JP2012015333A - Electronic component and electronic device - Google Patents

Electronic component and electronic device Download PDF

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JP2012015333A
JP2012015333A JP2010150477A JP2010150477A JP2012015333A JP 2012015333 A JP2012015333 A JP 2012015333A JP 2010150477 A JP2010150477 A JP 2010150477A JP 2010150477 A JP2010150477 A JP 2010150477A JP 2012015333 A JP2012015333 A JP 2012015333A
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terminal electrodes
electronic component
substrate
pair
protective layer
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JP5445357B2 (en
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Eriko Ajioka
恵理子 味岡
Kyong-Gu Choe
京九 崔
Tatsuo Namikawa
達男 浪川
Takashi Otsuka
隆史 大塚
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TDK Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic component and an electronic device capable of sufficiently enhancing the mounting reliability of the electronic component by reducing a load when the electronic component is mounted on an external substrate.SOLUTION: A capacitor 1 comprises: circuit elements 3, 4, 5a, 5b, and 7 formed on a substrate 2; at least a pair of terminal electrodes 9a and 9b connected to the circuit elements 3, 4, 5a, 5b, and 7 and arranged to face each other on at least one surface; and supports 10a and 10b which are formed to be more protruded from at least a pair of terminal electrodes 9a and 9b and provided in an area that does not overlap with the circuit elements in a plan view. With this structure, even if an external load is applied to the capacitor 1, the load is distributed and reduced because the load is received by the supports 10a and 10b. Therefore it is possible to protect the circuit elements 3, 4, 5a, 5b, and 7 formed just below the terminal electrodes 9a and 9b from the application of the load and suppress damages on the circuit elements.

Description

本発明は、電子部品、及び、その電子部品が搭載された電子部品パッケージ、電子部品モジュール、電子デバイス等（以下、まとめて「電子デバイス」という。「発明の名称」、「特許請求の範囲」においても同様とする。）に関する。   The present invention relates to an electronic component, and an electronic component package, an electronic component module, an electronic device and the like in which the electronic component is mounted (hereinafter collectively referred to as “electronic device”. “Title of Invention”, “Claims”) The same shall apply to the above).

近年、電子機器の小型化に伴い、その電子機器に用いられるＩＣチップ（ベアチップ：ダイ（Die））等の半導体装置といった能動部品や、コンデンサ（キャパシタ）、インダクタ、サーミスタ、抵抗等の受動部品等の電子部品が、従来に比して更に高密度で実装された電子デバイスのモジュール化が進んでいる。   In recent years, with the miniaturization of electronic devices, active components such as semiconductor devices such as IC chips (bare chips: die) used in the electronic devices, passive components such as capacitors (capacitors), inductors, thermistors, resistors, etc. The electronic devices in which electronic components are mounted at a higher density than in the past are being modularized.

このような電子部品における端子電極の構造として、例えば特許文献１に記載されたコンデンサ部品のように、外部基板に接続する側に、多層のめっき処理によって形成された電極端子２０，２１が形成されるＳＭＤ（表面実装部品：Surface Mount Device）構造や、特許文献２に記載された薄膜キャパシタのように、基板上に設けられた平面状の電極が格子状に並設されて電極パッド１７が形成されるいわゆるＬＧＡ（Land Grid Array）構造が知られている。   As a structure of the terminal electrode in such an electronic component, electrode terminals 20 and 21 formed by multilayer plating are formed on the side to be connected to the external substrate as in the capacitor component described in Patent Document 1, for example. The SMD (Surface Mount Device) structure and the thin electrode capacitor described in Patent Document 2 form planar electrodes arranged on the substrate side by side in a grid pattern to form the electrode pad 17. A so-called LGA (Land Grid Array) structure is known.

特開平５−０４７５８６号公報JP-A-5-047586 特開２００４−２１４５８９号公報JP 2004-214589 A

例えば、上述した従来のＬＧＡ構造を有する電子部品を外部基板にハンダ実装する場合には、通常、まず、表面実装機（マウンタ）のノズルに電子部品を吸着させ、外部基板に塗布されたハンダ上に電子部品を搭載した際、ノズルから電子部品の厚さ方向（ノズルの延軸方向）に荷重（電子部品に作用する外部からの外力）を印加することにより、電子部品と端子が外部基板上のハンダと密着され、その後、リフローなどで、ハンダを溶解させ、外部基板と接合する。   For example, when the electronic component having the above-described conventional LGA structure is solder-mounted on an external substrate, usually, the electronic component is first adsorbed by a nozzle of a surface mounter (mounter) and then applied to the solder applied to the external substrate. When an electronic component is mounted on the external component, a load (external external force acting on the electronic component) is applied from the nozzle in the thickness direction of the electronic component (the axial direction of the nozzle). After that, the solder is dissolved by reflow or the like and bonded to the external substrate.

このように、表面実装機を用いて電子部品を外部基板等に実装する場合には、基板搭載時に、電子部品の厚さ方向に荷重がかかるため、電子部品に過度な荷重が印加されてしまうと、かかる荷重が衝撃力となって、電子部品内に形成された回路素子が損傷するという不都合が生じ得る。かかる不都合は、薄膜コンデンサ等の薄膜電子部品において顕著となる傾向にある。また、かかる荷重は、電子部品の外部基板と電子部品が接触する部分に生じ、その力が電子部品の厚さ方向に伝わることにより、回路素子にクラック等の機械的な破壊が生じてしまい、電子部品の実装信頼性の低下を招くおそれもあった。それだけでなく、かかる実装信頼性の低下が、その電子部品が搭載された電子デバイスの電気的な特性（例えば、高周波帯域での特性）や機能の劣化を引き起こす要因にもなり得る。   As described above, when mounting an electronic component on an external substrate or the like using a surface mounter, an excessive load is applied to the electronic component because a load is applied in the thickness direction of the electronic component when the substrate is mounted. Then, such a load becomes an impact force, which may cause a disadvantage that a circuit element formed in the electronic component is damaged. Such inconvenience tends to be prominent in thin film electronic components such as thin film capacitors. In addition, such a load is generated in a portion where the external substrate of the electronic component and the electronic component are in contact, and the force is transmitted in the thickness direction of the electronic component, thereby causing a mechanical breakdown such as a crack in the circuit element, There is also a possibility that the mounting reliability of the electronic component is lowered. In addition, such a reduction in mounting reliability can be a factor that causes deterioration of electrical characteristics (for example, characteristics in a high frequency band) and functions of an electronic device on which the electronic component is mounted.

そこで、本発明は、かかる事情に鑑みてなされたものであり、外部基板への実装時における荷重を緩和させることにより、電子部品の実装信頼性を十分に高めることができる電子部品、及び、それを備える電子デバイスを提供することを目的とする。   Therefore, the present invention has been made in view of such circumstances, and an electronic component capable of sufficiently improving the mounting reliability of the electronic component by relaxing the load at the time of mounting on the external substrate, and the It is an object to provide an electronic device comprising:

上記課題を解決するために、本発明による電子部品は、基板上に形成された回路素子と、回路素子に接続され、且つ、少なくとも１面に対向配置された少なくとも１対の端子電極と、少なくとも１対の端子電極よりも突出して形成され（すなわち、少なくとも１対の端子電極の端面よりも突設されており）、且つ、前記少なくとも１面における平面視において回路素子と重ならない領域に設けられた支持体とを備える。なお、「回路素子」とは、電子部品内に形成された配線構造等を含む概念であり、例えば、コンデンサ、インダクタ、抵抗等の電子素子、及び、それらの電子素子の機能を発現するためのそれらの一部（例えば、コンデンサであれば、誘電体層や対向電極）を示す。また、「支持体」の形状は、特に制限されず、例えば、柱状、壁状、梁状等が挙げられる。   In order to solve the above-described problems, an electronic component according to the present invention includes a circuit element formed on a substrate, at least one pair of terminal electrodes connected to the circuit element and disposed to face at least one surface, and at least Protruding from the pair of terminal electrodes (that is, projecting from the end faces of at least one pair of terminal electrodes), and provided in a region that does not overlap with the circuit element in plan view on the at least one surface. And a support. The “circuit element” is a concept including a wiring structure formed in an electronic component, for example, an electronic element such as a capacitor, an inductor, and a resistor, and a function for expressing the function of the electronic element. Some of them (for example, in the case of a capacitor, a dielectric layer and a counter electrode) are shown. The shape of the “support” is not particularly limited, and examples thereof include a columnar shape, a wall shape, and a beam shape.

このように構成された電子部品においては、支持体が、少なくとも１対の端子電極よりも突出（換言すれば、少なくとも１対の端子電極に対して突出）するように設けられ、換言すれば、支持体が、対向して配置される少なくとも１対の端子電極の厚さよりも厚く（少なくとも１対の端子電極の高さよりも高く形成され、且つ、回路素子と重ならない領域に設けられるので、実装時において、表面実装機からの荷重は、端子電極よりも先に支持体で確実に受圧されるので、これにより、荷重が回路素子に印加されるのを確実に回避させることができる。このことから、電子部品内に形成された回路素子が損傷してしまうという不都合を防止することができる。その結果、電子部品の実装信頼性が向上するだけでなく、その電子部品が搭載された電子デバイスの電気的な特性（例えば、高周波帯域での特性）や機能の劣化をも回避することができる。なお、「電子デバイス」とは、基板（外部基板）に能動部品及び／又は受動部品が搭載されたもの、また、それらが適宜の形態でパッケージ化されたものを含むものであり、電子部品パッケージや電子部品モジュールを包含する概念を示す。   In the electronic component configured as described above, the support body is provided so as to protrude from at least one pair of terminal electrodes (in other words, protrude from at least one pair of terminal electrodes), in other words, Since the support is thicker than the thickness of at least one pair of terminal electrodes arranged opposite to each other (is formed higher than the height of at least one pair of terminal electrodes and does not overlap with the circuit element, mounting In some cases, the load from the surface mounter is reliably received by the support prior to the terminal electrode, so that the load can be reliably avoided from being applied to the circuit element. Therefore, it is possible to prevent the inconvenience that the circuit element formed in the electronic component is damaged.As a result, not only the mounting reliability of the electronic component is improved but also the electronic component is mounted. It is also possible to avoid deterioration of electrical characteristics (for example, characteristics in a high frequency band) and functions of an electronic device. "Electronic device" refers to an active component and / or passive component on a substrate (external substrate). Including those in which they are packaged in an appropriate form, including a concept including an electronic component package and an electronic component module.

また、回路素子を覆う保護層を有し、少なくとも１対の端子電極は、保護層を貫通して回路素子に接続され、且つ、保護層上に設けられており、支持体の少なくとも一部は、基板上から、保護層の側壁の少なくとも一部に沿って、又は、保護層の側壁の少なくとも一部に接して形成されていてもよい。これにより、支持体は、回路素子の形成された領域（エリア）外において、電子部品の厚さ方向に沿って基板上から端子電極上方の端子電極よりも突出した位置まで立設されるので、電子部品に印加される荷重は、電子部品の厚さ方向に沿って回路素子の形成されていない領域へ伝達され、これによって電子部品に印加される荷重が、回路素子に影響を及ぼすことなく、緩和・分散され得る。   In addition, a protective layer covering the circuit element is provided, and at least one pair of terminal electrodes is connected to the circuit element through the protective layer, and is provided on the protective layer, and at least a part of the support is Further, it may be formed along at least a part of the side wall of the protective layer or in contact with at least a part of the side wall of the protective layer from above the substrate. Thereby, the support body is erected out of the region (area) where the circuit element is formed, up to a position protruding from the terminal electrode above the terminal electrode from the substrate along the thickness direction of the electronic component. The load applied to the electronic component is transmitted along the thickness direction of the electronic component to a region where the circuit element is not formed, whereby the load applied to the electronic component does not affect the circuit element. Can be relaxed and dispersed.

この場合、保護層の側壁の少なくとも一部は、１対の端子電極から基板に向かって末細りとなる傾斜が形成されたテーパ形状を有していても好適である。これにより、保護層の側壁の少なくとも一部に沿って、又は、保護層の側壁の少なくとも一部に接して形成される支持体の側壁に、１対の端子電極から基板に向かって末広がりとなる傾斜が形成されたテーパが形成され、支持体の先端側（突端側）から底部側（基板側）に向かって水平断面積が大きくされるので、電子部品に印加される荷重が支持体の先端部（突端部）に印加されたとき、その荷重は、支持体の末広がりのテーパ形状に沿って分散され、より一層緩和され得る。   In this case, it is preferable that at least a part of the side wall of the protective layer has a tapered shape in which an inclination is formed so as to be tapered from the pair of terminal electrodes toward the substrate. Accordingly, the pair of terminal electrodes spread toward the substrate along at least part of the side wall of the protective layer or on the side wall of the support formed in contact with at least part of the side wall of the protective layer. A taper with an inclination is formed, and the horizontal cross-sectional area increases from the front end side (protrusion end side) to the bottom side (substrate side) of the support body, so that the load applied to the electronic component is When applied to the portion (protruding end), the load is distributed along the taper shape of the end of the support and can be further relaxed.

さらに、支持体の少なくとも一部は、基板の周端部又は周縁部の少なくとも一部から１対の端子電極の上方の端子電極よりも突出した位置まで立設される（つまり、平面視において前記基板の長手方向に沿って、且つ、断面視において基板の端部から１対の端子電極の上方よりも突設されている）と、支持体が１対の端子電極の形成エリアよりも外方に確実に形成される。これにより、かかる支持体によって、電子部品の外周部位に集中する荷重を吸収又は分散することができ、電子部品の外周部位に回路素子が形成されている場合であっても、その他、回路素子にクラック等の機械的な破壊が生じることを有効に防止することができる。   Furthermore, at least a part of the support is erected from at least a part of the peripheral edge or the peripheral part of the substrate to a position protruding from the terminal electrode above the pair of terminal electrodes (that is, in plan view) And the support body protrudes from the end of the substrate from above the pair of terminal electrodes in a cross-sectional view), and the support is outward from the formation area of the pair of terminal electrodes. Surely formed. Thus, the support can absorb or disperse the load concentrated on the outer peripheral part of the electronic component, and even if the circuit element is formed on the outer peripheral part of the electronic component, It is possible to effectively prevent mechanical destruction such as cracks from occurring.

また、支持体の少なくとも一部が、基板の周端部又は周縁部の少なくとも一部の上面に沿って形成されていると、支持体は、基板の周端部又は周縁部の少なくとも一部の到達するように形成されるので、支持体と基板が当接する面積が増大し、これに伴い、荷重が分散する面積も増大する。このことから、電子部品の回路素子にクラック等の機械的な破壊が生じることを一層防止することができる。さらに、支持体は、基板の周端部又は周縁部の少なくとも一部付近又はそこまで延在するので、リフロー時に溶融したハンダが、１対の端子電極の周囲のみならず、支持体の周囲にもしっかりと付着するので、電子部品とハンダの接合面積が増大され、これにより、ハンダ実装時において、電子部品が傾かない状態で、しかも、その固着強度を向上させることができる。   In addition, when at least a part of the support is formed along the upper surface of at least a part of the peripheral edge or the peripheral part of the substrate, the support is a part of the peripheral end or the peripheral part of the substrate. Since it forms so that it may reach | attain, the area which a support body and a board | substrate contact | abut increases, and the area where a load disperses also increases in connection with this. From this, it is possible to further prevent mechanical destruction such as cracks from occurring in the circuit element of the electronic component. Furthermore, since the support body extends to the vicinity of or at least a part of the peripheral edge or the peripheral edge of the substrate, the solder melted during reflow is not only around the pair of terminal electrodes but also around the support body. As a result, the bonding area between the electronic component and the solder is increased, so that when the solder is mounted, the electronic component is not inclined and the fixing strength can be improved.

さらに、支持体は、１対の端子電極のそれぞれと一体に、又は、１対の端子電極のそれぞれと別体に且つ隣接して形成されており、支持体及び／又は少なくとも１対の端子電極は、平面視において切り欠き部を有しても好適である。この場合、支持体及び／又は少なくとも１対の端子電極の切り欠き部の形状や大きさは、特に制限されず、例えば、後述するように、支持体及び／又は少なくとも１対の端子電極が平面視においてＨ形状を有するものも含まれる。この構成によれば、電子部品の短手方向のハンダ接合部に対して、長手方向のハンダ接合部の接合面積が多くなり、結果、短手方向に向かって引っ張ろうとするハンダの引張り外力（コンデンサ１を引き伸ばすように働く力）が生じ、引張り外力が短手方向で釣り合うことで、電子部品の外部基板に対する良好な固着バランスを格段に向上させることが可能となる。   Further, the support is formed integrally with each of the pair of terminal electrodes or separately from and adjacent to each of the pair of terminal electrodes, and the support and / or at least one pair of terminal electrodes It is also preferable to have a notch in plan view. In this case, the shape and size of the notches of the support and / or at least one pair of terminal electrodes are not particularly limited. For example, as described later, the support and / or at least one pair of terminal electrodes are planar. Those having an H shape in view are also included. According to this configuration, the bonding area of the solder joint portion in the longitudinal direction increases with respect to the solder joint portion in the short direction of the electronic component. As a result, the tensile external force of the solder that tries to pull in the short direction (capacitor) The force that works to stretch 1) is generated, and the tensile external force is balanced in the short direction, so that it is possible to remarkably improve the good fixing balance of the electronic component to the external substrate.

また、本発明による電子デバイスは、本発明の電子部品を備えるものであり、配線導体が形成された外部基板と、外部基板上に実装され、且つ、回路素子に接続され、且つ、少なくとも１面に対向配置され、且つ、配線導体に接続された少なくとも１対の端子電極、及び、少なくとも１対の端子電極よりも突出して形成され、且つ、上記少なくとも１面における平面視において回路素子と重ならない領域に設けられた支持体を有する電子部品とを備えるものである。   An electronic device according to the present invention comprises the electronic component of the present invention, and is mounted on the external substrate on which the wiring conductor is formed, connected to the circuit element, and at least one surface. And at least one pair of terminal electrodes connected to the wiring conductor and projecting more than the at least one pair of terminal electrodes, and does not overlap with the circuit element in plan view on the at least one surface. And an electronic component having a support provided in the region.

本発明の電子部品、及びそれを備える電子デバイスによれば、支持体が、対向して配置される少なくとも１対の端子電極よりも突出しており、換言すれば、支持体が、対向して配置される少なくとも１対の端子電極よりも厚く形成されるので、その支持体が、外部から印加される荷重を受圧、分散、緩和することにより、実装時に生じ得る電子部品の機械的な破壊を防止することができる。よって、電子部品の実装における歩留まりを改善して生産性をも高めることが可能となる。また、このように、電子部品の機械的な強度を高めることができるので、その電子部品が搭載された電子デバイスの電気的な特性や機能を十分に高めることができる。さらに、ハンダ実装時に生じ得る電子部品の傾きをも防止でき、その結果、電子部品の更なる高密度実装化が可能となるとともに、電子部品の固着強度を向上させて接続信頼性を高めることができる。   According to the electronic component of the present invention and the electronic device including the electronic component, the support protrudes from at least one pair of terminal electrodes that are arranged to face each other, in other words, the support is arranged to face each other. It is formed thicker than at least one pair of terminal electrodes, so that the support body receives, disperses and relaxes externally applied loads, thereby preventing mechanical destruction of electronic components that may occur during mounting. can do. Therefore, it is possible to improve the yield in mounting electronic components and increase productivity. In addition, since the mechanical strength of the electronic component can be increased as described above, the electrical characteristics and functions of the electronic device on which the electronic component is mounted can be sufficiently enhanced. Furthermore, it is possible to prevent tilting of electronic components that may occur during solder mounting. As a result, it is possible to achieve higher density mounting of electronic components and to improve the connection reliability by improving the bonding strength of electronic components. it can.

本発明による電子部品の第１実施形態の概略構造を示す斜視図である。1 is a perspective view showing a schematic structure of a first embodiment of an electronic component according to the present invention. 図１に示すコンデンサ１の平面図である。It is a top view of the capacitor | condenser 1 shown in FIG. 図２のＩＩＩ−ＩＩＩ線に沿う断面図である。It is sectional drawing which follows the III-III line of FIG. 図２のＩＶ−ＩＶ線に沿う断面図である。It is sectional drawing which follows the IV-IV line of FIG. コンデンサ１の変形例１を示す模式平面図である。6 is a schematic plan view showing a first modification of the capacitor 1. FIG. コンデンサ１の変形例２を示す模式平面図である。6 is a schematic plan view showing a second modification of the capacitor 1. FIG. コンデンサ１の変形例３を示す模式平面図である。6 is a schematic plan view showing a third modification of the capacitor 1. FIG. 本発明による電子部品の第２実施形態の概略構造を示す平面図である。It is a top view which shows schematic structure of 2nd Embodiment of the electronic component by this invention. 図８のＩＸ−ＩＸ線に沿う断面図である。It is sectional drawing which follows the IX-IX line of FIG. 本発明による電子部品の第３実施形態の概略構造を示す平面図である。It is a top view which shows schematic structure of 3rd Embodiment of the electronic component by this invention. 図１０のＸＩ−ＸＩ線に沿う断面図である。It is sectional drawing which follows the XI-XI line of FIG. コンデンサ２００の変形例４を示す模式平面図である。FIG. 9 is a schematic plan view showing a fourth modification of the capacitor 200. コンデンサ２００の変形例５を示す模式平面図である。FIG. 10 is a schematic plan view showing Modification Example 5 of capacitor 200. コンデンサ２００の変形例６を示す模式平面図である。10 is a schematic plan view showing Modification 6 of capacitor 200. FIG.

以下、本発明の実施の形態について、図面を参照して説明する。なお、図面中、同一の要素には同一の符号を付し、重複する説明を省略する。また、上下左右等の位置関係は、特に断らない限り、図面に示す位置関係に基づくものとする。さらに、図面の寸法比率は、図示の比率に限定されるものではない。また、以下の実施の形態は、本発明を説明するための例示であり、本発明をその実施の形態のみに限定する趣旨ではない。さらに、本発明は、その要旨を逸脱しない限り、さまざまな変形が可能である。   Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios in the drawings are not limited to the illustrated ratios. Further, the following embodiments are exemplifications for explaining the present invention, and are not intended to limit the present invention only to the embodiments. Furthermore, the present invention can be variously modified without departing from the gist thereof.

（第１実施形態）
図１は、本発明による電子部品の好適な第１実施形態の概略構造を示す斜視図であり、図２は、図１に示すコンデンサ１の平面図である。また、図３は、図２のＩＩＩ−ＩＩＩ線に沿う断面図であり、図４は、図２のＩＶ−ＩＶ線に沿う断面図である。 (First embodiment)
FIG. 1 is a perspective view showing a schematic structure of a first preferred embodiment of the electronic component according to the present invention, and FIG. 2 is a plan view of the capacitor 1 shown in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

コンデンサ１（電子部品）は、コンデンサ１間の所定の部位で基板２（これは電子部品が形成される基板であり、電子部品が実装される「外部基板」とは異なる。）を切断（ダイシング）することによって個片化されたものである。また、コンデンサ１は、平面矩形状をなす基板２上に、下部電極３（回路素子）、誘電体層４（回路素子）、第１電極５ａ（回路素子）、第１電極５ｂ（回路素子）、第１保護層６（保護層）、第２電極７（回路素子）、第２保護層８（保護層）、端子電極９ａ，９ｂ及び支持体１０ａ，１０ｂが、この順に積層されたものである。なお、端子電極９ａ，９ｂと支持体１０ａ，１０ｂとの積層順序は、特に制限されず、例えば支持体１０ａ，１０ｂは端子電極９ａ，９ｂと同時に形成されていてもよいし、支持体１０ａ，１０ｂが端子電極９ａ，９ｂより先に形成されていてもよい。   Capacitor 1 (electronic component) cuts (dicing) substrate 2 (this is a substrate on which electronic components are formed and is different from an “external substrate” on which electronic components are mounted) at a predetermined portion between capacitors 1. ). In addition, the capacitor 1 has a lower electrode 3 (circuit element), a dielectric layer 4 (circuit element), a first electrode 5a (circuit element), and a first electrode 5b (circuit element) on a substrate 2 having a planar rectangular shape. The first protective layer 6 (protective layer), the second electrode 7 (circuit element), the second protective layer 8 (protective layer), the terminal electrodes 9a and 9b, and the supports 10a and 10b are laminated in this order. is there. The order in which the terminal electrodes 9a and 9b and the supports 10a and 10b are stacked is not particularly limited. For example, the supports 10a and 10b may be formed simultaneously with the terminal electrodes 9a and 9b. 10b may be formed before the terminal electrodes 9a and 9b.

基板２の材料としては、特に制限されず、金属基板、アルミナ等のセラミックス基板、ガラスセラミックス基板、ガラス基板、サファイア、ＭｇＯ、ＳｒＴｉＯ等の単結晶基板、ＳｉやＳｉＧｅ等の半導体基板等が挙げられ、化学的且つ熱的に安定であり、かつ、応力発生が少なく表面の平滑性を保持し易いものを用いることが好ましい。なお、基板２は必要に応じて適宜の厚さとすることができる。   The material of the substrate 2 is not particularly limited, and examples thereof include metal substrates, ceramic substrates such as alumina, glass ceramic substrates, glass substrates, single crystal substrates such as sapphire, MgO, and SrTiO, and semiconductor substrates such as Si and SiGe. It is preferable to use a material that is chemically and thermally stable and that generates less stress and easily maintains the smoothness of the surface. In addition, the board | substrate 2 can be made into appropriate thickness as needed.

下部電極３は、基板２の外周よりも内側の領域上に設けられており、例えば、Ｎｉ、Ｔｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属から形成されている。   The lower electrode 3 is provided on a region inside the outer periphery of the substrate 2. For example, Ni, Ti, Cu, Au, Pt, Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru , Nb, or a complex metal such as an alloy containing these metals.

誘電体層４は、下部電極３の上面，及び側壁面、さらに下部電極３の外方に位置する基板２上面の一部を覆うように形成された薄膜からなる。なお誘電体層４の端部は、基板２上面の端部まで形成されていても、端部に達しなくてもよい。また誘電体層４の膜の材料は特に制限されず、例えば、ＰｂＴｉＯ3、Ｐｂ（Ｚｒ，Ｔｉ）Ｏ3（ＰＺＴ）、ＰｂＮｂ2Ｏ3、Ｐｂ（Ｍｇ，Ｎｂ）Ｏ3（ＰＭＮ）、ＢａＴｉＯ3、(Ｂａ，Ｓｒ)ＴｉＯ3（ＢＳＴ）、ＣａＴｉＯ3、ＺｒＯ2、ＨｆＯ2、ＴｉＯ2、Ｔａ2Ｏ6、Ｂｉ4Ｔｉ4Ｏ12、ＳｒＢｉ2Ｔａ2Ｏ9、Ａｌ2Ｏ3、Ｓｉ3Ｎ4、ＳｉＯ2等の高誘電体セラミック材料を用いることができる。 The dielectric layer 4 is made of a thin film formed so as to cover the upper surface and the side wall surface of the lower electrode 3 and a part of the upper surface of the substrate 2 located outside the lower electrode 3. Note that the end portion of the dielectric layer 4 may be formed up to the end portion of the upper surface of the substrate 2 or may not reach the end portion. The material of the film of the dielectric layer 4 is not particularly limited. For example, PbTiO 3 , Pb (Zr, Ti) O 3 (PZT), PbNb 2 O 3 , Pb (Mg, Nb) O 3 (PMN), BaTiO 3 , (Ba, Sr) TiO 3 (BST), CaTiO 3 , ZrO 2 , HfO 2 , TiO 2 , Ta 2 O 6 , Bi 4 Ti 4 O 12 , SrBi 2 Ta 2 O 9 , Al 2 O 3 , Si High dielectric ceramic materials such as 3 N 4 and SiO 2 can be used.

第１電極５ａは、その端部が誘電体層４を介して下部電極３の上面を覆うように形成された薄膜である。また、第１電極５ａの中央部は、下部電極３と当接されているので、下部電極３と第１電極５ａの中央部との間で電流が流れる構造となる。また、第１電極５ａは、下部電極３同様、例えば、Ｎｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属から形成されている。   The first electrode 5 a is a thin film formed so that the end thereof covers the upper surface of the lower electrode 3 through the dielectric layer 4. Moreover, since the center part of the 1st electrode 5a is contact | abutted with the lower electrode 3, it becomes a structure where an electric current flows between the lower electrode 3 and the center part of the 1st electrode 5a. The first electrode 5a is similar to the lower electrode 3, for example, a single metal such as Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru, Nb, or these It is formed from composite metals, such as an alloy containing.

第１電極５ｂは、誘電体層４の上面を覆うように形成された薄膜であり、誘電体層４の形成領域より内方に形成されている。これにより、誘電体層４と下部電極３と第１電極５ｂとからコンデンサが形成される。第１電極５ｂは、下部電極３、及び第１電極５ａ同様、例えば、Ｎｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属から形成されている。   The first electrode 5 b is a thin film formed so as to cover the upper surface of the dielectric layer 4, and is formed inward from the formation region of the dielectric layer 4. Thus, a capacitor is formed from the dielectric layer 4, the lower electrode 3, and the first electrode 5b. The first electrode 5b is a single metal such as Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru, Nb, etc., like the lower electrode 3 and the first electrode 5a. Or a composite metal such as an alloy containing them.

また、第１電極５ａ，５ｂ上に形成された第１保護層６は、第１電極５ａ，５ｂの角部のみならず、誘電体層４の上面角部及び側壁面を覆うように形成されており、その材質は特に制限されず、例えば、Ａｌ2Ｏ3、ＳｉＯ2、ＳｉＮ等の無機絶縁体、ポリイミド、エポキシ等の樹脂等の有機絶縁体を列挙することができる。 Further, the first protective layer 6 formed on the first electrodes 5a and 5b is formed so as to cover not only the corners of the first electrodes 5a and 5b but also the upper surface corners and side wall surfaces of the dielectric layer 4. The material is not particularly limited, and examples thereof include inorganic insulators such as Al 2 O 3 , SiO 2 , and SiN, and organic insulators such as resins such as polyimide and epoxy.

さらに第２電極７は、第１保護層６上に形成され、かつ、第１電極５ａ，５ｂを覆うように形成されており、第１電極５ａ，５ｂ上に形成されたビアＶａ，Ｖａを介して電気的に接続されている。第２電極７は、下部電極３及び第１電極５ａ，５ｂと同様、例えば、Ｎｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属から形成されている。   Further, the second electrode 7 is formed on the first protective layer 6 and is formed so as to cover the first electrodes 5a and 5b, and the vias Va and Va formed on the first electrodes 5a and 5b are formed. Is electrically connected. The second electrode 7 is similar to the lower electrode 3 and the first electrodes 5a and 5b, such as Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru, Nb, etc. It is formed from a single metal or a composite metal such as an alloy containing these metals.

そして、この第２電極７の上層として形成された第２保護層８は、第２電極７の角部を覆うように形成されており、その材質は、第１保護層６と同様、特に制限されず、例えば、Ａｌ2Ｏ3、ＳｉＯ2、ＳｉＮ等の無機物、ポリイミド、エポキシ等の樹脂等の絶縁体を列挙することができる。なお、本実施形態における第２保護層８は、第１保護層６の外周より内側に形成されているが、その大きさは特に制限されず、例えば、第１保護層６の外周と同じ外周となるように形成されていてもよい。 The second protective layer 8 formed as an upper layer of the second electrode 7 is formed so as to cover the corners of the second electrode 7, and the material thereof is particularly limited like the first protective layer 6. For example, insulators such as inorganic substances such as Al 2 O 3 , SiO 2 , SiN, and resins such as polyimide and epoxy can be listed. In addition, although the 2nd protective layer 8 in this embodiment is formed inside the outer periphery of the 1st protective layer 6, the magnitude | size is not restrict | limited in particular, For example, the same outer periphery as the outer periphery of the 1st protective layer 6 It may be formed so that.

その上層として形成されている端子電極９ａ，９ｂは、コンデンサ１（又は基板２）の長手方向Ｌ（図１参照：同図において幅方向を短手方向Ｗと記す。）に沿って対向配置するように、基板２の短辺側の両端部に設けられており、第２保護層８を貫通して形成された開口内に充填されたビア導体Ｖｂと、第１保護層６を貫通して形成された開口内に充填されたビア導体Ｖａ、及び第１電極５ａ，５ｂを介して下部電極３に接続されている。これらのビア導体Ｖａ，Ｖｂ、及び、端子電極９ａ，９ｂの材料も特に制限されず、下部電極３、第１電極５ａ，５ｂ、及び第２電極７と同様に、Ｎｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属が挙げられる。   The terminal electrodes 9a and 9b formed as upper layers thereof are arranged to face each other along the longitudinal direction L of the capacitor 1 (or the substrate 2) (see FIG. 1: the width direction is indicated as the short direction W in FIG. 1). As described above, the via conductor Vb is provided at both ends of the short side of the substrate 2 and filled in the opening formed through the second protective layer 8, and the first protective layer 6 is penetrated. It is connected to the lower electrode 3 via the via conductor Va filled in the formed opening and the first electrodes 5a and 5b. The materials of these via conductors Va and Vb and terminal electrodes 9a and 9b are not particularly limited, and are similar to those of the lower electrode 3, the first electrodes 5a and 5b, and the second electrode 7, Ni, Cu, Au, and Pt. , Ag, Sn, Cr, Co, W, Pd, Mo, Ta, Ru, Nb and other simple metals, or composite metals such as alloys containing these.

また、支持体１０ａ，１０ｂは、例えば、図示の如く、コンデンサ１（又は基板２）の長手方向Ｌに沿って、端子電極９ａ，９ｂの両端部に形成されている。また、本実施形態における支持体１０ａ，１０ｂは、端子電極９ａ，９ｂと一体に形成され、且つ、断面視において、第２保護層８の上面端部、側壁面、第１保護層６の上面端部、及び側壁面を覆い、基板２の上面端部まで延在されている。なお、誘電体層４が、基板２の上面端部を覆うように形成されている場合には、支持体１０ａ，１０ｂは、誘電体層４の上面端部まで延在していること（延設されていること）が好ましい。   The supports 10a and 10b are formed at both ends of the terminal electrodes 9a and 9b, for example, along the longitudinal direction L of the capacitor 1 (or the substrate 2) as shown in the drawing. Further, the support bodies 10a and 10b in the present embodiment are formed integrally with the terminal electrodes 9a and 9b, and in the cross-sectional view, the upper surface end portion, the side wall surface, and the upper surface of the first protective layer 6 in the second protective layer 8. The end portion and the side wall surface are covered and extended to the upper end portion of the substrate 2. When the dielectric layer 4 is formed so as to cover the upper end portion of the substrate 2, the supports 10 a and 10 b extend to the upper end portion of the dielectric layer 4 (extension) Is preferred).

また、支持体１０ａ，１０ｂの上面（外部基板側の面）は、端子電極９ａ，９ｂの上面（端面：外部基板に接続される側の面）に比して高くなるように形成されている。換言すれば、基板２の上面（回路素子３，４，５ａ，５ｂ，７側の面）から支持体１０ａ，１０ｂの上面までの厚さΔＴ１は、基板２の上面から端子電極９ａ，９ｂの上面までの厚さΔＴ２に比して、厚くなるように形成されている。   Further, the upper surfaces (surfaces on the external substrate side) of the supports 10a and 10b are formed to be higher than the upper surfaces (end surfaces: surfaces connected to the external substrate) of the terminal electrodes 9a and 9b. . In other words, the thickness ΔT1 from the upper surface of the substrate 2 (the surface on the circuit elements 3, 4, 5a, 5b, 7 side) to the upper surfaces of the supports 10a, 10b is from the upper surface of the substrate 2 to the terminal electrodes 9a, 9b. It is formed to be thicker than the thickness ΔT2 up to the upper surface.

支持体１０ａ，１０ｂの材質は、特に制限されないが、回路素子３，４，５ａ，５ｂ，７への衝撃力の伝搬を防止する観点、及び支持体１０ａ，１０ｂの形成を容易にする観点から、下部電極３、第１電極５ａ，５ｂ、第２電極７、及び端子電極９ａ，９ｂと同様に、Ｎｉ、Ｃｕ、Ａｕ、Ｐｔ、Ａｇ、Ｓｎ、Ｃｒ、Ｃｏ、Ｗ、Ｐｄ、Ｍｏ、Ｔａ、Ｒｕ、Ｎｂ等の単体金属、又は、これらを含む合金等の複合金属が挙げられる。   The material of the supports 10a, 10b is not particularly limited, but from the viewpoint of preventing the propagation of impact force to the circuit elements 3, 4, 5a, 5b, 7 and from the viewpoint of facilitating the formation of the supports 10a, 10b. As well as the lower electrode 3, the first electrodes 5a and 5b, the second electrode 7, and the terminal electrodes 9a and 9b, Ni, Cu, Au, Pt, Ag, Sn, Cr, Co, W, Pd, Mo, Ta , Ru, Nb, or other simple metals, or composite metals such as alloys containing these.

以上のとおり構成された第１実施形態のコンデンサ１によれば、支持体１０ａ，１０ｂが、図示において、端子電極９ａ，９ｂよりも高い位置まで延設されており、片や、基板２の上面にまで延在するように形成されている。これにより、外部からの荷重は、支持体１０ａ，１０ｂの上面から基板２側の上面端部まで、厚さ方向に伝搬し、換言すれば、コンデンサ１の外周部位に形成された支持体１０ａ，１０ｂに荷重が集中することになるので、荷重による衝撃力を基板２の端部から外方に逃がすことができる。したがって、コンデンサ１を外部基板へ実装する際に、コンデンサ１にかかる荷重を、支持体が柱のように支える働きをすることで、特に、コンデンサ１の内部の回路素子の各構成部位３，４，５ａ，５ｂ，７へ伝搬してしまうことを有効に防止することができ、殊に、薄膜部品であるコンデンサ１の機能層であり、且つ、衝撃や外部応力の印加に対する耐性が低い誘電体層４の損傷や機械的な破壊を防止することができ、その結果、コンデンサ１の実装信頼性を十分に高めることができる。   According to the capacitor 1 of the first embodiment configured as described above, the supports 10a and 10b are extended to a position higher than the terminal electrodes 9a and 9b in the drawing, It is formed so as to extend to. Thereby, the load from the outside propagates in the thickness direction from the upper surface of the supports 10a, 10b to the upper surface end on the substrate 2 side, in other words, the support 10a, Since the load concentrates on 10b, the impact force due to the load can be released outward from the end of the substrate 2. Therefore, when the capacitor 1 is mounted on the external substrate, the supporting body supports the load like the pillar like a pillar, and in particular, each component part 3, 4 of the circuit element inside the capacitor 1. , 5a, 5b, 7 can be effectively prevented, and in particular, it is a functional layer of the capacitor 1 which is a thin film component, and has a low resistance to impact and application of external stress. Damage to the layer 4 and mechanical destruction can be prevented, and as a result, the mounting reliability of the capacitor 1 can be sufficiently increased.

さらに、支持体１０ａ，１０ｂが第２保護層８及び第１保護層６の側壁面を超えて更に基板２側の端部にまで設けられるので、コンデンサ１を外部基板に接合させるためのハンダと端子電極９ａ，９ｂとの接触面積が更に増大（端子電極９ａ，９ｂに接合するハンダフィレットの外壁端が外方に拡大）され、これにより、ハンダ実装時におけるコンデンサ１の固着強度をより一層向上させることができる。   Furthermore, since the supports 10a and 10b are provided to the end of the substrate 2 side beyond the side wall surfaces of the second protective layer 8 and the first protective layer 6, solder for bonding the capacitor 1 to the external substrate and The contact area with the terminal electrodes 9a and 9b is further increased (the outer wall end of the solder fillet joined to the terminal electrodes 9a and 9b is expanded outward), thereby further improving the fixing strength of the capacitor 1 during solder mounting. Can be made.

また、ハンダ実装時、特にハンダ溶融時に、支持体１０ａ，１０ｂの側面においてはんだフィレットが形成され、コンデンサ１の短手方向Ｗ（幅方向）に向かって引っ張ろうとするハンダの引張り外力（コンデンサ１を引き伸ばすように働く力）が生じ、引張り外力が短手方向Ｗで釣り合うことで、コンデンサ１が短手方向Ｗに傾くことが回避され、外部基板に対するコンデンサ１の平行度をハンダ実装前後において良好に維持することができる。その結果、コンデンサ１の更なる高密度実装化を実現することができる。   Further, when solder is mounted, particularly when the solder is melted, a solder fillet is formed on the side surfaces of the support bodies 10a and 10b, and the solder's tensile external force (capacitor 1 is applied to the capacitor 1 in the short direction W (width direction)). Force), and the tensile external force is balanced in the short direction W, so that the capacitor 1 is prevented from tilting in the short direction W, and the parallelism of the capacitor 1 with respect to the external substrate is improved before and after solder mounting. Can be maintained. As a result, further high-density mounting of the capacitor 1 can be realized.

（変形例１〜３）
図５〜図７は、第１実施形態の各変形例を示す平面図である。各変形例の端子電極９ｃ〜９ｈは、平面視において、第１実施形態における端子電極９ａ，９ｂの一部を切り欠いた形状を有する。 (Modifications 1 to 3)
5-7 is a top view which shows each modification of 1st Embodiment. The terminal electrodes 9c to 9h of each modification have a shape in which a part of the terminal electrodes 9a and 9b in the first embodiment is cut out in plan view.

より具体的には、変形例１（図５）においては、端子電極９ｃ，９ｄよりも突出する支持体１０ｃ，１０ｄが、端子電極９ｃ，９ｄの縁辺に一体に形成されており、端子電極９ｃ，９ｄは、コンデンサ１Ａの短手方向Ｗ（幅方向）における端子電極９ｃ，９ｄの縁辺から中央に向かって、且つ、端子電極９ｃ，９ｄの角部を残すように、切り欠きが設けられている。なお、支持体１０ｃ，１０ｄは、第１実施形態の保護柱１０ａ，１０ｂと実質的に同様の構造・形状を有している。   More specifically, in Modification 1 (FIG. 5), supports 10c and 10d projecting from the terminal electrodes 9c and 9d are integrally formed on the edges of the terminal electrodes 9c and 9d. 9d are notched so as to leave the corners of the terminal electrodes 9c, 9d from the edges of the terminal electrodes 9c, 9d toward the center in the short direction W (width direction) of the capacitor 1A. Yes. The supports 10c and 10d have substantially the same structure and shape as the protective pillars 10a and 10b of the first embodiment.

一方、変形例２（図６）においては、端子電極９ｅ，９ｆよりも突出する支持体１０ｅ，１０ｆが、端子電極９ｅ，９ｆの縁辺に一体に形成されており、端子電極９ｅ，９ｆは、コンデンサ１Ｂの長手方向Ｌにおける端子電極９ｅ，９ｆの縁辺から中央に向かって、かつ、端子電極９ｅ，９ｆの角部を残すように、切り欠きが設けられている。なお、支持体１０ｅ，１０ｆは、切り欠きが形成されている（支持体１０ｅ，１０ｆ単独で見ると分割されている）こと以外は、第１実施形態の保護柱１０ａ，１０ｂと実質的に同様に構成されている。   On the other hand, in Modification 2 (FIG. 6), supports 10e and 10f protruding from the terminal electrodes 9e and 9f are integrally formed on the edge of the terminal electrodes 9e and 9f, and the terminal electrodes 9e and 9f are Notches are provided so as to leave the corners of the terminal electrodes 9e and 9f from the edges of the terminal electrodes 9e and 9f in the longitudinal direction L of the capacitor 1B toward the center. The supports 10e and 10f are substantially the same as the protective pillars 10a and 10b of the first embodiment, except that the notches are formed (separated when viewed from the supports 10e and 10f alone). It is configured.

他方、変形例３（図７）においては、端子電極９ｇ，９ｈよりも突出する支持体１０ｇ，１０ｈが、端子電極９ｇ，９ｈの縁辺に一体に形成されている。端子電極９ｇ，９ｈは、変形例１の端子電極９ｃ，９ｄと変形例２の端子電極９ｅ，９ｆとを組み合わせた形状を有する。すなわち、コンデンサ１Ｃの長手方向Ｌ及び短手方向Ｗにおける端子電極９ｇ，９ｈのそれぞれの縁辺から中央に向かって、且つ、端子電極９ｇ，９ｈの角部を残すように、切り欠きが設けられている。なお、支持体１０ｇ，１０ｈは、変形例２の保護柱１０ｅ，ｆと実質的に同様に構成されたものである。   On the other hand, in the modification 3 (FIG. 7), the support bodies 10g and 10h which protrude rather than the terminal electrodes 9g and 9h are integrally formed in the edge of the terminal electrodes 9g and 9h. The terminal electrodes 9g and 9h have a shape in which the terminal electrodes 9c and 9d of Modification 1 and the terminal electrodes 9e and 9f of Modification 2 are combined. That is, the notches are provided so as to leave the corners of the terminal electrodes 9g and 9h from the respective edges of the terminal electrodes 9g and 9h in the longitudinal direction L and the short direction W of the capacitor 1C toward the center. Yes. The supports 10g and 10h are configured substantially in the same manner as the protective pillars 10e and f of Modification 2.

このように、上述した各変形例によれば、第１実施形態のコンデンサ１が奏する作用効果に加え、支持体１０ｃ〜１０ｈと一体に形成された端子電極９ｃ〜９ｈの一部に切り欠きを形成したことから、コンデンサ１Ａ〜１Ｃの長手方向Ｌ（基板２の長辺）側に発生するハンダの引張り外力と、コンデンサ１Ａ〜１Ｃの短手方向Ｗ（基板２の短辺）側に発生するハンダの引張り外力の差を更に小さくすることが可能となり、その結果として、ハンダ実装時におけるコンデンサ１Ａ〜１Ｃの固着バランスを実現することができ、これにより、コンデンサ１Ａ〜１Ｃの傾きを一層防止することができる。   Thus, according to each modification mentioned above, in addition to the effect which the capacitor | condenser 1 of 1st Embodiment has, notch is carried out to some terminal electrodes 9c-9h integrally formed with the support bodies 10c-10h. Since it is formed, it is generated on the solder pulling external force generated in the longitudinal direction L (long side of the substrate 2) side of the capacitors 1A to 1C and in the short direction W (short side of the substrate 2) side of the capacitors 1A to 1C. It becomes possible to further reduce the difference in the tensile external force of the solder, and as a result, it is possible to realize the fixing balance of the capacitors 1A to 1C during solder mounting, thereby further preventing the inclination of the capacitors 1A to 1C. be able to.

（第２実施形態）
図８は、本発明による電子部品の第２実施形態の概略構造を示す平面図である。また、図９は、図８のＩＸ−ＩＸ線に沿う断面図である。コンデンサ１００（電子部品）は、図示の如く、第１保護層６ａの側壁面及び第２保護層８ａの側壁面が、逆テーパを有するように形成されていること以外は、上述した第１実施形態のコンデンサ１と同様に構成されたものである。 (Second Embodiment)
FIG. 8 is a plan view showing a schematic structure of a second embodiment of the electronic component according to the present invention. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. As shown in the figure, the capacitor 100 (electronic component) is the same as that shown in the first embodiment except that the side wall surface of the first protective layer 6a and the side wall surface of the second protective layer 8a are formed to have a reverse taper. It is comprised similarly to the capacitor | condenser 1 of a form.

第１保護層６ａの側壁面６０、及び、第２保護層８ａの側壁面８０は、端子電極側の面（図示における上面）６１，８１から基板側の面６２，８２（図示における下面）に向かって徐々に末細り（先細り、裾細り）となるようなテーパを有している。   The side wall surface 60 of the first protective layer 6a and the side wall surface 80 of the second protective layer 8a are changed from the terminal electrode side surfaces (upper surface in the drawing) 61, 81 to the substrate side surfaces 62, 82 (lower surface in the drawing). The taper is gradually tapered toward the end (tapering, hemging).

また、支持体１０ｉ，１０ｊの上面（外部基板側の面）における短手方向Ｗ（幅方向）の厚さΔＴ３は、支持体１０ｉ，１０ｊの下面（基板２側の面）における短手方向Ｗの厚さΔＴ４より薄く（ΔＴ３＜ΔＴ４）形成されている。   Further, the thickness ΔT3 in the short direction W (width direction) on the upper surfaces (surfaces on the external substrate side) of the supports 10i and 10j is the short direction W on the bottom surfaces (surfaces on the substrate 2 side) of the supports 10i and 10j. The thickness is smaller than the thickness ΔT4 (ΔT3 <ΔT4).

かかる構成を有する第２実施形態のコンデンサ１００によれば、第１実施形態のコンデンサ１が奏する作用効果に加え、外部からの荷重を、第２保護層８ａ及び第１保護層６ａに形成された逆テーパに沿って分散させることができる。   According to the capacitor 100 of the second embodiment having such a configuration, an external load is formed on the second protective layer 8a and the first protective layer 6a in addition to the operational effects exhibited by the capacitor 1 of the first embodiment. It can be distributed along a reverse taper.

また、第２保護層８ａの側壁面８０が逆テーパの形状を有するので、第１保護層６ａの上面６１（端子電極９ａ，９ｂ側の面）は、第１実施形態における第１保護層６の上面に比して、支持体１０ｉ，１０ｊに当接する面積が増大する。さらに、第１保護層６ａの側壁面６０も逆テーパの形状を有するので、支持体１０ｉ，１０ｊの下面（基板２側の面）が、第１実施形態における支持体１０ａ，１０ｂの下面に比して、基板２（又は誘電体層４）に当接する面積が増大する。これにより、第１保護層６ａの上面６１及び基板２（又は誘電体層４）の上面は、より広い面積で外部からの荷重を受圧することができる。このように、第２保護層８ａ及び第１保護層６ａに形成された逆テーパにより、支持体１０ｉ，１０ｊの側壁には、末広がり（裾広がり）のテーパが形成されるので、支持体１０ｉ，１０ｊに印加された外部からの荷重が更に分散され易くなるだけでなく、該荷重を一層緩和させることが可能となる。   Further, since the side wall surface 80 of the second protective layer 8a has a reverse taper shape, the upper surface 61 (the surface on the terminal electrode 9a, 9b side) of the first protective layer 6a is the first protective layer 6 in the first embodiment. As compared with the upper surface, the area in contact with the supports 10i and 10j increases. Furthermore, since the side wall surface 60 of the first protective layer 6a also has a reverse taper shape, the lower surfaces of the supports 10i and 10j (the surface on the substrate 2 side) are compared to the lower surfaces of the supports 10a and 10b in the first embodiment. Thus, the area in contact with the substrate 2 (or the dielectric layer 4) increases. Thereby, the upper surface 61 of the first protective layer 6a and the upper surface of the substrate 2 (or the dielectric layer 4) can receive a load from the outside in a wider area. As described above, the inverse taper formed in the second protective layer 8a and the first protective layer 6a forms a taper that widens toward the end (in a hem) on the side walls of the supports 10i and 10j. Not only is the external load applied to 10j more easily dispersed, but the load can be further relaxed.

（第３実施形態）
図１０は、本発明による電子部品の第３実施形態の概略構造を示す平面図である。また、図１１は、図１０のＸＩ−ＸＩ線に沿う断面図である。コンデンサ２００（電子部品）は、図示の如く、１対の第１支持体１０ｋ，１０ｌ（支持体）が、各端子電極９ｋ，９ｌから離間して形成されていること以外は、上述した第１実施形態のコンデンサ１と同様に構成されたものである。 (Third embodiment)
FIG. 10 is a plan view showing a schematic structure of a third embodiment of the electronic component according to the present invention. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. As shown in the figure, the capacitor 200 (electronic component) includes a first pair of first supports 10k and 10l (supports) that are formed apart from the terminal electrodes 9k and 9l. This is configured in the same manner as the capacitor 1 of the embodiment.

また、１対の第１支持体１０ｋ，１０ｌが端子電極９ｋ，９ｌから離間して形成されるため、端子電極９ｋ，９ｌの形成面積は、第１実施形態の端子電極９ａ，９ｂの形成面積に比して小さくされている。さらに、１対の第１支持体１０ｋ，１０ｌは、各端子電極９ｋ，９ｌの外方に位置し、端子電極９ｋ，９ｌの短辺から離間して形成されている。   In addition, since the pair of first supports 10k and 10l are formed away from the terminal electrodes 9k and 9l, the formation area of the terminal electrodes 9k and 9l is the formation area of the terminal electrodes 9a and 9b of the first embodiment. It is smaller than Further, the pair of first supports 10k and 10l are located outside the terminal electrodes 9k and 9l and are formed apart from the short sides of the terminal electrodes 9k and 9l.

なお、本実施形態においては、第２支持体１１ｋ，１１ｌ（支持体）が更に形成されているが、必須の構成要素ではない。第２支持体１１ｋ，１１ｌは、端子電極９ｋ，９ｌの外方であって、端子電極９ｋ，９ｌの長辺から離間して形成され、且つ、端子電極９ｋ，９ｌよりも突出するように形成されている。第２支持体１１ｋ，１１ｌの厚さは、第１支持体１０ｋ，１０ｌの厚さと略同等である。   In addition, in this embodiment, although the 2nd support bodies 11k and 11l (support body) are further formed, it is not an essential component. The second supports 11k and 11l are formed outside the terminal electrodes 9k and 9l, separated from the long sides of the terminal electrodes 9k and 9l, and so as to protrude from the terminal electrodes 9k and 9l. Has been. The thicknesses of the second supports 11k and 11l are substantially equal to the thicknesses of the first supports 10k and 10l.

以上の如く構成された第３実施形態のコンデンサ２００によれば、第１実施形態のコンデンサ１が奏する作用効果に加え、第１支持体１０ｋ，１０ｌが端子電極９ｋ，９ｌから離間して形成されているので、外部からの荷重は、まず第１支持体１０ｋ，１０ｌで確実に吸収される。これにより、端子電極９ｋ，９ｌにかかる外部からの荷重がより一層十分に緩和されるので、端子電極９ｋ，９ｌの直下に形成されている例えば誘電体層４（回路素子の一部）をより確実に保護することができる。   According to the capacitor 200 of the third embodiment configured as described above, the first supports 10k and 10l are formed apart from the terminal electrodes 9k and 9l in addition to the operational effects exhibited by the capacitor 1 of the first embodiment. Therefore, the external load is first reliably absorbed by the first supports 10k and 10l. As a result, the external load applied to the terminal electrodes 9k and 9l is further alleviated. For example, the dielectric layer 4 (part of the circuit element) formed immediately below the terminal electrodes 9k and 9l It can be surely protected.

（変形例４〜６）
図１２〜図１４は、第３実施形態の各変形例を示す平面図である。各変形例の端子電極９ｍ〜９ｒは、第３実施形態における端子電極９ｋ，９ｌの一部を切り欠いた形状を有する。また、端子電極９ｍ〜９ｒの切り欠き形状に沿うように、第１支持体１０ｍ〜１０ｒ（支持体）及び／又は第２支持体１１ｍ〜１１ｒ（支持体）が離間して配置されている。 (Modifications 4 to 6)
12-14 is a top view which shows each modification of 3rd Embodiment. The terminal electrodes 9m to 9r of each modification have a shape in which a part of the terminal electrodes 9k and 9l in the third embodiment is cut out. Moreover, the 1st support bodies 10m-10r (support body) and / or the 2nd support bodies 11m-11r (support body) are arrange | positioned apart so that the notch shape of the terminal electrodes 9m-9r may be followed.

このような構成を有する各変形例によれば、第１実施形態のコンデンサ１が奏する作用効果に加え、端子電極９ｃ〜９ｈの一部に切り欠きを形成し、この切り欠き形状に沿うように、第１支持体１０ｋ，１０ｌ及び／又は第２支持体１１ｍ〜１１ｒが離間して配置されたことから、コンデンサ２００Ａ〜２００Ｃの長手方向Ｌ（基板２の長辺）側に発生するハンダの引張り外力と、コンデンサ２００Ａ〜２００Ｃの短手方向Ｗ（基板２の短辺）側に発生するハンダの引張り外力の差を更に小さくすることが可能となり、その結果として、ハンダ実装時におけるコンデンサ２００Ａ〜２００Ｃの固着バランスを実現することができ、これにより、コンデンサ２００Ａ〜２００Ｃの傾きを一層防止することができる。   According to each modified example having such a configuration, in addition to the operational effects exhibited by the capacitor 1 of the first embodiment, a notch is formed in a part of the terminal electrodes 9c to 9h, and this notch shape is followed. Since the first supports 10k and 10l and / or the second supports 11m to 11r are spaced apart from each other, the tensile force of the solder generated on the side of the capacitors 200A to 200C in the longitudinal direction L (long side of the substrate 2) It becomes possible to further reduce the difference between the external force and the tensile external force of the solder generated in the short direction W (short side of the substrate 2) of the capacitors 200A to 200C. As a result, the capacitors 200A to 200C at the time of solder mounting. Can be achieved, which can further prevent the capacitors 200A to 200C from tilting.

なお、上述したとおり、本発明は上記実施形態に限定されるものではなく、その要旨を変更しない限度において様々な変形が可能である。例えば、電子部品はコンデンサに限られず、インダクタ、サーミスタ、抵抗等の受動部品，ＩＣチップ等の能動部品を用いてもよい。また、支持体は、断面視において基板の端部が露出するように形成されていたり、又は、基板の端部上面に沿って形成されていてもよい。加えて、図示を省略するが、コンデンサを適宜の外部基板にハンダ接合等により実装（搭載）したものが、本発明による電子デバイスである。   In addition, as above-mentioned, this invention is not limited to the said embodiment, A various deformation | transformation is possible in the limit which does not change the summary. For example, electronic components are not limited to capacitors, and passive components such as inductors, thermistors and resistors, and active components such as IC chips may be used. The support may be formed such that the end of the substrate is exposed in a cross-sectional view, or may be formed along the upper surface of the end of the substrate. In addition, although not shown, the electronic device according to the present invention is a device in which a capacitor is mounted (mounted) on a suitable external substrate by soldering or the like.

以上説明したとおり、本発明の電子部品によれば、外部基板への接合時における荷重を緩和させ、電子部品の実装信頼性を十分に高めることができるので、電子部品を内蔵する機器、装置、システム、各種デバイス等、特に小型化及び高性能化が要求されるもの、並びにそれらの生産、製造等に広く且つ有効に利用することができる。   As described above, according to the electronic component of the present invention, the load at the time of joining to the external substrate can be relaxed, and the mounting reliability of the electronic component can be sufficiently increased. It can be widely and effectively used for systems, various devices, etc. that are particularly required to be small and have high performance, and their production and production.

１，１Ａ〜１Ｃ，１００，２００，２００Ａ〜２００Ｃ…コンデンサ（電子部品）、２…基板、３…下部電極（回路素子）、４…誘電体層（回路素子）、５ａ…第１電極（回路素子）、５ｂ…第１電極（回路素子）、６，６ａ…第１保護層（保護層）、７…第２電極（回路素子）、８，８ａ…第２保護層（保護層）、９ａ〜９ｒ…端子電極、１０ａ〜１０ｊ…支持体、１０ｋ〜１０ｒ…第１支持体（支持体）、１１ｋ〜１１ｒ…第２支持体（支持体）、Ｖａ，Ｖｂ…ビア導体。   DESCRIPTION OF SYMBOLS 1,1A-1C, 100,200,200A-200C ... Capacitor (electronic component), 2 ... Substrate, 3 ... Lower electrode (circuit element), 4 ... Dielectric layer (circuit element), 5a ... 1st electrode (circuit) Element), 5b ... 1st electrode (circuit element), 6, 6a ... 1st protective layer (protective layer), 7 ... 2nd electrode (circuit element), 8, 8a ... 2nd protective layer (protective layer), 9a ˜9r... Terminal electrode, 10a to 10j... Support, 10k to 10r... First support (support), 11k to 11r... Second support (support), Va, Vb.

Claims (8)

基板上に形成された回路素子と、
前記回路素子に接続され、且つ、少なくとも１面に対向配置された少なくとも１対の端子電極と、
前記少なくとも１対の端子電極よりも突出して形成され、且つ、前記少なくとも１面における平面視において前記回路素子と重ならない領域に設けられた支持体と、
を備える電子部品。 Circuit elements formed on the substrate;
At least one pair of terminal electrodes connected to the circuit element and disposed to face at least one surface;
A support body that is formed so as to protrude from the at least one pair of terminal electrodes and that is provided in a region that does not overlap the circuit element in a plan view of the at least one surface;
With electronic components. 前記回路素子を覆う保護層を有し、
前記少なくとも１対の端子電極は、前記保護層を貫通して前記回路素子に接続され、且つ、前記保護層上に設けられており、
前記支持体の少なくとも一部は、前記基板上から、前記保護層の側壁の少なくとも一部に沿って、又は、前記保護層の側壁の少なくとも一部に接して形成されている、
請求項１記載の電子部品。 A protective layer covering the circuit element;
The at least one pair of terminal electrodes is connected to the circuit element through the protective layer and provided on the protective layer;
At least a part of the support is formed on the substrate, along at least a part of the side wall of the protective layer, or in contact with at least a part of the side wall of the protective layer.
The electronic component according to claim 1. 前記保護層の側壁の少なくとも一部は、前記１対の端子電極から前記基板に向かって末細りとなる傾斜が形成されたテーパ形状を有する、
請求項２記載の電子部品。 At least a part of the side wall of the protective layer has a tapered shape in which an inclination that is tapered toward the substrate from the pair of terminal electrodes is formed.
The electronic component according to claim 2. 前記支持体の側壁の少なくとも一部は、前記１対の端子電極から前記基板に向かって末広がりとなる傾斜が形成されたテーパ形状を有する、
請求項２記載の電子部品。 At least a part of the side wall of the support body has a tapered shape in which an inclination is formed that spreads toward the substrate from the pair of terminal electrodes.
The electronic component according to claim 2. 前記支持体の少なくとも一部は、基板の周端部又は周縁部の少なくとも一部から１対の端子電極の上方の端子電極よりも突出した位置まで立設されている、
請求項１乃至４のいずれか１項記載の電子部品。 At least a part of the support is erected from a peripheral end or a peripheral part of the substrate to a position protruding from the terminal electrode above the pair of terminal electrodes,
The electronic component according to claim 1. 前記支持体の少なくとも一部は、前記基板の周端部又は周縁部の少なくとも一部の上面に沿って形成されている、
請求項１乃至５のいずれか１項記載の電子部品。 At least a part of the support is formed along an upper surface of at least a part of a peripheral edge or a peripheral part of the substrate.
The electronic component according to claim 1. 前記支持体は、前記１対の端子電極のそれぞれと一体に、又は、前記１対の端子電極のそれぞれに隣接して形成されており、前記支持体及び／又は前記少なくとも１対の端子電極は、平面視において切り欠き部を有する、
請求項１乃至６のいずれか１項記載の電子部品。 The support is formed integrally with each of the pair of terminal electrodes or adjacent to each of the pair of terminal electrodes, and the support and / or the at least one pair of terminal electrodes are , Having a notch in plan view,
The electronic component according to claim 1. 配線導体が形成された外部基板と、
前記外部基板上に実装され、且つ、前記回路素子に接続され、且つ、少なくとも１面に対向配置され、且つ、前記配線導体に接続された少なくとも１対の端子電極、及び、前記少なくとも１対の端子電極よりも突出して形成され、且つ、前記少なくとも１面における平面視において前記回路素子と重ならない領域に設けられた支持体を有する電子部品と、
を備える電子デバイス。 An external board on which wiring conductors are formed;
At least one pair of terminal electrodes mounted on the external substrate, connected to the circuit element, arranged to face at least one surface, and connected to the wiring conductor, and the at least one pair of terminals An electronic component having a support formed in a region that protrudes from the terminal electrode and does not overlap the circuit element in plan view on the at least one surface;
An electronic device comprising:
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