241236A JP2013098416A (ja) | 2011-11-02 | 2011-11-02 | 発光モジュール、および照明器具 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013098416A true JP2013098416A (ja) | 2013-05-20 |
Family
ID=46851817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011241236A Pending JP2013098416A (ja) | 2011-11-02 | 2011-11-02 | 発光モジュール、および照明器具 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8766536B2 (ja) |
EP (1) | EP2590214A3 (ja) |
JP (1) | JP2013098416A (ja) |
CN (1) | CN103094265A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015061024A (ja) * | 2013-09-20 | 2015-03-30 | パナソニック株式会社 | 発光モジュール |
JP2017135130A (ja) * | 2016-01-25 | 2017-08-03 | コーデンシ株式会社 | 発光装置 |
JP2019054041A (ja) * | 2017-09-13 | 2019-04-04 | 日本特殊陶業株式会社 | 保持装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6497615B2 (ja) * | 2015-03-04 | 2019-04-10 | パナソニックIpマネジメント株式会社 | 実装基板及びそれを用いたledモジュール |
JP2016162971A (ja) * | 2015-03-04 | 2016-09-05 | パナソニックIpマネジメント株式会社 | Ledモジュール |
JP6645486B2 (ja) * | 2017-02-13 | 2020-02-14 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
CN109031779B (zh) * | 2018-07-25 | 2024-06-11 | 京东方科技集团股份有限公司 | 发光二极管基板、背光模组和显示装置 |
KR102664521B1 (ko) * | 2022-07-29 | 2024-05-09 | 엘지전자 주식회사 | 반도체 발광 소자 패키지 및 디스플레이 장치 |
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JPH0715043A (ja) * | 1993-06-25 | 1995-01-17 | Toshiba Corp | Ledランプ |
JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するled装置 |
JP2007012975A (ja) * | 2005-07-01 | 2007-01-18 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2009049000A (ja) * | 2007-07-26 | 2009-03-05 | Panasonic Electric Works Co Ltd | Led照明装置 |
JP2010027514A (ja) * | 2008-07-23 | 2010-02-04 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2011014695A (ja) * | 2009-07-01 | 2011-01-20 | Sharp Corp | 発光装置および発光装置の製造方法 |
WO2011111399A1 (ja) * | 2010-03-11 | 2011-09-15 | パナソニック株式会社 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
GB2458972B (en) * | 2008-08-05 | 2010-09-01 | Photonstar Led Ltd | Thermally optimised led chip-on-board module |
JP2011023138A (ja) | 2009-07-13 | 2011-02-03 | Sharp Corp | 照明装置 |
US8455910B2 (en) * | 2009-09-21 | 2013-06-04 | Walsin Lihwa Corporation | Method of manufacturing light emitting diode packaging lens and light emitting diode package |
JP5988073B2 (ja) * | 2011-11-01 | 2016-09-07 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
US20130169144A1 (en) * | 2012-01-03 | 2013-07-04 | Lustrous Technology Ltd. | Led package structure capable of adjusting the spatial color uniformity and the light distribution curve |
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2011
- 2011-11-02 JP JP2011241236A patent/JP2013098416A/ja active Pending
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2012
- 2012-08-22 US US13/591,617 patent/US8766536B2/en not_active Expired - Fee Related
- 2012-08-23 EP EP12181464.4A patent/EP2590214A3/en not_active Withdrawn
- 2012-09-20 CN CN2012103532805A patent/CN103094265A/zh active Pending
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JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するled装置 |
JP2007012975A (ja) * | 2005-07-01 | 2007-01-18 | Ngk Spark Plug Co Ltd | 配線基板 |
JP2009049000A (ja) * | 2007-07-26 | 2009-03-05 | Panasonic Electric Works Co Ltd | Led照明装置 |
JP2010027514A (ja) * | 2008-07-23 | 2010-02-04 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2011014695A (ja) * | 2009-07-01 | 2011-01-20 | Sharp Corp | 発光装置および発光装置の製造方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015061024A (ja) * | 2013-09-20 | 2015-03-30 | パナソニック株式会社 | 発光モジュール |
JP2017135130A (ja) * | 2016-01-25 | 2017-08-03 | コーデンシ株式会社 | 発光装置 |
JP2019054041A (ja) * | 2017-09-13 | 2019-04-04 | 日本特殊陶業株式会社 | 保持装置 |
Also Published As
Publication number | Publication date |
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US8766536B2 (en) | 2014-07-01 |
EP2590214A2 (en) | 2013-05-08 |
CN103094265A (zh) | 2013-05-08 |
EP2590214A3 (en) | 2015-03-04 |
US20130106279A1 (en) | 2013-05-02 |
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