JP2010287745A - 搬送モジュール - Google Patents

搬送モジュール Download PDF

Info

Publication number
JP2010287745A
JP2010287745A JP2009140598A JP2009140598A JP2010287745A JP 2010287745 A JP2010287745 A JP 2010287745A JP 2009140598 A JP2009140598 A JP 2009140598A JP 2009140598 A JP2009140598 A JP 2009140598A JP 2010287745 A JP2010287745 A JP 2010287745A
Authority
JP
Japan
Prior art keywords
arm
robot
link
transfer
transfer chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009140598A
Other languages
English (en)
Japanese (ja)
Inventor
Tsutomu Hiroki
勤 廣木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009140598A priority Critical patent/JP2010287745A/ja
Priority to PCT/JP2010/058498 priority patent/WO2010143505A1/ja
Priority to TW99119075A priority patent/TW201117313A/zh
Publication of JP2010287745A publication Critical patent/JP2010287745A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009140598A 2009-06-11 2009-06-11 搬送モジュール Pending JP2010287745A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009140598A JP2010287745A (ja) 2009-06-11 2009-06-11 搬送モジュール
PCT/JP2010/058498 WO2010143505A1 (ja) 2009-06-11 2010-05-20 搬送モジュール
TW99119075A TW201117313A (en) 2009-06-11 2010-06-11 Delivery module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009140598A JP2010287745A (ja) 2009-06-11 2009-06-11 搬送モジュール

Publications (1)

Publication Number Publication Date
JP2010287745A true JP2010287745A (ja) 2010-12-24

Family

ID=43308764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009140598A Pending JP2010287745A (ja) 2009-06-11 2009-06-11 搬送モジュール

Country Status (3)

Country Link
JP (1) JP2010287745A (zh)
TW (1) TW201117313A (zh)
WO (1) WO2010143505A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160127797A (ko) * 2014-03-31 2016-11-04 도쿄엘렉트론가부시키가이샤 기판 처리 시스템

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172121A (ja) * 1994-12-20 1996-07-02 Hitachi Ltd 基板搬送装置
JP2000120824A (ja) * 1998-10-16 2000-04-28 Seiko Seiki Co Ltd パラレルリンク機構
JP2003231076A (ja) * 2002-02-08 2003-08-19 Jel:Kk 搬送アーム
JP4737123B2 (ja) * 2007-03-19 2011-07-27 トヨタ自動車株式会社 移送ロボット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160127797A (ko) * 2014-03-31 2016-11-04 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR101866112B1 (ko) * 2014-03-31 2018-06-08 도쿄엘렉트론가부시키가이샤 기판 처리 시스템

Also Published As

Publication number Publication date
WO2010143505A1 (ja) 2010-12-16
TW201117313A (en) 2011-05-16

Similar Documents

Publication Publication Date Title
CN101262986B (zh) 不等连杆scara臂
KR102647806B1 (ko) 기판 이송 장치
JP4660434B2 (ja) 搬送機構およびそれを備えた処理装置
KR101292135B1 (ko) 시저 리프트 이송 로봇
KR100438502B1 (ko) 웨이퍼 가공 시스템
JP5467115B2 (ja) 搬送装置及びこれを用いた真空処理装置
US20130272823A1 (en) Robot systems, apparatus, and methods having independently rotatable waists
TWI704038B (zh) 用於在進行電子設備製造時輸送基板的機械手組件、基板處理裝置及方法
TWI453854B (zh) 基板無粒子處理裝置
JP5984036B2 (ja) z運動し、多関節アームを備える直線真空ロボット
TW201536494A (zh) 用於傳輸電子裝置製造中之基板之機器人設備、驅動組件,及方法
TW201145430A (en) Conveyance arm and conveyance robot with same
US20230129289A1 (en) Transport apparatus with linear bearing and method therefor
JP2007019216A (ja) 基板の搬送ロボット
TWI514499B (zh) Drive device and substrate processing system
JP5306908B2 (ja) 搬送モジュール
JP2010076073A (ja) 回転駆動装置
WO2010143505A1 (ja) 搬送モジュール
US20020182036A1 (en) Semiconductor wafer handling robot for linear transfer chamber
CN117637564A (zh) 具有单独附件馈通的衬底运输装置
CN101740439B (zh) 用于传输和处理衬底的装置和方法
JP5239845B2 (ja) 基板搬送ロボット、基板搬送装置および半導体製造装置
JP2000216214A (ja) 基板処理装置
JPH04264749A (ja) ウエハ移送ロボット
JP2010093028A (ja) 基板搬送システム