JP2011059556A - Equipment cleaning system, method, and program - Google Patents
Equipment cleaning system, method, and program Download PDFInfo
- Publication number
- JP2011059556A JP2011059556A JP2009211527A JP2009211527A JP2011059556A JP 2011059556 A JP2011059556 A JP 2011059556A JP 2009211527 A JP2009211527 A JP 2009211527A JP 2009211527 A JP2009211527 A JP 2009211527A JP 2011059556 A JP2011059556 A JP 2011059556A
- Authority
- JP
- Japan
- Prior art keywords
- defect
- position information
- substrate
- cleaning
- management means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Optical Filters (AREA)
Abstract
Description
本発明は、設備清掃に関する。 The present invention relates to equipment cleaning.
一般に、カラーフィルタ（ＣＦ）製造の各工程は、各工程毎に、カラーフィルタの欠陥を検出する検査装置を備えている。この検査装置の欠陥検査結果に応じて、カラーフィルタ基板は、良品或いは不良品の判定を受ける。この際、検査結果情報は、ファイルまたはデータベ−スに保存され、検査結果情報を履歴として参照できるツール等を利用して生産時の品質情報の閲覧或いは解析を行い、工程改善に活用される。 Generally, each process of manufacturing a color filter (CF) includes an inspection device that detects a defect of the color filter for each process. According to the defect inspection result of the inspection apparatus, the color filter substrate is judged as a good product or a defective product. At this time, the inspection result information is stored in a file or a database, and quality information at the time of production is browsed or analyzed using a tool or the like that can refer to the inspection result information as a history, and is used for process improvement.
また、検査結果情報は、工程内作業者により定期的に確認され、その際の欠陥発生状況、発生箇所に異常があると判断した場合には、ただちに異常原因の調査、対応が行われている。 In addition, inspection result information is regularly checked by in-process workers, and when it is judged that there is an abnormality at the defect occurrence status and location, the cause of the abnormality is immediately investigated and dealt with. .
また、工程内における基板のワレカケ発生時のワレカケ起点座標や、基板内の欠陥発生座標から、どの装置のどの部位が起因なのかを調査するために、工程内装置における、基板と接触する装置内の部位についてリストアップを行っており、その情報をワレカケ起因装置、欠陥発生起因装置の調査等に役立てている。 Also, in order to investigate which part of which device originates from the coordinates of the crack start point at the time of occurrence of cracks in the substrate in the process and the defect occurrence coordinates in the substrate, in the device in contact with the substrate in the device in the process This information is useful for investigating crack-causing devices and defect-causing devices.
また、工程内の各処理装置間の基板搬送、装置内基板搬送にはコロ搬送を採用している。 Further, roller conveyance is adopted for substrate conveyance between processing apparatuses in the process and substrate conveyance within the apparatus.
基板の搬送にコロ搬送を採用している場合、搬送コロへ経時的に微小埃が堆積して行き、基板搬送中に基板の裏面へと搬送コロに堆積した埃が転写することがある。この転写された埃は、工程内の欠陥検査装置により検出され、大量に転写されている場合、検査装置での欠陥検出上限値を超えるオーバーフローによる工程の停止、滞留を発生させてしまうことがある。 When roller conveyance is adopted for substrate conveyance, fine dust accumulates over time on the conveyance roller, and dust accumulated on the conveyance roller may be transferred to the back surface of the substrate during substrate conveyance. If the transferred dust is detected by a defect inspection apparatus in the process and transferred in large quantities, the process may stop or stay due to overflow exceeding the defect detection upper limit value in the inspection apparatus. .
そして工程停止後、停止原因となった裏面汚れの発生装置を接触位置情報を利用して調査を行うため、裏面汚れ発生から対応までの時間がかかってしまう。 Then, after the process is stopped, the back surface contamination generating device that has caused the stop is investigated using the contact position information, so that it takes time from the occurrence of the back surface contamination to the response.
これに対処する方法として、予め処理装置毎に搬送コロの配置位置を装置座標上に登録し、予め配置位置の座標をガラス基板上の基板座標上に変換して登録し、パターン形成ガラス基板から検出した欠陥の特異点を抽出してコロ裏面汚れの欠陥と判定し、コロ裏面汚れの欠陥座標と登録した搬送コロの基板座標上の位置座標とを照合して、座標値の一致とコロ裏面汚れの欠陥特徴により、コロ裏面汚れの欠陥起因となる処理装置および搬送コロを特定することが知られている（特許文献１参照）。 As a method of coping with this, the arrangement position of the transfer roller is previously registered on the apparatus coordinates for each processing apparatus, the coordinates of the arrangement position are previously converted and registered on the substrate coordinates on the glass substrate, and the pattern forming glass substrate is used. The singular point of the detected defect is extracted and judged as a defect on the roller back surface dirt, and the coordinate coordinates of the roller back surface dirt are collated with the position coordinates on the substrate coordinates of the registered transfer roller. It is known that a processing apparatus and a transport roller that cause defects on a roller back surface are identified based on the defect feature of the dirt (see Patent Document 1).
しかしながら、この方法では、工程内に基板座標上の位置座標が同じ搬送コロを有する処理装置が複数存在する場合、コロ裏面汚れの欠陥起因となるとして特定された複数の処理装置および搬送コロから、実際にコロ裏面汚れの欠陥起因となった処理装置および搬送コロを特定するために、一処理装置ずつ確認する必要があり、結局時間がかかるという問題がある。 However, in this method, when there are a plurality of processing apparatuses having transport rollers whose position coordinates on the substrate coordinates are the same in the process, from the plurality of processing apparatuses and transport rollers identified as being caused by defects on the back surface of the rollers, In order to identify the processing device and the transport roller that actually caused the roller back surface contamination defect, it is necessary to check each processing device one by one.
また、対処を行った装置については、裏面汚れの発生に規則性を見つけることが難しいため、どのタイミングで清掃を行ったら良いのかが分からず、装置の清掃カレンダーになかなか落とし込めないという問題がある。 In addition, it is difficult to find regularity for the occurrence of backside contamination for the devices that have been dealt with, so there is a problem that it is difficult to find out when to perform cleaning and it is difficult to drop them into the cleaning calendar of the device. .
本発明は斯かる背景技術に鑑みてなされたもので、搬送コロを最適なタイミングで効率良く清掃できることを課題とする。 The present invention has been made in view of such background art, and an object of the present invention is to efficiently clean a transport roller at an optimal timing.
本発明において上記課題を解決するために、まず請求項１の発明では、
基板を扱う工程内の各装置を清掃させるシステムであって、
工程内の各検査装置によって検出された基板の欠陥に係る最新の欠陥情報を順次登録して管理する欠陥情報管理手段と、
工程内の各装置の基板との接触部位に係る接触位置情報を管理する接触位置情報管理手段と、
工程内の各装置に対する作業履歴に係る情報を管理する作業履歴管理手段と、
工程内の各装置を制御する工程制御手段と、
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録する欠陥監視手段とを備えることを特徴とする設備清掃システムとしたものである。
In order to solve the above problems in the present invention, first, in the invention of claim 1,
A system for cleaning each device in the process of handling a substrate,
Defect information management means for sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection apparatus in the process;
Contact position information management means for managing contact position information related to a contact portion with the substrate of each device in the process;
Work history management means for managing information related to the work history for each device in the process;
Process control means for controlling each device in the process;
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated Provided with a defect monitoring means for notifying a cleaning instruction to each apparatus having a contact part via the process control means, receiving a cleaning completion report from each apparatus via the process control means, and registering it in the work history management means. The equipment cleaning system is characterized by the following.
また請求項２に係る発明では、
基板を扱う工程内の各装置を清掃させる方法であって、工程内の各検査装置によって検出された基板の欠陥に係る最新の欠陥情報を順次登録して管理する欠陥情報管理手段と、工程内の各装置の基板との接触部位に係る接触位置情報を管理する接触位置情報管理手段と、工程内の各装置に対する作業履歴に係る情報を管理する作業履歴管理手段と、工程内の各装置を制御する工程制御手段とに接続されたコンピュータが、
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録する設備清掃方法としたものである。
In the invention according to
A method of cleaning each device in the process of handling a substrate, the defect information management means for sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection device in the process, and in the process Contact position information management means for managing contact position information related to a contact portion of each device with the substrate, work history management means for managing information related to work history for each device in the process, and each device in the process. A computer connected to the process control means for controlling,
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated It is a facility cleaning method that notifies the cleaning instruction to each device having a contact part through the process control means, receives the cleaning completion report from each device through the process control means, and registers it in the work history management means. is there.
また請求項３の発明では、
基板を扱う工程内の各装置を清掃させるためのプログラムであって、工程内の各検査装置によって検出された基板の欠陥に係る最新の欠陥情報を順次登録して管理する欠陥情報管理手段と、工程内の各装置の基板との接触部位に係る接触位置情報を管理する接触位置情報管理手段と、工程内の各装置に対する作業履歴に係る情報を管理する作業履歴管理手段と、工程内の各装置を制御する工程制御手段とに接続されたコンピュータに、
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される
欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録することを実行させる設備清掃プログラムとしたものである。
In the invention of
Defect information management means for cleaning each device in the process of handling the substrate, and sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection device in the process; Contact position information management means for managing contact position information related to the contact portion of each device in the process with the substrate, work history management means for managing information related to work history for each device in the process, and each in the process A computer connected to a process control means for controlling the apparatus;
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated Equipment cleaning program that notifies a cleaning instruction to each device having a contact part via the process control means, receives a cleaning completion report from each device via the process control means, and executes registration to the work history management means It is what.
本発明は、工程内の各装置からの清掃完了報告を作業履歴として管理することにより、判定対象とする装置と基板との接触部位を絞り込み、最適なタイミングで清掃を行えるように、判定条件を設定し直すことができるという効果がある。 The present invention manages the cleaning completion report from each device in the process as a work history, narrows down the contact area between the device to be determined and the substrate, and sets the determination condition so that cleaning can be performed at the optimum timing. There is an effect that it can be set again.
従って、本発明は、搬送コロを最適なタイミングで効率良く清掃できるという効果がある。 Therefore, the present invention has an effect that the conveyance roller can be efficiently cleaned at an optimal timing.
以下に、本発明の一実施形態を説明する。 Hereinafter, an embodiment of the present invention will be described.
１．カラーフィルタ製造の各工程
本発明が適用されるカラーフィルタ製造の各工程は、各プロセス装置と、プロセス装置間の基板搬送をコロ搬送により行う少なくとも１台以上の搬送装置と、工程回収前に基板の欠陥検査を行う検査装置とを備える。プロセス装置、検査装置も、装置内基板搬送にコロ搬送を行うものであっても良い。
1. Each process of color filter manufacturing Each process of color filter manufacturing to which the present invention is applied includes each process device, at least one transport device that transports the substrate between the process devices by roller transport, and a substrate before process recovery. And an inspection apparatus for performing the defect inspection. The process apparatus and the inspection apparatus may also carry out roller conveyance for in-device substrate conveyance.
２．構成
本発明の設備清掃システムは、図１に示すように、構成要素として、検査結果管理ＤＢ（データベース）と、接触位置管理ＤＢ（データベース）と、設備情報管理ＤＢ（データベース）と、欠陥監視ＰＣ（パソコン）と、工程制御システムと、各工程内の装置１〜Ｎとを備え、各構成要素間は、Ｅｔｈｅｒｎｅｔ（登録商標）（イーサーネット）、ＣＣＬｉｎｋ（シーシーリンク）、光ケーブル等のネットワークにより接続されており、相互に通信可能である。各工程内の検査装置１〜Ｍは、各工程内の装置１〜Ｎの何れかに該当する。
2. Configuration As shown in FIG. 1, the equipment cleaning system of the present invention includes, as constituent elements, an inspection result management DB (database), a contact position management DB (database), an equipment information management DB (database), and a defect monitoring PC. (PC), process control system, and devices 1 to N in each process. Each component is connected by a network such as Ethernet (registered trademark), CCLink, or optical cable. And can communicate with each other. The inspection apparatuses 1 to M in each process correspond to any of the apparatuses 1 to N in each process.
３．検査結果管理ＤＢ
検査結果管理ＤＢは、製造現場の各工程内の検査装置によって検査された基板に対する検査結果情報を管理しているデータベースであり、検出された欠陥情報を管理するテーブルとして、少なくとも以下の表１に示すような欠陥情報管理テーブルを有する。
3. Inspection result management DB
The inspection result management DB is a database that manages inspection result information for a substrate that has been inspected by an inspection device in each process of the manufacturing site. As a table for managing detected defect information, at least the following Table 1 is used. It has a defect information management table as shown.
そして、検査結果管理ＤＢは、製造現場の各工程内の検査装置から、常時、最新の欠陥情報を受け取って、欠陥情報管理テーブルに登録する。 And inspection result management DB always receives the newest defect information from the inspection apparatus in each process of a manufacturing field, and registers it into a defect information management table.
４．基板接触位置管理ＤＢ
基板接触位置管理ＤＢは、製造現場の全工程の全装置に対して、各装置の基板と接触する部位について、基板との接触位置や接触方法の情報を管理しているデータベースであって、装置と基板との接触部位に係る接触位置情報を管理するテーブルとして、少なくとも以下の表２に示す接触位置管理テーブルを有する。
4). Substrate contact position management DB
Substrate contact position management DB is a database that manages information on the contact position and contact method with the substrate for each device in all processes on the manufacturing site, with respect to the portion that contacts the substrate of each device. At least a contact position management table shown in Table 2 below is provided as a table for managing contact position information relating to contact portions between the substrate and the substrate.
５．設備情報管理ＤＢ
設備情報管理ＤＢは、製造現場におけるメンテナンス記録等を管理しているデータベースであって、各設備に設置されている各装置に対する作業履歴を管理するテーブルとして、少なくとも以下の表３に示す作業履歴管理テーブルを有する。
5. Equipment information management DB
The equipment information management DB is a database that manages maintenance records and the like at manufacturing sites, and at least the work history management shown in Table 3 below is a table for managing work histories for each device installed in each equipment. Has a table.
６、欠陥監視ＰＣ
欠陥監視ＰＣは、最新の欠陥位置情報を検査結果管理ＤＢから読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を基板接触位置管理ＤＢから読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定対象の各装置の基板との各接触部位の汚染状況を判定し、汚染していると判定した場合、汚染された基板との接触部位を有する各装置への清掃指示を工程制御システムを介して通知し、各装置から清掃完了報告を工程制御システムを介して受け取って作業履歴として設備情報管理ＤＢに登録するパソコンである。
6. Defect monitoring PC
The defect monitoring PC reads the latest defect position information from the inspection result management DB, and displays the contact position information related to the contact portion with the substrate of the apparatus that caused the defect indicated by the latest defect position information. From the defect information and the contact position information, the contamination status of each contact site with the substrate of each device to be determined is determined according to preset determination conditions. A cleaning instruction is notified to each device having a contact part with the processed substrate via the process control system, and a cleaning completion report is received from each device via the process control system and registered in the facility information management DB as a work history. It is a personal computer.
７．工程制御システム
工程制御システムは、各工程内の基板管理、搬送制御を行っているシステムであり、各工程内の各装置と直接通信を行うことができ、各工程内の各装置は、工程制御システムからの指示を受け、この指示に対応できるようになっている。
7). Process control system The process control system is a system that performs substrate management and transfer control in each process, and can directly communicate with each device in each process. In response to an instruction from the system, it can respond to this instruction.
８．本発明の設備清掃システムによる清掃作業処理
以下に、本発明の設備清掃システムによる清掃作業処理を、図２のフローチャートに従って説明する。
8). Cleaning Work Process by Facility Cleaning System of the Present Invention Hereinafter, a cleaning work process by the facility cleaning system of the present invention will be described with reference to the flowchart of FIG.
Ｓ（ＳＴＥＰ）１；
欠陥監視ＰＣは、検査結果管理ＤＢを常時監視しており、検査装置１〜Ｍの何れかから、検査結果管理ＤＢの欠陥情報管理テーブルに、最新の基板検査の欠陥情報が登録される度に、欠陥情報管理テーブルから、最新の基板検査の欠陥情報を読み出す。
S (STEP) 1;
The defect monitoring PC constantly monitors the inspection result management DB, and each time the latest board inspection defect information is registered in the defect information management table of the inspection result management DB from any of the inspection apparatuses 1 to M. The latest board inspection defect information is read from the defect information management table.
Ｓ（ＳＴＥＰ）２；
欠陥監視ＰＣは、読み出した最新の基板検査の欠陥情報を基に、この欠陥情報で示され
る欠陥の起因となった装置の基板との接触部位に係る接触位置情報を、基板接触位置管理ＤＢの接触位置管理テーブルから読み出して、各装置の検査基板との接触部位毎に欠陥数を集計し、以下の表４に示す接触部位毎欠陥数情報を取得する。
S (STEP) 2;
Based on the read defect information of the latest substrate inspection, the defect monitoring PC obtains the contact position information related to the contact portion with the substrate of the apparatus that caused the defect indicated by the defect information in the substrate contact position management DB. It reads from a contact position management table, totals the number of defects for every contact part with the test | inspection board | substrate of each apparatus, The defect number information for every contact part shown in the following Table 4 is acquired.
Ｓ（ＳＴＥＰ）３；
欠陥監視ＰＣは、取得した接触部位毎欠陥数情報を基に、以下の表５に示す判定条件に従って、判定対象の各装置の基板との各接触部位の汚染状況を判定する。
S (STEP) 3;
The defect monitoring PC determines the contamination status of each contact site with the substrate of each device to be determined according to the determination conditions shown in Table 5 below based on the acquired defect number information for each contact site.
判定の結果、判定対象とする装置内の検査基板との接触部位に、汚染されているものがあれば、ＳＴＥＰ４に進み、
他方、汚染されているものがなければ、ＳＴＥＰ１に戻る。
As a result of the determination, if there is a contaminated part in contact with the inspection board in the apparatus to be determined, proceed to
On the other hand, if there is nothing contaminated, return to STEP1.
Ｓ（ＳＴＥＰ）４；
欠陥監視ＰＣは、汚染されていると判定した接触部位を有する装置を、検査基板の裏面汚れ起因装置とし、以下の表６に示す通知内容の情報を工程制御システムへ通知する。
S (STEP) 4;
The defect monitoring PC uses the apparatus having the contact portion determined to be contaminated as an apparatus for causing the backside contamination of the inspection board, and notifies the process control system of information of notification contents shown in Table 6 below.
Ｓ（ＳＴＥＰ）５；
工程制御システムは、欠陥監視ＰＣにより通知された情報を、工程制御システム参照画面に表示すると共に、起因装置にも、起因部位名、対象座標、清掃指示の通知を行う。
S (STEP) 5;
The process control system displays the information notified by the defect monitoring PC on the process control system reference screen, and also notifies the originating device of the originating part name, the target coordinates, and the cleaning instruction.
Ｓ（ＳＴＥＰ）６；
工程制御システムより通知を受けた起因装置は、通知内容を装置のタッチパネル上に表示すると共に、アラーム発報を行って、オペレータに通知する。
S (STEP) 6;
Upon receiving the notification from the process control system, the originating device displays the notification content on the touch panel of the device and issues an alarm to notify the operator.
Ｓ（ＳＴＥＰ）７；
アラーム発報後、起因装置の清掃を行う。その際、自動で清掃可能な装置については自動コロ清掃コードで装置自らが清掃を実行し、自動対応不可装置についてはオペレータ作業による清掃を実行する。
S (STEP) 7;
After the alarm is issued, the causative device is cleaned. At that time, for the device that can be automatically cleaned, the device itself performs cleaning with an automatic roller cleaning code, and for the device that cannot be automatically handled, cleaning is performed by an operator.
Ｓ（ＳＴＥＰ）８；
自動または手動での清掃完了後は、起因装置から工程制御システムへ、起因装置の清掃が完了した旨を報告する。自動清掃可能な装置の場合、自動コロ清掃モード完了後に、自動で工程制御システムへ清掃完了の報告を行う。手動で清掃実行の場合には、装置のオペレータが操作可能な画面（タッチパネル等）でボタンを押すことにより工程制御システムへ清掃完了の報告を行う。
S (STEP) 8;
After automatic or manual cleaning is completed, the cause device reports to the process control system that the cause device has been cleaned. In the case of an apparatus capable of automatic cleaning, after completion of the automatic roller cleaning mode, the completion of cleaning is automatically reported to the process control system. In the case of manually performing cleaning, the cleaning completion is reported to the process control system by pressing a button on a screen (touch panel or the like) that can be operated by the operator of the apparatus.
Ｓ（ＳＴＥＰ）９；
工程制御システムは、起因装置からの清掃完了報告を受け、欠陥監視ＰＣへ起因装置の清掃完了の報告を行う。報告内容は、装置名、清掃完了、清掃モード（自動／手動）である。
S (STEP) 9;
The process control system receives a cleaning completion report from the originating device and reports the completion of cleaning of the originating device to the defect monitoring PC. The report contents are the device name, cleaning completion, and cleaning mode (automatic / manual).
Ｓ（ＳＴＥＰ）１０；
欠陥監視ＰＣは、工程制御システムからの清掃完了報告を受け、報告をした起因装置に対する接触部位毎欠陥数情報のリセット（初期化）を行う。
S (STEP) 10;
The defect monitoring PC receives the cleaning completion report from the process control system, and resets (initializes) the information on the number of defects for each contact portion with respect to the reported originating device.
Ｓ（ＳＴＥＰ）１１；
リセットと共に、欠陥監視ＰＣは、検査基板の裏面汚れ起因装置の清掃完了報告を基にして、清掃作業情報を、設備情報管理ＤＢの作業履歴管理テーブルへ登録し、ＳＴＥＰ１に戻る。
S (STEP) 11;
At the same time as the reset, the defect monitoring PC registers the cleaning work information in the work history management table of the equipment information management DB based on the cleaning completion report of the back surface contamination-causing device of the inspection board, and returns to STEP 1.
尚、検査基板の裏面汚れ起因装置の清掃作業情報は、設備情報管理ＤＢの作業履歴管理テーブルへ登録後、判定条件の設定見直しに利用される。 Note that the cleaning work information of the apparatus causing the backside contamination of the inspection board is used for reviewing the setting of the determination condition after being registered in the work history management table of the equipment information management DB.
９．自動清掃機能付搬送装置
以下に、自動で搬送コロ清掃可能な搬送装置の例を説明する。
9. Hereinafter, an example of a transfer device capable of automatically cleaning a transfer roller will be described.
本搬送装置は、それぞれ図３〜６に示す上面図、裏面図、側面図、正面図から明らかなように、基板搬送用の搬送コロ１と、搬送コロ１を清掃するためのコロ清掃ユニット２とを備える。またコロ清掃ユニット２は、搬送装置のフレーム３の内側に設置されている。
As is apparent from the top view, the back view, the side view, and the front view shown in FIGS. 3 to 6, the transfer device includes a transfer roller 1 for transferring a substrate and a
コロ清掃ユニット２は、図７に示すように、搬送装置の各搬送コロ１を清掃可能にするために、搬送装置内を水平に移動するための水平移動軸７、８と、上下に移動するために上下移動軸５、６と、上下移動軸５、６の間に清掃布設置部４を有し、図８に示すように、清掃布設置部４に、コロ清掃に使用する清掃布９を設置するものである。清掃布９は、搬送コロ１と接触しても傷をつけない素材の布（例えば、純水を含んだアンチコン等）を使用する。また、各移動軸５、６、７、８は、移動による発塵が極力少ない材質で構成される。
As shown in FIG. 7, the
以下のＳＴＥＰ１〜５の順に、本搬送装置によるコロ清掃の動作を説明する。 The roller cleaning operation by the present conveying device will be described in the following order of STEP1 to STEP5.
ＳＴＥＰ１；
本搬送装置は、清掃対象のコロの情報（起因部位名、対象座標）を、工程制御システムから或いは手動の指令により受け取る。
STEP1;
This transport apparatus receives information on the rollers to be cleaned (caused part name, target coordinates) from the process control system or by a manual command.
ＳＴＥＰ２；
本搬送装置は、受け取った清掃対象コロの情報を基に、清掃対象コロの下まで水平移動軸を使用して清掃布を移動させる。
STEP2;
Based on the received information about the cleaning target roller, the transport device moves the cleaning cloth to the bottom of the cleaning target roller using the horizontal movement shaft.
ＳＴＥＰ３；
清掃対象コロの下まで移動後、本搬送装置は、上下軸により清掃対象コロと接触するまで清掃布を上昇させる。
STEP3;
After moving below the cleaning target roller, the transport device raises the cleaning cloth until it comes into contact with the cleaning target roller by the vertical axis.
ＳＴＥＰ４；
清掃対象コロと接触するまで上昇後、本搬送装置は、搬送コロを回転させる。搬送コロを回転させることで、搬送コロと接触している清掃布で搬送コロの汚れを拭き取る。尚、搬送コロの回転は、設定された時間分、行われる。
STEP4;
After ascending until it comes into contact with the roller to be cleaned, the transport device rotates the transport roller. By rotating the transport roller, the dirt on the transport roller is wiped off with a cleaning cloth in contact with the transport roller. The conveyance roller is rotated for a set time.
ＳＴＥＰ５；
搬送コロの清掃終了後、本搬送装置は、清掃布を下降させ、水平移動軸内の原点ポジションまで水平移動させる。
STEP5;
After completing the cleaning of the transport roller, the transport device lowers the cleaning cloth and horizontally moves it to the origin position in the horizontal movement shaft.
１…搬送コロ
２…コロ清掃ユニット
３…フレーム
４…清掃布設置部
５…上下移動軸
６…上下移動軸
７…水平移動軸
８…水平移動軸
９…清掃布
DESCRIPTION OF SYMBOLS 1 ...
Claims (3)
工程内の各検査装置によって検出された基板の欠陥に係る最新の欠陥情報を順次登録して管理する欠陥情報管理手段と、
工程内の各装置の基板との接触部位に係る接触位置情報を管理する接触位置情報管理手段と、
工程内の各装置に対する作業履歴に係る情報を管理する作業履歴管理手段と、
工程内の各装置を制御する工程制御手段と、
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録する欠陥監視手段とを備えることを特徴とする設備清掃システム。 A system for cleaning each device in the process of handling a substrate,
Defect information management means for sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection apparatus in the process;
Contact position information management means for managing contact position information related to a contact portion with the substrate of each device in the process;
Work history management means for managing information related to the work history for each device in the process;
Process control means for controlling each device in the process;
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated Provided with a defect monitoring means for notifying a cleaning instruction to each apparatus having a contact part via the process control means, receiving a cleaning completion report from each apparatus via the process control means, and registering it in the work history management means. Equipment cleaning system characterized by.
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録する設備清掃方法。 A method of cleaning each device in the process of handling a substrate, the defect information management means for sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection device in the process, and in the process Contact position information management means for managing contact position information related to a contact portion of each device with the substrate, work history management means for managing information related to work history for each device in the process, and each device in the process. A computer connected to the process control means for controlling,
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated A facility cleaning method for notifying a cleaning instruction to each device having a contact portion via a process control means, receiving a cleaning completion report from each device via the process control means, and registering it in the work history management means.
最新の欠陥位置情報を欠陥情報管理手段から読み出し、最新の欠陥位置情報で示される欠陥の起因となった装置の基板との接触部位に係る接触位置情報を接触位置情報管理手段から読み出し、これら欠陥情報と接触位置情報とから、予め設定された判定条件に従って、判定条件で判定対象とされた各装置の基板との各接触部位の汚染状況を判定し、汚染されていると判定した基板との接触部位を有する各装置への清掃指示を工程制御手段を介して通知し、各装置からの清掃完了報告を工程制御手段を介して受け取って作業履歴管理手段に登録することを実行させる設備清掃プログラム。 Defect information management means for cleaning each device in the process of handling the substrate, and sequentially registering and managing the latest defect information related to the defect of the substrate detected by each inspection device in the process; Contact position information management means for managing contact position information related to the contact portion of each device in the process with the substrate, work history management means for managing information related to work history for each device in the process, and each in the process A computer connected to a process control means for controlling the apparatus;
The latest defect position information is read from the defect information management means, and the contact position information related to the contact portion with the substrate of the apparatus causing the defect indicated by the latest defect position information is read from the contact position information management means, and these defects are read. Based on the information and the contact position information, according to a predetermined determination condition, the contamination status of each contact site with the substrate of each device determined by the determination condition is determined, and the substrate determined to be contaminated Equipment cleaning program that notifies a cleaning instruction to each device having a contact part via the process control means, receives a cleaning completion report from each device via the process control means, and executes registration to the work history management means .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009211527A JP5573058B2 (en) | 2009-09-14 | 2009-09-14 | Cleaning instruction system for substrate transfer roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009211527A JP5573058B2 (en) | 2009-09-14 | 2009-09-14 | Cleaning instruction system for substrate transfer roller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011059556A true JP2011059556A (en) | 2011-03-24 |
| JP5573058B2 JP5573058B2 (en) | 2014-08-20 |
Family
ID=43947220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009211527A Expired - Fee Related JP5573058B2 (en) | 2009-09-14 | 2009-09-14 | Cleaning instruction system for substrate transfer roller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5573058B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7502948B2 (en) | 2020-09-16 | 2024-06-19 | 株式会社カネカ | SOLAR CELL MANUFACTURING APPARATUS AND SOLAR CELL MANUFACTURING APPARATUS MANAGEMENT METHOD |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002515650A (en) * | 1998-05-11 | 2002-05-28 | アプライド マテリアルズ インコーポレイテッド | Manufacturing equipment yield improvement system |
| JP2002357377A (en) * | 2001-03-28 | 2002-12-13 | Mitsubishi Electric Corp | Device and method for cleaning piping |
| JP2003272983A (en) * | 2002-03-13 | 2003-09-26 | Hitachi High-Technologies Corp | Program for extracting candidate for defect source and inspection system |
| JP2004327465A (en) * | 2003-04-21 | 2004-11-18 | Renesas Technology Corp | Production management system of semiconductor device |
| JP2006155511A (en) * | 2004-12-01 | 2006-06-15 | Sharp Corp | Production history management system, production history management method, production history management program and program recording medium recording the program |
| JP2008046746A (en) * | 2006-08-11 | 2008-02-28 | Olympus Corp | Process managing system |
| JP2008267993A (en) * | 2007-04-20 | 2008-11-06 | Toppan Printing Co Ltd | Method of determining specific defect by inspection machine, and method of determining roller back face soil by inspection machine |
-
2009
- 2009-09-14 JP JP2009211527A patent/JP5573058B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002515650A (en) * | 1998-05-11 | 2002-05-28 | アプライド マテリアルズ インコーポレイテッド | Manufacturing equipment yield improvement system |
| JP2002357377A (en) * | 2001-03-28 | 2002-12-13 | Mitsubishi Electric Corp | Device and method for cleaning piping |
| JP2003272983A (en) * | 2002-03-13 | 2003-09-26 | Hitachi High-Technologies Corp | Program for extracting candidate for defect source and inspection system |
| JP2004327465A (en) * | 2003-04-21 | 2004-11-18 | Renesas Technology Corp | Production management system of semiconductor device |
| JP2006155511A (en) * | 2004-12-01 | 2006-06-15 | Sharp Corp | Production history management system, production history management method, production history management program and program recording medium recording the program |
| JP2008046746A (en) * | 2006-08-11 | 2008-02-28 | Olympus Corp | Process managing system |
| JP2008267993A (en) * | 2007-04-20 | 2008-11-06 | Toppan Printing Co Ltd | Method of determining specific defect by inspection machine, and method of determining roller back face soil by inspection machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7502948B2 (en) | 2020-09-16 | 2024-06-19 | 株式会社カネカ | SOLAR CELL MANUFACTURING APPARATUS AND SOLAR CELL MANUFACTURING APPARATUS MANAGEMENT METHOD |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5573058B2 (en) | 2014-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4023851B2 (en) | Electronic component mounting method | |
| JP5960644B2 (en) | Monitoring system | |
| CN209656575U (en) | A kind of LCM appearance detecting device | |
| CN110268814B (en) | Production management device | |
| WO2007125722A1 (en) | Print inspection method, print inspection device and printer | |
| WO2012165276A1 (en) | Board operation assisting device, and board operation assisting method | |
| JP5781835B2 (en) | Electric circuit manufacturing support apparatus and electric circuit manufacturing support method | |
| WO2018131066A1 (en) | Management device, mounting-related device, and mounting system | |
| US20190265122A1 (en) | Leak inspection assistance device and leak inspection method using same | |
| JPWO2016021043A1 (en) | Screen printing device | |
| JP6633616B2 (en) | Information management apparatus and information management method | |
| CN105842253A (en) | Automatic PCB optical detection method | |
| JP6922694B2 (en) | Management systems, management devices, management methods, and programs | |
| WO2014068664A1 (en) | System for monitoring production on component mounting line | |
| CN112271151B (en) | Machine pollution monitoring device and processing equipment | |
| JP5573058B2 (en) | Cleaning instruction system for substrate transfer roller | |
| JP6259565B2 (en) | Mounting management device, inspection management device, mounting system, mounting management method and program thereof, and inspection management method and program thereof | |
| CN113647207B (en) | Component mounting management device, component mounting management method, component mounting management program, and recording medium | |
| TWI462164B (en) | Method for cleaning a wafer stage | |
| JP6594971B2 (en) | Production control system for component mounting line | |
| TW202101563A (en) | Control system for controlling polishing device for polishing substrate, and polishing method | |
| JP2008147443A (en) | Process control system, and process control method | |
| JP6335246B2 (en) | Inspection management apparatus and inspection management method | |
| CN116784009A (en) | Management system, management device, management method, and program | |
| JP7503776B2 (en) | Component mounting system and method for manufacturing mounted substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120823 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130806 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131021 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140603 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140616 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5573058 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |