JP2012521634A5 - - Google Patents

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JP2012521634A5
JP2012521634A5 JP2012502002A JP2012502002A JP2012521634A5 JP 2012521634 A5 JP2012521634 A5 JP 2012521634A5 JP 2012502002 A JP2012502002 A JP 2012502002A JP 2012502002 A JP2012502002 A JP 2012502002A JP 2012521634 A5 JP2012521634 A5 JP 2012521634A5
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JP
Japan
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sensor
conductive
sensing element
state
thermal fuse
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JP2012502002A
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JP5555764B2 (ja
JP2012521634A (ja
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Priority claimed from US12/383,595 external-priority patent/US8581686B2/en
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保護回路のあるタイプは温度ヒューズである。温度ヒューズの機能は典型的なガラスフューズの機能と似ている。すなわち、標準的な操作状況の下では、ヒューズは短絡回路のように動き、不良状態の間は、ヒューズは開回路のように動く。温度ヒューズの温度が特定の温度を超えると、これら２つの操作モードの間を移行する。これらモードの移行を容易にするために、温度ヒューズは伝導要素(又はエレメント；ｅｌｅｍｅｎｔ)を含んで成る。伝導要素とは、例えば伝導性状態から非伝導性状態へ切り替えることが可能な可溶性ワイヤー、金属接触一式、又ははんだ付け金属コンタクトである。又、検知要素が取り入れられてもよい。検知要素の物理的状態は、検知要素の温度と共に変化する。例えば、検知要素は作動(又は活性化；ａｃｔｉｖａｔｉｏｎ)温度で溶融する溶融軽金属又は離散した溶融有機化合物に相当してもよい。検知要素の状態が変わると、伝導要素は電子伝導経路を物理的に遮断することにより、伝導性状態から非伝導性状態へと切り替わる。
伝導要素１４５は、第１パッド１１０および第２パッド１１５の各々と電気的に通じさせてもよい第１端部１４５ａおよび第２端部１４５ｂを含んで成る。又、伝導要素はセンサー１４５ｃを含んで成る。センサー１４５ｃは、相対的に低い融点を有し、および/又は特定の温度で復元力を失う伝導性材料又は非伝導性材料、例えばはんだ又はプラスチックから成ってもよい。ある態様では、センサー１４５ｃが復元力を失うと、センサー１４５ｃを包含するようになっている外管１４５ｄの内部に、センサー１４５ｃが配置される。例えば、センサー１４５ｃが溶けると、外管１４５ｄにより、センサー１４５ｃがハウジング１５０の内側を自由に動かないようにしてよい。別の態様では、検知要素は表面張力により包含されてもよい。リフロー可能な温度ヒューズの操作中、負荷電流が伝導要素１４５を介して流れる。例えば、電源からの負荷電流は、リフロー可能な温度ヒューズを介して、他の回路まで流れてもよい。ある態様では、伝導要素１４５を介して流れる電流は、主としてセンサー１４５ｃを介して流れる。他の態様では、主電流はセンサー１４５ｃを介して流れない。
更に他の態様では、伝導要素および検知要素は分離されてもよいが、検知要素を作動させて、伝導要素を低抵抗状態に維持してもよい。例えば、伝導要素は、米国特許第４５１４７１８号で開示されている４-メチルウンベリフェロンのような離散した溶融有機材料を含んで成るセンサーにより結合される「ドライ」(すなわちはんだ付けされていない)なコンタクトを含んで成ってもよい。
JP2012502002A 2009-03-24 2010-03-24 電気的に作動させた表面実装温度ヒューズ Active JP5555764B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/383,595 2009-03-24
US12/383,595 US8581686B2 (en) 2009-03-24 2009-03-24 Electrically activated surface mount thermal fuse
PCT/US2010/000863 WO2010110877A1 (en) 2009-03-24 2010-03-24 Electrically activated surface mount thermal fuse

Publications (3)

Publication Number Publication Date
JP2012521634A JP2012521634A (ja) 2012-09-13
JP2012521634A5 true JP2012521634A5 (ja) 2013-05-09
JP5555764B2 JP5555764B2 (ja) 2014-07-23

Family

ID=42307882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502002A Active JP5555764B2 (ja) 2009-03-24 2010-03-24 電気的に作動させた表面実装温度ヒューズ

Country Status (7)

Country Link
US (1) US8581686B2 (ja)
EP (1) EP2411991B1 (ja)
JP (1) JP5555764B2 (ja)
KR (1) KR101714802B1 (ja)
CN (1) CN102362329B (ja)
TW (1) TWI576884B (ja)
WO (1) WO2010110877A1 (ja)

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JP7173902B2 (ja) 2019-03-05 2022-11-16 デクセリアルズ株式会社 保護素子

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP7173902B2 (ja) 2019-03-05 2022-11-16 デクセリアルズ株式会社 保護素子

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