JP2012507846A - 成型された双方向光学部品を備えるled - Google Patents
成型された双方向光学部品を備えるled Download PDFInfo
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- JP2012507846A JP2012507846A JP2011533907A JP2011533907A JP2012507846A JP 2012507846 A JP2012507846 A JP 2012507846A JP 2011533907 A JP2011533907 A JP 2011533907A JP 2011533907 A JP2011533907 A JP 2011533907A JP 2012507846 A JP2012507846 A JP 2012507846A
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- 230000003287 optical effect Effects 0.000 title description 6
- 230000002457 bidirectional effect Effects 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 28
- 238000000465 moulding Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 16
- 238000000149 argon plasma sintering Methods 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00355—Production of simple or compound lenses with a refractive index gradient
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/003—Lens or lenticular sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (15)
- サブマウント上に取り付けられた発光ダイオード(LED)ダイを設けるステップであって、前記LEDダイは上面を有している、ステップと、
第1の屈折率を持つ第1のシリコーンを使用して前記LEDダイの周部を少なくとも囲んでいると共に、前記LEDダイの上面にわたる開口を有する外側レンズを成型するステップと、
前記外側レンズの成型の後、前記第1の屈折率よりも高い第2の屈折率を有する第2のシリコーンを使用して前記外側レンズの前記開口内の前記LEDダイの前記上面にわたって内側レンズを成型するステップと、
を有する照明装置を形成する方法であって、
前記内側レンズの形状は、全内部反射(TIR)によって前記上面によって発される光をコリメートするように作用し、
前記外側レンズの形状は、光の側部発光パターンが前記内側レンズ内で全内部反射されないように作用する、
照明装置を形成する方法。 - 前記第1の屈折率は少なくとも約1.3であり、前記第2の屈折率は少なくとも約1.6である、請求項1に記載の方法。
- 前記外側レンズを成型するステップは、前記上面に対する垂線から45°−65°の範囲内にピーク発光を生成するように前記外側レンズを成型するステップを含んでいる、請求項1に記載の方法。
- 前記内側レンズを成型するステップは、前記上面に対して垂線から10°−35°の間の光拡散パターンを生成するように前記内側レンズを成型するステップを含んでいる、請求項1に記載の方法。
- 前記外側レンズを成型するステップが、ほぼ半球状の外側の側壁表面を有するように前記外側レンズを成型するステップを含んでいる、請求項1に記載の方法。
- 前記内側レンズを成型するステップが、前記内側レンズの上部が平坦であるように前記内側レンズを成型するステップを含んでいる、請求項1に記載の方法。
- 前記内側レンズを成型するステップが、前記内側レンズの上部が光拡散フィーチャを有するように前記内側レンズを成型するステップを含んでいる、請求項1に記載の方法。
- 前記内側レンズを成型するステップ及び前記外側レンズを成型するステップが、前記内側レンズ及び前記外側レンズを中心の軸に関して対称に成型するステップを含んでいる、請求項1の方法。
- 前記内側レンズを成型するステップが、前記内側レンズを実質的に円筒形に成型するステップを含んでいる、請求項1に記載の方法。
- 前記内側レンズを成型するステップは、前記内側レンズをほぼ放物線状に成型するステップを含んでいる、請求項1に記載の方法。
- 前記外側レンズを成型するステップは、前記LEDダイの上面にわたって前記第1のシリコーンの層を形成するように前記第1のシリコーンを成型するステップであって、前記層は、所望の発光パターンを達成するために非平坦な形状を有している、ステップを含んでいる、請求項1に記載の方法。
- 前記層が、光散乱フィーチャを含んでいる、請求項11に記載の方法。
- サブマウント上に取り付けられている発光ダイオード(LED)ダイであって、上面を有するLEDダイと、
前記LEDダイの周部を少なくとも囲んでいる成型された外側レンズであって、第1の屈折率を有する第1のシリコーンを有しており、前記LEDダイの上面にわたる開口を有する外側レンズと、
前記外側レンズの開口内の前記LEDダイの上面にわたって成型された内側レンズであって、前記第1の屈折率よりも高い第2の屈折率を有する第2のシリコーンを有する内側レンズと、
を有する発光装置であって、
前記内側レンズの形状は、全内部反射(TIR)によって前記上面によって発される光をコリメートするように振る舞い、
前記外側レンズの形状は、前記内側レンズ内で内部反射されない光の側部発光パターンに影響を及ぼす、
発光装置。 - 前記内側レンズ及び外側レンズを有する複数のLEDがバックライト導波路の縁に光学的に結合されている、請求項13に記載の装置。
- 前記外側レンズは、前記上面に対する垂線から45°−65°の範囲内のピーク発光を生成し、前記内側レンズは、前記上面に対する垂線から10°−35°の間に光拡散パターンを生成する、請求項13に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/265,131 | 2008-11-05 | ||
US12/265,131 US7994529B2 (en) | 2008-11-05 | 2008-11-05 | LED with molded bi-directional optics |
PCT/IB2009/054805 WO2010052619A1 (en) | 2008-11-05 | 2009-10-29 | Led with molded bi-directional optics |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012507846A true JP2012507846A (ja) | 2012-03-29 |
JP2012507846A5 JP2012507846A5 (ja) | 2012-12-13 |
JP5676459B2 JP5676459B2 (ja) | 2015-02-25 |
Family
ID=41566086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011533907A Active JP5676459B2 (ja) | 2008-11-05 | 2009-10-29 | 成型された双方向光学部品を備えるled |
Country Status (9)
Country | Link |
---|---|
US (1) | US7994529B2 (ja) |
EP (1) | EP2347453B1 (ja) |
JP (1) | JP5676459B2 (ja) |
KR (1) | KR101632769B1 (ja) |
CN (1) | CN102203964B (ja) |
BR (1) | BRPI0916184B1 (ja) |
RU (1) | RU2512110C2 (ja) |
TW (1) | TWI507635B (ja) |
WO (1) | WO2010052619A1 (ja) |
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CN103476568B (zh) * | 2010-11-24 | 2016-05-11 | 拜耳知识产权有限责任公司 | 光学成型体的制备方法 |
US8885995B2 (en) | 2011-02-07 | 2014-11-11 | Morgan Solar Inc. | Light-guide solar energy concentrator |
GB2493177A (en) * | 2011-07-27 | 2013-01-30 | Ruiyun Optoelectronics Lighting Technology Co Ltd | An LED package for increasing side illumination or providing spotlighting |
JP5533827B2 (ja) * | 2011-09-20 | 2014-06-25 | 豊田合成株式会社 | 線状光源装置 |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
WO2013112435A1 (en) | 2012-01-24 | 2013-08-01 | Cooledge Lighting Inc. | Light - emitting devices having discrete phosphor chips and fabrication methods |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US8328403B1 (en) | 2012-03-21 | 2012-12-11 | Morgan Solar Inc. | Light guide illumination devices |
WO2013180366A1 (en) * | 2012-05-31 | 2013-12-05 | Lg Innotek Co., Ltd. | Member for cotrolling luminous flux, display device, and light emitting device |
TWI525861B (zh) | 2012-11-28 | 2016-03-11 | Lg化學股份有限公司 | 發光二極體 |
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2008
- 2008-11-05 US US12/265,131 patent/US7994529B2/en active Active
-
2009
- 2009-10-29 WO PCT/IB2009/054805 patent/WO2010052619A1/en active Application Filing
- 2009-10-29 BR BRPI0916184A patent/BRPI0916184B1/pt active IP Right Grant
- 2009-10-29 RU RU2011122644/28A patent/RU2512110C2/ru active
- 2009-10-29 EP EP09747925.7A patent/EP2347453B1/en active Active
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Publication number | Publication date |
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TWI507635B (zh) | 2015-11-11 |
RU2011122644A (ru) | 2012-12-20 |
EP2347453A1 (en) | 2011-07-27 |
BRPI0916184A2 (pt) | 2015-11-03 |
RU2512110C2 (ru) | 2014-04-10 |
US20100109034A1 (en) | 2010-05-06 |
KR20110084292A (ko) | 2011-07-21 |
TW201033538A (en) | 2010-09-16 |
CN102203964A (zh) | 2011-09-28 |
BRPI0916184B1 (pt) | 2019-08-13 |
CN102203964B (zh) | 2013-11-27 |
BRPI0916184A8 (pt) | 2018-07-10 |
EP2347453B1 (en) | 2016-07-20 |
WO2010052619A1 (en) | 2010-05-14 |
JP5676459B2 (ja) | 2015-02-25 |
KR101632769B1 (ko) | 2016-06-22 |
US7994529B2 (en) | 2011-08-09 |
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