JP2011049515A - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP2011049515A JP2011049515A JP2009247278A JP2009247278A JP2011049515A JP 2011049515 A JP2011049515 A JP 2011049515A JP 2009247278 A JP2009247278 A JP 2009247278A JP 2009247278 A JP2009247278 A JP 2009247278A JP 2011049515 A JP2011049515 A JP 2011049515A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer circuit
- circuit block
- electronic device
- conductor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 124
- 239000003990 capacitor Substances 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000012212 insulator Substances 0.000 claims description 27
- 238000010030 laminating Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000007606 doctor blade method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】 複数の四角形状の誘電体層が積層されて成る積層体2と積層体2の誘電体層間に形成された内部電極3と積層体2の両端部に形成されて内部電極3に接続されている端子電極4とを具備しているコンデンサ5が、実装基板6の上面に形成された接続パッド7に端子電極4を接続して実装されており、接続パッド7に実装基板6の内部に形成された貫通導体8が接続されている電子装置1であって、内部電極3は、端部が積層体2の端面から側面の途中にかけて露出しており、貫通導体8は、平面視で積層体2の側面における内部電極3の露出端部の端面から最も離れている部位の直下に位置している電子装置1である。電流経路が短くなるので、電子装置1のESLを低減させることが可能である。
【選択図】 図2
Description
2:積層体
3:内部電極
4:端子電極
5:コンデンサ
6:実装基板
7:接続パッド
8:貫通導体
9:内部導体
10,20:電子装置
11:絶縁体層
12:絶縁基体
13:貫通孔
14:第2多層回路ブロック
15:第1多層回路ブロック
16:第3多層回路ブロック
17:多層回路基板
18:電極パッド
19:第2の接続パッド
21:電源供給用の貫通導体
Claims (3)
- 複数の四角形状の誘電体層が積層されて成る積層体と該積層体の前記誘電体層間に形成された内部電極と前記積層体の両端部に形成されて前記内部電極に接続されている端子電極とを具備しているコンデンサが、実装基板の上面に形成された接続パッドに前記端子電極を接続して実装されており、前記接続パッドに前記実装基板の内部に形成された貫通導体が接続されている電子装置であって、
前記内部電極は、端部が前記積層体の端面から側面の途中にかけて露出しており、前記貫通導体は、平面視で前記積層体の前記側面における前記内部電極の露出端部の前記端面から最も離れている部位の直下に位置していることを特徴とする電子装置。 - 複数の絶縁体層が積層されて成る絶縁基体、複数の前記絶縁体層の層間に形成された内部導体、および複数の前記絶縁体層の異なる層間に形成された前記内部導体同士を電気的に接続するように前記絶縁体層を貫通して形成された貫通導体を含み、四角形状の貫通孔が形成された第2多層回路ブロック、該第2多層回路ブロックの下側に配置された第1多層回路ブロック、および前記第2多層回路ブロックの上側に配置された、下面に接続パッドが形成された第3多層回路ブロックから成る多層回路基板と、該多層回路基板の前記貫通孔に収容されたコンデンサとを含む電子装置であって、
前記コンデンサは、複数の四角形状の誘電体層が積層されて成る積層体、該積層体の前記誘電体層間に端部が前記積層体の端面から側面の途中にかけて露出するように形成された内部電極、および前記積層体の両端部に形成されて前記内部電極に接続されている端子電極を具備しており、
前記コンデンサの前記端子電極は、上側が前記接続パッドに接続されており、
前記第3多層回路ブロックの、前記接続パッドに電気的に接続されている前記貫通導体は、平面視で前記積層体の前記側面における前記内部電極の露出端部の前記端面から最も離れている部位の直上に位置していることを特徴とする電子装置。 - 前記第1多層回路ブロックの上面に第2の接続パッドが形成されており、前記コンデンサの前記端子電極は、下側が前記第2の接続パッドに接続されており、前記第1多層回路ブロックの、前記第2の接続パッドに電気的に接続されている前記貫通導体は、平面視で前記積層体の前記側面における前記内部電極の露出端部の前記端面から最も離れている部位の直下に位置していることを特徴とする請求項2に記載の電子装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009247278A JP5404312B2 (ja) | 2009-07-29 | 2009-10-28 | 電子装置 |
US12/826,423 US8232479B2 (en) | 2009-07-29 | 2010-06-29 | Electronic apparatus |
CN2010102431526A CN101989495B (zh) | 2009-07-29 | 2010-07-28 | 电容器的基板安装构造体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009176066 | 2009-07-29 | ||
JP2009176066 | 2009-07-29 | ||
JP2009247278A JP5404312B2 (ja) | 2009-07-29 | 2009-10-28 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011049515A true JP2011049515A (ja) | 2011-03-10 |
JP5404312B2 JP5404312B2 (ja) | 2014-01-29 |
Family
ID=43525936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009247278A Active JP5404312B2 (ja) | 2009-07-29 | 2009-10-28 | 電子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8232479B2 (ja) |
JP (1) | JP5404312B2 (ja) |
CN (1) | CN101989495B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015509659A (ja) * | 2012-02-08 | 2015-03-30 | アップル インコーポレイテッド | 三次元的な、複数の受動部品による構造 |
US10062514B2 (en) | 2016-04-12 | 2018-08-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
US10242797B2 (en) | 2016-04-14 | 2019-03-26 | Murata Manufacturing Co., Ltd. | Multilayer-ceramic-capacitor mounting structure |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011233840A (ja) * | 2010-04-30 | 2011-11-17 | Murata Mfg Co Ltd | 電子部品 |
EP2740122B1 (en) * | 2011-06-27 | 2016-08-31 | Thin Film Electronics ASA | Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate |
US9287049B2 (en) * | 2013-02-01 | 2016-03-15 | Apple Inc. | Low acoustic noise capacitors |
US8933343B2 (en) * | 2013-03-04 | 2015-01-13 | Inpaq Technology Co., Ltd. | Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes |
JP2014216643A (ja) * | 2013-04-22 | 2014-11-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミック電子部品及びその実装基板 |
JP5803998B2 (ja) * | 2013-07-23 | 2015-11-04 | 株式会社村田製作所 | 電子部品の製造方法及び基板型の端子の製造方法 |
JP6140834B2 (ja) * | 2013-10-23 | 2017-05-31 | 京セラ株式会社 | 配線基板および電子装置 |
KR101514562B1 (ko) * | 2013-11-06 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
JP6481446B2 (ja) * | 2014-06-13 | 2019-03-13 | 株式会社村田製作所 | 積層コンデンサの実装構造体 |
JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
JPWO2017094062A1 (ja) * | 2015-11-30 | 2018-06-14 | ルネサスエレクトロニクス株式会社 | 電子装置 |
SG11202003349PA (en) * | 2017-10-23 | 2020-05-28 | Avx Corp | Multilayer electronic device having improved connectivity and method for making the same |
KR102436222B1 (ko) * | 2017-11-10 | 2022-08-25 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자 부품, 그 제조 방법 및 적층 세라믹 전자 부품 내장형 인쇄회로기판 |
KR102595463B1 (ko) * | 2018-02-22 | 2023-10-30 | 삼성전기주식회사 | 전자 부품 |
JP6981438B2 (ja) * | 2019-02-20 | 2021-12-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
KR20190116123A (ko) * | 2019-07-04 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20190116124A (ko) * | 2019-07-05 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20220056296A (ko) | 2020-10-27 | 2022-05-06 | 삼성전자주식회사 | 반도체 패키지 및 반도체 패키지의 제조 방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198654A (ja) * | 2000-12-25 | 2002-07-12 | Kyocera Corp | 電気素子内蔵配線基板およびその製造方法 |
JP2006100708A (ja) * | 2004-09-30 | 2006-04-13 | Taiyo Yuden Co Ltd | 3端子型積層コンデンサ実装回路基板および3端子型積層コンデンサ |
JP2006121005A (ja) * | 2004-10-25 | 2006-05-11 | Denso Corp | プリント基板及びその製造方法 |
JP2007129224A (ja) * | 2005-10-31 | 2007-05-24 | Avx Corp | 内部電流キャンセル機能および底面端子を有する積層セラミックコンデンサ |
JP2008192808A (ja) * | 2007-02-05 | 2008-08-21 | Murata Mfg Co Ltd | 積層型電子部品の実装構造 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06173081A (ja) * | 1992-12-03 | 1994-06-21 | Murata Mfg Co Ltd | 電子部品 |
JPH10241991A (ja) * | 1997-02-24 | 1998-09-11 | Taiyo Yuden Co Ltd | 積層コンデンサとそのトリミング方法 |
JP4931329B2 (ja) * | 2002-09-27 | 2012-05-16 | 京セラ株式会社 | コンデンサ、配線基板、デカップリング回路及び高周波回路 |
JP4458812B2 (ja) * | 2002-10-30 | 2010-04-28 | 京セラ株式会社 | コンデンサ、コンデンサの製造方法、配線基板、デカップリング回路及び高周波回路 |
TWI229878B (en) * | 2003-03-12 | 2005-03-21 | Tdk Corp | Multilayer capacitor |
JP4433909B2 (ja) * | 2004-07-07 | 2010-03-17 | Tdk株式会社 | 表面実装型電子部品 |
CN1925720B (zh) * | 2005-09-01 | 2010-04-14 | 日本特殊陶业株式会社 | 布线基板、电容器 |
JP4757587B2 (ja) * | 2005-09-21 | 2011-08-24 | Tdk株式会社 | 積層コンデンサ、及び、その製造方法 |
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
JP4924163B2 (ja) * | 2007-04-06 | 2012-04-25 | パナソニック株式会社 | 電子部品とその製造方法 |
JP4539713B2 (ja) * | 2007-12-11 | 2010-09-08 | Tdk株式会社 | 積層コンデンサアレイ |
-
2009
- 2009-10-28 JP JP2009247278A patent/JP5404312B2/ja active Active
-
2010
- 2010-06-29 US US12/826,423 patent/US8232479B2/en active Active
- 2010-07-28 CN CN2010102431526A patent/CN101989495B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198654A (ja) * | 2000-12-25 | 2002-07-12 | Kyocera Corp | 電気素子内蔵配線基板およびその製造方法 |
JP2006100708A (ja) * | 2004-09-30 | 2006-04-13 | Taiyo Yuden Co Ltd | 3端子型積層コンデンサ実装回路基板および3端子型積層コンデンサ |
JP2006121005A (ja) * | 2004-10-25 | 2006-05-11 | Denso Corp | プリント基板及びその製造方法 |
JP2007129224A (ja) * | 2005-10-31 | 2007-05-24 | Avx Corp | 内部電流キャンセル機能および底面端子を有する積層セラミックコンデンサ |
JP2008192808A (ja) * | 2007-02-05 | 2008-08-21 | Murata Mfg Co Ltd | 積層型電子部品の実装構造 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015509659A (ja) * | 2012-02-08 | 2015-03-30 | アップル インコーポレイテッド | 三次元的な、複数の受動部品による構造 |
US10062514B2 (en) | 2016-04-12 | 2018-08-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
US10242797B2 (en) | 2016-04-14 | 2019-03-26 | Murata Manufacturing Co., Ltd. | Multilayer-ceramic-capacitor mounting structure |
Also Published As
Publication number | Publication date |
---|---|
US20110024175A1 (en) | 2011-02-03 |
CN101989495A (zh) | 2011-03-23 |
JP5404312B2 (ja) | 2014-01-29 |
US8232479B2 (en) | 2012-07-31 |
CN101989495B (zh) | 2012-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5404312B2 (ja) | 電子装置 | |
JP4953988B2 (ja) | 積層コンデンサおよびコンデンサ実装基板 | |
JP5755690B2 (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
JP5080144B2 (ja) | コンデンサ内蔵配線基板 | |
JP2015050452A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
US9230740B2 (en) | Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein | |
KR20140081360A (ko) | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 실장된 회로기판 | |
KR20180046278A (ko) | 적층 전자부품 및 그 제조방법 | |
JP2008078622A (ja) | 積層コンデンサ、回路基板及び回路モジュール | |
JPWO2005067359A1 (ja) | セラミック多層基板 | |
WO2014162478A1 (ja) | 部品内蔵基板及びその製造方法 | |
JP2015076600A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
JP4965237B2 (ja) | 配線基板内蔵用コンデンサ及び配線基板 | |
JP2010027899A (ja) | 積層セラミック電子部品およびその製造方法 | |
US11456109B2 (en) | Coil component | |
KR20160000329A (ko) | 적층 인덕터, 적층 인덕터의 제조방법 및 적층 인덕터의 실장 기판 | |
KR101477426B1 (ko) | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 | |
JP2009054974A (ja) | 積層コンデンサおよびコンデンサ実装基板 | |
JP2001156211A (ja) | コンデンサ内蔵型配線基板 | |
JP2009004457A (ja) | コンデンサ内蔵多層基板 | |
JP2006237446A (ja) | 多層配線基板およびその製造方法 | |
CN106341945B (zh) | 一种柔性线路板及其制作方法 | |
JP3472523B2 (ja) | 電気素子内蔵配線基板 | |
JP2003163559A (ja) | フィルタを有する回路基板 | |
JP5007763B2 (ja) | 積層セラミックコンデンサ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120717 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130606 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130709 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130903 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131001 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131029 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5404312 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |