JP2012151191A - Led用配線基板、発光モジュール、led用配線基板の製造方法、及び発光モジュールの製造方法 - Google Patents
Led用配線基板、発光モジュール、led用配線基板の製造方法、及び発光モジュールの製造方法 Download PDFInfo
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- JP2012151191A JP2012151191A JP2011007361A JP2011007361A JP2012151191A JP 2012151191 A JP2012151191 A JP 2012151191A JP 2011007361 A JP2011007361 A JP 2011007361A JP 2011007361 A JP2011007361 A JP 2011007361A JP 2012151191 A JP2012151191 A JP 2012151191A
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- led
- wiring board
- reflective film
- white reflective
- wiring pattern
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- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- Engineering & Computer Science (AREA)
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- Led Device Packages (AREA)
Abstract
【解決手段】LED用配線基板100が、絶縁層と、絶縁層上に形成された導体層21(配線パターン層)と、絶縁層上に形成され、白色顔料及びその結合材から構成される白色反射膜11と、を有する。そして、導体層21は、配線パターン21c(第1配線パターン)及び配線パターン21d(第2配線パターン)を有し、白色反射膜11は、配線パターン21cと配線パターン21dとの間に、配線パターン21c及び21dのいずれよりも薄い部位を有する。
【選択図】図3
Description
10a スルーホール
10b スルーホール導体
10c 非貫通孔
11 白色反射膜
11a、11b 素子部
21、22 導体層
21a、22a 導体パターン
21b、22b 耐食膜
21c、21d 配線パターン
100 LED用配線基板
101 金属基板
102 絶縁層
200 LED素子
200a 半田
200b ワイヤ
1000 発光モジュール
1001、1002 銅箔
1003 めっき
1004、1005 エッチングレジスト
1004a、1005a 開口部
2000 両面銅張積層板
2001 無電解めっき膜
2002、2003 めっきレジスト
2002a、2003a 開口部
Claims (16)
- 絶縁層と、
前記絶縁層上に形成された配線パターン層と、
前記絶縁層上に形成され、白色顔料及びその結合材から構成される白色反射膜と、
を有し、
前記配線パターン層は、第1配線パターン及び第2配線パターンを有し、
前記白色反射膜は、前記第1配線パターンと前記第2配線パターンとの間に、前記第1配線パターン及び前記第2配線パターンのいずれよりも薄い部位を有する、
ことを特徴とするLED用配線基板。 - 前記白色反射膜は、前記白色顔料として、二酸化チタン、酸化亜鉛、アルミナ、二酸化珪素、マグネシア、イットリア、硼酸、酸化カルシウム、酸化ストロンチウム、酸化バリウム、及びジルコニアの少なくとも1種を含む、
ことを特徴とする請求項1に記載のLED用配線基板。 - 前記二酸化チタンは、アナターゼ型である、
ことを特徴とする請求項2に記載のLED用配線基板。 - 前記白色反射膜は、前記結合材として、無機材料、有機珪素化合物、及びエポキシ樹脂の少なくとも1種を含む、
ことを特徴とする請求項1乃至3のいずれか一項に記載のLED用配線基板。 - 前記白色反射膜は、前記結合材として、無機材料を含む、
ことを特徴とする請求項4に記載のLED用配線基板。 - 前記無機材料は、水ガラス硬化物、低融点ガラス、及び無機ゾル硬化物の少なくとも1種である、
ことを特徴とする請求項5に記載のLED用配線基板。 - 前記絶縁層は、樹脂基板からなる、
ことを特徴とする請求項1乃至6のいずれか一項に記載のLED用配線基板。 - 請求項1乃至7のいずれか一項に記載のLED用配線基板と、
LED素子と、
を有する、
ことを特徴とする発光モジュール。 - 絶縁層上に、配線パターンと、白色顔料及びその結合材から構成される白色反射膜と、を形成することと、
前記白色反射膜の表面を研磨して、前記白色反射膜を、前記配線パターンよりも薄くすることと、
を含む、
ことを特徴とするLED用配線基板の製造方法。 - 前記白色反射膜は、前記白色顔料として、二酸化チタン、酸化亜鉛、アルミナ、二酸化珪素、マグネシア、イットリア、硼酸、酸化カルシウム、酸化ストロンチウム、酸化バリウム、及びジルコニアの少なくとも1種を含む、
ことを特徴とする請求項9に記載のLED用配線基板の製造方法。 - 前記二酸化チタンは、アナターゼ型である、
ことを特徴とする請求項10に記載のLED用配線基板の製造方法。 - 前記白色反射膜は、前記結合材として、無機材料、有機珪素化合物、及びエポキシ樹脂の少なくとも1種を含む、
ことを特徴とする請求項9乃至11のいずれか一項に記載のLED用配線基板の製造方法。 - 前記白色反射膜は、前記結合材として、無機材料を含む、
ことを特徴とする請求項12に記載のLED用配線基板の製造方法。 - 前記無機材料は、水ガラス硬化物、低融点ガラス、及び無機ゾル硬化物の少なくとも1種である、
ことを特徴とする請求項13に記載のLED用配線基板の製造方法。 - 前記絶縁層は、樹脂基板からなる、
ことを特徴とする請求項9乃至14のいずれか一項に記載のLED用配線基板の製造方法。 - 請求項9乃至15のいずれか一項に記載のLED用配線基板の製造方法により製造されたLED用配線基板にLED素子を実装することを含む、
ことを特徴とする発光モジュールの製造方法。
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014509086A (ja) * | 2011-03-18 | 2014-04-10 | コーニンクレッカ フィリップス エヌ ヴェ | 発光装置のための基板に反射性被覆を供給する方法 |
JP2014179457A (ja) * | 2013-03-14 | 2014-09-25 | Shinko Electric Ind Co Ltd | 発光素子搭載用の配線基板、発光装置、発光素子搭載用の配線基板の製造方法及び発光装置の製造方法 |
JP2014203942A (ja) * | 2013-04-04 | 2014-10-27 | 信越化学工業株式会社 | 光半導体装置 |
JP2015185560A (ja) * | 2014-03-20 | 2015-10-22 | スタンレー電気株式会社 | 半導体発光モジュール |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093372A (ja) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | 半導体装置 |
JP2006100444A (ja) * | 2004-09-28 | 2006-04-13 | Kyocera Corp | 発光素子搭載基板およびそれを用いた発光装置 |
JP2007103505A (ja) * | 2005-09-30 | 2007-04-19 | Tdk Corp | 発光装置 |
WO2007080803A1 (ja) * | 2006-01-16 | 2007-07-19 | Matsushita Electric Industrial Co., Ltd. | 半導体発光装置 |
JP2009004718A (ja) * | 2007-05-18 | 2009-01-08 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
JP2009212134A (ja) * | 2008-02-29 | 2009-09-17 | Toshiba Corp | 窒化アルミニウムパッケージ、発光装置、バックライトおよび照明装置 |
JP2010090201A (ja) * | 2008-10-03 | 2010-04-22 | Three M Innovative Properties Co | 光反射性樹脂組成物、発光装置及び光学表示装置 |
JP2010226095A (ja) * | 2009-02-24 | 2010-10-07 | Hitachi Chem Co Ltd | 配線基板、電子部品パッケージ及びこれらの製造方法 |
JP2012002580A (ja) * | 2010-06-15 | 2012-01-05 | Nikon Corp | 内挿誤差測定装置、内挿誤差測定方法、エンコーダおよび位置検出方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5514475A (en) * | 1993-01-22 | 1996-05-07 | Sumitomo Metal Industries, Ltd. | Heat-resistant electrical insulating layer |
KR100808705B1 (ko) * | 2003-09-30 | 2008-02-29 | 가부시끼가이샤 도시바 | 발광장치 |
JP2009130234A (ja) * | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 回路基板及び回路基板を有するledモジュール |
JP2009176847A (ja) * | 2008-01-23 | 2009-08-06 | Citizen Electronics Co Ltd | 発光ダイオード |
-
2011
- 2011-01-17 JP JP2011007361A patent/JP2012151191A/ja active Pending
-
2012
- 2012-01-13 US US13/349,599 patent/US20120181560A1/en not_active Abandoned
- 2012-01-17 TW TW101101814A patent/TWI468087B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093372A (ja) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | 半導体装置 |
JP2006100444A (ja) * | 2004-09-28 | 2006-04-13 | Kyocera Corp | 発光素子搭載基板およびそれを用いた発光装置 |
JP2007103505A (ja) * | 2005-09-30 | 2007-04-19 | Tdk Corp | 発光装置 |
WO2007080803A1 (ja) * | 2006-01-16 | 2007-07-19 | Matsushita Electric Industrial Co., Ltd. | 半導体発光装置 |
JP2009004718A (ja) * | 2007-05-18 | 2009-01-08 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
JP2009212134A (ja) * | 2008-02-29 | 2009-09-17 | Toshiba Corp | 窒化アルミニウムパッケージ、発光装置、バックライトおよび照明装置 |
JP2010090201A (ja) * | 2008-10-03 | 2010-04-22 | Three M Innovative Properties Co | 光反射性樹脂組成物、発光装置及び光学表示装置 |
JP2010226095A (ja) * | 2009-02-24 | 2010-10-07 | Hitachi Chem Co Ltd | 配線基板、電子部品パッケージ及びこれらの製造方法 |
JP2012002580A (ja) * | 2010-06-15 | 2012-01-05 | Nikon Corp | 内挿誤差測定装置、内挿誤差測定方法、エンコーダおよび位置検出方法 |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014509086A (ja) * | 2011-03-18 | 2014-04-10 | コーニンクレッカ フィリップス エヌ ヴェ | 発光装置のための基板に反射性被覆を供給する方法 |
JP2014179457A (ja) * | 2013-03-14 | 2014-09-25 | Shinko Electric Ind Co Ltd | 発光素子搭載用の配線基板、発光装置、発光素子搭載用の配線基板の製造方法及び発光装置の製造方法 |
JP2014203942A (ja) * | 2013-04-04 | 2014-10-27 | 信越化学工業株式会社 | 光半導体装置 |
JP2015185560A (ja) * | 2014-03-20 | 2015-10-22 | スタンレー電気株式会社 | 半導体発光モジュール |
JP2017520915A (ja) * | 2014-06-10 | 2017-07-27 | スリーエム イノベイティブ プロパティズ カンパニー | Uv保護を備えた可撓性ledアセンブリ |
US10424707B2 (en) | 2014-06-10 | 2019-09-24 | 3M Innovative Properties Company | Flexible LED assembly with UV protection |
US10177289B2 (en) | 2014-10-22 | 2019-01-08 | Murata Manufacturing Co., Ltd. | Mounting substrate |
JPWO2016063590A1 (ja) * | 2014-10-22 | 2017-04-27 | 株式会社村田製作所 | 実装基板 |
WO2016063590A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社村田製作所 | 実装基板 |
JP2017135148A (ja) * | 2016-01-25 | 2017-08-03 | スタンレー電気株式会社 | 半導体装置 |
US10580346B2 (en) | 2016-03-30 | 2020-03-03 | Panasonic Intellectual Property Management Co., Ltd. | Display device including a plurality of flexible LED mounting boards |
JPWO2017169262A1 (ja) * | 2016-03-30 | 2019-02-07 | パナソニックIpマネジメント株式会社 | 表示装置 |
WO2017169262A1 (ja) * | 2016-03-30 | 2017-10-05 | パナソニックIpマネジメント株式会社 | 表示装置 |
US10950768B2 (en) | 2017-04-27 | 2021-03-16 | Kyocera Corporation | Circuit board and light-emitting device provided with same |
WO2019003775A1 (ja) * | 2017-06-29 | 2019-01-03 | 京セラ株式会社 | 回路基板およびこれを備える発光装置 |
JPWO2019003775A1 (ja) * | 2017-06-29 | 2020-04-02 | 京セラ株式会社 | 回路基板およびこれを備える発光装置 |
TWI699021B (zh) * | 2017-06-29 | 2020-07-11 | 日商京瓷股份有限公司 | 電路基板及具備其之發光裝置 |
US11304291B2 (en) | 2017-06-29 | 2022-04-12 | Kyocera Corporation | Circuit board and light emitting device including circuit board |
JP2020057664A (ja) * | 2018-09-28 | 2020-04-09 | 日亜化学工業株式会社 | プリント回路板及びその製造方法 |
US11439019B2 (en) | 2018-09-28 | 2022-09-06 | Nichia Corporation | Printed circuit board and method of manufacturing the same |
JP7295373B2 (ja) | 2018-09-28 | 2023-06-21 | 日亜化学工業株式会社 | プリント回路板及びその製造方法 |
JP2020107708A (ja) * | 2018-12-27 | 2020-07-09 | デンカ株式会社 | 蛍光体基板の製造方法、発光基板の製造方法及び照明装置の製造方法 |
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