JP2011054978A - Znを用いた半田付け構造物および方法 - Google Patents
Znを用いた半田付け構造物および方法 Download PDFInfo
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- JP2011054978A JP2011054978A JP2010228990A JP2010228990A JP2011054978A JP 2011054978 A JP2011054978 A JP 2011054978A JP 2010228990 A JP2010228990 A JP 2010228990A JP 2010228990 A JP2010228990 A JP 2010228990A JP 2011054978 A JP2011054978 A JP 2011054978A
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- layer
- lead
- bonding layer
- free solder
- soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/24—Selection of soldering or welding materials proper
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- B23K35/262—Sn as the principal constituent
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- Parts Printed On Printed Circuit Boards (AREA)
Abstract
【解決手段】本半田付け構造物は、Znを含む結合層および結合層と結合反応する鉛フリー半田を含む。そして、前記結合層は、所定の物質から形成された少なくとも1つの物質層およびZn層が順次積層された多重層の構造であり、前記Zn層は前記多重層のうち前記鉛フリー半田側の最上に位置することを特徴とする。
【選択図】図4
Description
Finish Metalization)としての機能を担うことができる。本発明における実施例の結合層110は、Znを含むZn合金層(Zn Alloy Layer)から形成される。
まず、図6Aに示されるように、基板200上に絶縁層210を積層してパターンングし半田付け構造物が製造される位置を露出させる。絶縁層210は、二酸化珪素(SiO2)または酸化アルミニウム(Al2O2)のような絶縁物質で形成される。
110、130、220 結合層、
120、230 鉛フリー半田、
210 絶縁層。
Claims (11)
- Znを含む結合層と、
前記結合層と結合反応する鉛フリー半田と、
を含み、
前記結合層は、所定の物質から形成された少なくとも1つの物質層およびZn層が順次積層された多重層の構造であり、前記Zn層は前記多重層のうち前記鉛フリー半田側の最上に位置することを特徴とする半田付け構造物。 - 前記Zn層の厚さは、1μm以下であることを特徴とする請求項1に記載の半田付け構造物。
- 前記結合層を支える基板を更に含むことを特徴とする請求項1または2に記載の半田付け構造物。
- 前記基板と前記鉛フリー半田とを絶縁させる絶縁層を更に含むことを特徴とする請求項1〜3のいずれか1項に記載の半田付け構造物。
- 前記鉛フリー半田は、SnAg、SnAgCu、SnCu、SnBi、SnIn、SnZn、SnZnBi、SnZnInのいずれか1つであることを特徴とする請求項1〜4のいずれか1項に記載の半田付け構造物。
- 基板上にZnを含む結合層を形成するステップと、
前記結合層上に鉛フリー半田を形成するステップと、
を含み、
前記結合層を形成するステップは、前記基板上に所定の物質から形成された少なくとも1つの物質層を積層し、前記物質層上にZnから形成されたZn層を積層し、多重層の形の結合層を形成することを特徴とする半田付け方法。 - 前記結合層を形成するステップは、前記Zn層を1μm以下の厚さで積層することを特徴とする請求項6に記載の半田付け方法。
- 前記鉛フリー半田を形成するステップは、SnAg、SnAgCu、SnCu、SnBi、SnIn、SnZn、SnZnBi、SnZnInのいずれか1つを前記鉛フリー半田として用いることを特徴とする請求項6または7に記載の半田付け方法。
- 前記結合層を形成するステップは、
前記基板上に絶縁層を積層してパターニングを行なうステップと、
スパッタリング方式、蒸着方式、電気メッキ方式、無電気メッキ方式のいずれか1つを用いて前記絶縁層の一部および前記基板上に前記結合層を形成するステップと、
を含むことを特徴とする請求項6〜8のいずれか1項に記載の半田付け方法。 - 前記鉛フリー半田を形成するステップは、
前記結合層上で半田付け構造物が製造される位置を除く領域にフォトレジストを積層するステップと、
前記半田付け構造物が製造される位置に前記鉛フリー半田を積層するステップと、
前記フォトレジストおよび前記絶縁層を除去しリフロー工程を行なって前記鉛フリー半田および前記結合層とを結合させるステップと、
を含むことを特徴とする請求項9に記載の半田付け方法。 - 前記鉛フリー半田を形成するステップは、
前記結合層上で半田付け構造物が製造される位置を除く領域にフォトレジストを積層するステップと、
前記半田付け構造物を製造する位置に前記鉛フリー半田を積層するステップと、
前記フォトレジストを除去しリフロー工程を行なって前記鉛フリー半田および前記結合層とを結合させるステップと、
を含むことを特徴とする請求項6〜8のいずれか1項に記載の半田付け方法。
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US10347602B1 (en) * | 2018-07-23 | 2019-07-09 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure |
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