JP2013062747A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2013062747A JP2013062747A JP2011201100A JP2011201100A JP2013062747A JP 2013062747 A JP2013062747 A JP 2013062747A JP 2011201100 A JP2011201100 A JP 2011201100A JP 2011201100 A JP2011201100 A JP 2011201100A JP 2013062747 A JP2013062747 A JP 2013062747A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- plate
- substrate
- board
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/732—Printed circuits being in the same plane
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Telephone Set Structure (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】携帯電話機は、板面上に基板接点352aが形成された操作側フロント基板352と、バイブレータと、操作側フロント基板352とバイブレータとを接続する接点プレート364を備える。接点プレート364は、基板接点352aに接触する第1の接触部364a、及び第1の接触部364aから操作側フロント基板352の板面に沿って基板外形の外側まで延伸する板状の延伸部364b,c,dを有する。また、接点プレート364は、延伸部364b,c,dの基板外形の外側の板面に形成された第2の接触部364eを有する。バイブレータは、第2の接触部364eに接触する部品接点3626及び本体部3622を有し、部品接点3626及び本体部3622の一部が操作側フロント基板352の端面352bに対向するように配置される。
【選択図】図7
Description
250 表示側メイン基板
250a 基板接点
250b 端面
262 レシーバ
264 接点プレート
264a 第1の接触部
264b,264d 延伸部
264c 立ち上がり部
264e 第2の接触部
352 操作側フロント基板
352a 基板接点
352b 端面
362 バイブレータ
364a 第1の接触部
364b,364d 延伸部
364c 立ち下がり部
364e 第2の接触部
364 接点プレート
370 操作側リア基板
370a 基板接点
370b 端面
374 操作側メイン基板
382 スピーカ
384 接点プレート
384a 第1の接触部
384b,384d 延伸部
384c 立ち下がり部
384e 第2の接触部
2622,3622,3822 本体部
2624,3626,3824 部品接点
Claims (2)
- 板面上に他の部品との接点となる基板接点部が形成されたプリント配線基板と、
前記基板接点部に接触する第1の接触部、該第1の接触部から前記プリント配線基板の前記板面に沿って前記プリント配線基板の外形の外側まで延伸する板状の延伸部、及び該延伸部の前記プリント配線基板の外形の外側の板面に形成された第2の接触部を有する導電部材と、
前記第2の接触部に接触する部品接点部、及び該部品接点部が形成された本体部を有し、前記部品接点部又は前記本体部の少なくとも一部が前記プリント配線基板の端面に対向するように配置される電気部品と、
を備えることを特徴とする電子機器。 - 前記導電部材は、前記プリント配線基板の板厚より薄く形成された板金である
ことを特徴とする請求項1に記載の電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011201100A JP2013062747A (ja) | 2011-09-14 | 2011-09-14 | 電子機器 |
EP20120183055 EP2571339A3 (en) | 2011-09-14 | 2012-09-05 | Thin electronic device comprising a conductive member |
US13/607,348 US20130063915A1 (en) | 2011-09-14 | 2012-09-07 | Electronic device |
CN2012103424336A CN103002080A (zh) | 2011-09-14 | 2012-09-13 | 电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011201100A JP2013062747A (ja) | 2011-09-14 | 2011-09-14 | 電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013062747A true JP2013062747A (ja) | 2013-04-04 |
Family
ID=46982450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011201100A Pending JP2013062747A (ja) | 2011-09-14 | 2011-09-14 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130063915A1 (ja) |
EP (1) | EP2571339A3 (ja) |
JP (1) | JP2013062747A (ja) |
CN (1) | CN103002080A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9230418B2 (en) | 2013-06-24 | 2016-01-05 | Toyoda Gosei Co., Ltd. | Portable device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103592020A (zh) * | 2013-11-09 | 2014-02-19 | 严志杰 | 振动信号无线收集装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270822A (ja) * | 1997-03-27 | 1998-10-09 | Nippon Seiki Co Ltd | リードの接続構造 |
JP2008294652A (ja) * | 2007-05-23 | 2008-12-04 | Kyocera Corp | 携帯電子機器 |
JP2009111492A (ja) * | 2007-10-26 | 2009-05-21 | Kyocera Corp | 携帯電子機器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4497012A (en) * | 1983-11-14 | 1985-01-29 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
US5172214A (en) * | 1991-02-06 | 1992-12-15 | Motorola, Inc. | Leadless semiconductor device and method for making the same |
US5386343A (en) * | 1993-11-12 | 1995-01-31 | Ford Motor Company | Double surface mount technology for electronic packaging |
JP2000208183A (ja) * | 1998-07-27 | 2000-07-28 | Tyco Electronics Amp Kk | カ―ドエッジコネクタ |
JP2000049915A (ja) | 1998-07-28 | 2000-02-18 | Toshiba Corp | 移動通信機器 |
DE19953594A1 (de) * | 1998-11-20 | 2000-05-25 | Matsushita Electric Ind Co Ltd | Oberflächenmontierte elektronische Komponente |
US6239977B1 (en) * | 1999-05-17 | 2001-05-29 | 3Com Corporation | Technique for mounting electronic components on printed circuit boards |
US6456504B1 (en) * | 2000-10-31 | 2002-09-24 | 3Com Corporation | Surface mounted grounding clip for shielded enclosures |
US6657298B1 (en) * | 2001-07-18 | 2003-12-02 | Amkor Technology, Inc. | Integrated circuit chip package having an internal lead |
US7352601B1 (en) * | 2003-11-24 | 2008-04-01 | Michael Paul Minneman | USB flash memory device |
JP4416616B2 (ja) * | 2004-09-29 | 2010-02-17 | 株式会社リコー | 電子部品実装体及び電子機器 |
KR100839421B1 (ko) * | 2007-02-07 | 2008-06-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP2009053440A (ja) * | 2007-08-27 | 2009-03-12 | Canon Inc | 表示装置 |
US20110151709A1 (en) * | 2009-12-23 | 2011-06-23 | Ho Kim | Cable, cable connector and cable assembly |
JP5327119B2 (ja) * | 2010-03-26 | 2013-10-30 | 富士通株式会社 | 携帯端末装置 |
JP5665426B2 (ja) * | 2010-08-27 | 2015-02-04 | 京セラ株式会社 | 電子機器 |
-
2011
- 2011-09-14 JP JP2011201100A patent/JP2013062747A/ja active Pending
-
2012
- 2012-09-05 EP EP20120183055 patent/EP2571339A3/en not_active Withdrawn
- 2012-09-07 US US13/607,348 patent/US20130063915A1/en not_active Abandoned
- 2012-09-13 CN CN2012103424336A patent/CN103002080A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270822A (ja) * | 1997-03-27 | 1998-10-09 | Nippon Seiki Co Ltd | リードの接続構造 |
JP2008294652A (ja) * | 2007-05-23 | 2008-12-04 | Kyocera Corp | 携帯電子機器 |
JP2009111492A (ja) * | 2007-10-26 | 2009-05-21 | Kyocera Corp | 携帯電子機器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9230418B2 (en) | 2013-06-24 | 2016-01-05 | Toyoda Gosei Co., Ltd. | Portable device |
Also Published As
Publication number | Publication date |
---|---|
EP2571339A2 (en) | 2013-03-20 |
EP2571339A3 (en) | 2013-10-30 |
CN103002080A (zh) | 2013-03-27 |
US20130063915A1 (en) | 2013-03-14 |
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