JP2010287745A - 搬送モジュール - Google Patents
搬送モジュール Download PDFInfo
- Publication number
- JP2010287745A JP2010287745A JP2009140598A JP2009140598A JP2010287745A JP 2010287745 A JP2010287745 A JP 2010287745A JP 2009140598 A JP2009140598 A JP 2009140598A JP 2009140598 A JP2009140598 A JP 2009140598A JP 2010287745 A JP2010287745 A JP 2010287745A
- Authority
- JP
- Japan
- Prior art keywords
- arm
- robot
- link
- transfer
- transfer chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009140598A JP2010287745A (ja) | 2009-06-11 | 2009-06-11 | 搬送モジュール |
PCT/JP2010/058498 WO2010143505A1 (ja) | 2009-06-11 | 2010-05-20 | 搬送モジュール |
TW99119075A TW201117313A (en) | 2009-06-11 | 2010-06-11 | Delivery module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009140598A JP2010287745A (ja) | 2009-06-11 | 2009-06-11 | 搬送モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010287745A true JP2010287745A (ja) | 2010-12-24 |
Family
ID=43308764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009140598A Pending JP2010287745A (ja) | 2009-06-11 | 2009-06-11 | 搬送モジュール |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2010287745A (zh) |
TW (1) | TW201117313A (zh) |
WO (1) | WO2010143505A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160127797A (ko) * | 2014-03-31 | 2016-11-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172121A (ja) * | 1994-12-20 | 1996-07-02 | Hitachi Ltd | 基板搬送装置 |
JP2000120824A (ja) * | 1998-10-16 | 2000-04-28 | Seiko Seiki Co Ltd | パラレルリンク機構 |
JP2003231076A (ja) * | 2002-02-08 | 2003-08-19 | Jel:Kk | 搬送アーム |
JP4737123B2 (ja) * | 2007-03-19 | 2011-07-27 | トヨタ自動車株式会社 | 移送ロボット |
-
2009
- 2009-06-11 JP JP2009140598A patent/JP2010287745A/ja active Pending
-
2010
- 2010-05-20 WO PCT/JP2010/058498 patent/WO2010143505A1/ja active Application Filing
- 2010-06-11 TW TW99119075A patent/TW201117313A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160127797A (ko) * | 2014-03-31 | 2016-11-04 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
KR101866112B1 (ko) * | 2014-03-31 | 2018-06-08 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
Also Published As
Publication number | Publication date |
---|---|
WO2010143505A1 (ja) | 2010-12-16 |
TW201117313A (en) | 2011-05-16 |
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