JP2011014737A

JP2011014737A - Thermoelectric conversion module

Info

Publication number: JP2011014737A
Application number: JP2009158024A
Authority: JP
Inventors: Kazunori Yamanaka; 一典山中; Kazuaki Kurihara; 和明栗原; Katsuharu Hida; 勝春肥田
Original assignee: Fujitsu Ltd
Current assignee: Fujitsu Ltd
Priority date: 2009-07-02
Filing date: 2009-07-02
Publication date: 2011-01-20
Anticipated expiration: 2029-07-02
Also published as: JP5369942B2

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module that alleviates an effect of thermal stress distortion at the junction of a thermoelectric element.SOLUTION: First and second substrates 15 and 16 are arranged with a gap therebetween. Within the gap, a first structure 10A that produces a thermoelectric effect so as to reach from the first substrate to the second substrate is arranged. A first connecting member 18 is connected through elastic force to a first end of a first structure at the first substrate side. A second connecting member 19 is connected through elastic force to a second end of the first structure at the second substrate side. As to the first end of the first structure, the position of the first substrate with respect to the in-plane direction is constrained through the first connecting member, and as to the second end of the first structure, the position of the second substrate with respect to the in-plane direction is constrained through the second connecting member.

Description

本発明は、熱エネルギと電気エネルギとの相互変換を行う熱電変換モジュールに関する。 The present invention relates to a thermoelectric conversion module that performs mutual conversion between thermal energy and electrical energy.

熱エネルギを電気エネルギに変換する熱電変換モジュールにおいて、高温部と低温部との間に熱的な応力が発生し、熱電変換モジュールが損傷を受ける場合がある。従来のＢｉ−Ｔｅ系の熱電変換モジュールの動作温度の上限は、約４００℃である。より高温での動作が可能なＣａ−Ｃｏ酸化物系、Ｃａ−Ｌａ−Ｍｎ系酸化物を用いた熱電変換モジュールが開発されている。 In a thermoelectric conversion module that converts thermal energy into electrical energy, thermal stress is generated between the high temperature portion and the low temperature portion, and the thermoelectric conversion module may be damaged. The upper limit of the operating temperature of the conventional Bi-Te-based thermoelectric conversion module is about 400 ° C. Thermoelectric conversion modules using Ca—Co oxide and Ca—La—Mn oxides capable of operating at higher temperatures have been developed.

特開平５−３２７０３３号公報JP-A-5-327033 特開２００６−２４５２２４号公報JP 2006-245224 A

R. Funahashi et al., "A portable thermoelectric-power-generating module composed of oxide devices", Journal of Applied Physics 99, 066117 (2006)R. Funahashi et al., "A portable thermoelectric-power-generating module composed of oxide devices", Journal of Applied Physics 99, 066117 (2006)

熱電変換モジュールの動作温度が高くなると、熱電変換モジュールが熱的な応力の影響を受けやすくなる。また、π型構造の熱電変換モジュールは、特に熱応力による歪の影響を受けやすい。 When the operating temperature of the thermoelectric conversion module increases, the thermoelectric conversion module is easily affected by thermal stress. In addition, the thermoelectric conversion module having a π-type structure is particularly susceptible to distortion due to thermal stress.

本発明の一観点によると、
間隙を挟んで配置された第１及び第２の基板と、
前記間隙内に、前記第１の基板から前記第２の基板まで及ぶように配置された熱電効果を生じる第１の構造体と、
前記第１の構造体の前記第１の基板側の第１の端部に弾性力によって接続された第１の接続部材と、
前記第１の構造体の前記第２の基板側の第２の端部に弾性力によって接続された第２の接続部材と
を有し、
前記第１の構造体の前記第１の端部は、前記第１の接続部材を介して、前記第１の基板の面内方向に関する位置が拘束され、前記第１の構造体の前記第２の端部は、前記第２の接続部材を介して、前記第２の基板の面内方向に関する位置が拘束されている熱電変換モジュールが提供される。 According to one aspect of the invention,
First and second substrates disposed with a gap therebetween;
A first structure for producing a thermoelectric effect disposed in the gap so as to extend from the first substrate to the second substrate;
A first connection member connected by elastic force to a first end of the first structure on the first substrate side;
A second connection member connected by elastic force to a second end of the first structure on the second substrate side;
The position of the first end portion of the first structure body in the in-plane direction of the first substrate is constrained via the first connection member, and the second end portion of the first structure body is restrained. The thermoelectric conversion module in which the position in the in-plane direction of the second substrate is constrained via the second connection member is provided.

第１の構造体と第１の接続部材、第１の構造体と第２の接続部材が、弾性力によって接続されているため、熱応力による歪の影響を軽減することができる。、 Since the first structure and the first connection member, and the first structure and the second connection member are connected by elastic force, the influence of distortion due to thermal stress can be reduced. ,

（１Ａ）は、実施例１による熱電変換モジュールの断面図であり、（１Ｂ）は、（１Ａ）の一点鎖線１Ａ−１Ａにおける断面図であり、（１Ｃ）は、第１の接続部材の斜視図である。(1A) is a cross-sectional view of the thermoelectric conversion module according to the first embodiment, (1B) is a cross-sectional view taken along one-dot chain line 1A-1A of (1A), and (1C) is a perspective view of the first connecting member. FIG. 実施例１による熱電変換モジュールの断面図である。1 is a cross-sectional view of a thermoelectric conversion module according to Example 1. FIG. （３Ａ）は、実施例３による熱電変換モジュールの斜視図であり、（３Ｂ）は、接続部材の配置を示す平面図であり、（３Ｃ）は、実施例３による熱電変換モジュールの断面図である。(3A) is a perspective view of the thermoelectric conversion module according to the third embodiment, (3B) is a plan view showing the arrangement of the connection members, and (3C) is a cross-sectional view of the thermoelectric conversion module according to the third embodiment. is there. （４Ａ）は、実施例４による熱電変換モジュールの断面図であり、（４Ｂ）は、第２の接続部材の斜視図である。(4A) is a cross-sectional view of a thermoelectric conversion module according to Example 4, and (4B) is a perspective view of a second connection member. 実施例５による熱電変換モジュールの断面図である。6 is a cross-sectional view of a thermoelectric conversion module according to Example 5. FIG. 実施例６による熱電変換モジュールの断面図である。6 is a cross-sectional view of a thermoelectric conversion module according to Example 6. FIG. （７Ａ）は、実施例７による熱電変換モジュールの部分断面図であり、（７Ｂ）は、実施例７の他の構成例による熱電変換モジュールの部分断面図である。(7A) is a partial cross-sectional view of a thermoelectric conversion module according to Example 7, and (7B) is a partial cross-sectional view of a thermoelectric conversion module according to another configuration example of Example 7. FIG.

以下、図面を参照しながら実施例について説明する。 Hereinafter, embodiments will be described with reference to the drawings.

図１Ａに、実施例１による熱電変換モジュールの断面図を示し、図１Ｂに、図１Ａの一点鎖線１Ｂ−１Ｂにおける断面図を示す。図１Ｂの一点鎖線１Ａ−１Ａにおける断面図が図１Ａに相当する。 FIG. 1A shows a cross-sectional view of the thermoelectric conversion module according to the first embodiment, and FIG. 1B shows a cross-sectional view taken along one-dot chain line 1B-1B in FIG. 1A. A cross-sectional view taken along one-dot chain line 1A-1A in FIG. 1B corresponds to FIG. 1A.

第１の基板１５と第２の基板１６とが、間隙を挟んで配置されている。この間隙内に、第１の基板１５から第２の基板１６まで及ぶように、第１の構造体１０Ａが配置されている。 The first substrate 15 and the second substrate 16 are arranged with a gap in between. Within this gap, the first structure 10 A is disposed so as to extend from the first substrate 15 to the second substrate 16.

第１の構造体１０Ａは、熱電効果を生じる材料で形成されており、両側の端面に、凹部１１Ａが形成されている。第１の構造体１０Ａの軸方向に垂直な断面は、例えば一辺の長さが５ｍｍの正方形であり、軸方向の長さ（高さ）は１０ｍｍである。第１の構造体１０Ａには、ビスマステルル化合物、シリコン−ゲルマニウム半導体、導電性セラミクス等を用いることができる。導電性セラミクスの例として、Ｃａ_３Ｃｏ_４Ｏ_９、Ｃａ_１−ｘＬａ_ｘＭｎＯ_３（ｘは約０．１）、ＮｂドープＳｒＴｉＯ_３等が挙げられる。凹部１１Ａの内面に、導電膜１２が形成されている。導電膜１２には、例えばＡｇ−Ｐｄ系合金等が用いられる。なお、導電膜１２は、接触抵抗を低下させるためのものであるため、導電膜１２が無くても十分低い接触抵抗が得られる場合には、導電膜１２を形成する必要は無い。 10 A of 1st structures are formed with the material which produces a thermoelectric effect, and 11 A of recessed parts are formed in the end surface of both sides. The cross section perpendicular to the axial direction of the first structural body 10A is, for example, a square having a side length of 5 mm, and the axial length (height) is 10 mm. A bismuth tellurium compound, a silicon-germanium semiconductor, conductive ceramics, or the like can be used for the first structure 10A. Examples of conductive ceramics include Ca ₃ Co ₄ O ₉ , Ca _1-x La _x MnO ₃ (x is about 0.1), Nb-doped SrTiO _{3 and the} like. A conductive film 12 is formed on the inner surface of the recess 11A. For the conductive film 12, for example, an Ag—Pd alloy or the like is used. Note that since the conductive film 12 is for reducing the contact resistance, it is not necessary to form the conductive film 12 when a sufficiently low contact resistance can be obtained without the conductive film 12.

第１の構造体１０Ａの一方の端部（第１の端部）１０Ｅの端面に、第１の基板１５が接触している。第１の基板１５には、絶縁材料、例えばアルミナが用いられる。第１の基板１５に開口１５Ａが形成されている。開口１５Ａは、第１の構造体１０Ａに形成されている凹部１１Ａの開口面に整合する。 The first substrate 15 is in contact with the end surface of one end (first end) 10E of the first structure 10A. The first substrate 15 is made of an insulating material such as alumina. An opening 15 A is formed in the first substrate 15. The opening 15A is aligned with the opening surface of the recess 11A formed in the first structure 10A.

第１の接続部材１８が、弾性部分１８Ａと板状部分１８Ｆとを含む。 The first connecting member 18 includes an elastic portion 18A and a plate-like portion 18F.

図１Ｃに、第１の接続部材１８の斜視図を示す。板状部分１８Ｆの一方の表面から、弾性部分１８Ａが突出している。弾性部分１８Ａは、湾曲した一対の板ばねで構成される。一対の板ばねは、その凹面同士を対向させるように配置されている。すなわち、凸面が外側を向く。板状部分１８Ｆの厚さは、例えば０．３ｍｍ〜０．５ｍｍであり、第１の弾性部分１８Ａの各板ばねの厚さは、例えば０．１ｍｍである。 FIG. 1C shows a perspective view of the first connecting member 18. An elastic portion 18A protrudes from one surface of the plate-like portion 18F. The elastic portion 18A includes a pair of curved leaf springs. A pair of leaf | plate spring is arrange | positioned so that the concave surfaces may oppose. That is, the convex surface faces outward. The thickness of the plate-like portion 18F is, for example, 0.3 mm to 0.5 mm, and the thickness of each leaf spring of the first elastic portion 18A is, for example, 0.1 mm.

第１の接続部材１８は、例えば基材、基材の表面を覆う導電膜、及び基材と導電膜との間に配置される密着層を含む。基材には、セラミクス、例えばジルコニア、イットリウムスタビライズドジルコニア（ＹＳＺ）、アルミナ等が用いられる。基材は、例えばグリーン加工を行った成型体を焼結することにより作製される。導電膜には、ＡｕまたはＡｇが用いられる。密着層には、Ｐｄ、Ｎｉ、Ｔｉ、Ｃｒ、Ａｕ−Ｐｄ系合金、Ａｇ−Ｐｄ系合金、Ａｇ−Ｎｉ系合金、Ａｕ−Ｎｉ系合金等が用いられる。密着層は、例えば、スパッタリング、真空蒸着等により形成される。また、Ａｕ−Ｐｄ系合金、Ａｇ−Ｐｄ系合金、Ａｇ−Ｎｉ系合金、Ａｕ−Ｎｉ系合金を用いる場合には、導電ペーストを塗布して焼成する方法によって形成することも可能である。導電膜は、例えば導電ペーストを塗布して焼成する方法、電解めっき等により形成される。密着層は、基材に対する導電膜の密着性を高める。 The first connecting member 18 includes, for example, a base material, a conductive film covering the surface of the base material, and an adhesion layer disposed between the base material and the conductive film. As the substrate, ceramics such as zirconia, yttrium stabilized zirconia (YSZ), alumina, or the like is used. A base material is produced by sintering the molded object which performed green processing, for example. Au or Ag is used for the conductive film. For the adhesion layer, Pd, Ni, Ti, Cr, Au—Pd alloy, Ag—Pd alloy, Ag—Ni alloy, Au—Ni alloy, or the like is used. The adhesion layer is formed by, for example, sputtering, vacuum deposition, or the like. In the case of using an Au—Pd alloy, an Ag—Pd alloy, an Ag—Ni alloy, or an Au—Ni alloy, the conductive paste can be applied and fired. The conductive film is formed by, for example, a method of applying and baking a conductive paste, electrolytic plating, or the like. The adhesion layer enhances the adhesion of the conductive film to the substrate.

第１の接続部材１８に導電性セラミクスを用いてもよい。この場合には、表面に導電膜を形成する必要はない。一例として、第１の接続部材１８に、第１の構造体１０Ａに用いられる導電性セラミクスと同一のものを用いてもよい。第１の導電部材１８と第１の構造体１０Ａとを、同一の導電性セラミクスで形成すると、熱ストレスが与えられたときに両者に生ずる歪を緩和することができる。また、絶縁性の基材を被覆する導電膜として、導電性セラミクスを用いてもよい。 Conductive ceramics may be used for the first connecting member 18. In this case, it is not necessary to form a conductive film on the surface. As an example, the first connection member 18 may be the same as the conductive ceramic used for the first structure 10A. When the first conductive member 18 and the first structural body 10A are formed of the same conductive ceramics, strain generated in both when the thermal stress is applied can be reduced. Moreover, you may use electroconductive ceramics as an electrically conductive film which coat | covers an insulating base material.

図１Ａに戻って説明を続ける。第１の接続部材１８の弾性部分１８Ａが、第１の基板１５の開口１５Ａを通過して、第１の構造体１０Ａの凹部１１Ａ内に挿入されている。弾性部分１８Ａは、凹部１１Ａ内に挿入されることによって弾性変形する。弾性部分１８Ａの復元力が、凹部１１Ａの側面に作用する。この復元力によって、第１の接続部材１８が第１の構造体１０Ａに接続され、支持される。 Returning to FIG. 1A, the description will be continued. The elastic portion 18A of the first connection member 18 passes through the opening 15A of the first substrate 15 and is inserted into the recess 11A of the first structure 10A. The elastic portion 18A is elastically deformed by being inserted into the recess 11A. The restoring force of the elastic portion 18A acts on the side surface of the recess 11A. By this restoring force, the first connecting member 18 is connected to and supported by the first structure 10A.

第１の構造体１０Ａのもう一方の端部（第２の端部）１０Ｆの端面に、第２の基板１６が接している。第２の接続部材１９が、第１の接続部材１８と同様に、第１の構造体１０Ａの第２の端部１０Ｆに弾性力によって接続され、支持されている。第２の基板１６及び第２の接続部材１９の構成、及び相対位置関係は、それぞれ第１の基板１５及び第１の接続部材１８の構成及び相対位置関係と同一である。すなわち、第２の基板１６に開口１６Ａが形成され、第２の接続部材１９は、弾性部分１９Ａと板状部分１９Ｆとを含む。 The second substrate 16 is in contact with the end surface of the other end (second end) 10F of the first structure 10A. Similarly to the first connection member 18, the second connection member 19 is connected to and supported by the second end portion 10F of the first structure 10A by an elastic force. The configuration and relative positional relationship of the second substrate 16 and the second connecting member 19 are the same as the configuration and relative positional relationship of the first substrate 15 and the first connecting member 18, respectively. That is, the opening 16A is formed in the second substrate 16, and the second connection member 19 includes an elastic portion 19A and a plate-like portion 19F.

第１の接続部材１８及び第２の接続部材１９は、導電膜１２を介して第１の構造体１０Ａに電気的に接続される。このように、第１の接続部材１８は、第１の構造体１０Ａに弾性力によって機械的に接続されるとともに、電気的にも接続される。 The first connection member 18 and the second connection member 19 are electrically connected to the first structure 10 A through the conductive film 12. Thus, the first connecting member 18 is mechanically connected to the first structure 10A by an elastic force and is also electrically connected.

第１の構造体１０Ａの第１の端部１０Ｅは、第１の接続部材１８を介して、第１の基板１５の面内方向に関する位置が拘束される。同様に、第１の構造体１０Ａの第２の端部１０Ｆは、第２の接続部材１９を介して、第２の基板１６の面内方向に関する位置が拘束される。 The position of the first end 10E of the first structure 10A in the in-plane direction of the first substrate 15 is constrained via the first connecting member 18. Similarly, the position of the second end portion 10F of the first structure 10A in the in-plane direction of the second substrate 16 is constrained via the second connection member 19.

第１の端部１０Ｅと第２の端部１０Ｆとの間に温度差が生じると、第１の構造体１０Ａの長さ方向に起電力が発生する。この起電力が、第１の接続部材１８及び第２の接続部材１９を通して外部に取り出される。 When a temperature difference is generated between the first end 10E and the second end 10F, an electromotive force is generated in the length direction of the first structure 10A. This electromotive force is taken out through the first connecting member 18 and the second connecting member 19.

実施例１では、第１の接続部材１８及び第２の接続部材１９が、弾性力によって第１の構造体１０Ａに接続される。このため、第１の接続部材１８及び第２の接続部材１９を第１の構造体１０Ａにロウ付けする場合に比べて、第１の接続部材１８、第２の接続部材１９、及び第１の構造体１０Ａの相対位置関係が、熱変形等に容易に順応して変化する。従って、熱変形等による破壊や劣化が抑制される。 In the first embodiment, the first connection member 18 and the second connection member 19 are connected to the first structure 10A by an elastic force. For this reason, compared with the case where the 1st connection member 18 and the 2nd connection member 19 are brazed to 10 A of 1st structures, the 1st connection member 18, the 2nd connection member 19, and the 1st The relative positional relationship of the structure 10A easily adapts to thermal deformation or the like and changes. Therefore, destruction and deterioration due to thermal deformation and the like are suppressed.

また、第１の接続部材１８及び第２の接続部材１９が、第１の構造体１０Ａに対して着脱可能であるため、故障時に、第１の構造体１０Ａ、第１及び第２の接続部材１８、１９等を容易に交換することができる。 In addition, since the first connection member 18 and the second connection member 19 are detachable from the first structure 10A, the first structure 10A, the first and second connection members are provided at the time of failure. 18 and 19 can be easily exchanged.

図２に、実施例２による熱電変換モジュールの断面図を示す。実施例２による熱電変換モジュールはπ型構造を有する。以下、実施例１との相違点に着目して説明する。 In FIG. 2, sectional drawing of the thermoelectric conversion module by Example 2 is shown. The thermoelectric conversion module according to Example 2 has a π-type structure. Hereinafter, description will be made focusing on differences from the first embodiment.

実施例２においては、第１の構造体１０Ａの他に、第２の構造体１０Ｂが配置される。第２の構造体１０Ｂは、第１の構造体１０Ａと同様に、第１の基板１５と第２の基板１６との間の間隙内に、第１の基板１５から第２の基板１６まで及ぶように配置される。第１の構造体１０Ａと第２の構造体１０Ｂとは、相互に反対の導電型を有する熱電材料で形成される。ｐ型熱電材料の例として、Ｃａ_３Ｃｏ_４Ｏ_９が挙げられ、ｎ型熱電材料の例として、Ｃａ_０．９Ｌａ_０．１ＭｎＯ_３が挙げられる。第２の構造体１０Ｂの形状は、第１の構造体１０Ａの形状と同一である。 In the second embodiment, the second structure 10B is arranged in addition to the first structure 10A. Similar to the first structure 10A, the second structure 10B extends from the first substrate 15 to the second substrate 16 in the gap between the first substrate 15 and the second substrate 16. Are arranged as follows. The first structure body 10A and the second structure body 10B are formed of thermoelectric materials having conductivity types opposite to each other. An example of the p-type thermoelectric material is Ca ₃ Co ₄ O ₉ , and an example of the n-type thermoelectric material is Ca _0.9 La _0.1 MnO ₃ . The shape of the second structure 10B is the same as the shape of the first structure 10A.

第１の基板１５及び第２の基板１６に、それぞれ開口１５Ｂ及び１６Ｂが形成されている。開口１５Ｂ及び１６Ｂは、第２の構造体１０Ｂの端面に形成された凹部１１Ｂの開口面に整合する。 Openings 15B and 16B are formed in the first substrate 15 and the second substrate 16, respectively. The openings 15B and 16B are aligned with the opening surface of the recess 11B formed in the end surface of the second structure 10B.

第２の接続部材１９は、第１の構造体１０Ａに接続された弾性部分１９Ａの他に、弾性部分１９Ｂを有する。弾性部分１９Ａと弾性部分１９Ｂとは、板状部分１９Ｆの同一の表面から突出し、同一の形状及び構造を有する。弾性部分１９Ｂは、開口１６Ｂを通過して、第２の構造体１０Ｂの凹部１１Ｂ内に挿入されている。第２の接続部材１９は、弾性部分１９Ａの弾性力によって、第２の構造体１０Ｂに接続され、支持される。 The second connection member 19 includes an elastic portion 19B in addition to the elastic portion 19A connected to the first structure 10A. The elastic portion 19A and the elastic portion 19B protrude from the same surface of the plate-like portion 19F and have the same shape and structure. The elastic portion 19B passes through the opening 16B and is inserted into the recess 11B of the second structure 10B. The second connection member 19 is connected to and supported by the second structure 10B by the elastic force of the elastic portion 19A.

第１の接続部材１８と同じ形状及び構造を有する第３の接続部材２０の弾性部分２０Ａが、開口１５Ｂを通過して、第２の構造体１０Ｂの端面に形成された凹部１１Ｂ内に挿入されている。第３の接続部材２０は、弾性部分２０Ａの弾性力によって、第２の構造体１０Ｂに接続され、支持される。 The elastic portion 20A of the third connection member 20 having the same shape and structure as the first connection member 18 passes through the opening 15B and is inserted into the recess 11B formed on the end surface of the second structure 10B. ing. The third connection member 20 is connected to and supported by the second structure 10B by the elastic force of the elastic portion 20A.

第１の基板１５は、面内方向に関して、第１の構造体１０Ａの第１の基板１５側の端部と、第２の構造体１０Ｂの第１の基板１５側の端部との相対位置を拘束する。第２の基板１６は、第１の構造体１０Ａの第２の基板１６側の端部と、第２の構造体１０Ｂの第２の基板１６側の端部との相対位置を、面内方向に関して拘束する。第２の接続部材１９の板状部分１９Ｆが十分な機械的強度を有する場合には、第２の板状部分１９Ｆが、第１の構造体１０Ａと第２の構造体１０Ｂとの端部同士の相対位置を拘束することができる。このため、第２の基板１６を省略することも可能である。 In the in-plane direction, the first substrate 15 has a relative position between the end of the first structure 10A on the first substrate 15 side and the end of the second structure 10B on the first substrate 15 side. Is restrained. The second substrate 16 has an in-plane direction relative position between the end of the first structure 10A on the second substrate 16 side and the end of the second structure 10B on the second substrate 16 side. Restraint with respect to. When the plate-like portion 19F of the second connecting member 19 has a sufficient mechanical strength, the second plate-like portion 19F has ends of the first structure 10A and the second structure 10B. The relative position can be constrained. For this reason, the second substrate 16 can be omitted.

第２の接続部材１９は、第１の構造体１０Ａと第２の構造体１０Ｂとに、弾性力によって機械的に接続されるとともに、両者を電気的に接続する。 The second connection member 19 is mechanically connected to the first structure 10A and the second structure 10B by elastic force and electrically connects both.

第１の基板１５側の端部と、第２の基板１６側の端部とに温度差を生じさせると、第１の構造体１０Ａと第２の構造体１０Ｂとに、相互に反対向きの起電力が発生する。この起電力が、第１の接続部材１８と第３の接続部材２０とを通して外部に取り出される。 When a temperature difference is generated between the end portion on the first substrate 15 side and the end portion on the second substrate 16 side, the first structure body 10A and the second structure body 10B are opposite to each other. An electromotive force is generated. This electromotive force is taken out through the first connecting member 18 and the third connecting member 20.

第１の構造体１０Ａ、第２の構造体１０Ｂ、及び第１の基板１５が相互に弾性力によって接続されているため、第１の基板１５が昇温または降温によって膨張または収縮しても、接続箇所の破壊や劣化が抑制される。 Since the first structure 10A, the second structure 10B, and the first substrate 15 are connected to each other by an elastic force, even if the first substrate 15 expands or contracts due to temperature rise or fall, The destruction and deterioration of the connection location are suppressed.

図３Ａに、実施例３による熱電変換モジュールの斜視図を示す。実施例３による熱電変換モジュールは、相互に直列に接続された複数のπ型構造を含む。個々のπ型構造の構成は、実施例２による熱電変換モジュールと同一である。第１の基板１５と第２の基板１６との間に、第１の構造体１０Ａ、第２の構造体１０Ｂ、及び第２の接続部材１９を含む複数のπ型構造が、２次元的に、例えば行列状に配置されている。 FIG. 3A is a perspective view of the thermoelectric conversion module according to the third embodiment. The thermoelectric conversion module according to the third embodiment includes a plurality of π-type structures connected in series with each other. The configuration of each π-type structure is the same as that of the thermoelectric conversion module according to the second embodiment. A plurality of π-type structures including the first structure 10A, the second structure 10B, and the second connection member 19 are two-dimensionally arranged between the first substrate 15 and the second substrate 16. For example, they are arranged in a matrix.

図３Ｂに、第１の接続部材１８及び第２の接続部材１９の平面視における位置関係を示す。図３Ｃに、図３Ｂの一点鎖線３Ｃ−３Ｃにおける断面図を示す。１つのπ型構造の第１の接続部材１８が、隣のπ型構造の第３の接続部材２０に連続している。相互に連続した第１の接続部材１８と第３の接続部材２０とは、第２の接続部材１９と同一の構成を有する。直列接続されたπ型構造の両端のπ型構造においては、第１の接続部材１８及び第３の接続部材２０の一方が、他のπ型構造に接続されておらず孤立している。 FIG. 3B shows the positional relationship between the first connecting member 18 and the second connecting member 19 in plan view. 3C is a cross-sectional view taken along one-dot chain line 3C-3C in FIG. 3B. One π-type structure first connection member 18 is connected to the adjacent π-type structure third connection member 20. The first connecting member 18 and the third connecting member 20 that are continuous with each other have the same configuration as the second connecting member 19. In the π-type structure at both ends of the series-connected π-type structure, one of the first connection member 18 and the third connection member 20 is not connected to the other π-type structure and is isolated.

孤立した第１の接続部材１８または第３の接続部材２０が、起電力を外部に取り出す端子となる。第１の基板１５及び第２の基板１６は、すべてのπ型構造で共有される。 The isolated first connection member 18 or third connection member 20 serves as a terminal for extracting the electromotive force to the outside. The first substrate 15 and the second substrate 16 are shared by all the π-type structures.

実施例３においても、第１の基板１５が、第１の構造体１０Ａと第２の構造体１０Ｂとの第１の基板１５側の端部の相対位置を、面内方向に関して拘束する。第２の基板１６が、第１の構造体１０Ａと第２の構造体１０Ｂとの第２の基板１６側の端部の相対位置を、面内方向に関して拘束する。 Also in the third embodiment, the first substrate 15 constrains the relative positions of the end portions of the first structure 10A and the second structure 10B on the first substrate 15 side in the in-plane direction. The second substrate 16 restrains the relative positions of the end portions of the first structure 10A and the second structure 10B on the second substrate 16 side in the in-plane direction.

第１の構造体１０Ａ及び第２の構造体１０Ｂが、第１の接続部材１８、第２の接続部材１９、及び第３の接続部材２０を介して、第１の基板１５及び第２の基板１６に弾性力によって接続される。このため、第１の基板１５及び第２の基板１６が昇温または降温によって膨張または収縮しても、接続箇所の破壊や劣化が抑制される。これにより、２次元的に配置するπ型構造の数を増やすことが可能になる。 The first structure body 10A and the second structure body 10B are connected to the first substrate 15 and the second substrate via the first connection member 18, the second connection member 19, and the third connection member 20, respectively. 16 is connected by an elastic force. For this reason, even if the 1st board | substrate 15 and the 2nd board | substrate 16 expand or shrink by temperature rising or temperature falling, destruction and deterioration of a connection location are suppressed. As a result, the number of π-type structures arranged two-dimensionally can be increased.

図４Ａに、実施例４による熱電変換モジュールの断面図を示す。以下、実施例３による熱電変換モジュールとの相違点に着目して説明し、同一の構成について説明を省略する。 FIG. 4A shows a cross-sectional view of the thermoelectric conversion module according to the fourth embodiment. Hereinafter, description will be made by paying attention to differences from the thermoelectric conversion module according to the third embodiment, and description of the same configuration will be omitted.

実施例３では、第１の構造体１０Ａ及び第２の構造体１０Ｂの端面に凹部が形成されていたが、実施例４では、第１の構造体１０Ａ及び第２の構造体１０Ｂの端面は平坦である。第１の構造体１０Ａ及び第２の構造体１０Ｂは、例えば円柱状である。第１の接続部材１８の弾性部分１８Ａが、第１の構造体１０Ａの端部の外周面を取り囲むように配置され、外周面に接する。弾性部分１８Ａの復元力が第１の構造体１０Ａの外周面に作用することにより、第１の接続部材１８が、第１の構造体１０Ａに弾性力によって接続され、支持される。第２の接続部材１９及び第３の接続部材２０の各弾性部分の構造も、第１の接続部材１８の弾性部分１８Ａの構造と同一である。 In Example 3, the recesses were formed on the end surfaces of the first structure 10A and the second structure 10B. In Example 4, the end surfaces of the first structure 10A and the second structure 10B were It is flat. The first structure 10A and the second structure 10B are, for example, cylindrical. The elastic portion 18A of the first connecting member 18 is disposed so as to surround the outer peripheral surface of the end portion of the first structure 10A, and is in contact with the outer peripheral surface. When the restoring force of the elastic portion 18A acts on the outer peripheral surface of the first structure 10A, the first connecting member 18 is connected to and supported by the first structure 10A by the elastic force. The structure of each elastic part of the second connection member 19 and the third connection member 20 is also the same as the structure of the elastic part 18A of the first connection member 18.

図４Ｂに、第２の接続部材１９の斜視図を示す。板状部分１９Ｆの一方の表面から、弾性部分１９Ａ及び１９Ｂが突出している。弾性部分１９Ａ及び１９Ｂは、軸方向に延在する複数のスリットが設けられた円筒状の形状を有する。中心軸を通る断面は、内側に向かって凸になるように湾曲している。 FIG. 4B shows a perspective view of the second connecting member 19. Elastic portions 19A and 19B protrude from one surface of the plate-like portion 19F. The elastic portions 19A and 19B have a cylindrical shape provided with a plurality of slits extending in the axial direction. A cross section passing through the central axis is curved so as to be convex toward the inside.

第１の接続部材１８と第３の接続部材２０とは、実施例３の場合と同様に、相互に連続する。相互に連続する第１の接続部材１８及び第３の接続部材２０は、第２の接続部材１９と同一の構造を有する。 The first connecting member 18 and the third connecting member 20 are continuous with each other as in the case of the third embodiment. The first connecting member 18 and the third connecting member 20 that are continuous with each other have the same structure as the second connecting member 19.

第２の接続部材１９の板状部分１９Ｆが、第１の構造体１０Ａ及び第２の構造体１０Ｂの第２の基板１６側の端面に接する。第１の接続部材１８の板状部分１８Ａ及び第３の接続部材２０の板状部分２０Ｆが、それぞれ第１の構造体１０Ａ及び第２の構造体１０Ｂの第１の基板１５側の端面に接する。 The plate-like portion 19F of the second connection member 19 is in contact with the end surfaces of the first structure 10A and the second structure 10B on the second substrate 16 side. The plate-like portion 18A of the first connection member 18 and the plate-like portion 20F of the third connection member 20 are in contact with the end surfaces of the first structure 10A and the second structure 10B on the first substrate 15 side, respectively. .

第１の基板１５と第２の基板１６とは、実施例３の場合と同様に、間隙を挟んで配置されている。第１の基板１５及び第２の基板１６に複数の開口１５Ａ、１６Ａが形成されている。第１の構造体１０Ａの第１の基板１５側の端部と、その端部の外周面に接する第１の接続部材１８の弾性部分１８Ａが、開口１５Ａ内に挿入されている。これにより、第１の構造体１０Ａの第１の基板１５側の端部の面内方向の位置が拘束される。同様に、第２の構造体１０Ｂの第１の基板１５側の端部と、その端部の外周面に接する第３の接続部材２０の弾性部分２０Ａが、他の開口１５Ａ内に挿入されている。第１の構造体１０Ａの第２の基板１６側の端部と、その外周面に接する第２の接続部材１９の弾性部分１９Ａが開口１６Ａ内に挿入され、第２の構造体１０Ｂの第２の基板１６側の端部と、その外周面に接する第２の接続部材１９の弾性部分１９Ｂが他の開口１６Ａ内に挿入されている。 The first substrate 15 and the second substrate 16 are arranged with a gap in the same manner as in the third embodiment. A plurality of openings 15 A and 16 A are formed in the first substrate 15 and the second substrate 16. An end portion of the first structure 10A on the first substrate 15 side and an elastic portion 18A of the first connecting member 18 in contact with the outer peripheral surface of the end portion are inserted into the opening 15A. Accordingly, the position in the in-plane direction of the end portion of the first structure 10A on the first substrate 15 side is constrained. Similarly, the end portion of the second structure 10B on the first substrate 15 side and the elastic portion 20A of the third connecting member 20 in contact with the outer peripheral surface of the end portion are inserted into the other opening 15A. Yes. The end portion of the first structure 10A on the second substrate 16 side and the elastic portion 19A of the second connection member 19 in contact with the outer peripheral surface thereof are inserted into the opening 16A, and the second structure 10B The end portion on the substrate 16 side and the elastic portion 19B of the second connecting member 19 in contact with the outer peripheral surface thereof are inserted into the other opening 16A.

第１の基板１５と第２の基板１６との間隙は、スペーサ３０によって一定の寸法に維持されている。 The gap between the first substrate 15 and the second substrate 16 is maintained at a constant size by the spacer 30.

実施例４においても、第１の基板１５及び第２の基板１６が昇温または降温によって膨張または収縮しても、接続箇所の破壊や劣化が抑制される。 Also in the fourth embodiment, even if the first substrate 15 and the second substrate 16 expand or contract due to the temperature increase or decrease, the connection portion is prevented from being broken or deteriorated.

図５に、実施例５による熱電変換モジュールの断面図を示す。以下、実施例４による熱電変換モジュールとの相違点に着目して説明する。 In FIG. 5, sectional drawing of the thermoelectric conversion module by Example 5 is shown. Hereinafter, description will be made focusing on differences from the thermoelectric conversion module according to the fourth embodiment.

実施例４では、第１の基板１５及び第２の基板１６が、第１の接続部材１８の板状部分１８Ｆ、第２の接続部材１９の板状部分１９Ｆ、及び第３の接続部材２０の板状部分２０Ｆよりも内側に配置されていた。実施例５では、第１の基板１５及び第２の基板１６が、第１の接続部材１８の板状部分１８Ｆ、第２の接続部材１９の板状部分１９Ｆ、及び第３の接続部材２０の板状部分２０Ｆよりも外側に配置されている。 In Example 4, the first substrate 15 and the second substrate 16 are formed of the plate-like portion 18F of the first connection member 18, the plate-like portion 19F of the second connection member 19, and the third connection member 20. It was arrange | positioned inside the plate-shaped part 20F. In the fifth embodiment, the first substrate 15 and the second substrate 16 are formed of the plate-like portion 18F of the first connecting member 18, the plate-like portion 19F of the second connecting member 19, and the third connecting member 20. It arrange | positions outside the plate-shaped part 20F.

第１の接続部材１８の板状部分１８Ｆの、第１の構造体１０Ａに接触している表面とは反対側の表面に突起１８Ｐが形成されている。同様に第２の接続部材１９にも突起１９Ｐが形成され、第３の接続部材２０にも突起２０Ｐが形成されている。第１の基板１５に形成された開口１５Ａ内に、突起１８Ｐ及び２０Ｐが挿入されている。これにより、第１の構造体１０Ａ及び第２の構造体１０Ｂの、第１の基板１５側の端部の面内方向に関する位置が拘束される。第２の基板１６に形成された開口１６Ａ内に、突起１９Ｐが挿入されている。これにより、第１の構造体１０Ａ及び第２の構造体１０Ｂの、第２の基板１６側の端部の面内方向に関する位置が拘束される。 A protrusion 18P is formed on the surface of the plate-like portion 18F of the first connecting member 18 on the opposite side of the surface in contact with the first structure 10A. Similarly, a protrusion 19P is formed on the second connection member 19, and a protrusion 20P is also formed on the third connection member 20. The protrusions 18P and 20P are inserted into the opening 15A formed in the first substrate 15. As a result, the positions of the first structure body 10A and the second structure body 10B in the in-plane direction of the end portion on the first substrate 15 side are restrained. A protrusion 19 P is inserted into the opening 16 A formed in the second substrate 16. As a result, the positions of the first structure body 10A and the second structure body 10B in the in-plane direction of the end portion on the second substrate 16 side are restrained.

実施例５では、第１の基板１５と第２の基板１６とが、第１〜第３の接続部材１８〜２０よりも外側に配置されているため、両者の間に間隙を確保するためのスペーサは不要である。第１の基板１５と第２の基板１６とは、ボルトとナット３１により、π型構造を挟むように固定される。ボルトは、熱伝導の小さな部材で形成することが好ましい。例えば、ジルコニア、アルミナ、ＳＵＳ３０４等により形成することができる。 In Example 5, since the 1st board | substrate 15 and the 2nd board | substrate 16 are arrange | positioned outside the 1st-3rd connection members 18-20, in order to ensure a gap | interval between both No spacer is required. The first substrate 15 and the second substrate 16 are fixed with bolts and nuts 31 so as to sandwich the π-type structure. The bolt is preferably formed of a member having a small thermal conductivity. For example, it can be formed of zirconia, alumina, SUS304, or the like.

実施例５においても、第１の基板１５及び第２の基板１６が昇温または降温によって膨張または収縮しても、接続箇所の破壊や劣化が抑制される。 Also in the fifth embodiment, even if the first substrate 15 and the second substrate 16 expand or contract due to the temperature increase or decrease, the connection portion is prevented from being broken or deteriorated.

図６に、実施例６による熱電変換モジュールの断面図を示す。以下、実施例４による熱電変換モジュールとの相違点に着目して説明する。 In FIG. 6, sectional drawing of the thermoelectric conversion module by Example 6 is shown. Hereinafter, description will be made focusing on differences from the thermoelectric conversion module according to the fourth embodiment.

第１の接続部材１８の弾性部分１８Ａに、外方に向かって張り出した張出部１８Ｄが形成されている。張出部１８Ｄと板状部分１８Ｆとの間に、第１の基板１５が保持される。これにより、第１の接続部材１８に対して、第１の基板１５の厚さ方向の位置が拘束される。第２の接続部材１９及び第３の接続部材２０にも、同様の張出部１９Ｄ、２０Ｄが形成されている。 A protruding portion 18D that protrudes outward is formed on the elastic portion 18A of the first connecting member 18. The first substrate 15 is held between the overhanging portion 18D and the plate-like portion 18F. As a result, the position of the first substrate 15 in the thickness direction is constrained with respect to the first connecting member 18. Similar overhang portions 19D and 20D are formed in the second connection member 19 and the third connection member 20, respectively.

第１〜第３の接続部材１８〜２０に対して、第１の基板１５及び第２の基板１６の厚さ方向の位置が拘束されるため、第１の基板１５と第２の基板１６との間に、間隙を維持するためのスペーサを配置する必要はない。 Since the positions of the first substrate 15 and the second substrate 16 in the thickness direction are restricted with respect to the first to third connection members 18 to 20, the first substrate 15 and the second substrate 16 It is not necessary to arrange a spacer for maintaining the gap.

実施例６においても、第１の基板１５及び第２の基板１６が昇温または降温によって膨張または収縮しても、接続箇所の破壊や劣化が抑制される。 Also in Example 6, even if the first substrate 15 and the second substrate 16 expand or contract due to the temperature increase or decrease, the breakage or deterioration of the connection portion is suppressed.

図７Ａに、実施例７による熱電変換モジュールの断面図を示す。以下、実施例１〜実施例３による熱電変換モジュールとの相違点に着目して説明する。 FIG. 7A shows a cross-sectional view of the thermoelectric conversion module according to the seventh embodiment. Hereinafter, description will be made focusing on differences from the thermoelectric conversion modules according to the first to third embodiments.

実施例１〜実施例３においては、第１の接続部材１８と第１の構造体１０Ａとが直接接触していた。実施例７においては、両者の間に、伝熱シート４０が配置されている。伝熱シート４０には、第１の構造体１０Ａ及び第１の接続部材１８とのいずれよりも柔らかい導電材料が用いられる。図３Ｃに示した第１の構造体１０Ａと第２の接続部材１９との間、第２の構造体１０Ｂと第２の接続部材１９との間、及び第２の構造体１０Ｂと第３の接続部材２０との間にも、伝熱シートが配置されている。 In Examples 1 to 3, the first connecting member 18 and the first structure 10A were in direct contact. In Example 7, the heat transfer sheet 40 is arrange | positioned between both. A conductive material that is softer than both the first structure 10 A and the first connection member 18 is used for the heat transfer sheet 40. 3C, between the first structure 10A and the second connection member 19, between the second structure 10B and the second connection member 19, and between the second structure 10B and the third connection member 19. A heat transfer sheet is also disposed between the connecting member 20 and the connecting member 20.

伝熱シート４０は、第１の構造体１０Ａと第１の接続部材１５との密着性を高め、両者の間の熱伝達率を高める機能を持つ。伝熱シート４０には、熱伝導率の高い材料を用いることが好ましい。また、耐熱温度が熱電変換モジュールの動作温度よりも高い材料であることが好ましい。 The heat transfer sheet 40 has a function of improving the adhesion between the first structure 10A and the first connecting member 15 and increasing the heat transfer coefficient between the two. It is preferable to use a material having high thermal conductivity for the heat transfer sheet 40. Moreover, it is preferable that it is a material whose heat-resistant temperature is higher than the operating temperature of a thermoelectric conversion module.

伝熱シート４０を第１の構造体１０Ａと第１の接続部材４０との間に挟んで荷重を印加し、伝熱シート４０を、第１の構造体１０Ａの端面、及び第１の接続部材１５の表面に倣うように変形させておくことが好ましい。これにより、密着性をより高めることができ、接触界面における熱伝達率を高めることができる。 A load is applied by sandwiching the heat transfer sheet 40 between the first structure 10A and the first connection member 40, and the heat transfer sheet 40 is connected to the end face of the first structure 10A and the first connection member. It is preferable to be deformed so as to follow the surface of 15. Thereby, adhesiveness can be improved more and the heat transfer rate in a contact interface can be improved.

伝熱シート４０に用いられる材料として、ニッケル（Ｎｉ）、Ｎｉ基合金、ＳＵＳ３０４鋼、グラファイトシート等が挙げられる。Ｎｉの融点は１４５５℃である。ＳＵＳ３０４鋼の常用耐熱温度は約９００℃である。グラファイトシートの耐熱温度は、常用で約５００℃である。 Examples of the material used for the heat transfer sheet 40 include nickel (Ni), a Ni-based alloy, SUS304 steel, and a graphite sheet. The melting point of Ni is 1455 ° C. The normal heat resistant temperature of SUS304 steel is about 900 ° C. The heat resistance temperature of the graphite sheet is about 500 ° C. in ordinary use.

図７Ｂは、実施例４〜実施例６による熱電変換モジュールに伝熱シート４０を適用した例を示す。第１の構造体１０Ａと第１の接続部材１８との間に、伝熱シート４０が配置されている。 FIG. 7B shows an example in which the heat transfer sheet 40 is applied to the thermoelectric conversion modules according to the fourth to sixth embodiments. A heat transfer sheet 40 is disposed between the first structure 10 A and the first connection member 18.

図４Ａ、図５、図６に示した第１の構造体１０Ａと第２の接続部材１９との間、第２の構造体１０Ｂと第２の接続部材１９との間、及び第２の構造体１０Ｂと第３の接続部材２０との間にも、伝熱シートが配置されている。 4A, FIG. 5 and FIG. 6, between the first structure 10A and the second connection member 19, between the second structure 10B and the second connection member 19, and the second structure. A heat transfer sheet is also disposed between the body 10 B and the third connection member 20.

図７Ｂに示した例では、伝熱シート４０は、熱伝達率を高めるとともに、電気的な接触抵抗を低減させる機能を併せ持つ。 In the example shown in FIG. 7B, the heat transfer sheet 40 has a function of increasing the heat transfer coefficient and reducing the electrical contact resistance.

以上実施例に沿って本発明を説明したが、本発明はこれらに制限されるものではない。例えば、種々の変更、改良、組み合わせ等が可能なことは当業者に自明であろう。 Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

以上の実施例１〜実施例７を含む実施形態に関し、更に以下の付記を開示する。 The following additional notes are further disclosed with respect to the embodiments including the above-described Examples 1 to 7.

（付記１）
間隙を挟んで配置された第１及び第２の基板と、
前記間隙内に、前記第１の基板から前記第２の基板まで及ぶように配置された熱電効果を生じる第１の構造体と、
前記第１の構造体の前記第１の基板側の第１の端部に弾性力によって接続された第１の接続部材と、
前記第１の構造体の前記第２の基板側の第２の端部に弾性力によって接続された第２の接続部材と
を有し、
前記第１の構造体の前記第１の端部は、前記第１の接続部材を介して、前記第１の基板の面内方向に関する位置が拘束され、前記第１の構造体の前記第２の端部は、前記第２の接続部材を介して、前記第２の基板の面内方向に関する位置が拘束されている熱電変換モジュール。 (Appendix 1)
First and second substrates disposed with a gap therebetween;
A first structure for producing a thermoelectric effect disposed in the gap so as to extend from the first substrate to the second substrate;
A first connection member connected by elastic force to a first end of the first structure on the first substrate side;
A second connection member connected by elastic force to a second end of the first structure on the second substrate side;
The position of the first end portion of the first structure body in the in-plane direction of the first substrate is constrained via the first connection member, and the second end portion of the first structure body is restrained. The end portion of the thermoelectric conversion module in which the position in the in-plane direction of the second substrate is constrained via the second connection member.

（付記２）
前記第１の構造体の前記第１の端部の端面に凹部が形成されており、
前記第１の基板が、前記凹部に対応する位置に形成された開口を含み、
前記第１の接続部材は、前記第１の基板の前記開口、及び前記第１の端部の凹部内に挿入され、復元力によって該凹部内に支持された弾性部分を含む付記１に記載の熱電変換モジュール。 (Appendix 2)
A recess is formed on an end surface of the first end of the first structure,
The first substrate includes an opening formed at a position corresponding to the recess;
The first connection member includes an elastic portion that is inserted into the opening of the first substrate and the recess of the first end portion and is supported in the recess by a restoring force. Thermoelectric conversion module.

（付記３）
前記第１の接続部材は、前記第１の構造体の前記第１の端部の外周面に接触し、該外周面に作用する復元力によって該第１の構造体に支持された弾性部分を含む付記１に記載の熱電変換モジュール。 (Appendix 3)
The first connecting member contacts an outer peripheral surface of the first end portion of the first structure, and an elastic portion supported by the first structure by a restoring force acting on the outer peripheral surface. The thermoelectric conversion module according to appendix 1, including:

（付記４）
前記第１の基板は、前記第１の構造体の第１の端部及び該第１の端部の外周面に接触する前記第１の接続部材の弾性部分が挿入された開口を含む付記３に記載の熱電変換モジュール。 (Appendix 4)
The first substrate includes an opening into which the first end portion of the first structure and the elastic portion of the first connecting member that contacts the outer peripheral surface of the first end portion are inserted. The thermoelectric conversion module described in 1.

（付記５）
前記第１の接続部材は、
前記第１の構造体の第１の端部の端面に沿う板状部分と、
前記板状部分の、前記第１の構造体に接触する表面とは反対側の表面に形成された突起と
を含み、
前記第１の基板は、前記突起が挿入される開口を含む付記３に記載の熱電変換モジュール。 (Appendix 5)
The first connecting member is
A plate-like portion along the end face of the first end of the first structure;
A protrusion formed on the surface of the plate-like portion opposite to the surface in contact with the first structure,
The thermoelectric conversion module according to appendix 3, wherein the first substrate includes an opening into which the protrusion is inserted.

（付記６）
さらに、
前記間隙内に、前記第１の基板から前記第２の基板まで及ぶように配置された熱電効果を生じる第２の構造体と、
前記第２の構造体の前記第１の基板側の第１の端部に弾性力によって接続された第３の接続部材と
を有し、
前記第２の構造体の前記第２の基板側の第２の端部は、弾性力によって前記第２の接続部材に接続されている付記１乃至５のいずれか１項に記載の熱電変換モジュール。 (Appendix 6)
further,
A second structure for producing a thermoelectric effect disposed in the gap so as to extend from the first substrate to the second substrate;
A third connecting member connected by elastic force to a first end of the second structure on the first substrate side;
The thermoelectric conversion module according to any one of appendices 1 to 5, wherein a second end of the second structure body on the second substrate side is connected to the second connection member by an elastic force. .

（付記７）
前記第２の接続部材は、前記第１の構造体と前記第２の構造体とを電気的に接続する付記６に記載の熱電変換モジュール。 (Appendix 7)
The thermoelectric conversion module according to appendix 6, wherein the second connection member electrically connects the first structure and the second structure.

（付記８）
さらに、前記第１の構造体の端面と前記第１の基板との間に、該第１の構造体及び該第１の基板のいずれよりも柔らかい材料で形成された伝熱シートが配置されている付記２に記載の熱電変換モジュール。 (Appendix 8)
Further, a heat transfer sheet made of a softer material than either the first structure or the first substrate is disposed between the end surface of the first structure and the first substrate. The thermoelectric conversion module according to Appendix 2.

（付記９）
さらに、前記第１の構造体の端面と前記第１の接続部材との間に、該第１の構造体及び該第１の基板のいずれよりも柔らかい材料で形成された伝熱シートが配置されている付記３乃至５のいずれか１項に記載の熱電変換モジュール。 (Appendix 9)
Further, a heat transfer sheet formed of a softer material than either the first structure or the first substrate is disposed between the end face of the first structure and the first connecting member. The thermoelectric conversion module according to any one of appendices 3 to 5.

（付記１０）
前記第１の接続部材は、前記第１の構造体の端面に沿う板状部分を含み、前記弾性部分は、前記板状部分から離れた位置に、外向きに張り出した張出部を含み、
前記第１の基板は、前記第１の構造物の軸方向に関して、前記板状部分と前記張出部との間に支持されている付記３に記載の熱電変換モジュール。 (Appendix 10)
The first connecting member includes a plate-like portion along an end surface of the first structure, and the elastic portion includes an overhanging portion protruding outward at a position away from the plate-like portion,
The thermoelectric conversion module according to appendix 3, wherein the first substrate is supported between the plate-like portion and the projecting portion with respect to the axial direction of the first structure.

１０Ａ第１の構造体
１０Ｂ第２の構造体
１０Ｅ第１の端部
１０Ｆ第２の端部
１１Ａ奥部
１２Ａ導電膜
１５第１の基板
１５Ａ開口
１６第２の基板
１６Ａ開口
１８第１の接続部材
１８Ａ弾性部分
１８Ｄ張出部
１８Ｆ板状部分
１９第２の接続部材
１９Ａ、１９Ｂ弾性部分
１９Ｄ張出部
１９Ｆ板状部分
２０第３の接続部材
２０Ａ弾性部分
２０Ｄ張出部
２０Ｆ板状部分
３０スペーサ
３１ボルトとナット
４０伝熱シート 10A 1st structure 10B 2nd structure 10E 1st edge part 10F 2nd edge part 11A back part 12A Conductive film 15 1st board | substrate 15A opening 16 2nd board | substrate 16A opening 18 1st connection member 18A Elastic part 18D Overhang part 18F Plate-like part 19 Second connecting member 19A, 19B Elastic part 19D Overhang part 19F Plate-like part 20 Third connection member 20A Elastic part 20D Overhang part 20F Plate-like part 30 Spacer 31 Bolts and nuts 40 Heat transfer sheet

Claims

間隙を挟んで配置された第１及び第２の基板と、
前記間隙内に、前記第１の基板から前記第２の基板まで及ぶように配置された熱電効果を生じる第１の構造体と、
前記第１の構造体の前記第１の基板側の第１の端部に弾性力によって接続された第１の接続部材と、
前記第１の構造体の前記第２の基板側の第２の端部に弾性力によって接続された第２の接続部材と
を有し、
前記第１の構造体の前記第１の端部は、前記第１の接続部材を介して、前記第１の基板の面内方向に関する位置が拘束され、前記第１の構造体の前記第２の端部は、前記第２の接続部材を介して、前記第２の基板の面内方向に関する位置が拘束されている熱電変換モジュール。 First and second substrates disposed with a gap therebetween;
A first structure for producing a thermoelectric effect disposed in the gap so as to extend from the first substrate to the second substrate;
A first connection member connected by elastic force to a first end of the first structure on the first substrate side;
A second connection member connected by elastic force to a second end of the first structure on the second substrate side;
The position of the first end portion of the first structure body in the in-plane direction of the first substrate is constrained via the first connection member, and the second end portion of the first structure body is restrained. The end portion of the thermoelectric conversion module in which the position in the in-plane direction of the second substrate is constrained via the second connection member.

前記第１の構造体の前記第１の端部の端面に凹部が形成されており、
前記第１の基板が、前記凹部に対応する位置に形成された開口を含み、
前記第１の接続部材は、前記第１の基板の前記開口、及び前記第１の端部の凹部内に挿入され、復元力によって該凹部内に支持された弾性部分を含む請求項１に記載の熱電変換モジュール。 A recess is formed on an end surface of the first end of the first structure,
The first substrate includes an opening formed at a position corresponding to the recess;
2. The first connection member includes an elastic portion that is inserted into the opening of the first substrate and a recess of the first end portion and is supported in the recess by a restoring force. Thermoelectric conversion module.

前記第１の接続部材は、前記第１の構造体の前記第１の端部の外周面に接触し、該外周面に作用する復元力によって該第１の構造体に支持された弾性部分を含む請求項１に記載の熱電変換モジュール。 The first connecting member contacts an outer peripheral surface of the first end portion of the first structure, and an elastic portion supported by the first structure by a restoring force acting on the outer peripheral surface. The thermoelectric conversion module according to claim 1.

前記第１の基板は、前記第１の構造体の第１の端部及び該第１の端部の外周面に接触する前記第１の接続部材の弾性部分が挿入された開口を含む請求項３に記載の熱電変換モジュール。 The first substrate includes an opening into which a first end portion of the first structure and an elastic portion of the first connecting member that contacts an outer peripheral surface of the first end portion are inserted. 3. The thermoelectric conversion module according to 3.

前記第１の接続部材は、
前記第１の構造体の第１の端部の端面に沿う板状部分と、
前記板状部分の、前記第１の構造体に接触する表面とは反対側の表面に形成された突起と
を含み、
前記第１の基板は、前記突起が挿入される開口を含む請求項３に記載の熱電変換モジュール。 The first connecting member is
A plate-like portion along the end face of the first end of the first structure;
A protrusion formed on the surface of the plate-like portion opposite to the surface in contact with the first structure,
The thermoelectric conversion module according to claim 3, wherein the first substrate includes an opening into which the protrusion is inserted.