JP2014216643A - 積層セラミック電子部品及びその実装基板 - Google Patents
積層セラミック電子部品及びその実装基板 Download PDFInfo
- Publication number
- JP2014216643A JP2014216643A JP2013234089A JP2013234089A JP2014216643A JP 2014216643 A JP2014216643 A JP 2014216643A JP 2013234089 A JP2013234089 A JP 2013234089A JP 2013234089 A JP2013234089 A JP 2013234089A JP 2014216643 A JP2014216643 A JP 2014216643A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- multilayer ceramic
- electronic component
- internal electrodes
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 100
- 239000000758 substrate Substances 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
【解決手段】本発明は、厚さ方向に積層された複数の誘電体層を含み、幅をW、厚さをTとしたときにT/W>1.0を満たし、少なくとも一つの主面に内側へ凹んだ長さ方向の溝部を有するセラミック本体と、上記セラミック本体内で上記誘電体層を介して対向して配置され、上記セラミック本体の両端面から交互に露出した複数の第1及び第2の内部電極と、上記セラミック本体の両端面から上記溝部の形成された一つの主面まで形成され、上記第1及び第2の内部電極とそれぞれ電気的に連結された第1及び第2の外部電極と、を含む積層セラミック電子部品を提供する。
【選択図】図1
Description
図1は本発明の一実施形態による積層セラミックキャパシタを概略的に示した斜視図であり、図2は図1から外部電極を分離した状態を示した斜視図である。
図5は本発明の他の実施形態による積層セラミックキャパシタの外部電極を分離した状態を示した斜視図であり、図6は図5のB部分を拡大して示した斜視図である。
以下、本発明の一実施形態による積層セラミックキャパシタの製造方法を説明する。
図7は、本発明の一実施形態による積層セラミックキャパシタが印刷回路基板に実装された態様を積層セラミックキャパシタの一部を切開して概略的に示した斜視図である。
110 セラミック本体
111 誘電体層
112、113 支持部
114、115 溝部
121、122 第1及び第2の内部電極
131、132 第1及び第2の外部電極
Claims (6)
- 厚さ方向に積層された複数の誘電体層を含み、幅をW、厚さをTとしたときにT/W>1.0を満たし、少なくとも一つの主面に内側へ凹んだ長さ方向の溝部を有するセラミック本体と、
前記セラミック本体内で前記複数の誘電体層のそれぞれを介して対向して配置され、前記セラミック本体の両端面から交互に露出した複数の第1の内部電極及び複数の第2の内部電極と、
前記セラミック本体の両端面から前記溝部の形成された一つの主面まで形成され、前記複数の第1の内部電極及び前記複数の第2の内部電極とそれぞれ電気的に連結された第1の外部電極及び第2の外部電極と、
を含む、積層セラミック電子部品。 - 幅方向に積層された複数の誘電体層を含み、幅をW、厚さをTとしたときにT/W>1.0を満たし、少なくとも一つの主面に内側へ凹んだ長さ方向の溝部を有するセラミック本体と、
前記セラミック本体内で前記複数の誘電体層のそれぞれを介して対向して配置され、前記セラミック本体の両端面から交互に露出した複数の第1の内部電極及び複数の第2の内部電極と、
前記セラミック本体の両端面から前記溝部の形成された一つの主面まで形成され、前記複数の第1の内部電極及び前記複数の第2の内部電極とそれぞれ電気的に連結された第1の外部電極及び第2の外部電極と、
を含む、積層セラミック電子部品。 - 前記溝部の最大高さをa、前記セラミック本体の幅をbとしたとき、0.001≦a/b≦0.007の範囲を満たす、請求項1又は2に記載の積層セラミック電子部品。
- 前記溝部は前記セラミック本体の両主面に対向してそれぞれ形成される、請求項1から3のいずれか一項に記載の積層セラミック電子部品。
- 前記セラミック本体の幅方向のマージン部をcとしたとき、40μm≦c≦500μmの範囲を満たす、請求項1から4のいずれか一項に記載の積層セラミック電子部品。
- 上部に第1及び第2の電極パッドを有する印刷回路基板と、
前記第1及び第2の電極パッド上に設置された請求項1から5のいずれか一項に記載の積層セラミック電子部品と、
を含む、積層セラミック電子部品の実装基板。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130044150 | 2013-04-22 | ||
KR10-2013-0044150 | 2013-04-22 | ||
KR1020130098576A KR102067178B1 (ko) | 2013-04-22 | 2013-08-20 | 적층 세라믹 전자 부품 및 그 실장 기판 |
KR10-2013-0098576 | 2013-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014216643A true JP2014216643A (ja) | 2014-11-17 |
Family
ID=51709343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013234089A Pending JP2014216643A (ja) | 2013-04-22 | 2013-11-12 | 積層セラミック電子部品及びその実装基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9978514B2 (ja) |
JP (1) | JP2014216643A (ja) |
CN (1) | CN104112596B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019029378A (ja) * | 2017-07-25 | 2019-02-21 | Tdk株式会社 | 電子部品及びその製造方法 |
JP2019046823A (ja) * | 2017-08-29 | 2019-03-22 | 京セラ株式会社 | チップ型電子部品およびモジュール |
US11380490B2 (en) | 2019-11-29 | 2022-07-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180124211A (ko) * | 2017-05-10 | 2018-11-21 | 주식회사 엘지화학 | 홈이 형성된 칩 부품 |
JP6753421B2 (ja) * | 2018-01-11 | 2020-09-09 | 株式会社村田製作所 | 積層コイル部品 |
JP2020141079A (ja) | 2019-02-28 | 2020-09-03 | 太陽誘電株式会社 | 受動部品及び電子機器 |
JP2021166219A (ja) * | 2020-04-06 | 2021-10-14 | 株式会社村田製作所 | 積層セラミックコンデンサおよび半導体装置 |
JP2021174822A (ja) * | 2020-04-22 | 2021-11-01 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2021174856A (ja) * | 2020-04-24 | 2021-11-01 | 太陽誘電株式会社 | 積層セラミック電子部品、回路基板及び積層セラミック電子部品の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574644A (ja) * | 1991-09-12 | 1993-03-26 | Sony Corp | チツプ形積層セラミツクコンデンサの実装方法 |
JPH0621238U (ja) * | 1992-08-13 | 1994-03-18 | 株式会社明電舎 | チップ部品 |
JPH06349669A (ja) * | 1993-06-14 | 1994-12-22 | Murata Mfg Co Ltd | 積層コンデンサの製造方法 |
JPH0855752A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層コンデンサの実装方法及び積層コンデンサ |
JPH0997735A (ja) * | 1995-09-29 | 1997-04-08 | Mitsubishi Materials Corp | 積層セラミックコンデンサ |
JPH09260206A (ja) * | 1996-03-26 | 1997-10-03 | Taiyo Yuden Co Ltd | 積層コンデンサ |
JP2007134375A (ja) * | 2005-11-08 | 2007-05-31 | Tdk Corp | 積層電子部品、電子装置及び電子部品連 |
JP2012124458A (ja) * | 2010-12-08 | 2012-06-28 | Samsung Electro-Mechanics Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JP2013038332A (ja) * | 2011-08-10 | 2013-02-21 | Tdk Corp | 積層型コンデンサ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444436A (en) * | 1967-04-26 | 1969-05-13 | Erie Technological Prod Inc | Mounted capacitor with spaced terminal feet |
DE3517243A1 (de) * | 1985-05-13 | 1986-11-13 | Siemens AG, 1000 Berlin und 8000 München | Elektrischer kondensator und verfahren zu seiner herstellung |
US5034851A (en) * | 1990-05-23 | 1991-07-23 | American Technical Ceramics Corporation | Miniature monolithic multilayered capacitors and method for trimming |
JP3908715B2 (ja) | 2003-10-24 | 2007-04-25 | Tdk株式会社 | 積層セラミックコンデンサ |
JP2005136132A (ja) | 2003-10-30 | 2005-05-26 | Tdk Corp | 積層コンデンサ |
US7075775B2 (en) * | 2004-05-27 | 2006-07-11 | Kyocera Corporation | Chip-type electronic component |
JP5404312B2 (ja) * | 2009-07-29 | 2014-01-29 | 京セラ株式会社 | 電子装置 |
KR101548773B1 (ko) | 2011-08-22 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터의 회로 기판 실장 구조 |
KR101474126B1 (ko) * | 2013-05-06 | 2014-12-17 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
KR101496814B1 (ko) * | 2013-07-29 | 2015-02-27 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터의 실장 기판 |
-
2013
- 2013-11-12 JP JP2013234089A patent/JP2014216643A/ja active Pending
- 2013-11-14 US US14/080,517 patent/US9978514B2/en active Active
- 2013-11-29 CN CN201310629646.1A patent/CN104112596B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574644A (ja) * | 1991-09-12 | 1993-03-26 | Sony Corp | チツプ形積層セラミツクコンデンサの実装方法 |
JPH0621238U (ja) * | 1992-08-13 | 1994-03-18 | 株式会社明電舎 | チップ部品 |
JPH06349669A (ja) * | 1993-06-14 | 1994-12-22 | Murata Mfg Co Ltd | 積層コンデンサの製造方法 |
JPH0855752A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層コンデンサの実装方法及び積層コンデンサ |
JPH0997735A (ja) * | 1995-09-29 | 1997-04-08 | Mitsubishi Materials Corp | 積層セラミックコンデンサ |
JPH09260206A (ja) * | 1996-03-26 | 1997-10-03 | Taiyo Yuden Co Ltd | 積層コンデンサ |
JP2007134375A (ja) * | 2005-11-08 | 2007-05-31 | Tdk Corp | 積層電子部品、電子装置及び電子部品連 |
JP2012124458A (ja) * | 2010-12-08 | 2012-06-28 | Samsung Electro-Mechanics Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JP2013038332A (ja) * | 2011-08-10 | 2013-02-21 | Tdk Corp | 積層型コンデンサ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019029378A (ja) * | 2017-07-25 | 2019-02-21 | Tdk株式会社 | 電子部品及びその製造方法 |
JP7027713B2 (ja) | 2017-07-25 | 2022-03-02 | Tdk株式会社 | 電子部品及びその製造方法 |
JP2019046823A (ja) * | 2017-08-29 | 2019-03-22 | 京セラ株式会社 | チップ型電子部品およびモジュール |
US11380490B2 (en) | 2019-11-29 | 2022-07-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN104112596B (zh) | 2018-08-31 |
US9978514B2 (en) | 2018-05-22 |
US20140311789A1 (en) | 2014-10-23 |
CN104112596A (zh) | 2014-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6184914B2 (ja) | 積層セラミック電子部品及び積層セラミック電子部品の実装基板 | |
JP6504722B2 (ja) | 積層セラミックキャパシタ、積層セラミックキャパシタの製造方法及び積層セラミックキャパシタの実装基板 | |
KR102018307B1 (ko) | 적층 세라믹 커패시터 및 그 실장 기판 | |
KR102076145B1 (ko) | 적층 세라믹 전자 부품 및 그 실장 기판과 제조 방법 | |
JP2014216643A (ja) | 積層セラミック電子部品及びその実装基板 | |
KR102393213B1 (ko) | 적층 세라믹 커패시터 및 그 제조방법 | |
JP2014212295A (ja) | 積層セラミック電子部品及びその実装基板 | |
KR20140081283A (ko) | 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판 | |
JP2014220477A (ja) | 積層セラミック電子部品及びその実装基板 | |
JP2015057810A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
JP2017195392A (ja) | 積層セラミックキャパシタ | |
JP2014236215A (ja) | 積層セラミック電子部品及び積層セラミック電子部品の実装基板 | |
KR101496815B1 (ko) | 적층 세라믹 전자 부품 및 그 실장 기판 | |
JP2014216637A (ja) | 積層セラミック電子部品及びその実装基板 | |
JP2014212291A (ja) | 積層セラミック電子部品、その製造方法及びその実装基板 | |
JP5725678B2 (ja) | 積層セラミック電子部品、その製造方法及びその実装基板 | |
JP5694459B2 (ja) | 積層セラミック電子部品及びその実装基板 | |
KR102037268B1 (ko) | 적층 세라믹 커패시터 및 그 실장 기판 | |
KR20160053682A (ko) | 적층 세라믹 커패시터, 적층 세라믹 커패시터의 제조 방법 및 적층 세라믹 커패시터의 실장 기판 | |
JP2022008696A (ja) | 積層セラミック電子部品及びその実装基板 | |
JP2014222749A (ja) | 積層セラミック電子部品及びその実装基板 | |
KR102067178B1 (ko) | 적층 세라믹 전자 부품 및 그 실장 기판 | |
KR102500107B1 (ko) | 적층 세라믹 전자부품 | |
KR102436222B1 (ko) | 기판 내장용 적층 세라믹 전자 부품, 그 제조 방법 및 적층 세라믹 전자 부품 내장형 인쇄회로기판 | |
KR20230121320A (ko) | 적층형 전자 부품 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161025 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170328 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170619 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20171128 |