JP2012225966A - Diffraction grating for x-ray talbot interferometer, method for manufacturing the same, and x-ray talbot interferometer - Google Patents

Diffraction grating for x-ray talbot interferometer, method for manufacturing the same, and x-ray talbot interferometer Download PDF

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JP2012225966A
JP2012225966A JP2011090607A JP2011090607A JP2012225966A JP 2012225966 A JP2012225966 A JP 2012225966A JP 2011090607 A JP2011090607 A JP 2011090607A JP 2011090607 A JP2011090607 A JP 2011090607A JP 2012225966 A JP2012225966 A JP 2012225966A
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Yoshitomo Nakagawa
良知 中川
Yoshiharu Shirakawabe
喜春 白川部
Satoru Nakayama
哲 中山
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Seiko Instruments Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a diffraction grating for an X-ray Talbot interferometer which can be manufactured with ease and high accuracy as the diffraction grating having high aspect ratio of a groove, and to provide a method for manufacturing the diffraction grating for the X-ray Talbot interferometer and the X-ray Talbot interferometer.SOLUTION: In diffraction gratings 10, 20 for an X-ray Talbot interferometer, on a substrate 22, a plurality of metallic X-ray absorption parts 10b, 20b are formed in a wavy shape at prescribed intervals in one direction, and resin 26 is interposed in grooves 10a, 20a between X-ray absorption parts adjacent to each other. The X-ray absorption part is formed by installing two or more unit metal layers 2b, 4b, 6b vertically on the surface of the substrate. The unit metal layers are formed by cutting a metal film, and the irregularity of side walls 2s, 4s, 6s of grooves of the unit metal layers is 0.1 μm or less in an arithmetic average height Ra specified by JIS B0601.

Description

本発明は、Ｘ線タルボ干渉計用回折格子及びその製造方法、並びにＸ線タルボ干渉計に関する。   The present invention relates to a diffraction grating for an X-ray Talbot interferometer, a manufacturing method thereof, and an X-ray Talbot interferometer.

回折格子を用い、空間的に可干渉な光源からの光を透過させると、回折格子から特定の距離において、回折格子の自己像を形成するタルボ効果が知られている。近年、このタルボ効果を用い、透過Ｘ線の位相シフトを検出するＸ線タルボ干渉計が開発されている。タルボ効果を利用し、Ｘ線の位相シフトにより得られる画像は、従来の透過Ｘ線の吸収の大小によって得られる画像に比べ、特に原子番号の小さな物質でコントラストが高いという利点がある。
このようなＸ線タルボ干渉計１０００として、図１０に示すように、第１の回折格子１０１０および第２の回折格子１０２０と、Ｘ線画像検出器３０とを備えた構成が知られている（特許文献１参照）。第１の回折格子１０１０および第２の回折格子１０２０は、図１１に示すように、金属板の一方向に所定間隔で溝１０１０ａ、１０２０ａを形成し、溝からＸ線を透過させる一方、隣接する溝の間の畝部１０１０ｂではＸ線の位相をπ／２だけシフトして透過させ、畝部１０２０ｂでＸ線を遮蔽（吸収）するようになっている。回折格子の材料としては、通常、Ｘ線吸収能の高い金（Ａｕ）を用いている。 When a diffraction grating is used and light from a spatially coherent light source is transmitted, a Talbot effect that forms a self-image of the diffraction grating at a specific distance from the diffraction grating is known. In recent years, an X-ray Talbot interferometer that detects the phase shift of transmitted X-rays using this Talbot effect has been developed. The image obtained by utilizing the Talbot effect and the phase shift of the X-ray has an advantage that the contrast is particularly high with a substance having a small atomic number, compared with the image obtained by the conventional absorption X-ray absorption.
As such an X-ray Talbot interferometer 1000, as shown in FIG. 10, a configuration including a first diffraction grating 1010, a second diffraction grating 1020, and an X-ray image detector 30 is known ( Patent Document 1). As shown in FIG. 11, the first diffraction grating 1010 and the second diffraction grating 1020 form grooves 1010a and 1020a at a predetermined interval in one direction of a metal plate, and transmit X-rays from the grooves, but are adjacent to each other. The flange portion 1010b between the grooves shifts the X-ray phase by π / 2 and transmits it, and the flange portion 1020b shields (absorbs) the X-ray. As a material for the diffraction grating, gold (Au) having a high X-ray absorption ability is usually used.

このＸ線タルボ干渉計において、Ｘ線源から試料を介して第１の回折格子にＸ線を照射すると、溝部１０１０ａを透過したＸ線と畝部１０１０ｂを透過回折したＸ線とが互いに干渉する。そして、第一の回折格子１０１０のタルボ距離ｄ２／２λ（ｄは回折格子の周期、λはＸ線の波長）の整数倍の位置には、第一の回折格子１０１０の自己像が現れる（タルボ効果）。この自己像には試料４による歪みが生じ、この歪みは試料の情報を持っている。第二の回折格子１０２０は第一の回折格子１０１０の自己像が現れる位置に配置される。そして第二の回折格子１０２０を透過するＸ線の分布には、第一の回折格子の自己像が重なってモアレ縞が生じている。従って、このＸ線の分布をＸ線画像検出器で検出して、画像解析を行って試料４の像を得る。画像コントラストを向上させるには、第２の回折格子１０２０の溝部１０２０ａのＸ線透過率が高く、畝部１０２０ｂのＸ線透過率が低いと良い。そのため、第２の回折格子１０２０は第１の回折格子１０１０より厚い振幅型回折格子であることが好ましい。 In this X-ray Talbot interferometer, when the first diffraction grating is irradiated with X-rays from the X-ray source through the sample, the X-rays transmitted through the groove 1010a and the X-rays transmitted through the flange 1010b interfere with each other. . Then, a self-image of the first diffraction grating 1010 appears at a position that is an integral multiple of the Talbot distance d 2 / 2λ (d is the period of the diffraction grating, and λ is the wavelength of the X-ray) of the first diffraction grating 1010 ( Talbot effect). This self-image is distorted by the sample 4, and this distortion has sample information. The second diffraction grating 1020 is arranged at a position where the self-image of the first diffraction grating 1010 appears. In the distribution of X-rays transmitted through the second diffraction grating 1020, moiré fringes are generated by overlapping the self-images of the first diffraction grating. Therefore, this X-ray distribution is detected by an X-ray image detector, and image analysis is performed to obtain an image of the sample 4. In order to improve the image contrast, it is preferable that the X-ray transmittance of the groove portion 1020a of the second diffraction grating 1020 is high and the X-ray transmittance of the flange portion 1020b is low. Therefore, the second diffraction grating 1020 is preferably an amplitude type diffraction grating thicker than the first diffraction grating 1010.

ここで、タルボ効果を生じさせるため、回折格子の畝部（Ｘ線吸収部）をＸ線の可干渉性を確保した周期にする必要がある。そのため畝部の周期を１０μｍ以下程度としなければならない。さらに、位相型回折格子においては、位相シフト量がπ／２になるときに自己像のコントラストが最も高くなることから、これを実現するには、畝部の厚さ（溝の深さ）を１〜１０μｍ程度とする必要があり、微細な加工や製造技術が要求される。
一方、振幅型回折格子として機能するためには、回折格子の溝部１０２０ａのＸ線透過率が高く、畝部１０２０ｂのＸ線透過率が低いと良い。このため、金を用いても溝の深さを１０〜１００μｍ程度に深掘りすることが要求される。従って、回折格子の（溝の深さ）／（溝の幅）で表されるアスペクト比が非常に大きくなり、回折格子の製造が困難となる。 Here, in order to generate the Talbot effect, it is necessary to make the buttocks (X-ray absorption part) of the diffraction grating have a period that ensures the coherence of X-rays. Therefore, the period of the buttocks must be about 10 μm or less. Further, in the case of the phase type diffraction grating, the contrast of the self-image becomes the highest when the phase shift amount is π / 2. Therefore, in order to realize this, the thickness of the collar portion (groove depth) is set. It needs to be about 1 to 10 μm, and fine processing and manufacturing techniques are required.
On the other hand, in order to function as an amplitude type diffraction grating, it is preferable that the X-ray transmittance of the groove 1020a of the diffraction grating is high and the X-ray transmittance of the flange 1020b is low. For this reason, even if it uses gold | metal | money, it is requested | required to dig the depth of a groove | channel to about 10-100 micrometers. Therefore, the aspect ratio represented by (groove depth) / (groove width) of the diffraction grating becomes very large, making it difficult to manufacture the diffraction grating.

このようなことから、Ｘ線マスクを使ったＸ線リソグラフィーによって樹脂に深い溝を形成し、この溝に電鋳法によってＸ線吸収部を形成させ、Ｘ線タルボ干渉計用の回折格子を製造する技術が開示されている（特許文献２参照）。
又、シリコン基板表面の感光性樹脂をリソグラフィー法でパターニングして除去し、次にＩＣＰプラズマエッチング法で感光性樹脂が除去されたシリコン基板をエッチングしてスリット溝を形成した後、スリット溝に絶縁物を堆積し、さらに残った感光性樹脂及びシリコン基板をＩＣＰプラズマエッチング法でエッチングして第２のスリット溝を形成し、第２のスリット溝に電鋳法によってＸ線吸収金属部を形成する技術が開示されている（特許文献３参照）。 For this reason, a deep groove is formed in the resin by X-ray lithography using an X-ray mask, and an X-ray absorption part is formed in this groove by electroforming to produce a diffraction grating for an X-ray Talbot interferometer. The technique to do is disclosed (refer patent document 2).
In addition, the photosensitive resin on the surface of the silicon substrate is removed by patterning by lithography, and then the silicon substrate from which the photosensitive resin has been removed is etched by ICP plasma etching to form a slit groove, and then the slit groove is insulated. The remaining photosensitive resin and the silicon substrate are etched by ICP plasma etching to form a second slit groove, and an X-ray absorbing metal portion is formed by electroforming in the second slit groove. A technique is disclosed (see Patent Document 3).

国際公開第２００４／５８０７０号International Publication No. 2004/58070 特開２００６−２５９２６４号公報JP 2006-259264 A 特開２００９−４２５２８号公報JP 2009-42528 A

しかしながら、特許文献２、３記載の技術の場合、微細な溝（スリット）内に電鋳を行うため、溝のアスペクト比が高くなるほど、電鋳を確実に行うことが難しくなる。又、レジスト樹脂を用いてアスペクト比の高い溝を形成しようとすると、樹脂が柔らかくて絶縁物であるために変形して隣接する畝部が接触し（スティッキング）、寸法精度の高い回折格子の製造が難しいという問題がある。さらに、アスペクト比の高い溝を作製するためには、シンクロトロン放射による放射光を用い、直線性の高いＸ線で露光する必要があり、製造コストが大幅に上昇する。
従って、本発明の目的は、溝のアスペクト比の高い回折格子を容易かつ高精度で製造することができるＸ線タルボ干渉計用回折格子及びその製造方法、並びにＸ線タルボ干渉計を提供することにある。 However, in the case of the techniques described in Patent Documents 2 and 3, since electroforming is performed in fine grooves (slits), it becomes difficult to reliably perform electroforming as the aspect ratio of the grooves increases. Also, when trying to form a groove with a high aspect ratio using resist resin, the resin is soft and is an insulator, so it deforms and the adjacent ridges come into contact (sticking), producing a diffraction grating with high dimensional accuracy. There is a problem that is difficult. Furthermore, in order to produce a groove with a high aspect ratio, it is necessary to perform exposure with X-rays having high linearity using synchrotron radiation, which greatly increases the manufacturing cost.
Accordingly, an object of the present invention is to provide a diffraction grating for an X-ray Talbot interferometer, a manufacturing method thereof, and an X-ray Talbot interferometer capable of easily and highly accurately manufacturing a diffraction grating having a high groove aspect ratio. It is in.

本発明のＸ線タルボ干渉計用回折格子は、基板上に、金属製のＸ線吸収部が一方向に沿って所定間隔で畝状に複数形成され、隣接するＸ線吸収部の間の溝部に樹脂が介装され、前記Ｘ線吸収部は、２以上の単位金属層を前記基板の表面に垂直に積層してなり、前記単位金属層は金属膜を切削して形成され、該単位金属層の溝部の側壁の凹凸がＪＩＳ Ｂ０６０１で規定された算術平均高さＲａで０．１μｍ以下である。
このような構成とすると、切削刃具で金属膜に溝部を彫るため、レジスト樹脂を用いて形成した微細な溝（スリット）内に電鋳を行って回折格子を製造する従来技術に比べ、単位金属層の側壁、ひいてはＸ線吸収部の側壁の寸法精度の高い回折格子が得られる。
さらに、（溝部の深さ）／（溝部の幅）で表されるアスペクト比を高くした溝部を、一回の切削で製造するには、細長い単結晶ダイヤモンド切削刃具を用いることが必要となり、切削刃具が折れやすく、溝部の側壁の形状の寸法精度が低下する場合がある。そこで、１回の切削で形成される溝部の深さをそれほど深くせず（アスペクト比を高くせず）、個々の切削により形成した単位金属層を積層することにより、最終的に得られるＸ線吸収部（溝部）のアスペクト比を高くすることができ、かつ切削刃具の破損が低減される。 The diffraction grating for an X-ray Talbot interferometer according to the present invention has a plurality of metal X-ray absorbers formed in a bowl shape at a predetermined interval along one direction on a substrate, and a groove between adjacent X-ray absorbers The X-ray absorption part is formed by laminating two or more unit metal layers perpendicularly to the surface of the substrate, and the unit metal layer is formed by cutting a metal film. The unevenness of the side wall of the groove portion of the layer is not more than 0.1 μm in terms of arithmetic average height Ra specified by JIS B0601.
With such a configuration, the groove metal is carved into the metal film with the cutting blade, so that the unit metal is compared to the conventional technique in which a diffraction grating is manufactured by electroforming in a fine groove (slit) formed using a resist resin. A diffraction grating with high dimensional accuracy can be obtained on the side wall of the layer, and thus on the side wall of the X-ray absorber.
Furthermore, in order to manufacture a groove having a high aspect ratio expressed by (groove depth) / (groove width) by a single cutting, it is necessary to use an elongated single crystal diamond cutting tool. The cutting tool is easily broken, and the dimensional accuracy of the shape of the side wall of the groove may be lowered. Therefore, the X-rays finally obtained by laminating unit metal layers formed by individual cutting without increasing the depth of the groove formed by one cutting (not increasing the aspect ratio). The aspect ratio of the absorption part (groove part) can be increased, and breakage of the cutting blade is reduced.

前記Ｘ線吸収部は金を主成分とし、かつ平均粒径０．１μｍ以下の結晶から成るか、又はアモルファスから成ると好ましい。
このようにすると、切削加工の仕上がり面（側壁）が平滑でバリ発生も無く、回折格子の特性が向上する。 It is preferable that the X-ray absorption part is made of a crystal containing gold as a main component and having an average particle diameter of 0.1 μm or less, or made of an amorphous material.
In this way, the finished surface (side wall) of the cutting process is smooth, no burrs are generated, and the characteristics of the diffraction grating are improved.

本発明のＸ線タルボ干渉計用回折格子の製造方法は、基板上に初期金属膜を形成する初期金属膜形成工程と、前記初期金属膜を一方向に沿って所定間隔で切削して複数の溝部を彫り、隣接する前記溝部の間に畝状の単位金属層を形成する切削工程と、前記溝部に樹脂を充填する樹脂充填工程と、前記樹脂の表面を研削又は灰化して前記単位金属層の上面を表出させる金属層表出工程と、少なくとも前記単位金属層の上面に第２金属膜を積層する金属膜積層工程と、前記単位金属層の側壁に沿って前記第２金属膜を切削して複数の溝部を彫り、隣接する前記溝部の間に畝状の単位金属層を形成する第２切削工程と、を有し、前記金属膜積層工程、前記第２切削工程をこの順で少なくとも１回繰り返す。
このような構成とすると、切削刃具で金属膜に溝部を彫るため、レジスト樹脂を用いて形成した微細な溝（スリット）内に電鋳を行って回折格子を製造する従来技術に比べ、単位金属層の側壁、ひいてはＸ線吸収部の側壁の寸法精度の高い回折格子が得られる。
さらに、（溝部の深さ）／（溝部の幅）で表されるアスペクト比を高くした溝部を、一回の切削で製造するには、細長い単結晶ダイヤモンド切削刃具を用いることが必要となり、切削刃具が折れやすく、溝部の側壁の形状の寸法精度が低下する場合がある。そこで、１回の切削で形成される溝部の深さをそれほど深くせず（アスペクト比を高くせず）、個々の切削により形成した単位金属層を積層することにより、最終的に得られるＸ線吸収部（畝部）のアスペクト比を高くすることができ、かつ切削刃具の破損が低減される。
又、金属膜を切削して各単位金属層を形成する際に、樹脂が下側の単位金属層を保持し、この単位金属層が倒れたり変形するのを防止する。 An X-ray Talbot interferometer diffraction grating manufacturing method according to the present invention includes an initial metal film forming step of forming an initial metal film on a substrate, and a plurality of the initial metal film cut at predetermined intervals along one direction. A cutting step of carving a groove portion to form a bowl-shaped unit metal layer between adjacent groove portions, a resin filling step of filling the groove portion with a resin, and grinding or ashing the surface of the resin to form the unit metal layer A metal layer exposing step for exposing the upper surface of the metal layer, a metal film laminating step for laminating a second metal film on at least the upper surface of the unit metal layer, and cutting the second metal film along the side wall of the unit metal layer A second cutting step of carving a plurality of groove portions and forming a bowl-shaped unit metal layer between the adjacent groove portions, and at least the metal film lamination step and the second cutting step in this order. Repeat once.
With such a configuration, the groove metal is carved into the metal film with the cutting blade, so that the unit metal is compared to the conventional technique in which a diffraction grating is manufactured by electroforming in a fine groove (slit) formed using a resist resin. A diffraction grating with high dimensional accuracy can be obtained on the side wall of the layer, and thus on the side wall of the X-ray absorber.
Furthermore, in order to manufacture a groove having a high aspect ratio expressed by (groove depth) / (groove width) by a single cutting, it is necessary to use an elongated single crystal diamond cutting tool. The cutting tool is easily broken, and the dimensional accuracy of the shape of the side wall of the groove may be lowered. Therefore, the X-rays finally obtained by laminating unit metal layers formed by individual cutting without increasing the depth of the groove formed by one cutting (not increasing the aspect ratio). The aspect ratio of the absorption part (the collar part) can be increased, and the breakage of the cutting blade is reduced.
In addition, when the unit metal layer is formed by cutting the metal film, the resin holds the lower unit metal layer and prevents the unit metal layer from falling or deforming.

前記第２切削工程において、前記基板表面に設けたアライメントマークを基準として前記金属膜の切削位置を調整すると好ましい。
このようにすると、各種処理工程（例えば、金属層表出工程）で基板を搬送した後、切削加工機に基板が戻った際の位置合わせが正確となり、単位金属層の側壁に正確に沿って金属膜を切削することができる。 In the second cutting step, it is preferable to adjust the cutting position of the metal film with reference to an alignment mark provided on the substrate surface.
In this way, after the substrate is transported in various processing steps (for example, the metal layer exposing step), the alignment when the substrate returns to the cutting machine becomes accurate, and along the side wall of the unit metal layer accurately. The metal film can be cut.

前記基板と前記初期金属膜との間に、前記基板より硬度が低く、かつ前記初期金属膜より有効原子番号が小さい元素を含む層を形成する中間層形成工程をさらに有すると好ましい。
一般に基板は初期金属膜より硬いので、基板を削ると切削刃具を消耗するが、初期金属膜と基板の間に中間層を形成することにより、金属膜厚分を確実に切削して深い溝部を形成できると共に、基板より柔らかい中間層の一部を切削することで、切削刃具の消耗を防止する。また中間層は金属膜より有効原子番号が小さいので、中間層によるＸ線の遮蔽および位相変化が単位金属層より小さく、得られた回折格子による位相イメージの画質には影響しない。 It is preferable to further include an intermediate layer forming step of forming a layer containing an element having a lower hardness than the substrate and an effective atomic number smaller than the initial metal film between the substrate and the initial metal film.
In general, the substrate is harder than the initial metal film, so cutting the substrate consumes the cutting blade, but by forming an intermediate layer between the initial metal film and the substrate, the metal film thickness can be reliably cut to form deep grooves. It can be formed, and by cutting a part of the intermediate layer that is softer than the substrate, wear of the cutting blade is prevented. Further, since the intermediate layer has an effective atomic number smaller than that of the metal film, X-ray shielding and phase change by the intermediate layer are smaller than those of the unit metal layer, and the image quality of the phase image by the obtained diffraction grating is not affected.

前記樹脂が、ポリイミド及び／又はパラキシレン系ポリマーを含むと、機械強度に優れ、さらに位相イメージング時にＸ線に対する耐久性が高いので好ましい。
前記樹脂充填工程及び／又は前記第２樹脂充填工程において、前記樹脂としてポリイミドを真空注入法によって前記溝部に充填すると、溝部の深部までポリイミドが流入するので好ましい。
前記樹脂充填工程及び／又は前記第２樹脂充填工程において、前記樹脂としてパラキシレン系ポリマーを真空蒸着法によって前記溝部に充填すると、溝部の深部までパラキシレン系ポリマーが流入するので好ましい。 It is preferable that the resin contains polyimide and / or paraxylene-based polymer because it has excellent mechanical strength and high durability against X-rays during phase imaging.
In the resin filling step and / or the second resin filling step, it is preferable to fill the groove with polyimide as the resin by vacuum injection because polyimide flows into the deep portion of the groove.
In the resin filling step and / or the second resin filling step, it is preferable to fill the groove with a paraxylene polymer as the resin by a vacuum deposition method because the paraxylene polymer flows into the deep portion of the groove.

前記切削工程及び前記第２切削工程において、単結晶ダイヤモンドからなる切れ刃を有する切削工具を用いると、単結晶ダイヤモンドは硬度が高く、精密な溝加工が可能であるので好ましい。   In the cutting step and the second cutting step, it is preferable to use a cutting tool having a cutting edge made of single crystal diamond because the single crystal diamond has high hardness and enables precise grooving.

本発明のＸ線タルボ干渉計は、前記Ｘ線タルボ干渉計用回折格子を用いたものである。   The X-ray Talbot interferometer of the present invention uses the X-ray Talbot interferometer diffraction grating.

本発明によれば、溝のアスペクト比の高いＸ線タルボ干渉計用回折格子を容易かつ高精度で製造することができる。   ADVANTAGE OF THE INVENTION According to this invention, the diffraction grating for X-ray Talbot interferometers with a high aspect ratio of a groove | channel can be manufactured easily and with high precision.

本発明の実施形態に係るＸ線タルボ干渉計の概略構成を示す図である。It is a figure which shows schematic structure of the X-ray Talbot interferometer which concerns on embodiment of this invention. 第１の回折格子および第２の回折格子のｘ方向に沿う断面図である。It is sectional drawing in alignment with the x direction of a 1st diffraction grating and a 2nd diffraction grating. 本発明の実施形態に係るＸ線タルボ干渉計用回折格子の構成を示す斜視図である。It is a perspective view which shows the structure of the diffraction grating for X-ray Talbot interferometers concerning embodiment of this invention. 単結晶ダイヤモンド切削刃具を取り付けた工具本体を示す斜視図である。It is a perspective view which shows the tool main body which attached the single crystal diamond cutting blade. 単結晶ダイヤモンド切削刃具を示す斜視図である。It is a perspective view which shows a single crystal diamond cutting tool. 単結晶ダイヤモンド切削刃具を用い、各単位金属層を形成する方法を示す図である。It is a figure which shows the method of forming each unit metal layer using a single-crystal diamond cutting blade. Ｘ線タルボ干渉計用回折格子の製造方法の一例を示す工程図である。It is process drawing which shows an example of the manufacturing method of the diffraction grating for X-ray Talbot interferometers. 図７に続く工程図である。FIG. 8 is a process diagram following FIG. 7. 基板表面に設けられたアライメントマークを示す平面図である。It is a top view which shows the alignment mark provided in the board | substrate surface. 従来のＸ線タルボ干渉計の概略構成を示す図である。It is a figure which shows schematic structure of the conventional X-ray Talbot interferometer. 従来のＸ線タルボ干渉計の第１の回折格子および第２の回折格子の、ｘ方向に沿う断面図である。It is sectional drawing which follows the x direction of the 1st diffraction grating of the conventional X-ray Talbot interferometer, and a 2nd diffraction grating.

以下、本発明の実施形態について説明する。図１は、本発明の実施形態に係るＸ線タルボ干渉計１００の概略構成を示す図である。Ｘ線タルボ干渉計１００は、Ｘ線源２と、第１の回折格子１０および第２の回折格子２０と、Ｘ線画像検出器３０とを備えている。第１の回折格子１０および第２の回折格子２０はｚ方向に所定距離だけ離間して平行に配置され、第１の回折格子１０にｚ方向に沿って対向してＸ線源２が配置されている。又、第２の回折格子２０にｚ方向に沿って対向してＸ線画像検出器３０が配置されている。そして、観察対象となる試料４がｚ方向に沿って第１の回折格子１０とＸ線源２の間に配置されている。
第１の回折格子１０および第２の回折格子２０は、その平面に平行な一方向（図１ではｙ方向）に沿って延びつつ、互いに所定周期で離間する複数の溝部１０ａ、２０ａが形成され（図２の溝部の断面図参照）、溝部１０ａ、２０ａからＸ線を透過させる一方、隣接する溝部１０ａの間の短冊状の畝部１０ｂでＸ線の位相をπ／２だけシフトして透過させ、畝部２０ｂでＸ線を遮蔽（吸収）するようになっている。各溝部１０ａ、２０ａ及び畝部１０ｂ、２０ｂは、図１のＹ方向に延びている。回折格子の材料としては、Ｘ線吸収能の高い金を用いると好ましい。なお、この実施形態では、畝部１０ｂの幅（間隔）と溝部１０ａの幅（間隔）が等しく、畝部２０ｂの幅（間隔）と溝部２０ａの幅（間隔）が等しい。 Hereinafter, embodiments of the present invention will be described. FIG. 1 is a diagram showing a schematic configuration of an X-ray Talbot interferometer 100 according to an embodiment of the present invention. The X-ray Talbot interferometer 100 includes an X-ray source 2, a first diffraction grating 10 and a second diffraction grating 20, and an X-ray image detector 30. The first diffraction grating 10 and the second diffraction grating 20 are arranged parallel to each other by a predetermined distance in the z direction, and the X-ray source 2 is arranged facing the first diffraction grating 10 along the z direction. ing. Further, an X-ray image detector 30 is disposed so as to face the second diffraction grating 20 along the z direction. A sample 4 to be observed is arranged between the first diffraction grating 10 and the X-ray source 2 along the z direction.
The first diffraction grating 10 and the second diffraction grating 20 are formed with a plurality of grooves 10a and 20a that extend along one direction parallel to the plane (the y direction in FIG. 1) and are spaced apart from each other by a predetermined period. (See the cross-sectional view of the groove portion in FIG. 2), while transmitting X-rays from the groove portions 10a and 20a, the X-ray phase is shifted by π / 2 at the strip-shaped flange portion 10b between the adjacent groove portions 10a. The X-rays are shielded (absorbed) by the flange 20b. Each groove part 10a, 20a and collar part 10b, 20b are extended in the Y direction of FIG. As a material for the diffraction grating, gold having high X-ray absorption ability is preferably used. In this embodiment, the width (interval) of the flange portion 10b and the width (interval) of the groove portion 10a are equal, and the width (interval) of the flange portion 20b and the width (interval) of the groove portion 20a are equal.

Ｘ線タルボ干渉計１００において、Ｘ線源２から試料４を介して第１の回折格子１０にＸ線を照射すると、溝部１０ａを透過したＸ線と畝部１０ｂを透過回折したＸ線とが互いに干渉する。そして、タルボ距離だけ離れた位置で第１の回折格子の自己像が形成される。つまり、第１の回折格子１０は、照射Ｘ線に位相変調を与える位相型回折格子を構成する。ここで、タルボ効果を生じさせるため、第１の回折格子１０の畝部の周期ｄ（図２（ａ）参照）を、Ｘ線源２から照射されるＸ線の可干渉性を確保するよう調整する必要がある。
又、第２の回折格子２０の後方のＸ線画像検出器３０では、第１の回折格子１０の自己像のうち第２の回折格子２０の溝部２０ａを透過したＸ線が画像コントラストとして検出される。画像コントラストを向上させるには、第２の回折格子２０の溝部２０aのＸ線透過率が高く、畝部２０bのＸ線透過率が低いと良い。そのため、第２の回折格子２０は第１の回折格子１０より厚い振幅型回折格子であることが好ましい。 In the X-ray Talbot interferometer 100, when the first diffraction grating 10 is irradiated with X-rays from the X-ray source 2 through the sample 4, X-rays transmitted through the groove 10a and X-rays transmitted and diffracted through the flange 10b are generated. Interfere with each other. Then, a self-image of the first diffraction grating is formed at a position separated by the Talbot distance. That is, the first diffraction grating 10 constitutes a phase type diffraction grating that applies phase modulation to irradiated X-rays. Here, in order to generate the Talbot effect, the period d (see FIG. 2A) of the flange portion of the first diffraction grating 10 is ensured to ensure the coherence of the X-rays irradiated from the X-ray source 2. It needs to be adjusted.
Further, in the X-ray image detector 30 behind the second diffraction grating 20, X-rays transmitted through the groove 20 a of the second diffraction grating 20 among the self-images of the first diffraction grating 10 are detected as image contrast. The In order to improve the image contrast, it is preferable that the X-ray transmittance of the groove portion 20a of the second diffraction grating 20 is high and the X-ray transmittance of the flange portion 20b is low. Therefore, the second diffraction grating 20 is preferably an amplitude type diffraction grating thicker than the first diffraction grating 10.

ここで、第１の回折格子１０の前方に試料４が配置され、照射Ｘ線は試料４内部において僅かに異なる光路を通過するため、このときの位相差によって自己像には試料４による歪みが生じる。従って自己像の位置に第２の回折格子２０を重ねると、タルボ干渉像（画像コントラスト）にモアレ縞が生じ、Ｘ線画像検出器３０で検出される。生成されたモアレ縞が試料４によって受ける変調量は、試料４により照射Ｘ線が曲げられた角度に比例するため、モアレ縞を解析することで試料４とその内部構造を測定することができる。
なお、モアレ縞の解析法の一つである縞走査法では、第１の回折格子１０および第２の回折格子２０をＸ方向に相対的にずらすことで、モアレ縞の位相が変化することに着目している。すなわちモアレ縞の位相を変化させて複数のタルボ干渉像を得た後、これを積分処理等して合成することにより、位相像（試料４とその内部構造）を得ることができる。
又、試料４を回転させて多数の投影方向から像を取得し、これらを合成して試料４の断層像（ＣＴ像）を得ることも可能である。 Here, since the sample 4 is arranged in front of the first diffraction grating 10 and the irradiated X-rays pass through slightly different optical paths inside the sample 4, the self-image is distorted by the sample 4 due to the phase difference at this time. Arise. Therefore, when the second diffraction grating 20 is superimposed on the position of the self-image, moire fringes are generated in the Talbot interference image (image contrast) and detected by the X-ray image detector 30. Since the amount of modulation that the generated moire fringes receive by the sample 4 is proportional to the angle at which the irradiated X-rays are bent by the sample 4, the sample 4 and its internal structure can be measured by analyzing the moire fringes.
In the fringe scanning method, which is one of the moire fringe analysis methods, the phase of the moire fringe changes by relatively shifting the first diffraction grating 10 and the second diffraction grating 20 in the X direction. Pay attention. That is, a phase image (sample 4 and its internal structure) can be obtained by changing the phase of moire fringes to obtain a plurality of Talbot interference images and then synthesizing them by integration processing or the like.
It is also possible to obtain a tomographic image (CT image) of the sample 4 by rotating the sample 4 to acquire images from a number of projection directions and combining them.

なお、本発明のＸ線タルボ干渉計１００は、Ｘ線源２と試料４との間にマルチスリットを配置したタルボ・ロー干渉計も含む。マルチスリットを用いない場合、Ｘ線源２としては微小焦点Ｘ線源を用いる必要があるが、タルボ・ロー干渉計の場合は通常Ｘ線源を用いることができる。   The X-ray Talbot interferometer 100 of the present invention also includes a Talbot-Lau interferometer in which a multi slit is disposed between the X-ray source 2 and the sample 4. When a multi-slit is not used, it is necessary to use a microfocus X-ray source as the X-ray source 2, but in the case of a Talbot-Lau interferometer, an X-ray source can usually be used.

ところでＸ線は波長が短いので、可干渉性を確保するためには、第１の回折格子１０および第２の回折格子２０の畝部の周期を１０μｍ以下程度としなければならない。さらに、位相型回折格子においては、位相シフト量がπ／２になるときに自己像のコントラストが最も高くなることから、これを実現するには、畝部の厚さ（溝の深さ）を１〜１０μｍ程度とする必要があり、微細な加工や製造技術が要求される。例えば、各回折格子の畝部を金で形成する場合、畝部の厚さを１〜３μｍ程度、銅で形成する場合、畝部の厚さを３〜１０μｍ程度とする必要がある。
一方、振幅型回折格子として機能するためには、回折格子の溝部のＸ線透過率を高くし、畝部のＸ線透過率を低くする必要がある。このため、金を用いても畝部の厚さ（溝の深さ）を１０〜１００μｍ程度に深くすることが要求される。従って、回折格子の（溝の深さ）／（溝の幅）で表されるアスペクト比が３以上（場合によっては１０以上）と非常に大きくなる。 By the way, since the wavelength of X-rays is short, in order to ensure coherence, the period of the collar portion of the first diffraction grating 10 and the second diffraction grating 20 must be about 10 μm or less. Further, in the case of the phase type diffraction grating, the contrast of the self-image becomes the highest when the phase shift amount is π / 2. Therefore, in order to realize this, the thickness of the collar portion (groove depth) is set. It needs to be about 1 to 10 μm, and fine processing and manufacturing techniques are required. For example, when the collar part of each diffraction grating is formed of gold, the thickness of the collar part needs to be about 1 to 3 μm, and when it is formed of copper, the thickness of the collar part needs to be about 3 to 10 μm.
On the other hand, in order to function as an amplitude type diffraction grating, it is necessary to increase the X-ray transmittance of the groove portion of the diffraction grating and decrease the X-ray transmittance of the collar portion. For this reason, even if it uses gold | metal | money, it is requested | required that the thickness (depth of a groove | channel) of a collar part should be deepened to about 10-100 micrometers. Therefore, the aspect ratio represented by (groove depth) / (groove width) of the diffraction grating is very large as 3 or more (in some cases, 10 or more).

このようなことから、Ｘ線吸収部（畝部）を微細に形成すると共に、その側壁の形状をシャープに（溝の側壁の凹凸や側壁と切削隅部の曲率半径を微細に）形成する必要がある。そして、本発明者らは、例えば、硬度が高く精密な溝加工が可能な単結晶ダイヤモンド切削刃具を用いて金属膜を切削することで、微細で側壁の形状がシャープなＸ線吸収部（溝部）を形成できることを見出した。   For this reason, it is necessary to form the X-ray absorption part (saddle part) finely, and to form the side wall shape sharply (fine irregularities on the side wall of the groove and the curvature radius of the side wall and the cutting corner). There is. The inventors of the present invention, for example, cut a metal film using a single crystal diamond cutting tool having high hardness and capable of precise grooving, so that an X-ray absorbing portion (groove portion) having a fine and sharp side wall shape is obtained. ) Can be formed.

図３は、本発明の実施形態に係るＸ線タルボ干渉計用回折格子２０の構成を示す。Ｘ線タルボ干渉計用回折格子２０は、上記した図１に示す第２の回折格子（振幅型回折格子）２０であり、（溝の深さ）／（溝の幅）で表されるアスペクト比が好ましくは３以上である。なお、本発明は、位相型回折格子である第１の回折格子１０にも適用可能であるが、上記アスペクト比が高い振幅型回折格子に適用するとより好ましい。各単位金属層２ｂ、４ｂ、６ｂの境界は、断面観察によって各単位金属層の溝部の側壁の凹凸の状態や、各単位金属層の位置ずれを観察し、区別（測定）することができる。
Ｘ線タルボ干渉計用回折格子２０は、基板２２と、基板上２２に所定間隔で一方向に沿って複数形成された畝状で金属製のＸ線吸収部２０ｂと、隣接するＸ線吸収部の間の溝部２０ａに介装された樹脂２６とを有している。Ｘ線吸収部２０ｂは、金属膜（後述）を切削して形成され、Ｘ線吸収部２０ｂの側壁２０ｓの凹凸、及び側壁２０ｓと溝部の底との切削隅（角）部の曲率半径がそれぞれ０．１μｍ以下である。なお、上記側壁の凹凸、直角度、真直度はほとんど刃具の形状に依存し、後述する超精密ナノ加工機の移動機構の精度は刃具の表面の凹凸より高い。
又、Ｘ線吸収部２０ｂと基板２２との間には、中間層２４が介装されている。 FIG. 3 shows a configuration of the diffraction grating 20 for an X-ray Talbot interferometer according to the embodiment of the present invention. The X-ray Talbot interferometer diffraction grating 20 is the above-described second diffraction grating (amplitude diffraction grating) 20 shown in FIG. 1, and has an aspect ratio represented by (groove depth) / (groove width). Is preferably 3 or more. The present invention can also be applied to the first diffraction grating 10 which is a phase type diffraction grating, but is more preferably applied to an amplitude type diffraction grating having a high aspect ratio. The boundaries between the unit metal layers 2b, 4b, and 6b can be distinguished (measured) by observing the unevenness of the side walls of the groove portions of the unit metal layers and the positional deviation of the unit metal layers by observing the cross section.
The X-ray Talbot interferometer diffraction grating 20 includes a substrate 22, a plurality of bowl-shaped metal X-ray absorbers 20b formed on the substrate 22 at predetermined intervals along one direction, and adjacent X-ray absorbers. And a resin 26 interposed in the groove 20a. The X-ray absorbing portion 20b is formed by cutting a metal film (described later), and the curvature radius of the side wall 20s of the X-ray absorbing portion 20b and the cutting corner (corner) portion between the side wall 20s and the bottom of the groove portion are respectively. 0.1 μm or less. Note that the unevenness, perpendicularity, and straightness of the side wall almost depend on the shape of the cutting tool, and the accuracy of the moving mechanism of the ultraprecision nano-machining machine described later is higher than the unevenness of the surface of the cutting tool.
Further, an intermediate layer 24 is interposed between the X-ray absorption unit 20 b and the substrate 22.

基板２２は、Ｘ線透過率を高くするため、例えば炭素、ケイ素及びアルミニウムの群から選ばれる少なくとも１つを主成分とする材料からなることが好ましい。基板２２の組成の具体例としては、例えば、アモルファスカーボン若しくはシリコンのウェーハ、又は窒化シリコン若しくは炭化シリコンのメンブレン、又は３０００系のアルミニウム板やアルミマグネシウム合金板などが挙げられる。
基板２２として上記材料を用いることでＸ線透過率を高くすることができ、良好な回折特性が得られる。またＸ線の吸収や位相シフトの量は金属膜の厚さに依存しているため、溝部の底に金属膜の削り残しが存在しないことが好ましい。ところで多数の溝加工を行う場合の切削加工機の動きは、１回の溝彫りでは刃具を溝に沿った方向に動かすのみで、溝の深さ方向を一定にすることにより高速の加工を行えるようにしている。この場合、金属膜を削り残さないためには金属膜と中間層を含めた基板が平坦であることが好ましいが、各々の膜の膜厚、及び基板を切削加工機に装着したときのうねりは、それぞれ数ミクロン以下のばらつきがある。そこで金属膜と中間層を含めた基板の平坦度を好ましくは１０μm以下にしながら、中間層をその平坦度以上の厚さに形成することにより、金属膜を削り残さず、刃具が基板を削って消耗することを防ぐことができる。 In order to increase the X-ray transmittance, the substrate 22 is preferably made of, for example, a material mainly containing at least one selected from the group of carbon, silicon, and aluminum. Specific examples of the composition of the substrate 22 include an amorphous carbon or silicon wafer, a silicon nitride or silicon carbide membrane, or a 3000 series aluminum plate or an aluminum magnesium alloy plate.
By using the above-mentioned material as the substrate 22, the X-ray transmittance can be increased and good diffraction characteristics can be obtained. Further, since the amount of X-ray absorption and phase shift depends on the thickness of the metal film, it is preferable that there is no uncut portion of the metal film at the bottom of the groove. By the way, when a large number of grooves are machined, the cutting machine moves only by moving the cutting tool in the direction along the groove in a single groove engraving, and can perform high-speed machining by making the groove depth direction constant. I am doing so. In this case, it is preferable that the substrate including the metal film and the intermediate layer is flat in order not to leave the metal film uncut, but the film thickness of each film and the undulation when the substrate is mounted on a cutting machine , Each has a variation of several microns or less. Therefore, while the flatness of the substrate including the metal film and the intermediate layer is preferably 10 μm or less, the intermediate layer is formed to a thickness equal to or greater than the flatness, so that the metal film is not left uncut and the cutting tool cuts the substrate. It is possible to prevent exhaustion.

中間層２４は、基板より硬度（ビッカース硬度）が低く、かつ金属膜（Ｘ線吸収部２０ｂとなる金属膜）より有効原子番号が小さい元素を含む。この元素は、柔らかくてＸ線を通しやすい軽元素であればよく、金属（たとえばアルミニウム）、又は樹脂を挙げることができる。中間層２４は、基板２２上の金属膜を切削してＸ線吸収部２０ｂを形成する際、深く切削し過ぎて切削刃具が基板２２を削ることを防止する。一般に、基板２２は金属膜より硬いので、基板２２を削ると切削刃具を消耗するが、金属膜と基板２２の間に中間層２４を形成することにより、金属膜厚分を確実に切削して深い溝部を形成できると共に、基板２２より柔らかい中間層２４の一部を切削することで、切削刃具の消耗を防止する。なお、中間層自身はＸ線の吸収や位相変化が小さいので、Ｘ線吸収部２０ｂを形成する際に中間層２４の一部を切削しても差し支えない。
中間層２４としては、アルミニウム、又はアルミニウム層を含む多層膜とすることができる。但し、中間層２４は必須の構成ではない。
又、中間層２４は金属膜（各単位金属層２ｂ〜６ｂ）より有効原子番号が小さいので、中間層２４によるＸ線の遮蔽および位相変化が単位金属層より小さく、得られた回折格子による位相イメージの画質には影響しない。 The intermediate layer 24 includes an element having a lower hardness (Vickers hardness) than that of the substrate and a smaller effective atomic number than that of the metal film (metal film serving as the X-ray absorption part 20b). This element may be a light element that is soft and easily transmits X-rays, and examples thereof include metals (for example, aluminum) and resins. When the intermediate layer 24 cuts the metal film on the substrate 22 to form the X-ray absorbing portion 20b, the intermediate layer 24 prevents the cutting blade from cutting the substrate 22 by cutting too deeply. In general, since the substrate 22 is harder than the metal film, cutting the substrate 22 consumes the cutting blade. However, by forming the intermediate layer 24 between the metal film and the substrate 22, the metal film thickness can be reliably cut. A deep groove can be formed, and a part of the intermediate layer 24 softer than the substrate 22 is cut to prevent the cutting blade from being consumed. Since the intermediate layer itself has little X-ray absorption and phase change, a part of the intermediate layer 24 may be cut when forming the X-ray absorption part 20b.
The intermediate layer 24 can be aluminum or a multilayer film including an aluminum layer. However, the intermediate layer 24 is not an essential configuration.
Further, since the intermediate layer 24 has a smaller effective atomic number than the metal film (each of the unit metal layers 2b to 6b), X-ray shielding and phase change by the intermediate layer 24 are smaller than the unit metal layer, and the phase by the obtained diffraction grating It does not affect the image quality.

Ｘ線吸収部２０ｂは金を主成分とした金属膜、例えば純金めっき膜、又は金ニッケル合金めっき、金ニッケルタングステン合金めっきであって金の重量割合が９０％以上の膜を切削することで形成でき、Ｘ線を効率的に吸収して回折格子の特性が向上する。なお、上記したように、金属膜は純金属だけでなく、合金も含む。   The X-ray absorbing portion 20b is formed by cutting a metal film containing gold as a main component, for example, a pure gold plating film, a gold-nickel alloy plating, or a gold-nickel tungsten alloy plating and having a gold weight ratio of 90% or more. In addition, X-rays are efficiently absorbed and the characteristics of the diffraction grating are improved. As described above, the metal film includes not only a pure metal but also an alloy.

樹脂２６は、溝部の形成後に溝内に充填されてＸ線吸収部２０ｂを保持し、Ｘ線吸収部２０ｂが倒れたり変形するのを防止する。特に、樹脂２６として、ポリイミド、パラキシレン系ポリマーの少なくとも１種を用いると、機械強度に優れ、特に位相イメージング時のＸ線照射に対する耐久性が高いので好ましい。パラキシレン系ポリマーとしては、パラキシレンポリマー、パラキシレンのベンゼン環の水素の一部又は全部を塩素で置換したポリマー、パラキシレンのα水素原子をフッ素で置換したポリマーが挙げられ、パリレンＮ、パリレンＣ、パリレンＤ、パリレンＨＴ（いずれも登録商標）が市販されている。   The resin 26 is filled in the groove after the formation of the groove to hold the X-ray absorption part 20b, and prevents the X-ray absorption part 20b from falling or deforming. In particular, it is preferable to use at least one of polyimide and para-xylene polymers as the resin 26 because of excellent mechanical strength and particularly high durability against X-ray irradiation during phase imaging. Examples of paraxylene polymers include paraxylene polymers, polymers in which part or all of the hydrogen in the benzene ring of paraxylene is substituted with chlorine, and polymers in which the α hydrogen atom of paraxylene is substituted with fluorine. Parylene N, Parylene C, Parylene D, and Parylene HT (all registered trademarks) are commercially available.

次に、図４〜図６を参照し、金属膜を切削してＸ線吸収部２０ｂを形成するのに好適な、単結晶ダイヤモンドからなる切れ刃を有する切削工具について説明する。単結晶ダイヤモンドは硬度が高く、精密な溝加工が可能である。
図４は、単結晶ダイヤモンド切削刃具２００を取り付けた工具本体（バイト）４００を示す。単結晶ダイヤモンド切削刃具２００は、略台形の台金３００の先端に取り付けられて工具本体４００を構成し、台金３００の先端から単結晶ダイヤモンド切削刃具２００の切れ刃（図５参照）が突出している。工具本体４００は、図示しない切削加工機のホルダに固定され、後述するように、単結晶ダイヤモンド切削刃具２００により被切削物に溝を彫ることができるようになっている。 Next, with reference to FIGS. 4-6, the cutting tool which has a cutting edge which consists of a single crystal diamond suitable for cutting a metal film and forming the X-ray absorption part 20b is demonstrated. Single crystal diamond has a high hardness and enables precise groove processing.
FIG. 4 shows a tool body (bite) 400 to which a single crystal diamond cutting blade 200 is attached. The single crystal diamond cutting tool 200 is attached to the tip of a substantially trapezoidal base metal 300 to constitute a tool body 400, and the cutting edge (see FIG. 5) of the single crystal diamond cutting tool 200 protrudes from the tip of the base metal 300. Yes. The tool body 400 is fixed to a holder of a cutting machine (not shown), and a single crystal diamond cutting tool 200 can carve a groove in a workpiece as will be described later.

図５に示すように、単結晶ダイヤモンド切削刃具２００は、すくい面２０１と、すくい面２０１にそれぞれ隣接する側面となる２つの第１逃げ面２０３、２０４と、すくい面２０１に隣接し、被削物５００の切削面に対向する前逃げ面２０５と、すくい面２０１と前逃げ面２０５との境界部に形成される前切れ刃２１０と、すくい面２０１と第一逃げ面２０３、２０４との境界部に形成される２つの第１切れ刃２１３、２１４とを備えている。前逃げ面２０５及びすくい面２０１の形状は限定されず、平面であってもよく、曲面であってもよい。すくい面２０１は所定のすくい角０度又はすくい角がわずかに正方向に傾いていて、切削くずをすくい取るようになっている。
第一逃げ面２０３、２０４又は前逃げ面２０５は、集束イオンビーム（ＦＩＢ）のエッチングにより形成されている。ＦＩＢのエッチングは、複雑な形状の加工ができると共に、結晶面を選ばずに加工ができるという利点がある。従って、ダイヤモンドの一番固い結晶面である（１１１）面をも容易に加工ができる。これに対し、例えば砥石による研削では、ダイヤモンドの（１１１）面の研削ができない。
前切れ刃２１０の幅Ｗ１を４μｍ以下とすると、Ｘ線タルボ干渉計用の回折格子に適した微小な溝部を彫ることができるので好ましい。 As shown in FIG. 5, the single crystal diamond cutting tool 200 includes a rake face 201, two first flank surfaces 203 and 204 that are side faces adjacent to the rake face 201, and the rake face 201, respectively. The front flank 205 facing the cutting surface of the object 500, the front cutting edge 210 formed at the boundary between the rake face 201 and the front flank 205, and the boundary between the rake face 201 and the first flank faces 203 and 204 And two first cutting edges 213 and 214 formed in the section. The shapes of the front flank 205 and the rake face 201 are not limited, and may be flat or curved. The rake face 201 has a predetermined rake angle of 0 degrees or a rake angle slightly inclined in the positive direction so as to scoop cutting waste.
The first flank surfaces 203 and 204 or the front flank surface 205 are formed by etching of a focused ion beam (FIB). The FIB etching has an advantage that it can be processed in a complicated shape and can be processed without selecting a crystal plane. Therefore, the (111) plane which is the hardest crystal plane of diamond can be easily processed. In contrast, for example, grinding with a grindstone cannot grind the (111) face of diamond.
When the width W 1 of the cutting edge 210 and 4μm or less, it is possible to carve the small groove portion suitable for diffraction grating for X-ray Talbot interferometer preferred.

以上述べた単結晶ダイヤモンド切削刃具２００（工具本体４００）を切削加工機に取り付け、図６に示すようにして溝部２０ａを形成することができる。ここで、切削で形成される溝部の周期や深さは切削加工機の分解能に依存しているため、切削加工機として分解能がｎｍレベルの超精密ナノ加工機を用いることが好ましい。超精密ナノ加工機としては、例えばファナック株式会社製の製品名「FANUC ROBONANO α-0iB 」が市販されている。この超精密ナノ加工機は、リニアモータと同期ビルトインサーボモータを制御することにより、同時5軸を高精度にダイレクト駆動し、直線軸で1nmの分解能を有する。   The single crystal diamond cutting tool 200 (tool main body 400) described above is attached to a cutting machine, and the groove 20a can be formed as shown in FIG. Here, since the period and depth of the groove formed by cutting depend on the resolution of the cutting machine, it is preferable to use an ultra-precise nano-machining machine having a resolution of nm level as the cutting machine. As an ultra-precision nano processing machine, for example, a product name “FANUC ROBONANO α-0iB” manufactured by FANUC CORPORATION is commercially available. This ultra-precision nano-machining machine controls a linear motor and a synchronous built-in servo motor to directly drive five simultaneous axes with high accuracy and has a resolution of 1 nm on a linear axis.

このような加工機を用い、図６に示すように単結晶ダイヤモンド切削刃具２００により、金属膜２０ｘの一方向（図６の矢印方向）に沿い、かつ該一方向に垂直な方向に所定幅Ｗ３の畝を残した引き切り加工を行う。これにより、金属膜２０ｘが切削されて溝部２０ａが形成され、隣接する溝部２０ａの間に畝状のＸ線吸収部２０ｂを形成することができる。なお、Ｗ１＝Ｗ３とするとよい。 Using such a processing machine, as shown in FIG. 6, a single crystal diamond cutting tool 200 is used to make a predetermined width W along one direction of the metal film 20x (the arrow direction in FIG. 6) and perpendicular to the one direction. Performs a drawing process leaving 3 folds. Thereby, the metal film 20x is cut to form the groove portion 20a, and the bowl-shaped X-ray absorbing portion 20b can be formed between the adjacent groove portions 20a. Note that W 1 = W 3 is preferable.

ここで、単結晶ダイヤモンド切削刃具２００で金属膜２０ｘに溝部２０ａを彫るため、溝部の側面の凹凸、及び溝部の側面と底面との切削隅部の曲率半径がそれぞれ０．１μｍ以下の良好な加工が可能になり、レジスト樹脂を用いて形成した微細な溝（スリット）内に電鋳を行って回折格子を製造する従来技術に比べ、寸法の高い回折格子が得られる。   Here, since the groove 20a is carved in the metal film 20x with the single crystal diamond cutting tool 200, the unevenness of the side surface of the groove and the curvature radius of the cutting corner between the side and bottom of the groove are each 0.1 μm or less. Therefore, a diffraction grating having a higher size can be obtained as compared with the conventional technique in which a diffraction grating is manufactured by performing electroforming in a fine groove (slit) formed using a resist resin.

又、溝部２０ａの幅は前切れ刃２１０の幅Ｗ１となり、溝部２０ａの深さは第１逃げ面２０３、２０４の縦方向長さＬ以下となる。この場合、図１に示す第２の回折格子（振幅型回折格子）を製造しようとすると、（溝の深さ）／（溝の幅）で表されるアスペクト比を高く（例えば３以上）する必要がある。従って、一回の切削でこの回折格子を製造するには、Ｌ／Ｗ１が３以上の細長い単結晶ダイヤモンド切削刃具を用いることが必要となる。しかしながら、Ｌ／Ｗ１を３以上とすると、切削刃具が折れやすくなる。
そこで、本発明においては、１回の切削で形成される溝部２０ａの深さをそれほど深くせず（アスペクト比を高くせず）、個々の切削により形成した単位金属層を積層することにより、最終的に得られるＸ線吸収部（溝部）のアスペクト比を高くし、かつ切削刃具の破損が低減される。
例えば、Ｌ／Ｗ１が１の単結晶ダイヤモンド切削刃具を用いた場合、一回の切削で得られる溝部のアスペクト比は１であるが、以下に述べるように３回の切削を行うことで、溝部のアスペクト比が３以上の回折格子が得られる。 Also, next to the width W 1 of the wide cutting edge 210 of the groove 20a, the depth of the groove 20a is equal to or less than the longitudinal length L of the first flank 203 and 204. In this case, when the second diffraction grating (amplitude diffraction grating) shown in FIG. 1 is manufactured, the aspect ratio expressed by (groove depth) / (groove width) is increased (for example, 3 or more). There is a need. Therefore, in order to manufacture this diffraction grating by a single cutting, it is necessary to use an elongated single crystal diamond cutting tool having L / W 1 of 3 or more. However, when L / W 1 is 3 or more, the cutting blade is easily broken.
Therefore, in the present invention, the depth of the groove 20a formed by one-time cutting is not so deep (the aspect ratio is not increased), and the unit metal layers formed by individual cutting are laminated to obtain the final Thus, the aspect ratio of the X-ray absorption part (groove part) obtained can be increased, and the breakage of the cutting blade can be reduced.
For example, when a single crystal diamond cutting tool with L / W 1 of 1 is used, the aspect ratio of the groove part obtained by one cutting is 1, but by performing three cuttings as described below, A diffraction grating having an aspect ratio of 3 or more is obtained.

次に、図７、図８を参照し、Ｘ線タルボ干渉計用回折格子２０の製造方法の一例について説明する。
まず、シリコンウェハー基板２２上に必要に応じて中間層２４を形成した後、中間層２４の上に金属膜（これを「初期金属膜」と称する）２ｂｘを形成する（図７（ａ）；初期金属膜形成工程）。中間層２４はアルミニウム膜をイオンプレーティング又はスパッタ蒸着により形成する。中間層２４を銅で形成する場合は、電気銅めっきで形成する。基板２２と中間層２４の間には、中間層の密着性を確保するために薄いクロム蒸着膜あるいはチタン蒸着膜を付けても良い。初期金属膜２ｂｘは金を電気めっきにより形成する。初期金属膜２ｂｘの密着性を確保するために、中間層２４の表面に金を薄く蒸着してから金を電気めっきしても良い。
次に、上記した単結晶ダイヤモンド切削刃具２００を用い、初期金属膜２ｂｘを一方向（図７の紙面に垂直な方向）に沿って所定間隔で切削して複数の溝部２０ａを彫り、隣接する溝部２０ａの間に畝状の単位金属層２ｂを形成する（図７（ｂ）；切削工程）。 Next, an example of a method for manufacturing the X-ray Talbot interferometer diffraction grating 20 will be described with reference to FIGS.
First, an intermediate layer 24 is formed on the silicon wafer substrate 22 as necessary, and then a metal film (referred to as “initial metal film”) 2bx is formed on the intermediate layer 24 (FIG. 7A); Initial metal film formation step). As the intermediate layer 24, an aluminum film is formed by ion plating or sputtering deposition. When the intermediate layer 24 is formed of copper, it is formed by electrolytic copper plating. A thin chromium vapor deposition film or titanium vapor deposition film may be provided between the substrate 22 and the intermediate layer 24 in order to ensure the adhesion of the intermediate layer. The initial metal film 2bx is formed by gold electroplating. In order to ensure the adhesion of the initial metal film 2bx, gold may be electroplated after thinly depositing gold on the surface of the intermediate layer 24.
Next, using the single crystal diamond cutting tool 200 described above, the initial metal film 2bx is cut at a predetermined interval along one direction (a direction perpendicular to the paper surface of FIG. 7) to carve a plurality of grooves 20a, and adjacent grooves A bowl-shaped unit metal layer 2b is formed between 20a (FIG. 7B; cutting step).

そして、溝部２０ａに樹脂２６ａｘを充填する（図７（ｃ）；樹脂充填工程）。ここで、樹脂２６ａｘは溝部２０ａを完全に埋めると共に、単位金属層２ｂの表面をも覆っている。
上記したように、樹脂２６ａｘとして、ポリイミド、パラキシレン系ポリマーの少なくとも１種を用いると好ましい。ポリイミドを用いる場合は、真空注入法によって溝部２０ａに充填すると、溝部２０ａの深部までポリイミドが流入するので好ましい。又、パラキシレン系ポリマーを用いる場合は、真空蒸着法によって溝部２０ａに充填すると、溝部２０ａの深部までパラキシレン系ポリマーが流入するので好ましい。
なお、真空注入法は真空に保った系に溝部２０ａを有する基板２２を配置し、低分子量のポリイミドを系に導入して溝部２０ａ内に流入させた後、紫外線照射や加熱によって架橋反応を起こして重合する方法である。
またパラキシレン系ポリマーの真空蒸着による充填は、真空内でパラキシレンの２量体を１７５℃程度に加熱して蒸発させる。パラキシレン２量体の蒸気はその後６８０℃程度に加熱されて熱分解物質となる。パラキシレンの熱分解物質は溝部２０ａやＸ線吸収部２０ｂの表面に到達すると、熱分解物質同士が反応して安定な蒸着膜となる。 Then, resin 26ax is filled in the groove 20a (FIG. 7C; resin filling step). Here, the resin 26ax completely fills the groove 20a and also covers the surface of the unit metal layer 2b.
As described above, it is preferable to use at least one of polyimide and paraxylene-based polymer as the resin 26ax. When polyimide is used, it is preferable to fill the groove 20a by vacuum injection because polyimide flows into the deep part of the groove 20a. In the case of using a paraxylene-based polymer, it is preferable to fill the groove 20a by vacuum deposition because the paraxylene-based polymer flows into the deep portion of the groove 20a.
In the vacuum injection method, the substrate 22 having the groove 20a is placed in a system kept in a vacuum, and after introducing low molecular weight polyimide into the system and flowing into the groove 20a, a crosslinking reaction is caused by ultraviolet irradiation or heating. This is a polymerization method.
In addition, the filling of the paraxylene polymer by vacuum deposition is performed by heating the paraxylene dimer to about 175 ° C. in a vacuum. The vapor of para-xylene dimer is then heated to about 680 ° C. to become a pyrolytic substance. When the thermal decomposition substance of paraxylene reaches the surface of the groove 20a or the X-ray absorption part 20b, the thermal decomposition substances react with each other to form a stable vapor deposition film.

次に、樹脂２６ａｘの表面を研削又は灰化して単位金属層２ｂの上面を表出させる（図７（ｄ）；金属層表出工程）。金属層表出工程で研削を行うと、樹脂２６ａ（研削又は灰化後の樹脂を符号２６ａとして２６ａｘと区別する）と単位金属層２ｂがほぼ面一となるが、灰化の場合は、両者の間に若干の段差が生じることもある。研削は、例えば精密な研削砥石を溝２０ａの切削と同じ方向に摺動させて上部にはみ出た樹脂を削り取る。又、灰化（アッシング）は、半導体技術で用いられる公知のアッシング装置（技術）を適用することができ、例えば酸素プラズマアッシングが挙げられる。   Next, the surface of the resin 26ax is ground or incinerated to expose the upper surface of the unit metal layer 2b (FIG. 7 (d); metal layer exposing step). When grinding is performed in the metal layer exposing step, the resin 26a (the resin after grinding or ashing is identified as 26ax and distinguished from 26ax) and the unit metal layer 2b are almost flush with each other. There may be a slight level difference between the two. For grinding, for example, a precision grinding wheel is slid in the same direction as the cutting of the groove 20a to scrape off the resin protruding from the upper part. As ashing (ashing), a known ashing device (technique) used in semiconductor technology can be applied, for example, oxygen plasma ashing.

次に、少なくとも単位金属層２ｂの上面に第２金属膜４ｂｘを積層する（図８（ｅ）；金属膜積層工程）。ここで、第２金属膜４ｂｘは単位金属層４ｂを形成するためのものであり、理想的には単位金属層２ｂの上面にのみ形成されていればよい。従って、単位金属層２ｂをカソードとして電気めっきにより第２金属膜４ｂｘを形成すると、単位金属層２ｂ及びその周辺に第２金属膜４ｂｘが電析するが、樹脂２６の表面には第２金属膜４ｂｘが形成されないので好ましい。第２金属膜４ｂｘの組成は、単位金属層２ｂと同一とすることができる。   Next, the second metal film 4bx is stacked on at least the upper surface of the unit metal layer 2b (FIG. 8E; metal film stacking step). Here, the second metal film 4bx is used to form the unit metal layer 4b, and ideally, it may be formed only on the upper surface of the unit metal layer 2b. Accordingly, when the second metal film 4bx is formed by electroplating using the unit metal layer 2b as a cathode, the second metal film 4bx is electrodeposited on and around the unit metal layer 2b, but the second metal film is deposited on the surface of the resin 26. Since 4bx is not formed, it is preferable. The composition of the second metal film 4bx can be the same as that of the unit metal layer 2b.

次いで、上記した単結晶ダイヤモンド切削刃具２００を用い、単位金属層２ｂの側壁（図３の２ｓ）に沿って第２金属膜４ｂｘを切削して複数の溝部２０ａを彫り、隣接する溝部２０ａの間に畝状の単位金属層４ｂを形成する（図８（ｆ）；第２切削工程）。ここで、切削加工機として、上記した超精密ナノ加工機を用いれば、ｎｍレベルで単位金属層２ｂの側壁２ｓに一致して第２金属膜４ｂｘを切削することができる。又、第２切削工程における溝部２０ａは、金属層表出工程（図７（ｄ））で表出した樹脂２６の上に形成する。
なお、第２金属膜４ｂｘを電気めっきにより形成する場合、第２金属膜４ｂｘ表面が若干凸状になる（平面にならない）。そのため、単位金属層４ｂとして設計される厚みより、第２金属膜４ｂｘの厚みを厚くし、第２切削工程の後、又は後述する第２金属層表出工程（図８（ｈ））で第２金属膜４ｂｘ表面を研削して単位金属層４ｂの厚みに調整すると共に、単位金属層４ｂ表面を平坦にすると好ましい。 Next, using the single crystal diamond cutting tool 200 described above, the second metal film 4bx is cut along the side wall (2s in FIG. 3) of the unit metal layer 2b to carve a plurality of grooves 20a, and between the adjacent grooves 20a. A bowl-shaped unit metal layer 4b is formed (FIG. 8F; second cutting step). Here, if the above-described ultra-precision nano-machining machine is used as the cutting machine, the second metal film 4bx can be cut at the nm level so as to coincide with the side wall 2s of the unit metal layer 2b. Further, the groove 20a in the second cutting process is formed on the resin 26 exposed in the metal layer exposing process (FIG. 7D).
When the second metal film 4bx is formed by electroplating, the surface of the second metal film 4bx is slightly convex (not flat). Therefore, the thickness of the second metal film 4bx is made thicker than the thickness designed as the unit metal layer 4b, and the second metal layer is exposed after the second cutting step or in the second metal layer exposing step (FIG. 8 (h)). The surface of the two metal film 4bx is preferably ground to adjust the thickness of the unit metal layer 4b, and the surface of the unit metal layer 4b is preferably flattened.

次に、上記した樹脂充填工程（図７（ｃ））と同様にして、第２切削工程で形成された溝部２０ａに樹脂２６ｂｘを充填する（図８（ｇ）；第２樹脂充填工程）。そして、上記した金属層表出工程（図７（ｄ））と同様にして、樹脂２６ｂｘの表面を研削又は灰化して単位金属層４ｂの上面を表出させる（図８（ｈ）；第２金属層表出工程）。   Next, in the same manner as the resin filling step (FIG. 7C), the resin 26bx is filled in the groove 20a formed in the second cutting step (FIG. 8G; second resin filling step). Then, in the same manner as the metal layer exposing step (FIG. 7D), the surface of the resin 26bx is ground or ashed to expose the upper surface of the unit metal layer 4b (FIG. 8H; second). Metal layer exposing step).

このように、初期金属膜形成工程（図７（ａ））、切削工程（図７（ｂ））を１回以上繰り返すことで、２以上の単位金属層が積層されたＸ線吸収部を備えたＸ線タルボ干渉計用回折格子を製造することができる。又、樹脂充填工程（図７（ｃ））、金属層表出工程（図７（ｄ））を行った後、金属膜積層工程（図８（ｅ））、第２切削工程（図８（ｆ））、第２樹脂充填工程（図８（ｇ））、及び第２金属層表出工程（図８（ｈ））を行うとより好ましい。
なお、図３に示すＸ線タルボ干渉計用回折格子２０の場合、金属膜積層工程（図８（ｅ））、第２切削工程（図８（ｆ））、第２樹脂充填工程（図８（ｇ））、及び第２金属層表出工程（図８（ｈ））を２回繰り返すことで、３つの単位金属層２ｂ、４ｂ、６ｂが積層されたＸ線吸収部２０ｂと、隣接するＸ線吸収部の間の溝部２０ａに介装された樹脂２６とを有するＸ線タルボ干渉計用回折格子２０を製造することができる（図８（ｉ））。 As described above, the initial metal film forming step (FIG. 7A) and the cutting step (FIG. 7B) are repeated one or more times to provide an X-ray absorbing portion in which two or more unit metal layers are laminated. In addition, a diffraction grating for an X-ray Talbot interferometer can be manufactured. Further, after performing the resin filling step (FIG. 7C) and the metal layer exposing step (FIG. 7D), the metal film laminating step (FIG. 8E) and the second cutting step (FIG. f)), the second resin filling step (FIG. 8G), and the second metal layer exposing step (FIG. 8H) are more preferable.
In the case of the X-ray Talbot interferometer diffraction grating 20 shown in FIG. 3, the metal film laminating step (FIG. 8E), the second cutting step (FIG. 8F), and the second resin filling step (FIG. 8). (G)) and the second metal layer exposing step (FIG. 8 (h)) are repeated twice to adjoin the X-ray absorbing portion 20b in which the three unit metal layers 2b, 4b, 6b are laminated. The X-ray Talbot interferometer diffraction grating 20 having the resin 26 interposed in the groove 20a between the X-ray absorbing parts can be manufactured (FIG. 8 (i)).

なお、基板２２表面のうち、溝部２０a等を形成しない周縁領域にアライメントマーク２２ａを設け、このアライメントマーク２２ａを基準として金属膜の切削位置を調整すると、各種処理工程（例えば、金属層表出工程（図７（ｄ））で基板２２を搬送した後、切削加工機に基板２２が戻った際の位置合わせが正確となり、単位金属層２ｂの側壁２ｓに正確に沿って第２金属膜４ｂｘを切削することができる。アライメントマーク２２ａを、基板２２表面の異なる３つ以上の位置に設けると好ましい。   In addition, when the alignment mark 22a is provided in the peripheral area | region which does not form the groove part 20a etc. among the surfaces of the board | substrate 22, and the cutting position of a metal film is adjusted on the basis of this alignment mark 22a, various processing processes (for example, metal layer exposure process) (FIG. 7D) After the substrate 22 is transported, the alignment when the substrate 22 is returned to the cutting machine becomes accurate, and the second metal film 4bx is accurately formed along the side wall 2s of the unit metal layer 2b. The alignment mark 22a is preferably provided at three or more different positions on the surface of the substrate 22.

本発明は上記実施形態に限定されず、本発明の思想と範囲に含まれる様々な変形及び均等物に及ぶことはいうまでもない。   It goes without saying that the present invention is not limited to the above-described embodiment, but extends to various modifications and equivalents included in the spirit and scope of the present invention.

２ｂ、４ｂ、６ｂ 単位金属層
２ｓ、４ｓ、６ｓ 単位金属層の側壁
２ｂｘ 初期金属膜
４ｂｘ 第２金属膜
１０、２０ Ｘ線タルボ干渉計用回折格子
１０ａ、２０ａ 溝部
１０ｂ、２０ｂ Ｘ線吸収部（畝部）
２２ 基板
２２ａ アライメントマーク
２４ 中間層
２６ 樹脂
１００ Ｘ線タルボ干渉計
２００ 単結晶ダイヤモンド切削刃具
２１０ 前切れ刃
２１３、２１４ 第１切れ刃 2b, 4b, 6b Unit metal layer 2s, 4s, 6s Side wall of unit metal layer 2bx Initial metal film 4bx Second metal film 10, 20 X-ray Talbot interferometer diffraction grating 10a, 20a Groove 10b, 20b X-ray absorber ( Isobe)
22 substrate 22a alignment mark 24 intermediate layer 26 resin 100 X-ray Talbot interferometer 200 single crystal diamond cutting tool 210 front cutting edge 213, 214 first cutting edge

Claims (10)

基板上に、金属製のＸ線吸収部が一方向に沿って所定間隔で畝状に複数形成され、隣接するＸ線吸収部の間の溝部に樹脂が介装され、
前記Ｘ線吸収部は、２以上の単位金属層を前記基板の表面に垂直に積層してなり、
前記単位金属層は金属膜を切削して形成され、該単位金属層の溝部の側壁の凹凸がＪＩＳ Ｂ０６０１で規定された算術平均高さＲａで０．１μｍ以下であるＸ線タルボ干渉計用回折格子。 A plurality of metal X-ray absorbers are formed in a bowl shape at a predetermined interval along one direction on the substrate, and a resin is interposed in a groove between adjacent X-ray absorbers,
The X-ray absorption part is formed by stacking two or more unit metal layers perpendicularly to the surface of the substrate,
The unit metal layer is formed by cutting a metal film, and the unevenness of the side wall of the groove portion of the unit metal layer has an arithmetic average height Ra specified by JIS B0601 of 0.1 μm or less. lattice. 前記Ｘ線吸収部は金を主成分とし、かつ平均粒径０．１μｍ以下の結晶から成るか、又はアモルファスから成るＸ線タルボ干渉計用回折格子。   The X-ray absorption part is a diffraction grating for an X-ray Talbot interferometer, which is mainly composed of gold and is made of a crystal having an average particle diameter of 0.1 μm or less, or made of amorphous. 基板上に初期金属膜を形成する初期金属膜形成工程と、
前記初期金属膜を一方向に沿って所定間隔で切削して複数の溝部を彫り、隣接する前記溝部の間に畝状の単位金属層を形成する切削工程と、
前記溝部に樹脂を充填する樹脂充填工程と、
前記樹脂の表面を研削又は灰化して前記単位金属層の上面を表出させる金属層表出工程と、
少なくとも前記単位金属層の上面に金属膜を積層する金属膜積層工程と、
前記単位金属層の側壁に沿って前記金属膜を切削して複数の溝部を彫り、隣接する前記溝部の間に畝状の単位金属層を形成する第２切削工程と、
を有し、前記金属膜積層工程、前記第２切削工程を少なくとも１回繰り返すＸ線タルボ干渉計用回折格子の製造方法。 An initial metal film forming step of forming an initial metal film on the substrate;
A cutting step of cutting the initial metal film at a predetermined interval along one direction to carve a plurality of grooves, and forming a bowl-shaped unit metal layer between the adjacent grooves,
A resin filling step of filling the groove with resin;
A metal layer exposing step of grinding or ashing the surface of the resin to expose the upper surface of the unit metal layer;
A metal film laminating step of laminating a metal film on at least the upper surface of the unit metal layer;
A second cutting step of cutting the metal film along the side wall of the unit metal layer to carve a plurality of grooves and forming a bowl-shaped unit metal layer between the adjacent grooves;
A method of manufacturing a diffraction grating for an X-ray Talbot interferometer, which includes repeating the metal film laminating step and the second cutting step at least once. 前記第２切削工程において、前記基板表面に設けたアライメントマークを基準として前記金属膜の切削位置を調整する請求項３に記載のＸ線タルボ干渉計用回折格子の製造方法。   The method of manufacturing a diffraction grating for an X-ray Talbot interferometer according to claim 3, wherein in the second cutting step, a cutting position of the metal film is adjusted with reference to an alignment mark provided on the substrate surface. 前記基板と前記初期金属膜との間に、前記基板より硬度が低く、かつ前記初期金属膜より有効原子番号が小さい元素を含む層を形成する中間層形成工程をさらに有する請求項３〜４のいずれかに記載のＸ線タルボ干渉計用回折格子の製造方法。   5. The intermediate layer forming step of forming a layer including an element having a lower hardness than the substrate and an effective atomic number smaller than the initial metal film between the substrate and the initial metal film. The manufacturing method of the diffraction grating for X-ray Talbot interferometers in any one. 前記樹脂が、ポリイミド及び／又はパラキシレン系ポリマーを含む請求項３〜５のいずれかに記載のＸ線タルボ干渉計用回折格子の製造方法。   The method for producing a diffraction grating for an X-ray Talbot interferometer according to any one of claims 3 to 5, wherein the resin contains polyimide and / or a paraxylene-based polymer. 前記樹脂充填工程及び／又は前記第２樹脂充填工程において、前記樹脂としてポリイミドを真空注入法によって前記溝部に充填する請求項３〜６のいずれかに記載のＸ線タルボ干渉計用回折格子の製造方法。   The X-ray Talbot interferometer diffraction grating manufacturing method according to any one of claims 3 to 6, wherein, in the resin filling step and / or the second resin filling step, polyimide is filled as the resin into the groove by a vacuum injection method. Method. 前記樹脂充填工程及び／又は前記第２樹脂充填工程において、前記樹脂としてパラキシレン系ポリマーを真空蒸着法によって前記溝部に充填する請求項３〜６のいずれかに記載のＸ線タルボ干渉計用回折格子の製造方法。   The diffraction for an X-ray Talbot interferometer according to any one of claims 3 to 6, wherein in the resin filling step and / or the second resin filling step, a paraxylene polymer is filled into the groove portion by a vacuum deposition method as the resin. A method of manufacturing a lattice. 前記切削工程及び前記第２切削工程において、単結晶ダイヤモンドからなる切れ刃を有する切削工具を用いる請求項３〜８のいずれかに記載のＸ線タルボ干渉計用回折格子の製造方法。   The method for manufacturing a diffraction grating for an X-ray Talbot interferometer according to any one of claims 3 to 8, wherein a cutting tool having a cutting edge made of single crystal diamond is used in the cutting step and the second cutting step. 請求項１又は２に記載のＸ線タルボ干渉計用回折格子を用いたＸ線タルボ干渉計。   An X-ray Talbot interferometer using the diffraction grating for an X-ray Talbot interferometer according to claim 1 or 2.
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