TW201117313A - Delivery module - Google Patents

Delivery module Download PDF

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Publication number
TW201117313A
TW201117313A TW99119075A TW99119075A TW201117313A TW 201117313 A TW201117313 A TW 201117313A TW 99119075 A TW99119075 A TW 99119075A TW 99119075 A TW99119075 A TW 99119075A TW 201117313 A TW201117313 A TW 201117313A
Authority
TW
Taiwan
Prior art keywords
arm
link
transport
chamber
drive shaft
Prior art date
Application number
TW99119075A
Other languages
Chinese (zh)
Inventor
Tsutomu Hiroki
Original Assignee
Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201117313A publication Critical patent/TW201117313A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

This invention provides a delivery module capable of downsizing a delivery chamber in which a robot is received. Within a delivery chamber 14 is received a robot 12 for carrying an object W to be processed. The robot 12 includes arms 33, 34 connected to driving shaft 31, 32 and being rotatable in a horizontal plane, arm supporter 42 for supporting the arms 33, 34 at locations away from the driving shaft 31, 32 and transmitting the weight of the arms 33, 34 to the bottom face 14a of the delivery chamber 14, and a holder 39 for holding the object W to be processed and being able to move within a plane following the rotation of the arms 33, 34. Since cantilever support for the arms 33, 34 at the joints of the robot 12 is not necessary, it is possible to reduce the rigidity of the joints of the robot 12 and the arms 33, 34. Besides, since the size of the robot 12 in the height direction thereof is determined by the rigidity of the joints of the robot 12 and the arms 33, 34, it is possible to reduce the size of the robot 12 in the height direction thereof.

Description

201117313 六、發明說明: 【發明所屬之技術領域】 被運半導體晶圓、液晶縣板、有機el元件等 【先前技徇j 製造半導體祕❹PD(Flat Panel Display)時,可對半導體基 以成膜、_、氧化、擴散等各種處理。此 室内進行。為使處理穩定處理腔室内部 運送室亦呈真空,俾保持處理腔室内 室之於運送娜姆處理腔室與運送 r板,以之處理腔_ =卿機魏㈣儀‘ 首先’配置傳遞如下。 室呈真空後,運送模組機。真 將其導入運送室内後,傳至處 ·内之基板’ 臂運送基板至所有呈放射狀_之各運送模纽機械 2=真 201117313 業界要求運送桓相谨^ ^ 面内迴旋之功能,或使抛=之機械臂具有使被處理體於水平 有迴旋功能及伸縮功能之放射方向移動之功能。作為具 桿之娃足幾械臂(參照專^= 械=已知如娃足構成臂及連 向動作之水平多關節型機械 )^連結之複數根臂沿水平方 轉,且安裝於臂之滑件相對於水平面内旋 械臂(參照專利文獻3)。 牛k方向滑動之圓筒座標系機 先前技術文獻 專利文獻 日本特開平3_136779號公報 特開平8-27414〇號公報 專利文獻3··日本_娜丨6·號公報 【發明内容】 (發明所欲解決之課題) 然而,習知之機械臂呈以歸臂 认 及連桿之構造,故雖係運语輕^之曰$支持2平面内旋轉之臂 及連桿剛性需高。機械臂高度方向^寸之關節、臂 連捍之剛性;^定,故機械臂運送 室關節、臂及 送室係深度配合所搭载之機械臂尺寸之=度2向於ί高。運 之尺寸一旦增大,即需增加運甚°°機械臂鬲度方向 運送室板厚。因此,難以實現運切削加工量’或增加 特別是近年來,片成之^門 300mm大型化至450mm。伴隨著 ^ j尺寸自例如口徑 臂增大基錢魏㈣使奴賴"軌1 ^ t界要求麵 故搭載有麵叙運送室高度_向^ ^相彳性需更高, 化之明之目的在於提供可實現^^臂之運送室小型 (解決課題之手段) 為解決上述課題,本發明之一態樣係—種運送模組,收納使 201117313 臂包含:_之機械臂至少—部分於運送室,其特徵在於該機械 藉由驅動源旋轉驅動; 臂i持部:軸於水平面内旋轉; 該運送室底面;ί持該仏離該驅動轴之位置,傳遞該臂重量至 =:¾運=臂旋轉在水平面内移動。 機械臂至少-部分於且’收納使被運送體移動之 驅,严驢動;;翻:徵在於該機械臂包含·· 一、結合區動軸於水平面内旋轉; 固持體ί水面?,可旋轉之方式連結該臂; 旋轉在水平面内移動,固結該連桿’藉由該臂 置,傳遞 桿雜蝴之― (發明之效果) 故機=====或連桿之重量, 連桿之剛性。可抑制機械臂高節/ 制運送室高度,實現運送室之成本降低。 文Τ降低亚抑 實施方式】 以下參照附圖5兒明本發明運送模级一實施形態 與處理系統系2。 '類為入口運送系 之 於入口運送系1設有縱長形成之入口運送室3。於入 3J則面之入口埠4設置有作為被處理體收納複數片晶 至 圓凹口等以定位 斋。於入口運送室3長邊方向端部設有認知晶 皿谷 曰曰 6 201117313 圓之定位裝置5。於入π運送室3搭載有在人口埠技 7°多_械臂7 “滑動ΐί ill:運运至長邊方向滑動。多關節機械臂7固持晶圓之 才《取裔可沿垂直方向且沿水平方向移動,俾可傳遞晶圓持0 於處理系統系2巾央配置有呈多角形形成之轉移模《且1〇 ^模組10周圍呈放射狀配置有複數處理模組u。各處、 真空之處理腔室崎晶圓進行成膜、侧、氧化、擴散 舰大氣壓之小房間所構成。轉移模組1〇 4理3 模組1〇與真空預備室6經由閘閥13、16連結。直、: 預備至6與入口運送室3經由閘閥15連結。 一 如圖2所示,轉移模組1〇包含: 運送室14,呈平面多角形形成;及 機械臂12,搭載於運送室14内。 6 ^ 声理1夕日门,模組11。且可接收處理模組11内 圓其引入轉移模、组10内後,運送至真空預備官 3 ϊϊ θΒ1之功能。機械臂12首先於水平面内使晶圓 ΐ疋沿放射組11或真空預備室6之方向。 模組11或真空職&内。ssK w自運送室丨4移動至處理 節機。如圖1所示,首先多關 定位裝置5。定置/l 11盒容11内之晶® ’將其運送至 真空預備室6。此^直’多關節機械臂7運送晶圓至 1攻,異工麵至6内部為大氣壓。 備室6呈真^其室3 =之,15 ’真空預 組10。轉移模組10預井甲^人連通真空預備至6與轉移模 固持真空預備室6内之a ' 搭載於轉移模組1G之機械臂12 至内之日曰®,將其導入運送室14内。其後,機械 201117313 臂12將晶圓傳至處理模組u。於處理模組u處理一旦結束,機 械臂12即自處理模組11取出晶圓’將晶圓傳至進行下一處理之(下 模組11。於處理模組11處理整體—旦結束,機械臂 12即運送處理模組U内之晶圓至真空預備室6。 徽ΐΐ,關閉真空預備室6之閘閥13,開啟閘閥15,恢復真空 = 多關節機械臂7將處理結束之晶圓自真空預 \2==,轉移模組1()運送室14形成為四角形、六角形、 邊Ιΐίϊΐ處理模組數量或配置之多角形箱型。處理模組11 一 模組η時,設定運送室14多^^之角=一邊連接一座處理 ,接二座處理;1< 角形邊之長度例如約10〇〇mm,連 反慝理杈組11時,設定例如約1800_。 運送室14包含: 今體部21,收納機械臂12 ;及 蓋22,可相對於本體部21開合。 本體部21包含: 底壁部21a,呈多角形形成;及 侧壁2lb,包圍底壁部如周圍。 现空出有用以使晶圓^^=23配|^水平面内。於側壁部 f尸與側壁部21b之間= 有由二 =,部严之絞鏈引導。 從0形環(未經圖示)。本體部21及蓋廷至14内部之大口 亦可形成氧化鋁等保護骐。 之材質為鋁或不鏽鋼, 蓋22對應多角形本體部21呈 以目視或測定晶® W之窗或感測器^成。於蓋22安震有用 ,運送室!4之蓋22,運送室14° 進行處理期間内, 内。ί5或檢查機械臂12時,開啟蓋22。呈真二。打掃運送室14 於運送室14内收納有運读曰 含蛙足式運賴構30。j械㈣。顧臂12 从扭送機構30包含: 8 201117313 第一及第二驅動軸31、32 ; 第-及,二臂33、34,結合第—及第二驅動軸31、32 ; 專及第一連杯35、%,經由銷•轴承37以可旋轉之方式連 結苐一及第二臂33、34前端部;及 =為固?體之固持板39,經由銷·轴* %以可旋轉之方式連 、,’σ弟一及第二連桿35、36。 第:及第二驅動軸3卜32藉由作為驅動源之馬達旋轉驅動。 ^及第二驅動軸3卜32沿垂直方向延伸,其中碰相互—致。 、、-。&第一及第二驅動軸31、32之第一及第二臂33、34在水 内旋臂%之長度與第二臂34相同。連結第—及第二臂 、之弟一及第二連桿35、36亦在水平面内旋轉。第-連椁 35之長度與第二連桿36相同。 ,紐足式運送機構3〇中,第—及第二驅動軸3卜幻 向旋轉’運送機構3G整體即伸縮,固持板39於水平 °如圖2所示’運送機構3G最為伸長時,晶 甚朝n 4狹縫23朝外衝出。第一及第二驅動軸31、32 ί嗜雜獻運送觸3(3即在水平面内迴旋, 刀別由固疋於设體之軸承以可旋轉之方式支持之。 2 =圖2所*,於第一及第二臂33、34前端部安裝 34亦連結有連桿35、36,故臂支持部 二=、# 33、 之重量。且於連桿35、36固持板39側之前桿% 35、36重量至運送室Μ底壁部叫之連^而 遞連桿 部44在運送機構3〇伸長時不自運送室 之力杯支持 111出之乾圍内配置於連 201117313 桿35、36前端側。連桿支持部44允許 動(例如旋轉運動)並同時支持連桿35、36之的十面的自由運 子)附著於晶圓w,此等臂支持部42及 J;,防止微粒(粒 圓W更下方。 支持。卩44配置於較晶 圖4及圖5顯示係臂支持部及連 51。球形腳輪51包含: 、。卩—例之球形腳輪 球體固持框52,結合臂33、34或連桿3 滾動體固持框;及 %下表面’作為 ϊί L3 Viri轉固持於球體固持框52。 球體53可以其中心為中心朝所有方向 或連桿35、36之重量並同時在運送負载ί 33、34 進行滾動if動。球體固持框52及球 # 部21a上表面) 運送室Η底面14a如溜冰場被覆製。於 薄膜54。潤滑薄膜Μ由氟樹脂(龍之摩擦之潤滑 固體潤滑鮮所構成。潤滑薄膜可形成^:運冊商=)、二硫化鶴之 面,亦可沿依序移動之臂33'34或 3 至14底面14a全 於運送室14底面14a不塗布滑、、由黧件、典、之執道形成。又, 潤滑油蒸發。 / θ/心。此係為防止在真空中 圖6顯示臂支持部及連桿支 部及連桿支持部由下列者構成:、 列。此例中,臂支持 磁化層56,貼附於運送室14底壁部21&; 磁石57,推斥該磁化層56。 磁化層56由使例如鐵酸越_ 於磁化層56沿上下方向磁化^及’ ^ ’ ^磁性體所構成。 方向磁化為N極及S極。# 磁石57亦沿上下 相對’磁化層56與磁石57相推斥/磁石s ^ /、磁石57之^^極 此例中’磁石57可以非接觸之方式 可自,層56浮升。 故磁石57順暢移動。 乃式相對於運达室底面14a移動, 之』臂口室,與收納本實施形態 r比較運达室高度。如圖7(a)之習知 201117313 例所示,習知之機械臂 自此等者之旋轉中心沿式受到臂61及連桿62 63負載自臂61作用之^向延:。又:導臂61旋轉之軸承 桿62作用之力矩。特二2導連桿62說轉之軸承64負載自連 承受最大的力矩。因此申長時,軸承纪、64 矩大,臂61本身;5, θ大軸承63、64之尺寸,俾可負載力 數細1之晶圓w,作亦需增厚。其結果,雖運送厚度 MAWU ,連送至14之高度尺寸Μ大。 34負載之臂支持部圖427(=^=所*,藉由設置支持臂33、 可支持臂33、34錢=持^35、36負載之連桿支持部44, 引導臂33、34旋轉夕二“ 方向兩端部’可降低施加於 之力矩,可降低t义3=4^連^5、36旋轉之轴祕 可實現轴承65、66、臂33 % =及連桿35、36本身之力矩。 h2在不干擾機械臂12 f =了。又疋運达至14咼度 可抑制運itt Μ純h2lt盡趋。㈣咖_丨2高度, 依本貫施形態,可抑制運送官〗古 室Η之成本降低或輕量化:且可i 度至^限,故可實現運送 η血晶圓或玻璃基板等)。且可m距基板(例如 化’故可使此等者高逮作動^ 435、%輕量 之小型化。订、沾丨代止、u J現回處理能力、省能源、馬達 之機械臂12減^事故(對物、對人)時之損害,故係安全 具有述娃足式運送機構%之機械臂,只要是 臂或圓筒座標系$械臂。之機械臂’可適用於水平多關節型機械 圖8顯示水平多關節型機械臂。^ ^ ^ ^ 水:面内迴旋之第一及第二臂71#72,mm在 下表面設有支持第-及第二臂71、7會〗71、72 w於水平面内迴旋。藉由第—臂71及第=/72—朝向: 11 201117313 晶圓w沿放射方向移動。 $ 9顯不圓筒座標系機械臂。此機械臂包含: 臂(Θ軸)81 ’使晶圓w迴旋.及 R⑽,使晶叫;;方向及滑動。 臂,向败雜導執。於 之臂支持部83。藉的81、傳遞至魏室14底面14a 皮帶85等直線驅動R轴82之線f導軌面,旋。藉由以 圍内可進行各種變更。例如=臂旨之範 一者支持板侧宜有—個以上部其中 FPD製造裝置運=、、’且:造裝置’亦可適用於 送模組連接進行處理之座處理it曰運一座運 室,運送室内部呈真空或回到大氣壓。、至兼作為真工預備 且本發明之運送模纟且如(SJ m抓— 口不同之線上型半導體’亦可適晶圓入口與出 圓置入處理模組93内,出口^則^。入模㈣僅將晶 晶圓。 側運达模組92僅自處理模組93取出 有以咏-峨機構而具 二座運送機構可使處座運送機構。藉由設置 本說明書根據2〇〇9年6月n 口& 層携98。包含其所有内容於此月1日所申味之日本特願 【圖式簡單說明】 Ξ; ㈡:以導:元件製_,圖。 圖3係娃足式運送機構=立^圖’機組)之立體圖。 下 圖4係顯示藉由將臂支持部及連桿支持部安裝於臂及連捍 12 201117313 表面之球形腳輪構成之例圖。 圖5係球形腳輪之詳細圖。 圖6係顯示臂支持部及連桿支持部之另一例圖。 ,7係習知例與本翻例中運送室之高度之比較圖(圖中⑻顯 不習知例’圖中0)顯示本發明例)。 圖8係水平多關節型機械臂之立體圖。 圖9係圓筒座標系機械臂之侧視圖。 圖1〇係線上型轉體轉製钱置之俯視圖。 【主要元件符號說明】 hl、h2..·高度尺寸 W...晶圓 1…入口運送系 2...處理系統系 3…入Π7運送室 4…入口埠 5…定位裝置 6…真空預備室 7…多關節機械臂 8…滑動轴 10…轉移模組(運送模級) 11…處理模組 12…機械臂 13 ' b、16…閘閥 Μ…運送室 14a…運送室]4之底面 21…本體部 21a…底壁部 21b…側壁部 22…蓋 13 201117313 23.. .狹縫 30.. .運送機構 31.. .第一驅動軸 32…第二驅動轴 33.. .第一臂 34…第二臂 35.. .第一連桿 36…第二連桿 37、38...銷•轴承 39.. .固持板(固持體) 41.. .殼體 42.. .臂支持部 44.. .連桿支持部 51.. .球形腳輪(臂支持部、連桿支持部) 52…球體固持框(滾動體固持框) 53…球體(球形滚動體) 54.. .潤滑薄膜 56.. .磁化層 57.. .磁石 6卜81…臂 62.. .連桿 63〜66…軸承 71.. .第一臂 72…第二臂 73.. .第一臂支持部 74…第二臂支持部 82.. .R 軸 83.. .臂支持部 85…皮帶 91.. .入口側運送模組 14 201117313 92.. .出口側運送模組 93.. .處理模組201117313 VI. Description of the Invention: [Technical Fields of the Invention] Semiconductor wafers, liquid crystal panels, organic EL components, etc. [Previous technology] When manufacturing a semiconductor panel PD (Flat Panel Display), a semiconductor substrate can be formed into a film. , _, oxidation, diffusion and other treatments. This is done indoors. In order to make the processing room inside the chamber stable, the vacuum chamber is also maintained. The chamber is kept in the processing chamber to transport the namm processing chamber and transport the r plate to process the chamber. _ = Qing machine Wei (four) instrument 'First' configuration transfer is as follows . After the chamber is vacuumed, the module machine is transported. After it is introduced into the transport room, it will be transferred to the inside of the substrate. The arm transports the substrate to all the transporting molds that are radial. 2=True 201117313 The industry is required to transport the functions of the in-plane rotation, or The robot arm of the throwing body has a function of moving the object to be processed in the radial direction of the horizontal turning function and the stretching function. As a pole of the arm of the arm (refer to the special ^ = machinery = known as the foot of the foot constitutes the arm and the direction of the movement of the multi-joint type of machinery) ^ link of the plurality of arms along the horizontal direction, and installed in the arm The slider is rotated with respect to the horizontal plane (refer to Patent Document 3). Cylinder coordinate system for sliding in the singularity of the singular singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the invention. Problem to solve) However, the conventional robot arm has the structure of the arm and the connecting rod, so it is necessary to support the rotation of the arm and the connecting rod in the two planes. The height of the arm in the height direction of the arm and the rigidity of the arm are the same; therefore, the size of the arm mounted on the joint of the arm joint, the arm and the chamber is 2 degrees. Once the size of the transport is increased, it is necessary to increase the transport chamber thickness in the direction of the arm. Therefore, it is difficult to achieve the amount of machining and the increase or the like. In particular, in recent years, the 300 mm of the sheet has been enlarged to 450 mm. Along with the size of ^ j, for example, the increase of the base of the caliber arm Wei (four) makes the slaves " track 1 ^ t boundary requires the surface to carry the height of the transport room _ to ^ ^ ^ 彳 彳 需 需 需 需In order to solve the above problems, an embodiment of the present invention is a transport module that accommodates the 201117313 arm including: at least part of the transport. a chamber characterized in that the machine is rotationally driven by a driving source; an arm holding portion: the shaft rotates in a horizontal plane; a bottom surface of the conveying chamber; and the position of the arm is transferred from the driving shaft to the weight of the arm to ==3⁄4 = Arm rotation moves in the horizontal plane. The mechanical arm is at least partially-partially and 'accommodated to drive the transported body to move, and is severely swayed; the turn-over: the mechanical arm includes ·· 1. The joint moving shaft rotates in the horizontal plane; the retaining body ί water surface? Rotating to connect the arm; Rotating moves in the horizontal plane, consolidating the connecting rod 'by the arm, transmitting the rod--- (The effect of the invention) The machine ===== or the weight of the connecting rod, even The rigidity of the rod. The height of the robot arm can be suppressed and the height of the transport chamber can be reduced, and the cost of the transport chamber can be reduced. Τ Τ 亚 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施. The inlet transport system 1 is provided with an inlet transport chamber 3 formed vertically. In the inlet 埠4 of the surface of the 3J, a plurality of lamellae are placed as a to-be-processed object to a circular recess or the like to position the slab. A circular disc positioning device 5 is provided at the end of the entrance transport chamber 3 in the longitudinal direction. The π transport chamber 3 is equipped with a population of more than 7° _ arm 7 "sliding ΐ ί ill: transported to the long side direction. The multi-joint robot 7 holds the wafer only. Moving in the horizontal direction, the transferable wafer holds 0. The processing system is provided with a transfer die formed in a polygonal shape in the center of the towel system, and a plurality of processing modules u are radially arranged around the module 10. The vacuum processing chamber is formed by a small room for film formation, side, oxidation, and diffusion of atmospheric pressure. The transfer module 1 is configured to be connected to the vacuum preparation chamber 6 via the gate valves 13 and 16. The preparatory to 6 is connected to the inlet transport chamber 3 via the gate valve 15. As shown in Fig. 2, the transfer module 1A includes: a transport chamber 14 formed in a plane polygonal shape; and a robot arm 12 mounted in the transport chamber 14. 6 ^ Sounds 1 day gate, module 11. And can receive the function of the inner circle of the processing module 11 after it is introduced into the transfer mold, the group 10, and then transported to the vacuum preparation officer 3 ϊϊ θ Β 1. The mechanical arm 12 is first in the horizontal plane. The wafer is wound in the direction of the radiation group 11 or the vacuum preparation chamber 6. Module 11 or vacuum & inside.ssK w moves from the transport chamber 丨4 to the processing machine. As shown in Fig. 1, firstly, the positioning device 5 is closed. The crystal® in the box 11 is fixed to the vacuum preparation chamber 6 This ^ straight 'multi-joint arm 7 transports the wafer to 1 attack, and the iso-surface to 6 is atmospheric. The chamber 6 is true ^ its chamber 3 =, 15 'vacuum pre-group 10. Transfer module 10 pre- The well is connected to the vacuum preparation to 6 and the transfer mold holds the inside of the vacuum preparation chamber 6 a ' mounted on the robot arm 12 of the transfer module 1G to the inside of the transfer chamber 14 and introduced into the transfer chamber 14. Thereafter, the machine 201117313 The arm 12 transfers the wafer to the processing module u. After the processing module u is processed, the robot arm 12 takes out the wafer from the processing module 11 and transfers the wafer to the next processing (lower module 11) After the processing module 11 is processed as a whole, the robot arm 12 transports the wafer in the processing module U to the vacuum preparation chamber 6. The emblem is closed, the gate valve 13 of the vacuum preparation chamber 6 is closed, the gate valve 15 is opened, and the vacuum is restored. The multi-joint robot 7 forms the processed wafer from the vacuum pre-cut = 2 ==, and the transfer module 1 () transport chamber 14 is formed into a quadrangular shape, a hexagon The edge module ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ ϊΐ 。 。 。 。 。 。 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理The length is, for example, about 10 mm, and is set to, for example, about 1800 mm when the reaction group 11 is connected. The transport chamber 14 includes: the present body portion 21, the storage robot arm 12, and the cover 22 that is detachable from the body portion 21. The body portion 21 includes: a bottom wall portion 21a formed in a polygonal shape; and a side wall 21b surrounding the bottom wall portion such as the periphery. It is vacant to allow the wafer to be disposed in the horizontal plane. Between the side wall portion f body and the side wall portion 21b = there is a hinge of the second =, the part is tight. From the 0-ring (not shown). The large portion of the main body portion 21 and the inside of the cover to the inside of the 14 may also form a protective ridge such as alumina. The material is aluminum or stainless steel, and the cover 22 is formed by visually or measuring the window or sensor of the crystal body corresponding to the polygonal body portion 21. It is useful for the cover 22 Anzhen, the transport room! 4 cover 22, the transport chamber 14 ° during the processing period, inside. When the robot arm 12 is inspected, the cover 22 is opened. Really two. The cleaning and transporting room 14 houses a transport 曰 in the transport room 14 and includes a frog foot-type transport structure 30. j (four). The arm 12 from the twisting mechanism 30 comprises: 8 201117313 first and second drive shafts 31, 32; first and second arms 33, 34, combined with the first and second drive shafts 31, 32; 35.%, the front end portions of the first and second arms 33, 34 are rotatably coupled via the pin/bearing 37; and the retaining plate 39 of the solid body is rotatably connected via the pin shaft *% , 'σ 弟 一 and second links 35, 36. The first and second drive shafts 3b are rotationally driven by a motor as a drive source. And the second drive shaft 3b extends in the vertical direction, wherein the touches are mutual. ,, -. The first and second arms 33, 34 of the first and second drive shafts 31, 32 have the same length as the second arm 34 in the water inner arm %. The first and second arms, the first and second links 35, 36 are also rotated in the horizontal plane. The length of the first-link 35 is the same as that of the second link 36. In the three-legged transport mechanism, the first and second drive shafts 3 are slidably rotated, and the transport mechanism 3G is expanded and contracted as a whole, and the holding plate 39 is horizontal. As shown in FIG. 2, when the transport mechanism 3G is most elongated, the crystal Even the n 4 slit 23 rushes out. The first and second drive shafts 31, 32 are accommodating and transporting the touch 3 (3, which is swirled in the horizontal plane, and the cutter is rotatably supported by the bearing fixed to the set body. 2 = Fig. 2*, The first and second arms 33, 34 are attached to the front end portion 34, and the links 35, 36 are also connected, so that the weight of the arm support portion is two, #33, and the rod is before the links 35, 36 are held on the side of the plate 39. 35, 36 weight to the transport chamber, the bottom wall portion is called the connection, and the transfer link portion 44 is not disposed in the dry circumference of the power cup support 111 from the transport chamber when the transport mechanism 3 is extended. In the 201117313 rod 35, 36 The front end side. The link support portion 44 allows movement (e.g., rotational movement) while supporting the ten-sided free transport of the links 35, 36) to the wafer w, the arm support portions 42 and J; (The grain circle W is further below. Support. The 卩44 is arranged in the crystal 4 and FIG. 5 to show the arm support portion and the connection 51. The ball caster 51 includes: 卩, for example, the ball caster ball holding frame 52, the joint arm 33 , 34 or link 3 rolling element holding frame; and % lower surface 'as ϊί L3 Viri to be held by the ball holding frame 52. The ball 53 can be centered in the center The heart is oriented in all directions or the weights of the links 35, 36 and is simultaneously rolled at the transport load ί 33, 34. The ball holding frame 52 and the upper surface of the ball # 21a) The bottom surface 14a of the transport chamber is covered as an ice rink. In the film 54. Lubricating film Μ is composed of fluororesin (lubricated solid lubrication of dragon friction). Lubricating film can be formed into the surface of disulfide crane, and can also move along the arm 33'34 or 3 to 14 The bottom surface 14a is formed entirely by the bottom surface 14a of the transport chamber 14 without being slippery. Also, the lubricating oil evaporates. / θ / heart. This is to prevent the vacuum from being shown in Fig. 6. The arm support portion and the link support portion and the link support portion are composed of the following: In this example, the arm supports the magnetized layer 56 and is attached to the bottom wall portion 21 &; the magnet 57 of the transport chamber 14 to repel the magnetized layer 56. The magnetization layer 56 is composed of, for example, ferrite which is magnetized in the up and down direction with respect to the magnetization layer 56 and a magnetic body. The direction is magnetized to the N pole and the S pole. #磁石57 is also oscillated along the upper and lower relative magnetization layer 56 and magnet 57/ magnet s ^ /, magnet 57 ^ ^ pole In this example, the magnet 57 can be non-contact, the layer 56 can rise. Therefore, the magnet 57 moves smoothly. The equation is moved relative to the bottom surface 14a of the delivery chamber, and the arm chamber is compared with the height of the delivery chamber in the embodiment r. As shown in the conventional example of Fig. 7(a), the conventional robot arm is subjected to the action of the arm 61 and the connecting rod 62 63 from the center of rotation of the arm. Also: the torque acting on the bearing rod 62 that the guide arm 61 rotates. The special two-two guide link 62 is said to be the bearing of the bearing 64 and is self-connected to withstand the maximum torque. Therefore, when the application is long, the bearing segment, 64 moments are large, the arm 61 itself; 5, the size of the θ large bearing 63, 64, and the wafer w with a load of 1 can be thickened. As a result, although the thickness MAWU is transported, the height of the feed to 14 is large. 34 load arm support portion map 427 (=^=*, by providing support arm 33, support arm 33, 34 money = holding 35, 36 load link support portion 44, guide arm 33, 34 rotation The two ends of the direction can reduce the moment applied to it, and can reduce the axis of t=3=4^连^5, 36 rotation. The bearings 65, 66, the arm 33% = and the links 35, 36 themselves Torque. h2 does not interfere with the mechanical arm 12 f =. And the transport reaches 14 degrees to suppress the transport of the itt Μ pure h2lt. (4) coffee _ 丨 2 height, according to the form of the application, can inhibit the delivery of the official The cost of the room is reduced or lightened: it can be adjusted to a limit of η, so it can be transported to the η blood wafer or glass substrate, etc., and can be moved from the substrate (for example, so that the player can be arrested) 435,% light weight miniaturization. Ordering, sputum generation, u J current processing capacity, energy saving, motor robot arm 12 reduction accident (for objects, people) damage, so the safety is described The arm of the foot-type transport mechanism is only the arm of the arm or the cylinder. The arm of the arm can be applied to the horizontal articulated machine. Figure 8 shows the horizontal articulated arm. ^ ^ ^ ^ Water: the first and second arms of the in-plane maneuver 71#72, mm are supported on the lower surface to support the first and second arms 71, 7 and 71, 72 w in the horizontal plane. 71 and /=72—Orientation: 11 201117313 Wafer w moves in the radial direction. $9 shows the cylinder coordinate system arm. This arm contains: arm (Θ axis) 81 ' to wrap wafer w. and R(10) Directional and sliding. Arm, to the miscellaneous guide. On the arm support portion 83. Borrowed 81, transmitted to the bottom surface 14a of the Wei room 14 belt 85 or the like linearly drives the line f of the R-axis 82, Rotate. Various changes can be made in the enclosure. For example, if the arm of the arm is supported, the support side should have more than one part, and the FPD manufacturing device can be used, and the device can also be applied to the module. The processing for connecting and processing is to transport a transportation room, and the inside of the transportation chamber is vacuumed or returned to the atmospheric pressure, and is also used as a real work preparation and the transportation model of the present invention, and (SJ m is different from the on-line type semiconductor) 'It is also possible to place the wafer entrance and exit into the processing module 93, and the exit ^^^. The mold (4) only the crystal wafer. The side transport module 92 The self-processing module 93 is provided with a two-seat transport mechanism to enable the seat transport mechanism by means of a 咏-峨 mechanism. By setting this specification, according to the June 2nd, 9th & layer carrying 98, all contents thereof are included. The Japanese wish for the first day of this month [simplified description of the schema] Ξ; (b): to guide: component system _, map. Figure 3 is a three-dimensional diagram of the baby foot transport mechanism = vertical ^ map 'unit. Fig. 4 is a view showing an example in which the arm support portion and the link support portion are attached to the arm and the spherical caster on the surface of the raft 12 201117313. Figure 5 is a detailed view of a spherical caster. Fig. 6 is a view showing another example of the arm support portion and the link support portion. The comparison between the conventional example of the 7-series and the height of the transport chamber in the present example (the figure (8) in the figure (0) shows an example of the present invention). Figure 8 is a perspective view of a horizontal articulated robotic arm. Figure 9 is a side view of a cylindrical coordinate system arm. Figure 1 is a top view of the on-line type of swivel conversion money. [Description of main component symbols] hl, h2..·height dimension W...wafer 1...inlet transport system 2...processing system 3...input 运送7 transport chamber 4...inlet 埠5...positioning device 6...vacuum preparation Room 7...Multi-joint robot arm 8...Sliding shaft 10...Transfer module (transport mode) 11...Processing module 12...Machiner arm 13 ' b,16...Gate valve Μ...Transport chamber 14a...Transport chamber]4 Bottom 21 ... body portion 21a... bottom wall portion 21b... side wall portion 22... cover 13 201117313 23.. slit 30.. transport mechanism 31.. first drive shaft 32... second drive shaft 33.. first arm 34...second arm 35..first link 36...second link 37,38...pin•bearing 39.. holding plate (holding body) 41.. . housing 42.. arm support Part 44.. Linkage support part 51.. Ball caster (arm support, link support) 52... Ball holding frame (rolling body holding frame) 53...Sphere (spherical rolling element) 54.. Lubrication Film 56.. Magnetization layer 57.. Magnet 6b 81... Arm 62.. Link 63-66... Bearing 71.. First arm 72... Second arm 73.. First arm support 74 ...second arm support 82.. .R axis 83.. .arm support 8 5...Belt 91.. .Inlet side transport module 14 201117313 92.. .Exit side transport module 93.. .Processing module

Claims (1)

201117313 七、申請專利範圍: 1. 一種運送模組,將用來使被運送體 收納於運送室中,該機械臂包含·· 機械#至乂 一邛分 驅動轴,藉由驅動源旋轉驅動; ,結合該驅動軸,且可於水平面内旋轉; 量傳遞至該運送室的底面辄動轴的位置,將該臂之重 移動固持體,固持著該被運送體,藉由該臂之旋轉而在水平面内 其中,該機械臂更包含: 體;及 了在水千面内旋轉之方式連結該臂及該固持 置,叙賴料離的位 收納於運送室鍵运體移動之機械臂至少-部分 驅動軸,藉由驅動源旋轉驅動; ΐΠι結合該驅動軸’且可於水平面内旋轉; 連桿,以可在水平面内旋轉之方式連结. 旋轉=水平面内移動,固持該被運=連r亥連桿,藉由該臂 置,將該雜之其触叙連結部遠離的位 4. 如申請專二遞底:。 支持部及該連桿支持部其中至少項之運送模組,其中該臂 ,在該運送室之該底面上^滾動運動.及 該滚=_框’固_臂或該連捍,以可旋轉之方式固持 5. 如申請專利範圍第1至 臂支持部賴轉域部射奴馳’其中,該 16 201117313 磁化層,設於該運送室之該底面;及 磁石’固定於該臂或該連桿,推斥該磁化層。 其中, 該 6.如申請專利範圍第2至5項中任一項之運送模 驅動軸包含第一及第二驅動轴, '''' 該至少一臂包含結合該第一驅動軸之第一臂, 驅動軸之第二臂, 久〜合該第二 s亥至少一連桿包含以可旋轉之方式連結該第〜 桿,及以可旋轉之方式連結該第二臂之第二連桿, 之第一連 該固持體以可旋轉之方式連結該第一及該第二連浐, 藉由該第一驅動軸及該第二驅動軸、該第一臂及二结 該第一連桿及該第二連桿、以及該輯體構成可=二臂、 送機構。 辦之蛙足式運 ^如申請專利範圍第i至6項中任一項之運送模組,其中,該 連达,連接著用來處理該被運送體之處理腔室, 被運械臂仙部呈輕之該親錢魏理腔室之間傳遞該 八、圖式: S201117313 VII. Patent application scope: 1. A transport module for accommodating a transported object in a transport chamber, the mechanical arm including a mechanical drive to a drive shaft, and being driven by a drive source; The drive shaft is coupled to the drive shaft and is rotatable in a horizontal plane; the amount is transmitted to the bottom surface of the transport chamber to move the shaft, and the arm is moved by the weight to hold the transported body, and the arm is rotated by the arm In the horizontal plane, the mechanical arm further comprises: a body; and the rotating arm is connected to the arm and the holding device in a manner of rotating in the water surface, and the position of the material to be separated is stored in the transporting chamber. Part of the drive shaft is driven by the drive source; ΐΠι combines the drive shaft' and can rotate in a horizontal plane; the link is connected in a manner that can be rotated in a horizontal plane. Rotation = movement in the horizontal plane, holding the transported = connected The r-Hail link, by means of the arm, moves the mismatched link away from the bit 4. As for the application of the second hand:. a support module and a transport module of at least one of the link support portions, wherein the arm is rolled on the bottom surface of the transport chamber, and the roll=_frame 'solid_arm or the flail is rotatable The manner of holding 5. If the patent application scope is 1 to the arm support portion, the directional domain is taken by the slave, wherein the 16 201117313 magnetization layer is disposed on the bottom surface of the transport chamber; and the magnet 'fixed to the arm or the joint Rod, repels the magnetized layer. The transport die drive shaft of any one of claims 2 to 5, wherein the first and second drive shafts are included, the at least one arm includes a first one combined with the first drive shaft An arm, a second arm of the drive shaft, the second link, the second link, the second link includes a second link that rotatably connects the second lever, and the second arm is rotatably coupled to the second arm The first connecting body and the second connecting body are rotatably coupled to the first and second connecting shafts, wherein the first driving shaft and the second driving shaft, the first arm and the second connecting the first connecting rod and The second link and the assembly constitute a second arm and a feed mechanism. The transport module of any one of the patent scopes i to 6 wherein the connection is connected to a processing chamber for processing the transported body, and is transported by the arm. The Ministry of Light is the light of the pro-money between the Wei Li chamber to pass the eight, the pattern: S
TW99119075A 2009-06-11 2010-06-11 Delivery module TW201117313A (en)

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