JP2011035198A - Method of manufacturing led light-emitting device - Google Patents
Method of manufacturing led light-emitting device Download PDFInfo
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- JP2011035198A JP2011035198A JP2009180706A JP2009180706A JP2011035198A JP 2011035198 A JP2011035198 A JP 2011035198A JP 2009180706 A JP2009180706 A JP 2009180706A JP 2009180706 A JP2009180706 A JP 2009180706A JP 2011035198 A JP2011035198 A JP 2011035198A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
Description
本発明は、波長変換部材の分析・分類・管理が容易で、ＬＥＤ発光デバイスの発光色や照度を制御し易く、歩留まりが高い上に、更に耐湿性及び放熱性にも優れたＬＥＤ発光デバイスに関するものである。 The present invention relates to an LED light-emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the light emission color and illuminance of the LED light-emitting device, has a high yield, and is excellent in moisture resistance and heat dissipation. Is.
従来、窒化ガリウム系化合物半導体を用いて青色光又は紫外線を放射するＬＥＤ素子と種々の蛍光体とを組み合わせることにより、白色をはじめとするＬＥＤ素子の発光色とは異なる色の光を発するＬＥＤ発光デバイスが開発されている。ＬＥＤ素子を用いた、このようなＬＥＤ発光デバイスは、小型、省電力、長寿命等の長所があり、表示用光源や照明用光源として広く用いられている。 Conventionally, LED light emission that emits light of a color different from the light emission color of LED elements including white by combining LED elements that emit blue light or ultraviolet rays with various phosphors using a gallium nitride compound semiconductor A device is being developed. Such LED light-emitting devices using LED elements have advantages such as small size, power saving, and long life, and are widely used as display light sources and illumination light sources.
このようなＬＥＤ発光デバイスとしては、凹部が形成された基体の前記凹部内にＬＥＤ素子が実装され、ＬＥＤ素子を覆う透光性の封止部材と、蛍光体を含有する波長変換部材とがＬＥＤ素子側からこの順に設けられているものが知られており（特許文献１）、当該ＬＥＤ発光デバイスは、封止層が備わっていることにより、ＬＥＤ素子からの光の取り出し効率に優れ、また、蛍光体の熱劣化を防止することができる。 As such an LED light emitting device, an LED element is mounted in the concave portion of the base in which the concave portion is formed, and a translucent sealing member that covers the LED element and a wavelength conversion member that contains a phosphor are LEDs. What is provided in this order from the element side is known (Patent Document 1), and the LED light emitting device is provided with a sealing layer, so that it has excellent light extraction efficiency from the LED element, Thermal degradation of the phosphor can be prevented.
当該ＬＥＤ発光デバイスを製造するには、ＬＥＤ素子が実装された基体の凹部内に、封止部材用の透光性樹脂を充填し硬化させてから、その上に波長変換部材用の蛍光体含有樹脂組成物を注入する。 In order to manufacture the LED light-emitting device, a light-transmitting resin for a sealing member is filled and cured in a concave portion of a substrate on which an LED element is mounted, and then a phosphor for a wavelength conversion member is contained thereon. A resin composition is injected.
蛍光体が分散した波長変換部材用の樹脂組成物は、複数個のＬＥＤ発光デバイス分を一時に調整してから、所定量ずつ使用するものであるが、当該樹脂組成物中の蛍光体の分散状態は経時的に変化するので、同じ仕様のＬＥＤ発光デバイスであっても、発光色の色目や照度にはロット毎に若干のバラツキが生じる。また、ＬＥＤ素子の発光色や照度にもバラツキがあり、このことも最終製品であるＬＥＤ発光デバイスの発光色や照度のバラツキの原因となる。そして、得られたＬＥＤ発光デバイスを検査装置用の光源として用いる場合には、僅かでもこのようなバラツキがあると検査結果の信頼性が損なわれるので問題となる。 A resin composition for a wavelength conversion member in which a phosphor is dispersed is prepared by adjusting a plurality of LED light emitting devices at one time and then using a predetermined amount. The dispersion of the phosphor in the resin composition Since the state changes with time, even in the LED light emitting device having the same specification, the color of light emission and the illuminance slightly vary from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, which also causes variations in the emission color and illuminance of the LED light-emitting device that is the final product. And when using the obtained LED light-emitting device as a light source for an inspection apparatus, if there is even such slight variation, the reliability of the inspection result is impaired, which is a problem.
このため、従来は、最終製品であるＬＥＤ発光デバイスについて発光色の色目や照度の検査を行い、許容範囲から逸脱するものを排除している。 For this reason, conventionally, the LED light emitting device which is the final product is inspected for the color of emitted light and the illuminance, and those that deviate from the allowable range are excluded.
また、近時ＬＥＤ素子が高出力化することによって、ＬＥＤ素子の発熱量が著しく増大し、その熱によってＬＥＤ素子そのものが劣化するという問題が生じている。また、蛍光体も熱に脆弱であることから、ＬＥＤ素子からの伝熱によって蛍光体が熱劣化すると考えられている。 In addition, recently, the output of LED elements has been increased, and the amount of heat generated by the LED elements has increased remarkably, and the LED element itself has deteriorated due to the heat. Further, since the phosphor is also vulnerable to heat, it is considered that the phosphor is thermally deteriorated by heat transfer from the LED element.
そこで、従来は、ＬＥＤ素子の下に放熱板を敷き、ここから熱を発散させるようにしているが、実際には、例えば紫外線により蛍光体を励起させると、蛍光体が顕著に熱を発し自身の劣化を促進しているという事実を本発明者は鋭意検討により初めて発見した。ＬＥＤ素子を放熱基板上に搭載し、その上を封止部材で覆い、更にその上を波長変換部材で覆い、印加電圧３．５Ｖ、電流３００ｍＡの条件で実験したところ、ＬＥＤ素子の上面発光層部分が８５℃、封止部材の上面が５５℃と言うように温度が下がっているにも拘わらず、波長変換部材の上面温度は６５℃になっており、従来、軽視されていた蛍光体での発熱が顕著であることが確認された。 Therefore, conventionally, a heat sink is laid under the LED element to dissipate heat. However, in practice, when the phosphor is excited by, for example, ultraviolet rays, the phosphor generates significant heat. The present inventor discovered for the first time through intensive studies the fact that the deterioration of the material was promoted. When an LED element is mounted on a heat dissipation substrate, covered with a sealing member, and further covered with a wavelength conversion member, an experiment was conducted under conditions of an applied voltage of 3.5 V and a current of 300 mA. The temperature of the upper surface of the wavelength conversion member is 65 ° C. despite the fact that the temperature is lowered such that the portion is 85 ° C. and the upper surface of the sealing member is 55 ° C. It was confirmed that the exotherm of was remarkable.
本発明はかかる問題点に鑑みなされたものであって、波長変換部材の分析・分類・管理が容易で、ＬＥＤ発光デバイスの発光色や照度を制御し易く、歩留まりの高いＬＥＤ発光デバイスを提供することをその主たる所期課題としたものである。 The present invention has been made in view of the above problems, and provides an LED light emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the emission color and illuminance of the LED light emitting device, and has a high yield. This is the main intended issue.
すなわち本発明に係るＬＥＤ発光デバイスの製造方法は、上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたＬＥＤ素子とを具備し、透光性を有し前記ＬＥＤ素子を封止する封止部材と、蛍光体を含有する波長変換部材とが、前記凹部の底面側からこの順に設けられているＬＥＤ発光デバイスを製造する方法であって、前記波長変換部材が透光性基板上に積層している積層体を作製する積層工程と、前記基体の凹部の底面にＬＥＤ素子を実装する実装工程と、前記ＬＥＤ素子が実装された前記基体の凹部に封止部材用の透光性樹脂を充填して前記ＬＥＤ素子を封止する封止工程と、前記透光性樹脂を硬化させる前に、前記透光性樹脂が充填された前記基体の凹部の開口部を、前記透光性基板が前記凹部の底面側を向くように前記積層体で覆う搭載工程とを備えていることを特徴とする。 That is, the manufacturing method of the LED light-emitting device according to the present invention includes a base body having a recess opening in an upper end surface, and an LED element mounted on the bottom surface of the recess, and has translucency and the LED element. A method of manufacturing an LED light emitting device in which a sealing member to be sealed and a wavelength conversion member containing a phosphor are provided in this order from the bottom surface side of the recess, the wavelength conversion member being translucent A laminating process for producing a laminate laminated on a substrate, a mounting process for mounting an LED element on the bottom surface of the recess of the substrate, and a sealing member transparent member in the recess of the substrate on which the LED element is mounted. A sealing step of sealing the LED element by filling with a light-transmitting resin, and an opening of the concave portion of the base body filled with the light-transmitting resin before the light-transmitting resin is cured; The optical substrate faces the bottom side of the recess. Characterized in that it includes a mounting step of covering with serial laminate.
上述のとおり、波長変換部材用の蛍光体含有樹脂組成物は、複数個のＬＥＤ発光デバイス分を一時に調整するものであるが、蛍光体含有樹脂組成物中の蛍光体の分散状態は経時的に変化するので、同じ仕様のＬＥＤ発光デバイスであっても、発光色の色目や照度にはロット毎に若干のバラツキが生じる。また、ＬＥＤ素子の発光色や照度にもバラツキがあり、このことが最終製品であるＬＥＤ発光デバイスの発光色や照度のバラツキの原因となっている。 As described above, the phosphor-containing resin composition for the wavelength conversion member adjusts a plurality of LED light emitting devices at a time, but the dispersion state of the phosphor in the phosphor-containing resin composition is temporal. Therefore, even if the LED light emitting device has the same specification, the color of light emission and the illuminance slightly vary from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, and this causes variations in the emission color and illuminance of the LED light emitting device as the final product.
これに対して、本発明では、前記波長変換部材と前記透光性基板との積層体を、前記ＬＥＤ素子が実装された基体とは別体として作製してから、前記ＬＥＤ素子が実装された基体に前記積層体を搭載するので、波長と光強度が予め定められた、例えば近紫外線を発する基準光源を使用して、前記積層体の発光色や照度等を測定し、バラツキのある前記積層体群を発光色や照度等に従い分類・管理し、所望の発光色や照度等を有するものを選び出して、適合するＬＥＤ素子と組み合わせて所期の性能を有するＬＥＤ発光デバイスを作製することができる。このため、最終製品であるＬＥＤ発光デバイスの発光色や照度等のバラツキを極力抑えることができる。 On the other hand, in the present invention, the laminate of the wavelength conversion member and the translucent substrate is manufactured separately from the base on which the LED element is mounted, and then the LED element is mounted. Since the laminate is mounted on the substrate, the wavelength and light intensity are determined in advance, for example, a reference light source that emits near ultraviolet rays is used to measure the emission color, illuminance, and the like of the laminate, and the laminate having variations Classification and management of body groups according to luminescent color, illuminance, etc., selecting those having the desired luminescent color, illuminance, etc., and combining them with suitable LED elements can produce LED light emitting devices with the expected performance . For this reason, it is possible to suppress variations in the emission color, illuminance, and the like of the LED light emitting device that is the final product as much as possible.
また、前記透光性基板は、前記波長変換部材及び前記封止部材の放熱作用も発揮するので、前記波長変換部材中の蛍光体が熱劣化することに起因するＬＥＤ発光デバイスの発光色の変化を良好に抑制することができる。 Further, since the light-transmitting substrate also exhibits a heat dissipation action of the wavelength conversion member and the sealing member, a change in emission color of the LED light-emitting device due to thermal deterioration of the phosphor in the wavelength conversion member. Can be suppressed satisfactorily.
更に、前記封止部材用の透光性樹脂としては気体透過率が高いシリコーン樹脂が使用されることがあるが、前記封止部材を前記透光性基板で覆うことにより、前記凹部内への気体の侵入を抑制することができるので、前記凹部の側面及び底面に銀等の金属薄膜からなるリフレクタが形成されていても、当該金属薄膜の酸化、硫化、塩化等による腐食等を防止することができる。また、前記透光性基板は防水機能も発現しうる。 Furthermore, a silicone resin having a high gas permeability may be used as the translucent resin for the sealing member, but by covering the sealing member with the translucent substrate, Since the intrusion of gas can be suppressed, even if a reflector made of a metal thin film such as silver is formed on the side surface and bottom surface of the recess, the metal thin film is prevented from being corroded by oxidation, sulfidation, chloride, etc. Can do. Further, the translucent substrate can also exhibit a waterproof function.
また、ＬＥＤ素子は点光源であるので、光の取り出し効率を上げるためには、ＬＥＤ素子と蛍光体とは近接していることが好ましいが、蛍光体はＬＥＤ素子からの熱により劣化してしまうので、そのバランスが最適になるように蛍光体とＬＥＤ素子との距離を管理することが必要である。しかしながら、従来のように、ＬＥＤ素子が実装された基体の凹部内に透光性樹脂を充填し硬化させてから、その上に蛍光体含有樹脂組成物を注入するようにする方法では、凹部の側面の状態や透光性樹脂の粘度等によっては、透光性樹脂が基体凹部の側面をせり上がり、封止部材と波長変換部材の界面が窪んだ状態で硬化することがあるので、透光性樹脂の充填量を厳密に管理しても、ＬＥＤ素子と蛍光体（波長変換部材）との距離を再現性よく管理することは難しい。これに対して、本発明では、前記波長変換部材と前記透光性基板との積層体を、前記ＬＥＤ素子が実装された基体とは別体として作製し、かつ、前記基体の凹部に充填した透光性樹脂が硬化する前に、前記凹部の開口部を覆うように、前記積層体を前記透光性樹脂の上に載置することにより、予め作製された積層体から波長変換部材の厚さが所望のものを選び出すことができるので、ＬＥＤ素子と蛍光体（波長変換部材）との距離を再現性よく管理することができる。このため、例えば、蛍光体の熱劣化への対応も容易となる。 Further, since the LED element is a point light source, in order to increase the light extraction efficiency, it is preferable that the LED element and the phosphor are close to each other, but the phosphor is deteriorated by heat from the LED element. Therefore, it is necessary to manage the distance between the phosphor and the LED element so that the balance is optimal. However, as in the prior art, in the method in which the light-transmitting resin is filled and cured in the concave portion of the substrate on which the LED element is mounted, and then the phosphor-containing resin composition is injected thereon, Depending on the state of the side surface and the viscosity of the translucent resin, the translucent resin may rise up the side surface of the substrate recess and harden in a state where the interface between the sealing member and the wavelength conversion member is depressed. Even if the filling amount of the functional resin is strictly managed, it is difficult to manage the distance between the LED element and the phosphor (wavelength conversion member) with good reproducibility. On the other hand, in the present invention, the laminate of the wavelength conversion member and the translucent substrate is produced as a separate body from the base on which the LED element is mounted, and the concave portion of the base is filled. Before the translucent resin is cured, by placing the laminate on the translucent resin so as to cover the opening of the concave portion, the thickness of the wavelength conversion member from the prefabricated laminate is increased. Therefore, the distance between the LED element and the phosphor (wavelength conversion member) can be managed with good reproducibility. For this reason, for example, it becomes easy to cope with thermal deterioration of the phosphor.
前記積層工程としては、具体的には、例えば、蛍光体含有樹脂組成物を前記透光性基板上に塗布し、当該蛍光体含有樹脂組成物を硬化させる工程が挙げられ、なかでも、ポッティングにより前記蛍光体含有樹脂組成物を塗布すると、前記蛍光体含有樹脂組成物の塗布量の管理が容易になる。なお、前記蛍光体含有樹脂組成物を硬化させるとは、硬化前の前記透光性樹脂よりも硬い状態にすることを意味する。 Specific examples of the laminating step include a step of applying a phosphor-containing resin composition onto the light-transmitting substrate and curing the phosphor-containing resin composition. When the phosphor-containing resin composition is applied, management of the coating amount of the phosphor-containing resin composition becomes easy. In addition, hardening the said fluorescent substance containing resin composition means making it a harder state than the said translucent resin before hardening.
前記積層体は、複数個を一括して作製してもよく、この場合、前記積層工程が、複数個分の前記透光性基板が一体となった大基板上に、波長変換部材用の蛍光体含有樹脂組成物を、複数個の前記波長変換部材が形成されるように、例えばインクジェットプリンター等を用いて印刷し、当該蛍光体含有樹脂組成物を硬化させて、複数個の前記積層体を一体として作製する工程と、その上に複数個の前記波長変換部材が形成された大基板を切断して、複数個の前記積層体を切り出す工程とからなることが好ましい。 A plurality of the laminates may be produced in a lump, and in this case, the lamination step is performed on a large substrate on which a plurality of the light-transmitting substrates are integrated. The phosphor-containing resin composition is printed using, for example, an ink jet printer so that a plurality of the wavelength conversion members are formed, and the phosphor-containing resin composition is cured to form a plurality of the laminates. It is preferable that the manufacturing method includes a step of manufacturing as a single body, and a step of cutting a large substrate on which a plurality of the wavelength conversion members are formed to cut out the plurality of laminated bodies.
この際、赤色光を発する蛍光体（以下、赤色蛍光体という。）を含有する蛍光体含有樹脂組成物と、緑色光を発する蛍光体（以下、緑色蛍光体という。）を含有する蛍光体含有樹脂組成物と、青色光を発する蛍光体（以下、青色蛍光体という。）を含有する蛍光体含有樹脂組成物とを別々に重ねて印刷してもよく、とりわけ、赤色蛍光体含有樹脂組成物と、緑色蛍光体含有樹脂組成物と、青色蛍光体含有樹脂組成物とをこの順に重ねて印刷すると、青色蛍光体が発した青色光や緑色蛍光体が発した緑色光が他の蛍光体に吸収されず、光の取り出し効率やエネルギー変換効率を高くすることができるので好ましい。 In this case, a phosphor-containing resin composition containing a phosphor that emits red light (hereinafter referred to as a red phosphor) and a phosphor containing a phosphor that emits green light (hereinafter referred to as a green phosphor). A resin composition and a phosphor-containing resin composition containing a phosphor that emits blue light (hereinafter referred to as a blue phosphor) may be printed separately, and in particular, a red phosphor-containing resin composition. When the green phosphor-containing resin composition and the blue phosphor-containing resin composition are printed in this order, the blue light emitted from the blue phosphor and the green light emitted from the green phosphor are transferred to other phosphors. This is preferable because the light extraction efficiency and energy conversion efficiency can be increased without being absorbed.
前記封止工程においては、前記透光性樹脂の表面が膨出するように、前記基体の凹部に前記透光性樹脂を充填してもよい。なお、本発明において「前記透光性樹脂の表面が膨出する」とは、前記透光性樹脂の表面上の１点が頂点となるように、充填した前記透光性樹脂が盛り上がっていることをいう。 In the sealing step, the translucent resin may be filled in the recesses of the base so that the surface of the translucent resin swells. In the present invention, “the surface of the translucent resin swells” means that the filled translucent resin is raised so that one point on the surface of the translucent resin is a vertex. That means.
このようなものであれば、前記凹部の開口部を前記積層体で覆う際に、最初に前記透光性樹脂の表面上の頂点が前記積層体と接し、前記頂点を起点として連続的に前記透光性樹脂と前記積層体との接触面積が拡大していくので、前記透光性樹脂と前記積層体との間に気泡が形成されにくい。 If it is such, when covering the opening of the concave portion with the laminate, the vertex on the surface of the translucent resin is first in contact with the laminate, and continuously from the vertex as the starting point. Since the contact area between the translucent resin and the laminate increases, bubbles are not easily formed between the translucent resin and the laminate.
また、前記搭載工程の前に、前記積層体の表面のうち前記透光性基板側の表面に、前記透光性樹脂を付着させる樹脂付着工程を、更に備えていてもよい。前記積層体の前記透光性基板側の表面に、ポッティング等により透光性樹脂を付着させて、膨出部を形成し、当該膨出部が、凹部内に充填した透光性樹脂と最初に接するように、前記凹部の開口部を前記積層体で覆うことにより、前記膨出部から連続的に前記透光性樹脂と前記積層体との接触面積が拡大していくので、前記透光性樹脂と前記積層体との間に気泡が形成されにくい。 Moreover, you may further provide the resin adhesion process which adheres the said translucent resin to the surface at the side of the said translucent board | substrate among the surfaces of the said laminated body before the said mounting process. A translucent resin is adhered to the surface of the laminated body on the translucent substrate side by potting or the like to form a bulge portion, and the bulge portion and the translucent resin filled in the recess are first By covering the opening of the recess with the laminated body so as to come into contact, the contact area between the translucent resin and the laminated body is continuously expanded from the bulged portion. Air bubbles are hardly formed between the functional resin and the laminate.
このような製造方法により得られるＬＥＤ発光デバイスもまた、本発明の１つである。すなわち本発明に係るＬＥＤ発光デバイスは、上端面に開口する凹部を有する基体と、前記凹部の底面に実装されたＬＥＤ素子と、透光性を有し前記ＬＥＤ素子を封止する封止部材と、前記封止部材を前記凹部内に気密的に封ずるように、前記封止部材の上に設けられた透光性基板と、蛍光体を含有するものであって、前記透光性基板の上に設けられた波長変換部材とを備えていることを特徴とする。 An LED light-emitting device obtained by such a manufacturing method is also one aspect of the present invention. That is, the LED light-emitting device according to the present invention includes a base having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, and a sealing member that has translucency and seals the LED element. And a light-transmitting substrate provided on the sealing member so as to hermetically seal the sealing member in the recess, and a phosphor. And a wavelength conversion member provided on the top.
本発明に係るＬＥＤ発光デバイスとしては、具体的には、前記ＬＥＤ素子が、紫外線又は短波長の可視光線を発するものであり、前記蛍光体が、赤色蛍光体、緑色蛍光体、及び、青色蛍光体であるものが挙げられる。 Specifically, as the LED light emitting device according to the present invention, the LED element emits ultraviolet light or visible light having a short wavelength, and the phosphor is a red phosphor, a green phosphor, and a blue phosphor. The thing which is a body is mentioned.
前記透光性基板としては特に限定されないが、例えば、紫外線及び短波長の可視光線を透過して、より長波長の可視光線を反射する短波長透過フィルタを用いた場合は、前記ＬＥＤ素子が発した紫外線や短波長の可視光線により励起された前記蛍光体が発する可視光線のうち、前記ＬＥＤ素子が実装された基体に向かって進行したものは、前記短波長透過フィルタで反射して、進行方向を変えて装置外に射出される。このため、蛍光体により変換された可視光線を効率的に装置外に取り出すことができる。 The translucent substrate is not particularly limited. For example, when a short-wavelength transmission filter that transmits ultraviolet rays and short-wavelength visible rays and reflects longer-wavelength visible rays is used, the LED element emits light. Of the visible light emitted from the phosphor excited by ultraviolet light or short wavelength visible light, the light traveling toward the substrate on which the LED element is mounted is reflected by the short wavelength transmission filter and travels in the direction of travel. It is injected out of the device by changing. For this reason, the visible light converted by the phosphor can be efficiently taken out of the apparatus.
前記ＬＥＤ素子としては、具体的には、４３０ｎｍ以下に放射ピークを有するものが好適に用いられ、より好ましくは３６０〜４３０ｎｍの近紫外領域に放射ピークを有するものである。 As the LED element, specifically, one having a radiation peak at 430 nm or less is preferably used, and more preferably has a radiation peak in the near ultraviolet region of 360 to 430 nm.
前記短波長透過フィルタとしては、具体的には、光の反射率と透過率との高低が逆転する境界を、前記ＬＥＤ素子の放射ピーク波長より１０ｎｍ以上大きく、かつ、４４０ｎｍ以下の波長領域に有する誘電体多層膜が好適に用いられる。誘電体多層膜は、金属酸化物等の誘電体のなかでも透明性の高い物質からなる薄膜から、屈折率の異なる２つ以上のものを選択して積層してなるものであり、熱伝導性にも優れるものである。 Specifically, the short wavelength transmission filter has a boundary where the light reflectance and transmittance are reversed in a wavelength region of 10 nm or more larger than the emission peak wavelength of the LED element and 440 nm or less. A dielectric multilayer film is preferably used. A dielectric multilayer film is formed by selecting and laminating two or more films having different refractive indexes from a thin film made of a highly transparent substance such as a metal oxide. It is also excellent.
前記波長変換部材には、赤色光を発する蛍光体を含有する層と、緑色を発する蛍光体を含有する層と、青色を発する蛍光体を含有する層とが、前記ＬＥＤ素子側からこの順に形成されていてもよい。 In the wavelength conversion member, a layer containing a phosphor emitting red light, a layer containing a phosphor emitting green, and a layer containing a phosphor emitting blue light are formed in this order from the LED element side. May be.
このような構成の本発明によれば、波長変換部材の分析・分類・管理が容易で、ＬＥＤ発光デバイスの発光色や照度を制御し易く、ＬＥＤ発光デバイスを高い歩留まりで製造することができる。更に、ＬＥＤ発光デバイスの耐湿性や放熱性を向上することもできる。 According to the present invention having such a configuration, the wavelength conversion member can be easily analyzed, classified, and managed, the light emission color and illuminance of the LED light emitting device can be easily controlled, and the LED light emitting device can be manufactured with a high yield. Furthermore, the moisture resistance and heat dissipation of the LED light-emitting device can be improved.
以下に本発明の一実施形態について図面を参照して説明する。 An embodiment of the present invention will be described below with reference to the drawings.
まず、本実施形態に係るＬＥＤ発光デバイス１について説明する。ＬＥＤ発光デバイス１は、図１に示すように、上端面２１に開口する凹部２２を有した基体２と、凹部２２の底面２２１に実装されたＬＥＤ素子３と、ＬＥＤ素子３を封止する封止部材４と、封止部材４の上に設けられて凹部２２の開口部を覆う透光性基板５と、透光性基板５の上に設けられた波長変換部材６とを備えたものである。 First, the LED light emitting device 1 according to the present embodiment will be described. As shown in FIG. 1, the LED light emitting device 1 includes a base body 2 having a recess 22 that opens to an upper end surface 21, an LED element 3 mounted on a bottom surface 221 of the recess 22, and a seal that seals the LED element 3. It is provided with a stop member 4, a translucent substrate 5 provided on the sealing member 4 and covering the opening of the recess 22, and a wavelength conversion member 6 provided on the translucent substrate 5. is there.
以下に各部を詳述する。
基体２は、上端面２１に開口し、底面２２１から開口部に向けて拡開する切頭円錐形状をなす凹部２２を有するものであり、例えば、アルミナや窒化アルミニウム等の熱伝導率が高い絶縁材料を成型してなるものである。
Each part is described in detail below.
The base 2 has a recess 22 having a truncated conical shape that opens to the upper end surface 21 and expands from the bottom surface 221 toward the opening. For example, an insulating material having high thermal conductivity such as alumina or aluminum nitride. It is made by molding a material.
基体２は、その凹部２２の底面２２１に後述するＬＥＤ素子３を実装するものであるが、当該底面２２１には、ＬＥＤ素子３が電気的に接続されるための配線導体（図示しない。）が形成されている。この配線導体が基体２内部に形成された配線層（図示しない。）を介してＬＥＤ発光デバイス１の外表面に導出されて外部電気回路基板に接続されることにより、ＬＥＤ素子３と外部電気回路基板とが電気的に接続される。 The base body 2 mounts an LED element 3 to be described later on the bottom surface 221 of the recess 22, and a wiring conductor (not shown) for electrically connecting the LED element 3 to the bottom surface 221. Is formed. This wiring conductor is led to the outer surface of the LED light emitting device 1 through a wiring layer (not shown) formed inside the base 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit are connected. The substrate is electrically connected.
基体２の凹部２２の側面２２２及び底面２２１を含む内面には、銀等の金属メッキ等が施されることにより高反射率の金属薄膜２３が形成されており、リフレクタとして機能している。 A metal thin film 23 having high reflectivity is formed on the inner surface including the side surface 222 and the bottom surface 221 of the concave portion 22 of the base 2 by performing metal plating of silver or the like, and functions as a reflector.
ＬＥＤ素子３は、紫外線や短波長の可視光線を発するものであり、例えば３６０〜４３０ｎｍに放射ピークを有するものである。このようなＬＥＤ素子３は、例えば、サファイア基板や窒化ガリウム基板の上に窒化ガリウム系化合物半導体がｎ型層、発光層及びｐ型層の順に積層したものである。 The LED element 3 emits ultraviolet rays or short-wavelength visible light, and has a radiation peak at 360 to 430 nm, for example. For example, the LED element 3 is formed by laminating a gallium nitride-based compound semiconductor in the order of an n-type layer, a light-emitting layer, and a p-type layer on a sapphire substrate or a gallium nitride substrate.
ＬＥＤ素子３は、窒化ガリウム系化合物半導体を下（凹部２２の底面２２１側）にして凹部２２の底面２２１に半田バンプや金バンプ等（図示しない。）を用いてフリップチップ実装されている。 The LED element 3 is flip-chip mounted on the bottom surface 221 of the recess 22 with solder bumps or gold bumps (not shown) with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the recess 22).
封止部材４は、凹部２２に充実されてＬＥＤ素子３を封止しており、例えば、透光性及び耐熱性に優れ、ＬＥＤ素子３との屈折率差が小さいシリコーン樹脂等の透光性樹脂４からなるものである。このような封止部材４が備わっていると、ＬＥＤ素子３からの光の取り出し効率が向上し、また、波長変換部材６中の蛍光体６１の熱劣化を防止することができる。 The sealing member 4 is filled in the concave portion 22 and seals the LED element 3. For example, the sealing member 4 is excellent in translucency and heat resistance, and has a translucency such as a silicone resin having a small refractive index difference from the LED element 3. It is made of resin 4. When such a sealing member 4 is provided, the light extraction efficiency from the LED element 3 can be improved, and thermal deterioration of the phosphor 61 in the wavelength conversion member 6 can be prevented.
透光性基板５は、製造工程において波長変換部材６の塗装基板として機能するものであり、封止部材４の上に設けられて、凹部２２の開口部を覆っており、封止部材４を凹部２２内に気密的に封じている。封止部材４を構成するシリコーン樹脂は気体透過率が高いところ、凹部２２の開口部を透光性基板５で覆うことにより、凹部２２内への気体の侵入を抑制することができるので、凹部２２の内面に形成された金属薄膜２３の酸化、硫化、塩化等による腐食等を防止することができる。また、透光性基板５は防水機能も発現しうる。 The translucent substrate 5 functions as a coated substrate for the wavelength conversion member 6 in the manufacturing process, and is provided on the sealing member 4 to cover the opening of the recess 22. The recess 22 is hermetically sealed. Since the silicone resin constituting the sealing member 4 has a high gas permeability, it is possible to suppress the intrusion of gas into the recess 22 by covering the opening of the recess 22 with the translucent substrate 5. Corrosion due to oxidation, sulfidation, chlorination, etc. of the metal thin film 23 formed on the inner surface of 22 can be prevented. Moreover, the translucent board | substrate 5 can also express a waterproof function.
本実施形態では、透光性基板５として、可視光線を反射して、紫外領域から近紫外領域の光のみを選択的に透過する短波長透過フィルタが用いられている。当該短波長透過フィルタは、具体的には、例えば、図２に示すように、４３０ｎｍ近傍を境界として、光の透過率と反射率とが逆転する誘電体多層膜である。このような誘電体多層膜は、例えばガラス基板等に膜材料を付着させることにより形成される。 In the present embodiment, a short wavelength transmission filter that reflects visible light and selectively transmits only light from the ultraviolet region to the near ultraviolet region is used as the translucent substrate 5. Specifically, for example, as shown in FIG. 2, the short wavelength transmission filter is a dielectric multilayer film in which the light transmittance and the reflectance are reversed around 430 nm as a boundary. Such a dielectric multilayer film is formed, for example, by attaching a film material to a glass substrate or the like.
波長変換部材６は、内部に蛍光体６１が分散しているものであり、透光性基板５の上に設けられている。このような波長変換部材６としては、例えば、透光性及び耐熱性に優れ、封止部材４との屈折率差が小さいシリコーン樹脂等の透光性樹脂中に蛍光体６１が分散しているものが挙げられる。 The wavelength conversion member 6 has a phosphor 61 dispersed therein, and is provided on the translucent substrate 5. As such a wavelength conversion member 6, for example, the phosphor 61 is dispersed in a translucent resin such as a silicone resin that is excellent in translucency and heat resistance and has a small refractive index difference from the sealing member 4. Things.
波長変換部材６は、本実施形態では、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ、青色蛍光体６１Ｂを含有しており、それぞれの蛍光体６１を含有する層が、ＬＥＤ素子３側から、赤色蛍光体含有層６Ｒ、緑色蛍光体含有層６Ｇ、青色蛍光体含有層６Ｂの順に形成されている。 In this embodiment, the wavelength conversion member 6 includes a red phosphor 61R, a green phosphor 61G, and a blue phosphor 61B, and the layers containing the respective phosphors 61 are red fluorescent from the LED element 3 side. The body-containing layer 6R, the green phosphor-containing layer 6G, and the blue phosphor-containing layer 6B are formed in this order.
赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ及び青色蛍光体６１Ｂが、ＬＥＤ素子３が発した紫外線や短波長の可視光線によって励起されると、各蛍光体６１が発する赤色光、緑色光及び青色光が混ざり合って白色光が発せられる。そして、ＬＥＤ素子３が発する紫外線や短波長の可視光線はＬＥＤ発光デバイス１の発光色である白色に実質的に影響しにくい。このため、例えば、ＬＥＤ素子３が青色光を発するものであって、当該青色光が蛍光体６１から発した光と混ざり合うように構成してある場合は、ＬＥＤ発光デバイス１の発光面において光路長の差に由来する色調むらが生じやすいが、ＬＥＤ素子３が紫外線や短波長の可視光線を発するものであって、蛍光体６１が、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ及び青色蛍光体６１ＢであるＬＥＤ発光デバイス１では、このような色調むらが生じにくい。 When the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B are excited by ultraviolet rays or short-wavelength visible light emitted from the LED elements 3, red light, green light, and blue light emitted from the phosphors 61 are emitted. It mixes and emits white light. And the ultraviolet-ray and short wavelength visible light which LED element 3 emits cannot affect the white which is the luminescent color of LED light-emitting device 1 substantially. For this reason, for example, when the LED element 3 emits blue light and the blue light is configured to mix with the light emitted from the phosphor 61, the optical path on the light emitting surface of the LED light emitting device 1. Although the color tone unevenness due to the difference in length is likely to occur, the LED element 3 emits ultraviolet rays or visible light having a short wavelength, and the phosphor 61 is composed of a red phosphor 61R, a green phosphor 61G, and a blue phosphor 61B. In such an LED light-emitting device 1, such uneven color tone is unlikely to occur.
そして、本実施形態のような、ＬＥＤ素子３として紫外線や短波長の可視光線を発するものを用い、蛍光体６１として、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ及び青色蛍光体６１Ｂを用いたＬＥＤ発光デバイス１が発する混合光は、プランク軌跡上を移動するものであって、太陽光に極めて近い自然な白色である。 Then, LED emission using ultraviolet light or short wavelength visible light as the LED element 3 as in the present embodiment, and red phosphor 61R, green phosphor 61G and blue phosphor 61B as the phosphor 61 is used. The mixed light emitted from the device 1 moves on the Planck locus and is a natural white color very close to sunlight.
次に、本実施形態に係るＬＥＤ発光デバイス１の製造方法について、図３及び図４を参照して説明する。 Next, the manufacturing method of the LED light-emitting device 1 which concerns on this embodiment is demonstrated with reference to FIG.3 and FIG.4.
まず、図３に示すように、複数個分の透光性基板５に相当する大きさの大基板Ｂ上に、複数個の波長変換部材６が一括して作製されるように、波長変換部材６用の蛍光体含有樹脂組成物６をインクジェットプリンター等を用いて印刷する。この際、赤色蛍光体６１Ｒを含有する赤色蛍光体含有樹脂組成物６Ｒと、緑色蛍光体６１Ｇを含有する緑色蛍光体含有樹脂組成物６Ｇと、青色蛍光体６１Ｂを含有する青色蛍光体含有樹脂組成物６Ｂとを別々に、この順に重ねて印刷する。 First, as shown in FIG. 3, the wavelength conversion member is formed so that a plurality of wavelength conversion members 6 are collectively produced on a large substrate B having a size corresponding to a plurality of translucent substrates 5. The phosphor-containing resin composition 6 for 6 is printed using an inkjet printer or the like. At this time, the red phosphor-containing resin composition 6R containing the red phosphor 61R, the green phosphor-containing resin composition 6G containing the green phosphor 61G, and the blue phosphor-containing resin composition containing the blue phosphor 61B. The product 6B is printed separately in this order.
その後、加熱したり光（紫外線を含む）照射したりして大基板Ｂ上に印刷された蛍光体含有樹脂組成物６を硬化させて、波長変換部材６が透光性基板５上に積層してなる積層体７を、複数個分を一体として作製する。次いで、その上に複数個の波長変換部材６が一体として形成された大基板Ｂをレーザ等により切断して、複数個の積層体７を切り出す。 Thereafter, the phosphor-containing resin composition 6 printed on the large substrate B is cured by heating or irradiation with light (including ultraviolet rays), and the wavelength conversion member 6 is laminated on the translucent substrate 5. A plurality of laminated bodies 7 are manufactured as a unit. Next, the large substrate B on which the plurality of wavelength conversion members 6 are integrally formed is cut with a laser or the like, and a plurality of laminated bodies 7 are cut out.
続いて、基体２の凹部２２の底面２２１にＬＥＤ素子３を実装して、そこに封止部材４用の透光性樹脂４を、その表面が膨出するように、必要量より多めに充填する。 Subsequently, the LED element 3 is mounted on the bottom surface 221 of the concave portion 22 of the base 2, and the translucent resin 4 for the sealing member 4 is filled in a larger amount than necessary so that the surface swells there. To do.
ところで、凹部２２の側面２２２に電気パターンが形成されている場合は、透光性樹脂４の粘度が低いと、充填した透光性樹脂４が凹部２２の側面２２２を這い上がりやすくなり、電気パターンがないものと比べて這い上がり量が増える。そうすると、透光性樹脂４の充填量を厳密に管理したとしても、実質的な透光性樹脂４の充填量が這い上がり量によって左右され、かつその這い上がり量を一定にすることは極めて難しいことから、透光性樹脂４の中央部表面の高さがまちまちとなる恐れが多分にある。この現象を抑制し、高さを一定に管理するために、本実施形態では透光性樹脂４の量を多めにして積層体７で蓋をしたときに敢えて溢れさせているわけであるが、透光性樹脂４に、例えば１００ｍｍ２／ｓ以上といった粘度の高い樹脂を用いれば、前記這い上がり量がそもそも減少するため、溢れさせる量、つまり透光性樹脂４の当初充填量をより少なく抑えることが可能になり、凹部２２の側面２２２に電気パターンが形成されているものには特に好ましいものとなる。 By the way, when the electrical pattern is formed on the side surface 222 of the recess 22, if the viscosity of the translucent resin 4 is low, the filled translucent resin 4 tends to scoop up the side surface 222 of the recess 22. Increases the amount of crawls compared to those without. Then, even if the filling amount of the translucent resin 4 is strictly controlled, the substantial filling amount of the translucent resin 4 depends on the rising amount, and it is extremely difficult to make the rising amount constant. For this reason, there is a possibility that the height of the surface of the central portion of the translucent resin 4 will vary. In order to suppress this phenomenon and manage the height to be constant, in this embodiment, the amount of the translucent resin 4 is increased, and when the lid is covered with the laminate 7, it is overflowing. If a resin having a high viscosity of, for example, 100 mm 2 / s or more is used as the translucent resin 4, the amount of scooping is reduced in the first place. Therefore, the amount of overflow, that is, the initial filling amount of the translucent resin 4 is reduced. This is particularly preferable when the electric pattern is formed on the side surface 222 of the recess 22.
そして、透光性樹脂４を硬化させる前に、透光性樹脂４が充填された凹部２２の開口部を、透光性基板５が凹部２２の底面２２１側を向くように積層体７で覆う（図４（ａ））。 And before hardening the translucent resin 4, the opening part of the recessed part 22 with which the translucent resin 4 was filled is covered with the laminated body 7 so that the translucent board | substrate 5 may face the bottom face 221 side of the recessed part 22. FIG. (FIG. 4A).
上述のとおり、凹部２２の側面２２２の状態や透光性樹脂４の粘度等によっては、凹部２２内に充填した透光性樹脂４が凹部２２の側面２２２を這い上がることがあるので、透光性樹脂４の凹部２２内への充填量を厳密に管理しても、その界面の高さを管理することは難しい。これに対して、本実施形態では、凹部２２内に透光性樹脂４を多めに充填して、次いで、透光性樹脂４が充填された凹部２２の開口部を積層体７で覆うので、波長変換部材６（蛍光体６１）とＬＥＤ素子３との距離を容易に管理することができる。 As described above, depending on the state of the side surface 222 of the recess 22 and the viscosity of the translucent resin 4, the translucent resin 4 filled in the recess 22 may crawl up the side surface 222 of the recess 22. Even if the filling amount of the functional resin 4 into the recess 22 is strictly controlled, it is difficult to control the height of the interface. On the other hand, in the present embodiment, the concave portion 22 is filled with a large amount of the translucent resin 4, and then the opening of the concave portion 22 filled with the translucent resin 4 is covered with the laminate 7, The distance between the wavelength conversion member 6 (phosphor 61) and the LED element 3 can be easily managed.
また、透光性樹脂４の表面が膨出するように、透光性樹脂４を必要量より多めに充填すると、まず初めに膨出部４１の頂点が積層体７と接し、透光性樹脂４と積層体７との接触面積が徐々に拡大していく。 Further, when the translucent resin 4 is filled more than necessary so that the surface of the translucent resin 4 swells, the apex of the bulging portion 41 first comes into contact with the laminate 7, and the translucent resin The contact area between 4 and the laminate 7 gradually increases.
凹部２２の開口部を完全に積層体７で覆うと、積層体７と基体２との間に僅かに透光性樹脂４がはみ出すが、シリコーン樹脂等の透光性樹脂４は透明であるので外観や機能に与える影響はほとんどない（図４（ｂ））。なお、凹部２２から溢れ出し、積層体７と基体２との間にはみ出した透光性樹脂４は、積層体７と基体２とを接着させる機能も果たす。 When the opening of the recess 22 is completely covered with the laminate 7, the translucent resin 4 slightly protrudes between the laminate 7 and the base 2, but the translucent resin 4 such as silicone resin is transparent. There is almost no influence on the appearance and function (FIG. 4B). The translucent resin 4 that overflows from the recess 22 and protrudes between the laminate 7 and the base 2 also serves to adhere the laminate 7 and the base 2.
最後に、加熱等して透光性樹脂４を硬化することにより、ＬＥＤ発光デバイス１を得ることができる。 Finally, the LED light-emitting device 1 can be obtained by curing the translucent resin 4 by heating or the like.
このような実施形態であれば、波長変換部材６が透光性基板５上に積層してなる積層体７を、ＬＥＤ素子３が実装された基体２とは別体として作製してから、ＬＥＤ素子３が実装された基体２に積層体７を搭載することより、基準光源を使用して積層体７の発光色や照度等を分析し、バラツキのある積層体７群を発光色や照度等に従い分類・管理し、所望の発光色や照度等を有するものを選び出して、適合するＬＥＤ素子３と組み合わせて所期の性能を有するＬＥＤ発光デバイス１を作製することができる。 If it is such embodiment, after producing the laminated body 7 in which the wavelength conversion member 6 is laminated | stacked on the translucent board | substrate 5, as a different body from the base | substrate 2 with which the LED element 3 was mounted, LED By mounting the laminated body 7 on the substrate 2 on which the element 3 is mounted, the emission color, illuminance, and the like of the laminated body 7 are analyzed using a reference light source, and the group of the laminated bodies 7 having variations is emitted. The LED light-emitting device 1 having the desired performance can be manufactured by combining and classifying and managing the light-emitting elements having the desired emission color, illuminance, and the like and combining them with the suitable LED elements 3.
また、本実施形態では、凹部２２に充填した透光性樹脂４が硬化する前に、凹部２２の開口部を覆うように、透光性樹脂４の上に積層体７を載置することにより、ＬＥＤ素子３と蛍光体６１（波長変換部材６）との距離を再現性よく管理できる。このため、ＬＥＤ素子３からの光の取り出し効率と蛍光体６１が受ける熱の影響とが最適なバランスとなるように、ＬＥＤ素子３と蛍光体６１（波長変換部材６）との距離を制御することができる。 Moreover, in this embodiment, before the translucent resin 4 with which the recessed part 22 was filled hardens | cures, by mounting the laminated body 7 on the translucent resin 4 so that the opening part of the recessed part 22 may be covered. The distance between the LED element 3 and the phosphor 61 (wavelength conversion member 6) can be managed with good reproducibility. For this reason, the distance between the LED element 3 and the phosphor 61 (wavelength conversion member 6) is controlled so that the light extraction efficiency from the LED element 3 and the influence of the heat received by the phosphor 61 are in an optimal balance. be able to.
また、本実施形態では、透光性樹脂４を、その表面が膨出するように、必要量より多めに凹部２２に充填するので、最初に透光性樹脂４の膨出部４１の頂点が積層体７と接し、透光性樹脂４と積層体７との接触面積が徐々に拡大していくので、透光性樹脂４と積層体７との間に気泡が形成されにくい。 In the present embodiment, the translucent resin 4 is filled in the concave portion 22 more than necessary so that the surface of the translucent resin 4 bulges. Since the contact area between the translucent resin 4 and the laminate 7 gradually increases in contact with the laminate 7, bubbles are not easily formed between the translucent resin 4 and the laminate 7.
また、本実施形態で得られたＬＥＤ発光デバイス１は、凹部２２の開口部を覆う透光性基板５を備えているので、凹部２内のリフレクタ２３や、ＬＥＤ素子３、封止部材４を水分やガス等の外部環境因子の影響から守ることができ、耐蝕性に優れたものとなる。また、透光性基板５は波長変換部材６及び封止部材４の放熱部材としても機能するので、蛍光体６１の熱劣化に起因する照射光の色調変化や出力低下等を良好に抑制することができる。 Moreover, since the LED light-emitting device 1 obtained in this embodiment includes the translucent substrate 5 that covers the opening of the recess 22, the reflector 23, the LED element 3, and the sealing member 4 in the recess 2 are provided. It can be protected from the influence of external environmental factors such as moisture and gas, and has excellent corrosion resistance. Moreover, since the translucent board | substrate 5 functions also as a heat radiating member of the wavelength conversion member 6 and the sealing member 4, it suppresses the color tone change of the irradiated light, the output fall, etc. resulting from the thermal deterioration of the fluorescent substance 61 favorably. Can do.
また、本実施形態では、透光性基板５として短波長透過フィルタを用いているので、図５に示すように、ＬＥＤ素子３が発した紫外線や短波長の可視光線Ｕにより励起された蛍光体６１が発する可視光線Ｖのうち、基体２に向かって進行したものは、短波長透過フィルタで反射されて、ＬＥＤ発光デバイス１外に射出される。従って、透光性基板５として短波長透過フィルタを用いることにより、変換された可視光線Ｖを効率的にＬＥＤ発光デバイス１外に取り出すことができる。 In the present embodiment, since a short wavelength transmission filter is used as the translucent substrate 5, as shown in FIG. 5, the phosphor excited by ultraviolet rays or short wavelength visible light U emitted from the LED element 3. Of the visible light V emitted by 61, the light traveling toward the substrate 2 is reflected by the short wavelength transmission filter and emitted outside the LED light emitting device 1. Therefore, by using a short wavelength transmission filter as the translucent substrate 5, the converted visible light V can be efficiently taken out of the LED light emitting device 1.
また、本実施形態では、波長変換部材６中で、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ、青色蛍光体６１Ｂをそれぞれの含有する層が、ＬＥＤ素子３側から、赤色蛍光体含有層６Ｒ、緑色蛍光体含有層６Ｇ、青色蛍光体含有層６Ｂの順に形成されているので、青色蛍光体６１Ｂが発した青色光や緑色蛍光体６１Ｇが発した緑色光が他の蛍光体６１に吸収されず、このため、エネルギー変換効率、光の取り出し効率を向上することができる。 In the present embodiment, the layers containing the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B in the wavelength conversion member 6 are respectively arranged from the LED element 3 side to the red phosphor containing layer 6R, green. Since the phosphor-containing layer 6G and the blue phosphor-containing layer 6B are formed in this order, the blue light emitted from the blue phosphor 61B and the green light emitted from the green phosphor 61G are not absorbed by the other phosphors 61, For this reason, energy conversion efficiency and light extraction efficiency can be improved.
なお、本発明は前記実施形態に限られるものではない。 The present invention is not limited to the above embodiment.
例えば、透光性基板５に蛍光体含有樹脂組成物６を塗布する方法は印刷に限られず、ポッティングや、ディッピング等であってもよい。また、複数個の積層体７を一括して作製せずに、１個ずつ作製してもよい。 For example, the method of applying the phosphor-containing resin composition 6 to the translucent substrate 5 is not limited to printing, and may be potting or dipping. Moreover, you may produce one by one, without producing the several laminated body 7 collectively.
また、図６に示すように、積層体７の透光性基板５側の表面にポッティング等により透光性樹脂４を付着させて、膨出部４２を形成してもよい。このように膨出部４２を形成し、当該膨出部４２が、凹部２２内に充填した透光性樹脂４と最初に接するように、凹部２２の開口部を積層体７で覆うことにより、膨出部４２から連続的に透光性樹脂４と積層体７との接触面積が拡大していくので、透光性樹脂４と積層体７との間に気泡が形成されにくい。 In addition, as shown in FIG. 6, the bulging portion 42 may be formed by attaching the translucent resin 4 to the surface of the laminated body 7 on the translucent substrate 5 side by potting or the like. By forming the bulging portion 42 in this way and covering the opening of the concave portion 22 with the laminate 7 so that the bulging portion 42 first contacts the translucent resin 4 filled in the concave portion 22, Since the contact area between the translucent resin 4 and the laminate 7 continuously increases from the bulging portion 42, it is difficult for bubbles to be formed between the translucent resin 4 and the laminate 7.
ＬＥＤ素子３は、紫外線や短波長の可視光線を発するものに限定されず、青色光を発するものであってもよい。また、ＬＥＤ素子３はフリップチップ実装されていなくともよく、基体２に設けられた配線導体にワイヤボンディングを用いて接続されていてもよい。 The LED element 3 is not limited to one that emits ultraviolet rays or visible light having a short wavelength, and may emit blue light. Further, the LED element 3 may not be flip-chip mounted, and may be connected to a wiring conductor provided on the base 2 using wire bonding.
透光性基板５は、短波長透過フィルタに限定されず、透光性を有するものであれば他のものを用いることもでき、例えば、ダイヤモンド、サファイア、水晶、ガラス、プラスチック等からなるものであってもよい。なかでも、透光性基板５がダイヤモンド、サファイア、水晶等の水晶以上の高い熱伝導率を有する材料からなる場合は、波長変換部材６の熱を透光性基板５を通して効率的に放出することができるので、波長変換部材６に含まれる蛍光体６１の熱変性や熱劣化を効果的に防ぐことができる。 The translucent substrate 5 is not limited to a short-wavelength transmission filter, and any other translucent substrate can be used as long as it has translucency. For example, the translucent substrate 5 is made of diamond, sapphire, crystal, glass, plastic, or the like. There may be. In particular, when the translucent substrate 5 is made of a material having a higher thermal conductivity than that of quartz, such as diamond, sapphire, or quartz, the heat of the wavelength conversion member 6 can be efficiently released through the translucent substrate 5. Therefore, thermal denaturation and thermal degradation of the phosphor 61 included in the wavelength conversion member 6 can be effectively prevented.
波長変換部材６は、蛍光体６１の種類毎に分かれた層状構造を有していなくてもよく、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ及び青色蛍光体６１Ｂが、一層からなる波長変換部材６中に混在していてもよい。また、波長変換部材６が含有する蛍光体６１は、赤色蛍光体６１Ｒ、緑色蛍光体６１Ｇ、青色蛍光体６１Ｂに限定されず、黄色蛍光体であってもよい。黄色蛍光体を含有する波長変換部材６と、青色光を発するＬＥＤ素子３とを組み合わせて用いることによっても、ＬＥＤ発光デバイス１に白色光を射出させることができる。 The wavelength conversion member 6 does not have to have a layered structure divided for each type of the phosphor 61, and the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B are included in the wavelength conversion member 6 including one layer. May be mixed. The phosphor 61 contained in the wavelength conversion member 6 is not limited to the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B, and may be a yellow phosphor. White light can also be emitted to the LED light-emitting device 1 by using a combination of the wavelength conversion member 6 containing a yellow phosphor and the LED element 3 that emits blue light.
基体２は、凹部２２が底面２２１から開口部に向けて拡開する切頭円錐形状をなすものに限定されず、例えば、凹部２２が円柱形状をなすものであってもよい。また、基体２は、図７に示すように、凹部２２の側面２２２に段部２４が形成されていて、当該段部２４の上端面に、透光性基板５側の周縁部が載置されるように積層体７を配設することにより、積層体７が基体２に対し、光軸方向にも軸直交方向にも位置決めされるように構成してあってもよい。 The base body 2 is not limited to one having a truncated cone shape in which the concave portion 22 expands from the bottom surface 221 toward the opening portion. For example, the concave portion 22 may have a cylindrical shape. Further, as shown in FIG. 7, the base body 2 has a stepped portion 24 formed on the side surface 222 of the concave portion 22, and a peripheral portion on the translucent substrate 5 side is placed on the upper end surface of the stepped portion 24. By disposing the laminated body 7 as described above, the laminated body 7 may be configured to be positioned with respect to the base 2 both in the optical axis direction and in the axis orthogonal direction.
また、波長変換部材６内を進行して来た可視光線Ｖが、波長変換部材６と空気との界面で全反射して波長変換部材６内に逆進してしまうことがあるが、図８に示すように、波長変換部材６の上に更に、サファイア等の高屈折率材料からなる透明板状体８を設け、そのＬＥＤ発光デバイス１から露出する面に、反射防止コーティングや微細な凹凸を形成する粗面化等の反射防止処理を施せば、上述のような全反射を防いで、光の取り出し効率を向上することができる。 Further, the visible light V traveling in the wavelength conversion member 6 may be totally reflected at the interface between the wavelength conversion member 6 and the air and may reversely travel into the wavelength conversion member 6. FIG. As shown in FIG. 4, a transparent plate 8 made of a high refractive index material such as sapphire is further provided on the wavelength conversion member 6, and an antireflection coating or fine irregularities are provided on the surface exposed from the LED light emitting device 1. If antireflection treatment such as roughening to be formed is performed, total reflection as described above can be prevented and light extraction efficiency can be improved.
ＬＥＤ素子３が紫外線を放射するものである場合では、必要に応じて、上記の高屈折率材料からなる透明板状体８の上面又は下面に紫外線カット層を設けてもよい。 In the case where the LED element 3 emits ultraviolet rays, an ultraviolet cut layer may be provided on the upper or lower surface of the transparent plate-like body 8 made of the high refractive index material as necessary.
大基板Ｂ上に波長変換部材６を形成するに際しては、複数個の波長変換部材６を一体として形成しなくともよく、図９に示すように、複数個の波長変換部材６を所定の間隔を空けて大基板Ｂ上に形成してもよい。このように所定の間隔を空けて複数個の波長変換部材６を大基板Ｂ上に形成することにより、大基板Ｂを切断して複数個の積層体７を切り出すのが容易になる。 When forming the wavelength conversion member 6 on the large substrate B, the plurality of wavelength conversion members 6 do not have to be formed integrally, and as shown in FIG. It may be formed on the large substrate B in a space. By forming a plurality of wavelength conversion members 6 on the large substrate B at a predetermined interval in this way, it becomes easy to cut the large substrate B and cut a plurality of laminated bodies 7.
１つの基体２に形成される凹部２２は１つに限られず、図１０に示すように、１つの基体２に複数の凹部２２が形成されて、各凹部２２内にそれぞれＬＥＤ素子３（図示しない）が実装され、各凹部２２の開口部がそれぞれ積層体７で覆われていてもよい。 The number of recesses 22 formed in one base 2 is not limited to one. As shown in FIG. 10, a plurality of recesses 22 are formed in one base 2, and each LED element 3 (not shown) is formed in each recess 22. ) May be mounted, and the opening of each recess 22 may be covered with the laminate 7.
また、１つの基体２に複数の凹部２２が形成されている場合、図１１に示すように、近紫外励起のＬＥＤ素子３がそれぞれ実装された複数の凹部２２を１組として、それらをＲ・Ｇ・Ｂの混合比を変えた複数個の波長変換部材６が形成された単一の積層体７で覆うようにしてもよい。そして、ＬＥＤ素子３へ供給する電流値を変化させて、各ＬＥＤ素子３に由来する可視光線Ｖを混ぜ合わせることにより、色温度を自由に変えることができる。例えば、図１１に示す実施形態において、発光装置１の一のユニット１１が３０００Ｋの色温度の白色を発するものとし、発光装置１の他のユニット１２が６０００Ｋの色温度の白色を発するものとすることにより、黒体軌跡に沿って色温度が変化する演色性に優れた白色光発光装置１を構成することができる。 Further, when a plurality of recesses 22 are formed in one base body 2, as shown in FIG. 11, a plurality of recesses 22 each mounted with a near-ultraviolet-excited LED element 3 are set as one set, and R · You may make it cover with the single laminated body 7 in which the several wavelength conversion member 6 which changed the mixture ratio of G * B was formed. The color temperature can be freely changed by changing the current value supplied to the LED elements 3 and mixing the visible light V derived from the LED elements 3. For example, in the embodiment shown in FIG. 11, it is assumed that one unit 11 of the light emitting device 1 emits white having a color temperature of 3000K, and the other unit 12 of the light emitting device 1 emits white having a color temperature of 6000K. Thus, it is possible to configure the white light emitting device 1 having excellent color rendering properties in which the color temperature changes along the black body locus.
その他、本発明は上記の各実施形態に限られず、本発明の趣旨を逸脱しない限り、前述した種々の構成の一部又は全部を適宜組み合わせて構成してもよい。 In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.
１・・・ＬＥＤ発光デバイス
２・・・基体
３・・・ＬＥＤ素子
４・・・封止部材（封止部材用の透光性樹脂）
５・・・透光性基板
６・・・波長変換部材（波長変換部材用の蛍光体含有樹脂組成物）
DESCRIPTION OF SYMBOLS 1 ... LED light emitting device 2 ... Base | substrate 3 ... LED element 4 ... Sealing member (Translucent resin for sealing members)
5 ... Translucent substrate 6 ... Wavelength conversion member (phosphor-containing resin composition for wavelength conversion member)
Claims (14)
前記波長変換部材が透光性基板上に積層している積層体を作製する積層工程と、
前記基体の凹部の底面にＬＥＤ素子を実装する実装工程と、
前記ＬＥＤ素子が実装された前記基体の凹部に封止部材用の透光性樹脂を充填して前記ＬＥＤ素子を封止する封止工程と、
前記透光性樹脂を硬化させる前に、前記透光性樹脂が充填された前記基体の凹部の開口部を、前記透光性基板が前記凹部の底面側を向くように前記積層体で覆う搭載工程とを備えていることを特徴とするＬＥＤ発光デバイスの製造方法。 A base member having a recess opening in the upper end surface and an LED element mounted on the bottom surface of the recess, having a light-transmitting sealing member for sealing the LED element, and a phosphor The wavelength conversion member is a method of manufacturing an LED light emitting device provided in this order from the bottom surface side of the recess,
A laminating step for producing a laminate in which the wavelength conversion member is laminated on a light-transmitting substrate;
A mounting step of mounting the LED element on the bottom surface of the concave portion of the substrate;
A sealing step of sealing the LED element by filling a light-transmitting resin for a sealing member into a concave portion of the base on which the LED element is mounted;
Prior to curing the translucent resin, the mounting body covers the opening of the concave portion of the base filled with the translucent resin with the laminate so that the translucent substrate faces the bottom surface of the concave portion. And a process for producing an LED light-emitting device.
その上に複数個の前記波長変換部材が形成された大基板を切断して、複数個の前記積層体を切り出す工程とからなる請求項１又は２記載のＬＥＤ発光デバイスの製造方法。 In the laminating step, a phosphor-containing resin composition for a wavelength conversion member is formed on a large substrate in which a plurality of the translucent substrates are integrated, so that the plurality of wavelength conversion members are formed. Printing, curing the phosphor-containing resin composition, and producing a plurality of the laminates as a unit;
The manufacturing method of the LED light-emitting device of Claim 1 or 2 which consists of the process of cut | disconnecting the several laminated body by cut | disconnecting the large board | substrate with which the said several wavelength conversion member was formed on it.
前記凹部の底面に実装されたＬＥＤ素子と、
透光性を有し前記ＬＥＤ素子を封止する封止部材と、
前記封止部材を前記凹部内に気密的に封ずるように、前記封止部材の上に設けられた透光性基板と、
蛍光体を含有するものであって、前記透光性基板の上に設けられた波長変換部材とを備えていることを特徴とするＬＥＤ発光デバイス。 A substrate having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A sealing member having translucency and sealing the LED element;
A translucent substrate provided on the sealing member so as to hermetically seal the sealing member in the recess;
An LED light emitting device comprising a phosphor and comprising a wavelength conversion member provided on the translucent substrate.
前記蛍光体が、赤色光を発する蛍光体、緑色光を発する蛍光体、及び、青色光を発する蛍光体である請求項９記載のＬＥＤ発光デバイス。 The LED element emits ultraviolet rays or visible light having a short wavelength,
The LED light-emitting device according to claim 9, wherein the phosphor is a phosphor that emits red light, a phosphor that emits green light, and a phosphor that emits blue light.
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| JP2009180706A JP2011035198A (en) | 2009-08-03 | 2009-08-03 | Method of manufacturing led light-emitting device |
| TW99125748A TW201119092A (en) | 2009-08-03 | 2010-08-03 | LED device manufacturing method |
| PCT/JP2010/063052 WO2011016433A1 (en) | 2009-08-03 | 2010-08-03 | Method for manufacturing led light emitting device |
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| JP2009180706A JP2011035198A (en) | 2009-08-03 | 2009-08-03 | Method of manufacturing led light-emitting device |
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| WO2011016433A1 (en) | 2011-02-10 |
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