JP2013069748A - ベースプレートおよび半導体装置 - Google Patents
ベースプレートおよび半導体装置 Download PDFInfo
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- JP2013069748A JP2013069748A JP2011205707A JP2011205707A JP2013069748A JP 2013069748 A JP2013069748 A JP 2013069748A JP 2011205707 A JP2011205707 A JP 2011205707A JP 2011205707 A JP2011205707 A JP 2011205707A JP 2013069748 A JP2013069748 A JP 2013069748A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 230000002093 peripheral effect Effects 0.000 claims abstract description 11
- 239000007767 bonding agent Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/151—Die mounting substrate
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- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H01L2924/161—Cap
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- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】ベースプレート11は、対向する第1および第2の面11a、11bを有し、第2の面11b側が凸状であり、中央部に設けられた第1の領域と、中央部を除く周辺部に位置し、貫通孔を有する第2の領域とを具備している。第2の領域11dの厚さH2は、第1の領域11cの厚さH1より薄い。
【選択図】 図1
Description
(付記1) 前記第1の領域には、半導体チップを含む内部部品が載置され、前記第2の領域の前記貫通孔に螺子が挿通される請求項1に記載のベースプレート。
11a、11b、31a、31b、51c、51d、61a、61b、71a、71b 第1、第2の面
11c、11d、31c、31d、61c、61d、71c、71d 第1、第2の領域
12、32、82 貫通孔
13、53 境界線
20、40、80 半導体装置
21 接合剤
22 内部部品
23、81 ケース
24 充填剤
25 螺子
26 ヒートシンク
27、41 螺子締結部
28a、28b、42a、42b 螺子締結部周辺
29、43 接合部
81a 基台部
81b 収納部
81d 切り欠き部
83 カラー
Claims (5)
- 対向する第1および第2の面を有し、前記第2の面側が凸状であり、中央部に設けられた第1の領域と、
前記中央部を除く周辺部に位置し、貫通孔を有する第2の領域と、
を具備し、
前記第2の領域の厚さは、前記第1の領域の厚さより薄いことを特徴とするベースプレート。 - 前記ベースプレートは矩形状であり、前記第2の領域は前記矩形の隅に設けられ、前記第1の面の平面視において、前記第1の領域と前記第2の領域との境界が直線状であることを特徴とする請求項1に記載のベースプレート。
- 対向する第1および第2の面を有し、前記第2の面側が凸状であり、中央部に設けられた第1の領域と、前記中央部を除く周辺部に位置し、貫通孔を有する第2の領域とを有し、前記第2の領域の厚さは、前記第1の領域の厚さより薄いベースプレートと、
前記ベースプレートの前記第1の領域の前記第1の面に接合剤を介して載置される半導体チップを含む内部部品と、
を具備することを特徴とする半導体装置。 - 前記内部部品を収納し、前記ベースプレートに冠着されたケースと、
前記ケースと前記内部部品の隙間に充填された樹脂と、
を更に具備することを特徴とする請求項4に記載の半導体装置。 - 基台に螺着され、前記第2の領域の、前記貫通孔と前記第1の領域との間に変形部を有することを特徴とする請求項3または請求項4に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011205707A JP2013069748A (ja) | 2011-09-21 | 2011-09-21 | ベースプレートおよび半導体装置 |
CN2012103151678A CN103021963A (zh) | 2011-09-21 | 2012-08-30 | 基板以及半导体装置 |
US13/607,522 US8896113B2 (en) | 2011-09-21 | 2012-09-07 | Base plate and semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011205707A JP2013069748A (ja) | 2011-09-21 | 2011-09-21 | ベースプレートおよび半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013069748A true JP2013069748A (ja) | 2013-04-18 |
Family
ID=47879893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011205707A Pending JP2013069748A (ja) | 2011-09-21 | 2011-09-21 | ベースプレートおよび半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8896113B2 (ja) |
JP (1) | JP2013069748A (ja) |
CN (1) | CN103021963A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014215491A (ja) * | 2013-04-26 | 2014-11-17 | ソニー株式会社 | 液晶表示ユニット及び投射型表示装置 |
JP2019054069A (ja) * | 2017-09-14 | 2019-04-04 | 株式会社東芝 | 半導体装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015138835A (ja) * | 2014-01-21 | 2015-07-30 | 株式会社東芝 | 半導体装置 |
DE102014104496B4 (de) * | 2014-03-31 | 2019-07-18 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur schweißtechnischen Verbindung von Anschlusselementen mit dem Substrat eines Leistungshalbleitermoduls und zugehöriges Verfahren |
EP2940718B1 (en) * | 2014-04-30 | 2018-04-18 | Vincotech GmbH | Assembly for cooling a power module |
JP6382348B2 (ja) * | 2014-05-15 | 2018-08-29 | インテル コーポレイション | 集積回路アセンブリ用の成形コンポジットエンクロージャ |
JP6406121B2 (ja) * | 2015-05-14 | 2018-10-17 | 三菱電機株式会社 | 高周波高出力デバイス |
US10764996B1 (en) * | 2018-06-19 | 2020-09-01 | Xilinx, Inc. | Chip package assembly with composite stiffener |
JP7193730B2 (ja) * | 2019-03-26 | 2022-12-21 | 三菱電機株式会社 | 半導体装置 |
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JPH06268121A (ja) * | 1993-03-12 | 1994-09-22 | Hitachi Ltd | 半導体装置 |
JPH08204071A (ja) * | 1995-01-27 | 1996-08-09 | Toshiba Corp | 半導体装置 |
JP2000091481A (ja) * | 1998-09-08 | 2000-03-31 | Tokin Corp | 電力用トランジスタケースおよび電力用トランジスタ |
JP2003243584A (ja) * | 2002-02-15 | 2003-08-29 | Mitsubishi Electric Corp | 半導体装置 |
JP2004022964A (ja) * | 2002-06-19 | 2004-01-22 | Hitachi Metals Ltd | Al−SiC系複合体およびそれを用いた放熱部品、半導体モジュール装置 |
JP2006100320A (ja) * | 2004-09-28 | 2006-04-13 | Mitsubishi Electric Corp | 半導体装置 |
JP2012212788A (ja) * | 2011-03-31 | 2012-11-01 | Dowa Holdings Co Ltd | 金属ベース基板およびその製造方法 |
Family Cites Families (9)
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JP3168901B2 (ja) | 1996-02-22 | 2001-05-21 | 株式会社日立製作所 | パワー半導体モジュール |
JP3519299B2 (ja) | 1999-01-06 | 2004-04-12 | 芝府エンジニアリング株式会社 | 半導体装置 |
JP3971296B2 (ja) * | 2002-12-27 | 2007-09-05 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板およびその製造方法 |
JP2006100752A (ja) * | 2004-09-30 | 2006-04-13 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
JP2006179648A (ja) | 2004-12-22 | 2006-07-06 | Mitsubishi Electric Corp | 電力用半導体装置 |
CN201667332U (zh) * | 2010-03-29 | 2010-12-08 | 比亚迪股份有限公司 | 一种半导体功率模块 |
-
2011
- 2011-09-21 JP JP2011205707A patent/JP2013069748A/ja active Pending
-
2012
- 2012-08-30 CN CN2012103151678A patent/CN103021963A/zh active Pending
- 2012-09-07 US US13/607,522 patent/US8896113B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268121A (ja) * | 1993-03-12 | 1994-09-22 | Hitachi Ltd | 半導体装置 |
JPH08204071A (ja) * | 1995-01-27 | 1996-08-09 | Toshiba Corp | 半導体装置 |
JP2000091481A (ja) * | 1998-09-08 | 2000-03-31 | Tokin Corp | 電力用トランジスタケースおよび電力用トランジスタ |
JP2003243584A (ja) * | 2002-02-15 | 2003-08-29 | Mitsubishi Electric Corp | 半導体装置 |
JP2004022964A (ja) * | 2002-06-19 | 2004-01-22 | Hitachi Metals Ltd | Al−SiC系複合体およびそれを用いた放熱部品、半導体モジュール装置 |
JP2006100320A (ja) * | 2004-09-28 | 2006-04-13 | Mitsubishi Electric Corp | 半導体装置 |
JP2012212788A (ja) * | 2011-03-31 | 2012-11-01 | Dowa Holdings Co Ltd | 金属ベース基板およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014215491A (ja) * | 2013-04-26 | 2014-11-17 | ソニー株式会社 | 液晶表示ユニット及び投射型表示装置 |
JP2019054069A (ja) * | 2017-09-14 | 2019-04-04 | 株式会社東芝 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
US20130069216A1 (en) | 2013-03-21 |
US8896113B2 (en) | 2014-11-25 |
CN103021963A (zh) | 2013-04-03 |
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