JP2012109821A - Mounting method of patch antenna - Google Patents

Mounting method of patch antenna Download PDF

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JP2012109821A
JP2012109821A JP2010257387A JP2010257387A JP2012109821A JP 2012109821 A JP2012109821 A JP 2012109821A JP 2010257387 A JP2010257387 A JP 2010257387A JP 2010257387 A JP2010257387 A JP 2010257387A JP 2012109821 A JP2012109821 A JP 2012109821A
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power supply
patch antenna
pin
solder
supply pin
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JP2012109821A5 (en
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Hiroyuki Fujiwara
宏之 藤原
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Priority to JP2010257387A priority Critical patent/JP2012109821A/en
Priority to US13/282,565 priority patent/US8830127B2/en
Priority to CN201110369569.1A priority patent/CN102569982B/en
Publication of JP2012109821A publication Critical patent/JP2012109821A/en
Publication of JP2012109821A5 publication Critical patent/JP2012109821A5/ja
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Abstract

PROBLEM TO BE SOLVED: To provide a mounting method of a patch antenna, capable of preventing the damage of a feeding pad as much as possible and performing highly reliable surface mounting.SOLUTION: The length of a feeding pin 13 is set to such a length that an upper end is projected from the upper surface of a radiation electrode 10 when a lower end is abutted to a feeding pad 61, the feeding pin 13 is loosely fitted to a through-hole 20 of a dielectric 11, and the feeding pin is temporarily fixed in the state that the lower end of the feeding pin 13 is positioned flatly with the lower surface of a ground electrode 12 or above the lower surface by first solder 30 deposited from the upper end part of the feeding pin to the radiation electrode. By fusing the first solder by heating, the feeding pin 13 is dropped inside the through-hole 20, and the lower end of the feeding pin 13 is abutted to the feeding pad 61. Thus, the damage of the feeding pad 61 is prevented and the feeding pin 13 and the feeding pad 61 are surely connected.

Description

本発明は、パッチアンテナの実装方法に関するものである。     The present invention relates to a patch antenna mounting method.

従来、パッチアンテナとして、上下方向に貫通する貫通孔を有する誘電体の上面に放射電極が形成される一方、誘電体の下面に接地電極が形成され、前記貫通孔に挿入された給電ピンの上端部が半田を介して放射電極に電気的に接続され、給電ピンの下端部が、誘電体の下面に形成され貫通孔の直径よりも大きい内周を有する凹部内に臨み、給電ピンの下端が接地電極の下面とほぼ面一に形成された表面実装可能なパッチアンテナが知られている（例えば、特許文献１）。   Conventionally, as a patch antenna, a radiation electrode is formed on the upper surface of a dielectric having a through-hole penetrating in the vertical direction, while a ground electrode is formed on the lower surface of the dielectric, and the upper end of a feed pin inserted into the through-hole Is electrically connected to the radiation electrode through solder, the lower end of the power supply pin faces a recess formed on the lower surface of the dielectric and having an inner circumference larger than the diameter of the through hole, and the lower end of the power supply pin is A surface-mountable patch antenna formed substantially flush with the lower surface of the ground electrode is known (for example, Patent Document 1).

特開２００５−２６０８７５号公報JP 2005-260875 A

上記特許文献１に記載のパッチアンテナでは、当該パッチアンテナを実装基板に表面実装する場合、パッチアンテナの給電ピンの下端を実装基板の給電パッドに当接させるか、実装基板の給電パッドにクリーム半田を予め塗布しておき、このクリーム半田を加熱によって溶融させ、この溶融した半田を給電ピンに沿って上らせることで、パッチアンテナの給電ピンの下端部と実装基板の給電パッドを電気的に接続させている。後者のクリーム半田を使用する実装方法の場合、誘電体の下面に形成した凹部は、半田などの導電性部材が給電ピンにしっかりと固着するスペースを確保するとともに、半田が接地電極に接触するのを防止する働きをしている。   In the patch antenna described in Patent Document 1, when the patch antenna is surface-mounted on a mounting board, the lower end of the feeding pin of the patch antenna is brought into contact with the feeding pad of the mounting board, or cream solder is applied to the feeding pad of the mounting board. Is applied in advance, the cream solder is melted by heating, and the melted solder is moved up along the power supply pins to electrically connect the lower end of the power supply pins of the patch antenna and the power supply pads of the mounting substrate. Connected. In the latter mounting method using cream solder, the concave portion formed on the lower surface of the dielectric ensures a space for a conductive member such as solder to be firmly fixed to the power supply pin, and the solder contacts the ground electrode. It works to prevent.

しかしながら、上記特許文献１に記載のパッチアンテナでは、給電ピンの下端が接地電極の下面とほぼ面一となっているので、前者の実装方法の場合、実装基板にパッチアンテナを載置した際の給電ピンと給電パッドとの接触が不完全になる虞がある。すなわち、パッチアンテナの誘電体及び接地電極の平坦性や、実装基板の上面の給電パッドの平坦性が悪かったりすると、給電ピンの下端と給電パッドとが当接不良となる虞がある。
また、後者の実装方法の場合も、同様の理由によって、給電ピンの下端とクリーム半田とが適切に当接せず、溶融した半田が給電ピンに沿ってうまく上らず、好適な半田フィレットが形成されない虞がある。
一方、このような問題を避けるため、給電ピンの下端を接地電極の下面から少し突出させるとパッチアンテナの搬送の際などに、給電ピンの突出部分が外部物体に衝突したりして、給電ピンが損傷する虞がある。さらには、給電ピンの下端を接地電極の下面から突出させると、パッチアンテナを実装基板に載置したとき、給電ピンの下端がパッチアンテナの他の部分よりも先に給電パッドに強く当接し、給電パッドが損傷したり、或いは、給電ピンと給電パッドとの当接点を支点としてパッチアンテナが傾き、傾いたままでパッチアンテナが実装されてしまう虞もある。 However, in the patch antenna described in Patent Document 1, since the lower end of the feed pin is substantially flush with the lower surface of the ground electrode, in the former mounting method, when the patch antenna is placed on the mounting substrate There is a possibility that the contact between the power supply pin and the power supply pad becomes incomplete. That is, if the flatness of the dielectric and ground electrode of the patch antenna and the flatness of the power supply pad on the upper surface of the mounting substrate are poor, there is a possibility that the lower end of the power supply pin and the power supply pad may be in poor contact.
Also, in the case of the latter mounting method, for the same reason, the lower end of the power supply pin and the cream solder do not come into contact with each other properly, and the molten solder does not rise well along the power supply pin. There is a risk that it will not be formed.
On the other hand, in order to avoid such a problem, if the lower end of the feed pin is slightly projected from the lower surface of the ground electrode, the projecting portion of the feed pin may collide with an external object when the patch antenna is transported. May be damaged. Furthermore, when the lower end of the power supply pin protrudes from the lower surface of the ground electrode, when the patch antenna is placed on the mounting substrate, the lower end of the power supply pin strongly contacts the power supply pad before the other part of the patch antenna, There is a possibility that the power supply pad is damaged, or the patch antenna is tilted with the contact point between the power supply pin and the power supply pad as a fulcrum, and the patch antenna is mounted in a tilted state.

本発明は、かかる問題点に鑑みなされたもので、給電パッドの損傷が極力防止でき、且つ、信頼性の高い表面実装が可能なパッチアンテナの実装方法を提供することを目的としている。   The present invention has been made in view of such problems, and an object of the present invention is to provide a patch antenna mounting method capable of preventing damage to a power feeding pad as much as possible and capable of highly reliable surface mounting.

請求項１の発明は、
上下方向に貫く貫通孔を有する誘電体、前記誘電体の上面に形成された放射電極、前記誘電体の下面に形成された接地電極、及び、前記貫通孔に挿入された給電ピンを備えるパッチアンテナを、前記誘電ピンの下端部を実装基板の上面に形成された給電パッドに電気的に接続させて、前記実装基板に実装するにあたり、
前記給電ピンの長さを、下端が前記給電パッドに当接した際に上端が前記放射電極の上面から突出する程度の長さに設定し、当該給電ピンを前記貫通孔に遊嵌させ、前記給電ピンの上端部から前記放射電極に亘って付着された第１の半田によって当該給電ピンの下端が前記接地電極の下面と面一又は当該下面より上方に位置する状態で当該給電ピンの仮止めをしておき、
前記パッチアンテナを前記実装基板の上に載置し、前記第１の半田を加熱により溶融させることによって、前記給電ピンを前記貫通孔内で落下させ、当該給電ピンの下端を前記給電パッドに当接させるようにしたことを特徴とするパッチアンテナの実装方法である。
ここで、「遊嵌」とは、給電ピンが貫通孔内を重力によって円滑に落下できる程度の間隙をもって、給電ピンが貫通孔に挿入された状態をいう。 The invention of claim 1
A patch antenna comprising a dielectric having a through-hole penetrating in the vertical direction, a radiation electrode formed on the upper surface of the dielectric, a ground electrode formed on the lower surface of the dielectric, and a feed pin inserted into the through-hole When the lower end portion of the dielectric pin is electrically connected to the power supply pad formed on the upper surface of the mounting substrate, and mounted on the mounting substrate,
The length of the power supply pin is set to such a length that the upper end protrudes from the upper surface of the radiation electrode when the lower end comes into contact with the power supply pad, and the power supply pin is loosely fitted into the through hole, Temporarily fixing the power supply pin in a state where the lower end of the power supply pin is flush with the lower surface of the ground electrode or above the lower surface by the first solder attached from the upper end of the power supply pin to the radiation electrode And
The patch antenna is placed on the mounting substrate, and the first solder is melted by heating, whereby the power supply pin is dropped in the through hole, and the lower end of the power supply pin is applied to the power supply pad. The patch antenna mounting method is characterized in that the contact is made.
Here, “free fitting” refers to a state in which the power feed pin is inserted into the through hole with a gap that allows the power feed pin to smoothly fall through the through hole due to gravity.

請求項２の発明は、請求項１に記載のパッチアンテナの実装方法において、前記給電パッドの上に第２の半田を付着させておき、前記半田と前記第２の半田とを加熱により同時に溶融させ、前記第２の半田によって前記給電ピンの下端部を前記給電パッドに電気的に接続させることを特徴とする。   According to a second aspect of the present invention, in the method for mounting a patch antenna according to the first aspect, a second solder is adhered on the power supply pad, and the solder and the second solder are simultaneously melted by heating. The lower end portion of the power supply pin is electrically connected to the power supply pad by the second solder.

請求項３の発明は、請求項１又は２のパッチアンテナの実装方法において、前記誘電体に、下面に開口し前記貫通孔の直径よりも大きい内周を有し当該貫通孔と連通された凹部を形成しておくとともに、前記給電ピンの下端に、当該給電ピンの全周囲に張り出した座部を形成しておき、前記仮止めの際に前記座部の下端を前記接地電極の下面と面一又は当該下面より上方に位置させておくことを特徴とする。   According to a third aspect of the present invention, in the patch antenna mounting method according to the first or second aspect, the dielectric has an inner periphery larger than a diameter of the through hole that is open on the lower surface and communicated with the through hole. In addition, a seat portion is formed at the lower end of the power supply pin so as to protrude all around the power supply pin, and the lower end of the seat portion is faced to the lower surface of the ground electrode during the temporary fixing. It is characterized by being positioned above or below the lower surface.

請求項４の発明は、請求項１又は２のパッチアンテナの実装方法において、前記給電ピンの上端に全周囲に張り出した頭部を形成しておき、前記頭部の下面から前記放射電極に亘って付着させた前記第１の半田によって前記仮止めをしておくことを特徴とする。   According to a fourth aspect of the present invention, in the patch antenna mounting method according to the first or second aspect, a head that protrudes all around is formed at the upper end of the power feed pin, and extends from the lower surface of the head to the radiation electrode. The temporary fixing is performed by the first solder adhered in this manner.

本願発明によれば、給電ピン及び半田の下端は、接地電極の下面と面一、又は当該下面よりも上方に位置しているので、給電ピンの下端部がそれを取り囲む周壁によって保護され、パッチアンテナの搬送の際などに、給電ピンの下端部が外部の物体と衝突したりすることがなくなる。その結果、給電ピンの下端部が損傷する虞がなくなる。
また、同様の理由により、パッチアンテナを実装基板の上に載置する場合でも、給電ピンの下端がパッチアンテナの他の部分よりも先に給電パッドに当接することがないので、給電パッドの損傷が防止できるとともに、パッチアンテナが傾くことも防止される。
一方、実装の際の半田の溶融によって、給電ピンが落下するので、給電ピンの下端部と給電パッドとの電気的接続が確実に行えることになる。 According to the present invention, since the lower end of the power supply pin and the solder is positioned flush with the lower surface of the ground electrode or above the lower surface, the lower end portion of the power supply pin is protected by the surrounding wall surrounding it, and the patch When the antenna is transported, the lower end portion of the power feed pin does not collide with an external object. As a result, there is no possibility that the lower end portion of the power supply pin is damaged.
For the same reason, even when the patch antenna is mounted on the mounting substrate, the lower end of the power supply pin does not contact the power supply pad before the other part of the patch antenna. In addition to preventing the patch antenna from tilting.
On the other hand, since the power supply pin falls due to melting of the solder at the time of mounting, the electrical connection between the lower end portion of the power supply pin and the power supply pad can be reliably performed.

本発明の第１の実施形態に係るパッチアンテナを示す断面図である。It is sectional drawing which shows the patch antenna which concerns on the 1st Embodiment of this invention. 図１のパッチアンテナの製造方法の工程図であり、（Ａ）は基台の上にアンテナ本体を載置するときの様子を示す図、（Ｂ）は基台の上にアンテナ本体を載置した状態を示す図、（Ｃ）はアンテナ本体の貫通孔に給電ピンを挿入する様子を示す図、（Ｄ）はアンテナ本体の放射電極と給電ピンとを電気的に接続した状態を示す図である。It is process drawing of the manufacturing method of the patch antenna of FIG. 1, (A) is a figure which shows a mode when mounting an antenna main body on a base, (B) is mounting an antenna main body on a base. The figure which shows the state which carried out, (C) is a figure which shows a mode that a feed pin is inserted in the through-hole of an antenna main body, (D) is a figure which shows the state which connected the radiation electrode and feed pin of the antenna main body electrically. . 図１のパッチアンテナの実装方法の工程図であり、（Ａ）は実装に使用される実装基板の正面図、（Ｂ）は基台の上にアンテナ本体を載置するときの様子を示す図、（Ｃ）は給電ピンの下端部と実装基板の給電パッドとを電気的に接続した状態を示す図である。It is process drawing of the mounting method of the patch antenna of FIG. 1, (A) is a front view of the mounting board | substrate used for mounting, (B) is a figure which shows a mode when mounting an antenna main body on a base. (C) is a figure which shows the state which connected the lower end part of the electric power feeding pin, and the electric power feeding pad of the mounting board | substrate. 本発明の第２の実施形態に係るパッチアンテナを示す断面図である。It is sectional drawing which shows the patch antenna which concerns on the 2nd Embodiment of this invention. 図４のパッチアンテナを実装基板に載置した状態を示す図である。It is a figure which shows the state which mounted the patch antenna of FIG. 4 on the mounting board | substrate. 図４のパッチアンテナを実装基板に実装した状態を示す図である。It is a figure which shows the state which mounted the patch antenna of FIG. 4 on the mounting board | substrate. 本発明の第３の実施形態に係るパッチアンテナを示す断面図である。It is sectional drawing which shows the patch antenna which concerns on the 3rd Embodiment of this invention. 図７のパッチアンテナを実装基板に載置した状態を示す図である。It is a figure which shows the state which mounted the patch antenna of FIG. 7 on the mounting board | substrate. 図７のパッチアンテナを実装基板に実装した状態を示す図である。It is a figure which shows the state which mounted the patch antenna of FIG. 7 on the mounting board | substrate.

以下、本発明の実施形態について図面を用いて説明する。     Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、第１の実施形態の実装方法に使用されるパッチアンテナ１の断面図である。
このパッチアンテナ１は、放射電極１０、誘電体１１及び接地電極１２を備えている。 このうち誘電体１１は例えばセラミックスによって形成されている。この誘電体１１には上下方向に貫通する貫通孔２０が形成されている。 FIG. 1 is a cross-sectional view of a patch antenna 1 used in the mounting method of the first embodiment.
The patch antenna 1 includes a radiation electrode 10, a dielectric 11, and a ground electrode 12. Of these, the dielectric 11 is made of ceramics, for example. A through-hole 20 is formed in the dielectric 11 so as to penetrate in the vertical direction.

また、放射導体１０は誘電体１１の上面に形成されている。この放射電極１０の形成は、例えば、スクリーン印刷や転写などの方法によって電極用ペースト材を誘電体１１に付着した後に焼き付けを行うことによってなされている。なお、この放射電極１０の形状及び面積は所望の使用周波数やアンテナ特性との関係を考慮して決定されている。例えば、円偏波特性を有するアンテナとする場合には、放射電極１０の外周に切り欠き部が形成される。   The radiation conductor 10 is formed on the upper surface of the dielectric 11. The radiating electrode 10 is formed by, for example, baking after applying an electrode paste material to the dielectric 11 by a method such as screen printing or transfer. The shape and area of the radiation electrode 10 are determined in consideration of the relationship with a desired operating frequency and antenna characteristics. For example, when an antenna having a circular polarization characteristic is formed, a notch is formed on the outer periphery of the radiation electrode 10.

また、接地電極１２は誘電体１１の下面に形成されている。この接地電極１２の形成も、例えば、スクリーン印刷や転写などの方法によって電極用ペースト材を誘電体１１に付着した後に焼き付けを行うことによってなされている。   The ground electrode 12 is formed on the lower surface of the dielectric 11. The ground electrode 12 is also formed by, for example, baking the electrode paste material after attaching it to the dielectric 11 by a method such as screen printing or transfer.

また、給電ピン１３は例えば真鍮製で全体が棒状に形成されている。この給電ピン１３は貫通孔２０に挿入されている。この給電ピン１３の上端は、放射電極１１の上面から突出している。そして、給電ピン１３は、その上端部が半田３０を介して放射電極１０と電気的に接続された状態で、仮止めされている。
この仮止め状態では、給電ピン１３の下端は、接地電極１２の下面と面一、又は、当該下面よりも上方に位置している。そのため、給電ピン１３の下端部は、パッチアンテナ１の搬送の際などに、それを取り囲む壁によって保護され、外部の物体との衝突が防止される。 The power supply pin 13 is made of, for example, brass and is formed in a rod shape as a whole. The power supply pin 13 is inserted into the through hole 20. The upper end of the power supply pin 13 protrudes from the upper surface of the radiation electrode 11. The power supply pin 13 is temporarily fixed with its upper end portion electrically connected to the radiation electrode 10 via the solder 30.
In this temporarily fixed state, the lower end of the power supply pin 13 is positioned flush with the lower surface of the ground electrode 12 or above the lower surface. Therefore, the lower end portion of the power supply pin 13 is protected by a wall surrounding the patch antenna 1 when it is transported, and collision with an external object is prevented.

次に、パッチアンテナ１の製造方法について図３を用いて説明する。
この製造方法では、図２（Ａ）に示すように、始発材料としてアンテナ本体１Ａが使用される。ここで、アンテナ本体１Ａとは、放射電極１０、誘電体１１及び接地電極１２を備え、誘電体１１に貫通孔２０及び凹部２１が形成されたものを言う。
また、この製造方法では、図２（Ａ）に示すように、アンテナ本体１Ａを載置するための基台５０が使用される。基台５０の上面には突起５１が形成されている。この突起５１は、アンテナ本体１Ａの貫通孔２０近くの接地電極１２の欠損部分２１ａに対向して形成されており、基台５０の上面から僅かに突出している。基台５０の上面のその他の部分は平面となっている。また、突起５１の上面も平面となっている。この突起５１は、給電ピン１３の下端を接地電極１２の下面よりも上方に位置させるためのものである。
パッチアンテナ１を製造するにあたっては、まず、図２（Ａ）に示すように接地電極１２を下方に向けた状態で、アンテナ本体１Ａを基台５０の上に載置する。載置した状態では、図２（Ｂ）に示すように、基台５０の突起５１と接地電極２１の欠損部分２１ａとの平面的な位置を合致させるようにする。
次に、図２（Ｃ）に示すように、アンテナ本体１Ａの貫通孔２０に上方から給電ピン１３を挿入する。そして、給電ピン１３の下端を突起５１の上面に当接させる。給電ピン１３の下端を突起５１の上面に当接させた状態では、給電ピン１３の上端は、放射電極１０の上面から突出している。一方、給電ピン１３の下端は、接地電極１２の下面よりも上方に位置している。
この状態で、アンテナ本体１Ａの上面に半田３０を付着させ、半田３０を加熱によって溶融させ、第２（Ｄ）に示すように、給電ピン１３を、その上端部が半田３０を介して放射電極１０の上面と電気的に接続された状態で、仮止めする。
これによって、図１に示すパッチアンテナ１が得られる。 Next, a method for manufacturing the patch antenna 1 will be described with reference to FIG.
In this manufacturing method, as shown in FIG. 2A, the antenna body 1A is used as a starting material. Here, the antenna body 1 </ b> A refers to an antenna body including the radiation electrode 10, the dielectric 11, and the ground electrode 12, and the through-hole 20 and the recess 21 are formed in the dielectric 11.
In this manufacturing method, as shown in FIG. 2A, a base 50 for mounting the antenna body 1A is used. A protrusion 51 is formed on the upper surface of the base 50. The protrusion 51 is formed so as to face the missing portion 21 a of the ground electrode 12 near the through hole 20 of the antenna body 1 A, and slightly protrudes from the upper surface of the base 50. Other portions of the upper surface of the base 50 are flat. Further, the upper surface of the protrusion 51 is also a flat surface. The protrusion 51 is for positioning the lower end of the power supply pin 13 above the lower surface of the ground electrode 12.
In manufacturing the patch antenna 1, first, the antenna body 1 </ b> A is placed on the base 50 with the ground electrode 12 facing downward as shown in FIG. In the mounted state, as shown in FIG. 2B, the planar positions of the protrusions 51 of the base 50 and the missing portions 21a of the ground electrode 21 are matched.
Next, as shown in FIG. 2C, the feed pin 13 is inserted into the through hole 20 of the antenna body 1A from above. Then, the lower end of the power supply pin 13 is brought into contact with the upper surface of the protrusion 51. In a state where the lower end of the power supply pin 13 is in contact with the upper surface of the protrusion 51, the upper end of the power supply pin 13 protrudes from the upper surface of the radiation electrode 10. On the other hand, the lower end of the power supply pin 13 is located above the lower surface of the ground electrode 12.
In this state, the solder 30 is attached to the upper surface of the antenna body 1A, and the solder 30 is melted by heating. As shown in the second (D), the power supply pin 13 has its upper end portion radiated through the solder 30 as a radiation electrode. Temporarily fix in a state where it is electrically connected to the upper surface of 10.
Thereby, the patch antenna 1 shown in FIG. 1 is obtained.

なお、上記製造方法によれば、上面に突起５１を形成した基台５０を使用しているが、上面に突起５１を設けずに、基台５０の上面を平面としてもよい。この場合には、誘電体１１の貫通孔２０に挿入した給電ピン１３の下端を基台５０の上面に当接させれば、給電ピン１３の下端は接地電極１２の下面と面一となる。
また、上記製造方法によれば、アンテナ本体１Ａを基台５０に載置した後に給電ピン１３を貫通孔２０に挿入したが、基台５０に載置する前に、給電ピン１３を上又は下からアンテナ本体１Ａの貫通孔２０に挿入しておき、その後にアンテナ本体１Ａを基台５０に載置し、給電ピン１３の下端を突起５１に当接させてもよい。 In addition, according to the said manufacturing method, although the base 50 which formed the protrusion 51 in the upper surface is used, it is good also considering the upper surface of the base 50 as a plane, without providing the protrusion 51 in an upper surface. In this case, if the lower end of the power supply pin 13 inserted into the through hole 20 of the dielectric 11 is brought into contact with the upper surface of the base 50, the lower end of the power supply pin 13 is flush with the lower surface of the ground electrode 12.
Further, according to the above manufacturing method, the power supply pin 13 is inserted into the through hole 20 after the antenna body 1A is placed on the base 50. However, before the power supply pin 13 is placed on the base 50, the power feed pin 13 is moved up or down. May be inserted into the through hole 20 of the antenna body 1 </ b> A, and then the antenna body 1 </ b> A may be placed on the base 50 and the lower end of the power feed pin 13 may be brought into contact with the protrusion 51.

続いて、パッチアンテナ１の実装方法を説明する。
この実装では、図３（Ａ）に示すような実装基板６０が使用される。この実装基板６０は、給電ピン１３に電気的に接続すべき給電パッド６１と、接地電極１１に電気的に接続すべき接地電極６２とを上面に備えている。
パッチアンテナ１を実装するにあたっては、まず、図３（Ｂ）に示すように、この実装基板６０の給電パッド６１及び接地電極６２の上にクリーム半田７０を塗布する。
次に、給電ピン１３の下端と実装基板６０の給電パッド６１とが対向するように位置決めして、図３（Ｃ）に示すように、実装基板６０の上にパッチアンテナ１を載置する。この時点では、給電ピン１３の下端はクリーム半田７０に当接されていなくてもよい。 Next, a method for mounting the patch antenna 1 will be described.
In this mounting, a mounting board 60 as shown in FIG. 3A is used. The mounting substrate 60 includes a power supply pad 61 to be electrically connected to the power supply pin 13 and a ground electrode 62 to be electrically connected to the ground electrode 11 on the upper surface.
In mounting the patch antenna 1, first, as shown in FIG. 3B, cream solder 70 is applied on the power supply pad 61 and the ground electrode 62 of the mounting substrate 60.
Next, the patch antenna 1 is placed on the mounting substrate 60 as shown in FIG. 3C by positioning so that the lower end of the power supply pin 13 and the power supply pad 61 of the mounting substrate 60 face each other. At this time, the lower end of the power supply pin 13 may not be in contact with the cream solder 70.

次に、図３（Ｃ）の状態を保ったまま、実装基板５０及びパッチアンテナ１０をリフロー炉に挿入し、半田３０及びクリーム半田７０を溶融させる。   Next, with the state of FIG. 3C maintained, the mounting substrate 50 and the patch antenna 10 are inserted into a reflow furnace, and the solder 30 and the cream solder 70 are melted.

このとき半田３０は次のように作用する。
半田３０は溶融されると、給電ピン１３の保持力を失う。その結果、給電ピン１３は貫通孔２０内を自重によって落下し、接地電極１２の下面から突出する。 At this time, the solder 30 operates as follows.
When the solder 30 is melted, the holding force of the power supply pin 13 is lost. As a result, the power supply pin 13 falls in the through hole 20 due to its own weight and protrudes from the lower surface of the ground electrode 12.

このように給電ピン１３は、接地電極１２の下面から突出し、確実に、給電パッド６１と当接するため、溶融した半田が給電ピン１３に沿って上り、好適な半田フィレットが形成されることになる。
これによって、パッチアンテナ１の給電ピン１３の下端部が第２の給電パッド６１に電気的に接続される。
また、パッチアンテナ１の接地電極１２もクリーム半田７０を介して実装基板６０の接地電極６２に電気的に接続される。 Thus, since the power feed pin 13 protrudes from the lower surface of the ground electrode 12 and reliably contacts the power feed pad 61, the molten solder rises along the power feed pin 13 and a suitable solder fillet is formed. .
As a result, the lower end portion of the feed pin 13 of the patch antenna 1 is electrically connected to the second feed pad 61.
The ground electrode 12 of the patch antenna 1 is also electrically connected to the ground electrode 62 of the mounting substrate 60 via the cream solder 70.

なお、ここでは実装基板６０にパッチアンテナ１だけを実装する場合について説明したが、パッチアンテナ１が実装される実装基板６０の上面には抵抗やＩＣ等の電気部品が半田によって実装されるときがあり、このときには、その電気部品の実装のための半田もリフロー炉で同時に溶融し、パッチアンテナ１の実装と他の電気部品の実装とを同時に行うことができる。このようにすれば、全体として、実装の作業性が向上することになる。   Here, the case where only the patch antenna 1 is mounted on the mounting substrate 60 has been described, but there are times when an electrical component such as a resistor or an IC is mounted on the upper surface of the mounting substrate 60 on which the patch antenna 1 is mounted by solder. In this case, the solder for mounting the electrical component is also melted simultaneously in the reflow furnace, so that the mounting of the patch antenna 1 and the mounting of other electrical components can be performed simultaneously. In this way, the workability of mounting is improved as a whole.

以上説明した、上記パッチアンテナ１及びその製造方法によれば、次のような効果が得られる。
すなわち、本実施形態によれば、給電ピン１３の下端は、接地電極１２の下面と面一か当該下面よりも上方に位置しているので、給電ピン１３の下端部はそれを取り囲む壁に保護され、パッチアンテナ１の搬送の際などに、給電ピン１３の下端部が外部の物体と衝突するのが防止される。その結果、給電ピン１３の下端部が損傷する虞がなくなる。
また、同様の理由により、パッチアンテナ１を実装基板６０の上に載置する場合でも、給電ピン１３の下端がパッチアンテナ１の他の部分よりも先に給電パッド６１に当接することがないので、給電パッド１３の損傷が防止できるとともに、パッチアンテナ１が傾くことも防止される。
一方、実装の際の半田３０の溶融によって、給電ピン１３が落下するので、給電ピン１３の下端部と給電パッド６１との電気的接続が確実に行えることになる。 According to the patch antenna 1 and the manufacturing method thereof described above, the following effects can be obtained.
That is, according to the present embodiment, the lower end of the power feed pin 13 is positioned flush with or above the lower surface of the ground electrode 12, so that the lower end of the power feed pin 13 is protected by the wall surrounding it. Thus, when the patch antenna 1 is transported, the lower end portion of the power feed pin 13 is prevented from colliding with an external object. As a result, there is no possibility that the lower end portion of the power supply pin 13 is damaged.
For the same reason, even when the patch antenna 1 is placed on the mounting substrate 60, the lower end of the power feed pin 13 does not come into contact with the power feed pad 61 before other portions of the patch antenna 1. In addition to preventing the power supply pad 13 from being damaged, the patch antenna 1 is also prevented from tilting.
On the other hand, since the power supply pin 13 falls due to melting of the solder 30 at the time of mounting, the electrical connection between the lower end portion of the power supply pin 13 and the power supply pad 61 can be reliably performed.

図４は、第２の実施形態の実装方法に使用されるパッチアンテナ２の断面図である。
なお、このパッチアンテナ２において、上記パッチアンテナ１と同じ要素には、同じ符号を付している。
このパッチアンテナ２の誘電体１１には、下面に開口し貫通孔２０の直径よりも大きい内周を有し当該貫通孔と連通された凹部２１が形成されている。
また、このパッチアンテナ２の給電ピン１３の下端には、全周囲に張り出す座部１３ａが形成されている。この給電ピン１３の座部１３ａの下端は、給電ピン１３の仮止め状態では、接地電極１２の下面と面一又は当該下面よりも上方に位置している。 FIG. 4 is a cross-sectional view of the patch antenna 2 used in the mounting method of the second embodiment.
In the patch antenna 2, the same elements as those of the patch antenna 1 are denoted by the same reference numerals.
The dielectric 11 of the patch antenna 2 is formed with a recess 21 which is open on the lower surface and has an inner circumference larger than the diameter of the through hole 20 and communicates with the through hole.
In addition, a seat portion 13a is formed at the lower end of the power supply pin 13 of the patch antenna 2 so as to project to the entire periphery. The lower end of the seat portion 13a of the power supply pin 13 is located flush with the lower surface of the ground electrode 12 or above the lower surface when the power supply pin 13 is temporarily fixed.

このパッチアンテナ２の製造は、上記パッチアンテナ１の製造方法と同様な方法でなされる。ただし、給電ピン１３に座部１３ａが形成されているので、アンテナ本体１Ａを基台５０に載置する前に、給電ピン１３を貫通孔２０に下から挿入しておく必要がある。   The patch antenna 2 is manufactured by the same method as the patch antenna 1. However, since the seat portion 13 a is formed on the power feed pin 13, it is necessary to insert the power feed pin 13 into the through hole 20 from below before placing the antenna body 1 </ b> A on the base 50.

また、このパッチアンテナ２の実装も、上記パッチアンテナ１の実装方法と同様な方法でなされる。図５にはパッチアンテナ２を実装基板６０に載置した状態が示され、図６にはパッチアンテナ２を実装基板６０に実装した状態が示されている。なお、図５及び図６では、上記実装基板６０と同じ要素には同じ符号を付している。   The patch antenna 2 is mounted in the same manner as the patch antenna 1 is mounted. FIG. 5 shows a state where the patch antenna 2 is placed on the mounting substrate 60, and FIG. 6 shows a state where the patch antenna 2 is mounted on the mounting substrate 60. 5 and 6, the same reference numerals are given to the same elements as those of the mounting substrate 60.

この実装方法によれば、上記パッチアンテナ１の実装方法と同様な効果が得られることは勿論のこと、給電ピン１３に座部１３ａが形成されているため、図６に示すように広い範囲で、給電ピン１３の下端部と給電パッド６１とが当接することになる。
また、座部１３ａは重りとしても機能し、給電ピン１３が落下し易くなる。 According to this mounting method, the same effect as the mounting method of the patch antenna 1 can be obtained, and since the seat portion 13a is formed on the power feed pin 13, a wide range as shown in FIG. The lower end portion of the power supply pin 13 and the power supply pad 61 come into contact with each other.
Further, the seat portion 13a also functions as a weight, and the power supply pin 13 is easily dropped.

図７は、第３の実施形態の実装方法に使用されるパッチアンテナ３の断面図である。なお、このパッチアンテナ３において、上記パッチアンテナ１と同じ要素には、同じ符号を付している。
このパッチアンテナ３の給電ピン１３の上端には、全周囲に張り出す頭部１３ｂが形成されている。この頭部１３ｂの下面はテーパ面となっている。そして、この頭部１３ｂから放射電極１０の上面に亘って半田３０が付着され、誘電ピン１３が仮止めされている。この仮止め状態では、給電ピン１３の下端は、接地電極１２の下面と面一又は当該下面よりも上方に位置している。 FIG. 7 is a cross-sectional view of the patch antenna 3 used in the mounting method of the third embodiment. In the patch antenna 3, the same elements as those of the patch antenna 1 are denoted by the same reference numerals.
At the upper end of the feed pin 13 of the patch antenna 3, a head portion 13 b that protrudes to the entire periphery is formed. The lower surface of the head 13b is a tapered surface. The solder 30 is adhered from the head 13b to the upper surface of the radiation electrode 10, and the dielectric pin 13 is temporarily fixed. In this temporarily fixed state, the lower end of the power supply pin 13 is positioned flush with the lower surface of the ground electrode 12 or above the lower surface.

このパッチアンテナ３の製造は、上記パッチアンテナ１の製造方法と同様な方法でなされる。ただし、給電ピン１３に頭部１３ｂが形成されているので、給電ピン１３は貫通孔２０に上から挿入する必要がある。   The patch antenna 3 is manufactured in the same manner as the patch antenna 1 is manufactured. However, since the head 13 b is formed on the power supply pin 13, it is necessary to insert the power supply pin 13 into the through hole 20 from above.

また、このパッチアンテナ３の実装も、上記パッチアンテナ１の実装方法と同様な方法でなされる。図８にはパッチアンテナ３を実装基板６０に載置した状態が示され、図９にはパッチアンテナ３を実装基板６０に実装した状態が示されている。なお、図５及び図６では、上記実装基板６０と同じ要素には同じ符号を付している。   The patch antenna 3 is mounted in the same manner as the patch antenna 1 is mounted. FIG. 8 shows a state where the patch antenna 3 is placed on the mounting substrate 60, and FIG. 9 shows a state where the patch antenna 3 is mounted on the mounting substrate 60. 5 and 6, the same reference numerals are given to the same elements as those of the mounting substrate 60.

この実装方法によれば、上記パッチアンテナ１の実装方法と同様な効果が得られることは勿論のこと、給電ピン１３は重力に加え半田３０の表面張力によって貫通孔２０内に引き込まれるので、給電ピン１３が落下し易くなる。   According to this mounting method, the effect similar to that of the mounting method of the patch antenna 1 can be obtained, and the power supply pin 13 is pulled into the through hole 20 by the surface tension of the solder 30 in addition to the gravity. It becomes easy for the pin 13 to fall.

以上、本発明の実施形態について説明したが、本発明は、かかる実施形態に限定されず、その発明の要旨を逸脱しない範囲で種々変形可能であることは言うまでもない。   As mentioned above, although embodiment of this invention was described, it cannot be overemphasized that this invention can be variously deformed in the range which is not limited to this embodiment and does not deviate from the summary of the invention.

また、上記実施形態では、パッチアンテナ１の接地電極１２と実装基板６０の接地電極６２とをクリーム半田７０によって電気的に接続したが、電気的に接続しなくてもよく、また、クリーム半田７０に代えて、熱硬化型接着剤で接着してもよい。   In the above-described embodiment, the ground electrode 12 of the patch antenna 1 and the ground electrode 62 of the mounting substrate 60 are electrically connected by the cream solder 70. However, the cream solder 70 may not be electrically connected. Instead of this, a thermosetting adhesive may be used.

１ パッチアンテナ
１Ａ アンテナ本体
１０ 放射電極
１１ 誘電体
１２ 接地電極
１３ 給電ピン
２０ 貫通孔
２１ 凹部
３０ 半田
５０ 基台
６０ 実装基板
６１ 給電パッド DESCRIPTION OF SYMBOLS 1 Patch antenna 1A Antenna main body 10 Radiation electrode 11 Dielectric body 12 Ground electrode 13 Feeding pin 20 Through-hole 21 Recess 30 Solder 50 Base 60 Mounting board 61 Feeding pad

Claims (4)

上下方向に貫く貫通孔を有する誘電体、前記誘電体の上面に形成された放射電極、前記誘電体の下面に形成された接地電極、及び、前記貫通孔に挿入された給電ピンを備えるパッチアンテナを、前記誘電ピンの下端部を実装基板の上面に形成された給電パッドに電気的に接続させて、前記実装基板に実装するにあたり、
前記給電ピンの長さを、下端が前記給電パッドに当接した際に上端が前記放射電極の上面から突出する程度の長さに設定し、当該給電ピンを前記貫通孔に遊嵌させ、前記給電ピンの上端部から前記放射電極に亘って付着された第１の半田によって当該給電ピンの下端が前記接地電極の下面と面一又は当該下面より上方に位置する状態で当該給電ピンの仮止めをしておき、
前記パッチアンテナを前記実装基板の上に載置し、前記第１の半田を加熱により溶融させることによって、前記給電ピンを前記貫通孔内で落下させ、当該給電ピンの下端を前記給電パッドに当接させるようにしたことを特徴とするパッチアンテナの実装方法。 A patch antenna comprising a dielectric having a through-hole penetrating in the vertical direction, a radiation electrode formed on the upper surface of the dielectric, a ground electrode formed on the lower surface of the dielectric, and a feed pin inserted into the through-hole When the lower end portion of the dielectric pin is electrically connected to the power supply pad formed on the upper surface of the mounting substrate, and mounted on the mounting substrate,
The length of the power supply pin is set to such a length that the upper end protrudes from the upper surface of the radiation electrode when the lower end comes into contact with the power supply pad, and the power supply pin is loosely fitted into the through hole, Temporarily fixing the power supply pin in a state where the lower end of the power supply pin is flush with the lower surface of the ground electrode or above the lower surface by the first solder attached from the upper end of the power supply pin to the radiation electrode And
The patch antenna is placed on the mounting substrate, and the first solder is melted by heating, whereby the power supply pin is dropped in the through hole, and the lower end of the power supply pin is applied to the power supply pad. A method for mounting a patch antenna, characterized in that the contact is made. 前記給電パッドの上に第２の半田を付着させておき、前記第１の半田と前記第２の半田とを加熱により同時に溶融させ、前記第２の半田によって前記給電ピンの下端部を前記給電パッドに電気的に接続させることを特徴とする請求項１に記載のパッチアンテナの実装方法。   A second solder is attached on the power supply pad, the first solder and the second solder are melted simultaneously by heating, and the lower end portion of the power supply pin is connected to the power supply by the second solder. 2. The patch antenna mounting method according to claim 1, wherein the patch antenna is electrically connected to the pad. 前記誘電体に、下面に開口し前記貫通孔の直径よりも大きい内周を有し当該貫通孔と連通された凹部を形成しておくとともに、前記給電ピンの下端に、当該給電ピンの全周囲に張り出した座部を形成しておき、前記仮止めの際に前記座部の下端を前記接地電極の下面と面一又は当該下面より上方に位置させておくことを特徴とする請求項１又は２のパッチアンテナの実装方法。   The dielectric has a recess that is open on the lower surface and has an inner circumference larger than the diameter of the through-hole and communicated with the through-hole, and at the lower end of the feed pin, the entire circumference of the feed pin A seat portion that protrudes from the ground electrode is formed, and the lower end of the seat portion is positioned flush with or above the lower surface of the ground electrode during the temporary fixing. 2. A method for mounting the patch antenna. 前記給電ピンの上端に全周囲に張り出した頭部を形成しておき、前記頭部の下面から前記放射電極に亘って付着させた前記第１の半田によって前記仮止めをしておくことを特徴とする請求項１又は２のパッチアンテナの実装方法。   A head portion that protrudes to the entire periphery is formed at the upper end of the power supply pin, and the temporary fixing is performed by the first solder adhered from the lower surface of the head portion to the radiation electrode. The patch antenna mounting method according to claim 1 or 2.
JP2010257387A 2010-11-18 2010-11-18 Mounting method of patch antenna Pending JP2012109821A (en)

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US13/282,565 US8830127B2 (en) 2010-11-18 2011-10-27 Patch antenna and method of mounting the same
CN201110369569.1A CN102569982B (en) 2010-11-18 2011-11-15 Paster antenna and installation method thereof

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179824A (en) * 2013-03-15 2014-09-25 Casio Comput Co Ltd Mounting method of patch antenna
CN108470559A (en) * 2018-04-25 2018-08-31 昆山海旭科技电子有限公司中山分公司 A kind of SMD buzzers
US20220152716A1 (en) * 2020-11-19 2022-05-19 Ting-Jui Wang Soldering component and method of assembling soldering component to object

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Publication number Priority date Publication date Assignee Title
JP2005260875A (en) * 2004-03-15 2005-09-22 Yokowo Co Ltd Surface mounted patch antenna and its mounting method
JP2008078895A (en) * 2006-09-20 2008-04-03 Mitsumi Electric Co Ltd Antenna device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260875A (en) * 2004-03-15 2005-09-22 Yokowo Co Ltd Surface mounted patch antenna and its mounting method
JP2008078895A (en) * 2006-09-20 2008-04-03 Mitsumi Electric Co Ltd Antenna device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179824A (en) * 2013-03-15 2014-09-25 Casio Comput Co Ltd Mounting method of patch antenna
CN108470559A (en) * 2018-04-25 2018-08-31 昆山海旭科技电子有限公司中山分公司 A kind of SMD buzzers
US20220152716A1 (en) * 2020-11-19 2022-05-19 Ting-Jui Wang Soldering component and method of assembling soldering component to object

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