JP2010267912A - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
JP2010267912A
JP2010267912A JP2009119971A JP2009119971A JP2010267912A JP 2010267912 A JP2010267912 A JP 2010267912A JP 2009119971 A JP2009119971 A JP 2009119971A JP 2009119971 A JP2009119971 A JP 2009119971A JP 2010267912 A JP2010267912 A JP 2010267912A
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JP
Japan
Prior art keywords
heat
cooling device
receiving block
thermally connected
heat receiving
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2009119971A
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Japanese (ja)
Inventor
Shuko Satake
周子 佐竹
Hisao Enomoto
久男 榎本
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to JP2009119971A priority Critical patent/JP2010267912A/en
Publication of JP2010267912A publication Critical patent/JP2010267912A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device that prevents a heating element from deteriorating or getting out of order by relaxing a rise in temperature of the heating element even if a large amount of heat exceeding the heat dissipating performance of a heat dissipation portion is generated in a short time. <P>SOLUTION: The cooling device includes a heat reception block 10 including a heat reception portion 10a which is thermally connected to the heating element and a heat storage portion 10b which temporarily stores heat of the heating element, heat pipes 20 for heat transfer which are thermally connected to the heat reception block, and heat dissipation fins 30 which are thermally connected to ends of the heat pipes for heat transfer. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、電機・電子機器に搭載される半導体素子などの素子（発熱体）を冷却するた
めの冷却装置、特に間欠的に発熱する素子を冷却するための冷却装置に関する。 The present invention relates to a cooling device for cooling an element (a heating element) such as a semiconductor element mounted on an electric / electronic device, and more particularly to a cooling device for cooling an element that generates heat intermittently.

近年、電気・電子機器に搭載されている半導体等の発熱素子は、高機能になるにしたが
って発熱量が増大している。
このような発熱素子を冷却するための冷却装置の構造としては、受熱ブロックからなる
受熱部及び複数の放熱フィンからなる放熱部を備えたヒートシンクを発熱素子に熱的に接
続し、ファン等によって放熱フィンに冷却風を当てることによって冷却する構造が、一般
的に用いられている。（特許文献１）
このような構成では、まず発熱素子の熱を受熱ブロックによって吸熱・拡散し、さらに
熱が受熱ブロックから各放熱フィンに移動する。各放熱フィンは概ね平行に配列されてお
り、その間を通る冷却風が放熱フィンの表面から熱を奪い、結果として発熱素子の熱が空
気中へ放散される。 2. Description of the Related Art In recent years, heat generation elements such as semiconductors mounted on electric / electronic devices have increased in heat generation as they become more sophisticated.
As a structure of a cooling device for cooling such a heat generating element, a heat sink having a heat receiving portion made of a heat receiving block and a heat radiating portion made of a plurality of heat radiating fins is thermally connected to the heat generating element, and heat is radiated by a fan or the like. A structure that cools the fins by applying cooling air is generally used. (Patent Document 1)
In such a configuration, first, the heat of the heat generating element is absorbed and diffused by the heat receiving block, and further, the heat is transferred from the heat receiving block to each radiating fin. The radiating fins are arranged substantially in parallel, and the cooling air passing between them takes heat from the surface of the radiating fins, and as a result, the heat of the heating elements is dissipated into the air.

一方、このような放熱構造は、通常、発熱素子の最大発熱量を基準に設計される。すな
わち、発熱素子が最大発熱量で動作している時には、常に発熱素子に許容される温度以下
に抑える放熱性能が得られるように設計されている。このため、常に最大発熱量で動作し
ているわけではない発熱素子の場合でも、ファンの大型化やファン回転の高速化が必要と
なり、ひいては冷却装置の大型化、消費電力、およびファン騒音の増大につながってしま
うという問題があった。 On the other hand, such a heat dissipation structure is usually designed based on the maximum heat generation amount of the heat generating element. That is, when the heat generating element is operating at the maximum heat generation amount, it is designed to obtain a heat radiation performance that is always kept below the temperature allowed for the heat generating element. For this reason, even in the case of a heating element that does not always operate at the maximum heat generation amount, it is necessary to increase the size of the fan and the speed of rotation of the fan, resulting in an increase in the size of the cooling device, power consumption, and fan noise. There was a problem of being connected to.

このような問題を解決するための従来技術として、図１１に示すように、物質の相変化
による潜熱によって熱量を蓄熱する蓄熱部を設けて、発熱部からの熱を蓄熱部に一時的に
蓄熱させ、発熱部の温度を平準化することによって、放熱構造を小型化し、ファン騒音の
低騒音化する放熱システムが記載されている。（特許文献２） As a conventional technique for solving such a problem, as shown in FIG. 11, a heat storage unit that stores heat by latent heat due to phase change of a substance is provided, and heat from the heat generation unit is temporarily stored in the heat storage unit. In addition, a heat dissipation system is described in which the temperature of the heat generating part is leveled to reduce the size of the heat dissipation structure and reduce fan noise. (Patent Document 2)

特開２０００−２９４６９５号公報JP 2000-294695 A 特開２０００−２３２２８６号公報JP 2000-232286 A

しかしながら、特許文献２に記載された放熱システムでは、放熱部とは別に蓄熱部を設
けるため、そのスペースが必要となり、小型化には限界があった。さらに、この放熱シス
テムでは、発熱素子の熱を一旦、別の部材（伝熱部）によって移動させるため、部材が増
え、設計が複雑になったり、コストが増加したりするという問題があった。
本発明は、上記の課題を解決するためになされたものである。 However, in the heat dissipation system described in Patent Document 2, since a heat storage unit is provided separately from the heat dissipation unit, the space is required, and there is a limit to downsizing. Furthermore, in this heat dissipation system, since the heat of the heating element is once moved by another member (heat transfer portion), there are problems that the number of members increases, the design becomes complicated, and the cost increases.
The present invention has been made to solve the above problems.

上記の課題を解決するため、本発明の一の実施形態に係る冷却装置は、発熱素子に熱的
に接続される受熱部、および前記発熱素子の熱を一時的に蓄熱する蓄熱部を備えた受熱ブ
ロックと、前記受熱ブロックに熱的に接続された伝熱用ヒートパイプと、前記伝熱用ヒー
トパイプの少なくとも一方の端部に熱的に接続された放熱フィンとを備えたことを特徴と
する。 In order to solve the above-described problem, a cooling device according to an embodiment of the present invention includes a heat receiving unit that is thermally connected to a heating element, and a heat storage unit that temporarily stores heat of the heating element. A heat receiving block, a heat transfer heat pipe thermally connected to the heat reception block, and a heat radiation fin thermally connected to at least one end of the heat transfer heat pipe To do.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記受熱ブロッ
クは、容積比熱が２．０Ｊ／ｃｍ３・Ｋ以上、かつ、熱伝導率が５０Ｗ／ｍＫ以上の材料
からなることを特徴とする。 In order to solve the above problems, a cooling device according to another embodiment of the present invention is such that the heat receiving block has a volume specific heat of 2.0 J / cm 3 · K or more and a thermal conductivity of 50 W / mK or more. It is made of a material.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記受熱ブロッ
クは、少なくとも一方の主面に前記伝熱用ヒートパイプを収容する溝部を備えた平板形状
であることを特徴とする。 In order to solve the above-described problem, in the cooling device according to another embodiment of the present invention, the heat receiving block has a flat plate shape including a groove portion that accommodates the heat transfer heat pipe on at least one main surface. It is characterized by.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記伝熱用ヒー
トパイプは、一方の端部が前記受熱ブロックの前記溝部に収容されて、前記受熱ブロック
に熱的に接続され、かつ、他方の端部が前記受熱ブロックの前記主面に対して平行に延伸
し、前記放熱フィンに熱的に接続されていることを特徴とする。 In order to solve the above problems, a cooling device according to another embodiment of the present invention includes a heat pipe for heat transfer, wherein one end of the heat pipe is accommodated in the groove of the heat receiving block, and the heat receiving block is heated. And the other end extends in parallel to the main surface of the heat receiving block and is thermally connected to the heat radiating fins.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記伝熱用ヒー
トパイプは、中央部が前記受熱ブロックの前記溝部に収容されて、前記受熱ブロックに熱
的に接続され、一方の端部が前記受熱ブロックの前記主面に対して平行に延伸し、他方の
端部が前記一方の端部の逆方向に延伸して、前記放熱フィンに熱的に接続されていること
を特徴とする。 In order to solve the above-described problem, a cooling device according to another embodiment of the present invention is configured such that the heat transfer heat pipe has a central portion accommodated in the groove portion of the heat receiving block, and is thermally applied to the heat receiving block. Connected, one end extends parallel to the main surface of the heat receiving block, the other end extends in the opposite direction of the one end, and is thermally connected to the radiating fin. It is characterized by.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記受熱ブロッ
クは、前記溝部と交わる方向に配置された均熱用ヒートパイプを備えることを特徴とする
。 In order to solve the above problems, a cooling device according to another embodiment of the present invention is characterized in that the heat receiving block includes a heat equalizing heat pipe arranged in a direction intersecting with the groove.

上記の課題を解決するため、本発明の別の実施形態に係る冷却装置は、前記均熱用ヒー
トパイプは、前記受熱ブロックの内部に配置されていることを特徴とする。 In order to solve the above problems, a cooling device according to another embodiment of the present invention is characterized in that the heat equalizing heat pipe is disposed inside the heat receiving block.

本発明によれば、発熱素子が動作している短時間に、放熱部の放熱性能を超える大きな
発熱が起こっても、平均値に近い値の発熱量で設計された放熱部によって効率良く放熱で
き、かつ、発熱素子の温度上昇を緩和させて、発熱素子の劣化・故障を防止することがで
きる冷却装置を提供することができる。 According to the present invention, even if a large amount of heat that exceeds the heat dissipation performance of the heat dissipation part occurs in a short time during which the heat generating element is operating, heat can be efficiently radiated by the heat dissipation part designed with a heat generation value close to the average value. In addition, it is possible to provide a cooling device that can alleviate the temperature rise of the heat generating element and prevent deterioration and failure of the heat generating element.

本発明の第１の実施形態に係る冷却装置を示す斜視図。The perspective view which shows the cooling device which concerns on the 1st Embodiment of this invention. 図１におけるＡ−Ａ´断面図。AA 'sectional drawing in FIG. 本発明の第１の実施形態に係る冷却装置に発熱素子を実装した状態を示す斜視図。The perspective view which shows the state which mounted the heat generating element in the cooling device which concerns on the 1st Embodiment of this invention. 図３におけるＢ−Ｂ´断面図。BB 'sectional drawing in FIG. 本発明の第２の実施形態に係る冷却装置を示す斜視図。The perspective view which shows the cooling device which concerns on the 2nd Embodiment of this invention. 図５におけるＣ−Ｃ´断面図。CC 'sectional drawing in FIG. 本発明の第３の実施形態に係る冷却装置の受熱ブロックを示す断面図。Sectional drawing which shows the heat receiving block of the cooling device which concerns on the 3rd Embodiment of this invention. 本発明の冷却装置が適用される発熱素子４０の発熱量と発熱時間の関係の例を示すグラフ。The graph which shows the example of the relationship between the emitted-heat amount of the heat generating element 40 with which the cooling device of this invention is applied, and heat-generation time. 発熱素子温度の時間変化を示すグラフ。The graph which shows the time change of heating element temperature. 本発明の第１の実施の形態に係る冷却装置の蓄熱部の熱伝導率と温度上昇値の関係を示したグラフ。The graph which showed the relationship between the heat conductivity of the thermal storage part of the cooling device which concerns on the 1st Embodiment of this invention, and a temperature rise value. 従来技術に係る冷却装置を示す模式図。The schematic diagram which shows the cooling device which concerns on a prior art.

以下、本発明の好ましい実施の形態における冷却装置について、図面を参照して詳細に
説明する。なお、同一機能を有する各構成部については、図示及び説明簡略化のため、同
一符号を付して示す。 Hereinafter, a cooling device according to a preferred embodiment of the present invention will be described in detail with reference to the drawings. In addition, about each component which has the same function, the same code | symbol is attached | subjected and shown for simplification of illustration and description.

図１は、本発明の第１の実施形態に係る冷却装置を示す斜視図である。図１に示すよう
に、冷却装置１００は、図示しない発熱素子に熱的に接続された、受熱部１０ａと蓄熱部
１０ｂを備えた受熱ブロック１０と、受熱部１０ａの主面に形成された溝部１２（後述す
る。）に収容されて、一方の端部が受熱部１０ａに熱的に接続された伝熱用ヒートパイプ
２０と、伝熱用ヒートパイプ２０の他方の端部に接続された複数の放熱フィン３０を備え
ている。 FIG. 1 is a perspective view showing a cooling device according to a first embodiment of the present invention. As shown in FIG. 1, the cooling device 100 includes a heat receiving block 10 including a heat receiving unit 10a and a heat storage unit 10b, which are thermally connected to a heating element (not shown), and a groove formed on the main surface of the heat receiving unit 10a. 12 (which will be described later), a heat transfer heat pipe 20 having one end portion thermally connected to the heat receiving portion 10a, and a plurality connected to the other end portion of the heat transfer heat pipe 20. The radiating fin 30 is provided.

受熱ブロック１０は、熱伝導率が高く、かつ、熱容量（容積比熱）が大きい材料で形成
されていることが好ましく、熱伝導率としては、５０Ｗ／ｍＫ以上、かつ容積比熱として
は、２．０Ｊ／ｃｍ３・Ｋ以上が好ましい。
このような材料としては、銅（容積比熱３．４Ｊ／ｃｍ３・Ｋ、熱伝導率３９８Ｗ／ｍ
Ｋ）、アルミニウム（容積比熱２．４Ｊ／ｃｍ３・Ｋ、熱伝導率２３７Ｗ／ｍＫ）、鉄（
容積比熱３．５Ｊ／ｃｍ３・Ｋ、熱伝導率８０．３Ｗ／ｍＫ）等の金属、またはその合金
が挙げられる。特に、アルミニウムを用いると、冷却装置を軽量化することができるため
、より好ましい。 The heat receiving block 10 is preferably formed of a material having a high thermal conductivity and a large heat capacity (volume specific heat). The heat conductivity is 50 W / mK or more, and the volume specific heat is 2.0 J. / Cm 3 · K or more is preferable.
Such materials include copper (volume specific heat 3.4 J / cm 3 · K, thermal conductivity 398 W / m
K), aluminum (volume specific heat 2.4 J / cm 3 · K, thermal conductivity 237 W / mK), iron (
Examples thereof include metals such as volume specific heat 3.5 J / cm 3 · K, thermal conductivity 80.3 W / mK), and alloys thereof. In particular, the use of aluminum is more preferable because the cooling device can be reduced in weight.

また、受熱ブロック１０は、熱伝導性が高い材料からなる受熱部１０ａと、熱容量が大
きい材料からなる蓄熱部１０ｂを組み合わせて形成されていてもよい。例えば、熱容量が
大きい材料としては、エポキシ樹脂、シリコーン樹脂等の樹脂を用いることもできる。こ
のように、受熱部１０ａと蓄熱部１０ｂは、一体の材料で形成してもよく、別々の材料を
組み合わせることによって形成してもよい。 Further, the heat receiving block 10 may be formed by combining a heat receiving portion 10a made of a material having high thermal conductivity and a heat storage portion 10b made of a material having a large heat capacity. For example, as a material having a large heat capacity, an epoxy resin, a silicone resin, or the like can be used. Thus, the heat receiving part 10a and the heat storage part 10b may be formed of an integral material, or may be formed by combining different materials.

図２は、図１におけるＡ−Ａ´断面図である。本発明の冷却装置に用いられる伝熱用ヒ
ートパイプ２０としては、従来公知のものを用いることができるが、受熱部１０ａとの接
合を考慮すると、丸型のヒートパイプを扁平加工した扁平ヒートパイプを用いることが好
ましい。このようなヒートパイプを用いることによって、図２に示すように、受熱部１０
ａとの熱接触を良好なものとすることができることに加え、接合後の伝熱用ヒートパイプ
２０によって形成される面と受熱部１０ａの主面とを一致させることができ、発熱素子と
の熱接触を良好にすることができる。 2 is a cross-sectional view taken along the line AA ′ in FIG. As the heat transfer heat pipe 20 used in the cooling device of the present invention, a conventionally known heat pipe 20 can be used, but in consideration of joining with the heat receiving portion 10a, a flat heat pipe obtained by flattening a round heat pipe Is preferably used. By using such a heat pipe, as shown in FIG.
In addition to being able to make good thermal contact with a, the surface formed by the heat pipe 20 for heat transfer after joining and the main surface of the heat receiving portion 10a can be matched, Thermal contact can be improved.

受熱部１０ａに形成される、伝熱用ヒートパイプ２０を収容する溝１２は、少なくとも
一方の主面に形成されていればよく、両面に形成されていてもよい。
また、溝１２の断面は、少なくとも底面１２ａで伝熱用ヒートパイプ２０と隙間なく接
触するような形状であればよく、特に、底面１２ａと側壁を滑らかに接続することが好ま
しい。 The groove 12 that accommodates the heat transfer heat pipe 20 that is formed in the heat receiving portion 10a only needs to be formed on at least one main surface, and may be formed on both surfaces.
The cross section of the groove 12 only needs to have a shape that makes contact with the heat transfer heat pipe 20 at least at the bottom surface 12a, and it is particularly preferable to smoothly connect the bottom surface 12a and the side wall.

また、設計誤差によって受熱部１０ａと伝熱用ヒートパイプ２０との間に生じる間隙は
、はんだや伝熱グリス等で埋めることによってさらに熱接触を良好にすることができる。 In addition, a gap generated between the heat receiving portion 10a and the heat transfer heat pipe 20 due to a design error can be further improved in thermal contact by being filled with solder, heat transfer grease, or the like.

伝熱用ヒートパイプ２０の他方の端部には、複数の放熱フィン３０が熱的に接続され、
放熱部を形成している。
伝熱用ヒートパイプ２０と、放熱フィン３０との固定は、従来周知の様々な方法を採用
することができるが、加工の容易性を考慮するとかしめによる固定が好ましい。 A plurality of heat radiation fins 30 are thermally connected to the other end of the heat transfer heat pipe 20,
A heat dissipating part is formed.
For fixing the heat transfer heat pipe 20 and the radiation fins 30, various conventionally known methods can be adopted. However, in consideration of ease of processing, fixing by caulking is preferable.

この場合、複数の放熱フィンにそれぞれ設けた所定の孔に伝熱用ヒートパイプ２０を挿
通し、その後、複数の放熱フィン３０を同時にかしめることによって伝熱用ヒートパイプ
２０に固定する。
複数の放熱フィンの間隔や形状は、ファンの性能および放熱部を形成するスペース等に
よって適宜設定することができる。 In this case, the heat transfer heat pipe 20 is inserted into a predetermined hole provided in each of the plurality of heat radiation fins, and then the plurality of heat radiation fins 30 are simultaneously caulked to be fixed to the heat transfer heat pipe 20.
The space | interval and shape of a several heat radiating fin can be suitably set with the performance of a fan, the space which forms a heat radiating part, etc.

図３は、本発明の第１の実施形態に係る冷却装置に発熱素子を実装した状態を示す斜視
図である。図３に示すように、発熱素子４０は、受熱ブロック１０の受熱部１０ａの一方
の主面（伝熱用ヒートパイプ２０が配置されている面）に接合されている。
発熱素子４０で発生した熱は、一部が伝熱用ヒートパイプ２０によって放熱フィン３０
に移動され、それ以外の熱は、受熱ブロック１０によって蓄熱される。放熱フィン３０に
移動された熱は、図示しないファン等の送風手段による風流Ｘによって空気中へ放散され
る。 FIG. 3 is a perspective view showing a state in which a heating element is mounted on the cooling device according to the first embodiment of the present invention. As shown in FIG. 3, the heat generating element 40 is joined to one main surface (the surface on which the heat transfer heat pipe 20 is disposed) of the heat receiving portion 10 a of the heat receiving block 10.
A part of the heat generated in the heat generating element 40 is radiated by the heat transfer heat pipe 20 to the heat radiation fin 30.
The other heat is stored in the heat receiving block 10. The heat transferred to the heat radiating fins 30 is dissipated into the air by the airflow X by a blowing means such as a fan (not shown).

図４は、図３におけるＢ−Ｂ´断面図である。図４に示すように、伝熱用ヒートパイプ
２０は、風流Ｘの方向に垂直な方向から扁平加工されている。このようにすることによっ
て、放熱部における空気抵抗が低減され、風流Ｘを、放熱フィン３０の間を良好に通過さ
せることができるので、放熱性能を向上させることができる。 4 is a cross-sectional view taken along the line BB ′ in FIG. As shown in FIG. 4, the heat transfer heat pipe 20 is flattened from a direction perpendicular to the direction of the wind flow X. By doing in this way, the air resistance in a thermal radiation part is reduced, and since the wind flow X can be made to pass between the thermal radiation fins 30 favorably, the thermal radiation performance can be improved.

図５、図６は、それぞれ本発明の第２の実施形態に係る冷却装置を示す斜視図、および
図５におけるＣ−Ｃ´断面図である。図５および図６に示すように、冷却装置２００は、
冷却装置１００と同様の構成に加えて、受熱部１０ａと蓄熱部１０ｂとを熱的に接続する
均熱用ヒートパイプ２５を備えている。均熱用ヒートパイプ２５は、受熱ブロック１０に
形成された溝部、又は受熱ブロック１０の内部に配置され、受熱部１０ａの熱を蓄熱部１
０ｂに移動し、受熱ブロック１０中の熱の均一性を保つ機能を有する。
均熱用ヒートパイプ２５を備えていることで、受熱部１０ａの熱を素早く蓄熱部１０ｂ
に移動させることが可能となり、発熱素子の急激な温度上昇を抑制することができる。 5 and 6 are a perspective view showing a cooling device according to the second embodiment of the present invention and a cross-sectional view taken along the line CC 'in FIG. 5, respectively. As shown in FIG. 5 and FIG.
In addition to the configuration similar to that of the cooling device 100, a heat equalizing heat pipe 25 that thermally connects the heat receiving unit 10a and the heat storage unit 10b is provided. The heat equalizing heat pipe 25 is disposed in a groove portion formed in the heat receiving block 10 or in the heat receiving block 10, and the heat of the heat receiving portion 10 a is stored in the heat storage portion 1.
It moves to 0b and has the function of maintaining the heat uniformity in the heat receiving block 10.
By providing the heat equalizing heat pipe 25, the heat of the heat receiving portion 10 a can be quickly transferred to the heat storage portion 10 b.
It is possible to suppress the rapid temperature rise of the heating element.

本発明に係る冷却装置は、上記の構成に制限されるものではなく、適宜変更が可能であ
る。例えば、ヒートパイプや放熱フィンの数やサイズは、発熱素子の平均発熱量等によっ
て適宜設定することができる。また、ヒートパイプと受熱ブロック、放熱フィンとの接合
は、機械的な接合（かしめ）、溶接等によって直接接合されるものでもよく、ＴＩＭ（Th
ermal Interface Material）等を介して接合されていてもよい。 The cooling device according to the present invention is not limited to the above configuration, and can be changed as appropriate. For example, the number and size of the heat pipes and the radiating fins can be set as appropriate depending on the average heat generation amount of the heating elements. The heat pipe, the heat receiving block, and the heat radiating fin may be joined directly by mechanical joining (caulking), welding, or the like.
ermal Interface Material) or the like.

また、上記実施形態では、放熱フィンは、ヒートパイプの一方の端部に取り付けられて
いるものについて説明したが、ヒートパイプが受熱ブロックの他方側へも延伸し、ヒート
パイプの両端に放熱フィンが接続されていてもよい。この場合、受熱ブロックの受熱部に
は、ヒートパイプの中央部が接続される。 Moreover, in the said embodiment, although the heat radiating fin demonstrated what was attached to one edge part of a heat pipe, a heat pipe is extended also to the other side of a heat receiving block, and a heat radiating fin is the both ends of a heat pipe. It may be connected. In this case, the center part of the heat pipe is connected to the heat receiving part of the heat receiving block.

図７は、本発明の第３の実施形態に係る冷却装置の受熱ブロックを示す断面図である。
図７に示すように、この受熱ブロック１４は、アルミニウム、銅等、熱伝導性の高い材料
からなる受熱部１４ａと、エポキシ樹脂等、熱容量の大きい材料からなる蓄熱部１４ｂと
からなっている。冷却装置のその他の構造は、第１の実施形態に係る冷却装置と同様であ
る。 FIG. 7 is a cross-sectional view showing a heat receiving block of a cooling device according to the third embodiment of the present invention.
As shown in FIG. 7, the heat receiving block 14 includes a heat receiving portion 14a made of a material having high thermal conductivity such as aluminum and copper, and a heat storage portion 14b made of a material having a large heat capacity such as epoxy resin. Other structures of the cooling device are the same as those of the cooling device according to the first embodiment.

このような構成とすることで、上記の効果に加えて、簡易な構造で蓄熱部１４ｂをさら
に軽量化することができる。
ここで、蓄熱部１４ｂをエポキシ樹脂等の樹脂で形成する場合、樹脂は熱伝導性が低い
ため、受熱部１４ａとの接触面積を大きくするような構造にすることが好ましい。 By setting it as such a structure, in addition to said effect, the heat storage part 14b can further be reduced in weight with a simple structure.
Here, when the heat storage part 14b is formed of a resin such as an epoxy resin, since the resin has low thermal conductivity, it is preferable to have a structure that increases the contact area with the heat receiving part 14a.

次に、発熱素子４０の発熱について説明する。図８は、本発明の冷却装置が適用される
発熱素子４０の発熱量と発熱時間の関係の例を示すグラフである。
図８に示すように、発熱素子４０は、動作開始から１０秒間は１２０Ｗの熱を発生し、
それ以降、１９０秒間は数Ｗの発熱、又はまったく発熱せず、さらに１０秒間１２０Ｗの
熱を発生するというサイクルを繰り返す。
このような場合、冷却装置を、１２０Ｗの熱を放熱できるように設計すると、冷却装置
は大型なものになり、かつ、放熱ファンも風量を増やすために大型・高速回転のものを用
いることになり、さらに冷却装置の大型化につながってしまう。すなわち、この発熱素子
４０の平均発熱量は６Ｗであるにもかかわらず、冷却装置としては、放熱性能を１２０Ｗ
以上として設計しなければならない。 Next, heat generation of the heating element 40 will be described. FIG. 8 is a graph showing an example of the relationship between the heat generation amount and the heat generation time of the heat generating element 40 to which the cooling device of the present invention is applied.
As shown in FIG. 8, the heating element 40 generates 120 W of heat for 10 seconds from the start of operation,
Thereafter, a cycle of generating several watts of heat for 190 seconds or not generating heat at all and generating 120 W of heat for 10 seconds is repeated.
In such a case, if the cooling device is designed so that heat of 120 W can be dissipated, the cooling device becomes large, and the heat dissipating fan also uses a large and high speed rotating fan to increase the air volume. Furthermore, it leads to the enlargement of a cooling device. That is, although the average heating value of the heating element 40 is 6 W, the cooling device has a heat dissipation performance of 120 W.
It must be designed as above.

図９は、本発明の冷却装置によって、図８に示すような条件で発熱する発熱素子を冷却
した場合の、発熱素子温度の時間変化を示すグラフである。条件１、２は、それぞれ、蓄
熱部のない冷却装置、および本発明の第１の実施形態に係る冷却装置である。
図９に示すように、本発明の第１の実施形態に係る冷却装置では、蓄熱部のない冷却装
置にと比較して、温度上昇を３０％以上抑制することができる。 FIG. 9 is a graph showing temporal changes in the temperature of the heating element when the heating element that generates heat under the conditions shown in FIG. 8 is cooled by the cooling device of the present invention. Conditions 1 and 2 are a cooling device without a heat storage unit and a cooling device according to the first embodiment of the present invention, respectively.
As shown in FIG. 9, in the cooling device according to the first embodiment of the present invention, the temperature increase can be suppressed by 30% or more compared to a cooling device without a heat storage section.

図１０は、本発明の第１の実施の形態に係る冷却装置の蓄熱部の熱伝導率と温度上昇値
の関係を示したグラフである。このグラフは図８に示すような条件で発熱する発熱素子を
冷却した場合の発熱素子の最高温度を示したグラフである。グラフの横軸は、受熱部の熱
伝導率、縦軸は、発熱素子の上昇温度（最高温度）を示しており、蓄熱部の熱容量を変化
させて測定している。
ここで、実験条件として、発熱素子の大きさを幅５０ｍｍ×長さ５０ｍｍ×厚さ５ｍｍ
、受熱ブロック（発熱素子を含む）の大きさを幅５０ｍｍ×長さ１００ｍｍ×厚さ５ｍｍ
とし、ヒートパイプの熱伝達率を１×１０５Ｗ／ｍＫとした。 FIG. 10 is a graph showing the relationship between the thermal conductivity and the temperature rise value of the heat storage unit of the cooling device according to the first embodiment of the present invention. This graph is a graph showing the maximum temperature of the heating element when the heating element that generates heat under the conditions shown in FIG. 8 is cooled. The horizontal axis of the graph indicates the thermal conductivity of the heat receiving part, and the vertical axis indicates the rising temperature (maximum temperature) of the heat generating element, which is measured by changing the heat capacity of the heat storage part.
Here, as an experimental condition, the size of the heating element is 50 mm wide × 50 mm long × 5 mm thick.
The size of the heat receiving block (including the heating element) is 50 mm wide × 100 mm long × 5 mm thick.
And the heat transfer coefficient of the heat pipe was 1 × 10 5 W / mK.

図１０に示すように、本発明の第１の実施形態に係る冷却装置では、蓄熱部の熱容量が
５０Ｊ／Ｋ以上、かつ熱伝導率が５０Ｗ／ｍＫ以下であれば、温度上昇値が３０℃以下と
なるため、発熱素子の温度上昇を緩和させて、発熱素子の劣化・故障を効果的に防止する
ことができる。 As shown in FIG. 10, in the cooling device according to the first embodiment of the present invention, if the heat capacity of the heat storage unit is 50 J / K or more and the thermal conductivity is 50 W / mK or less, the temperature increase value is 30 ° C. Therefore, the temperature rise of the heating element can be mitigated, and deterioration and failure of the heating element can be effectively prevented.

１００、２００ 冷却装置
１０、１４ 受熱ブロック
１０ａ、１４ａ 受熱部
１０ｂ、１４ｂ 蓄熱部
１２ 溝
１２ａ 底面
２０ 伝熱用ヒートパイプ
２５ 均熱用ヒートパイプ
３０ 放熱フィン
４０ 発熱素子
100, 200 Cooling device 10, 14 Heat receiving block 10a, 14a Heat receiving portion 10b, 14b Heat storage portion 12 Groove 12a Bottom surface 20 Heat transfer heat pipe 25 Heat equalizing heat pipe 30 Heat radiation fin 40 Heating element

Claims (7)

発熱素子に熱的に接続される受熱部、および前記発熱素子の熱を一時的に蓄熱する蓄熱
部を備えた受熱ブロックと、
前記受熱ブロックに熱的に接続された伝熱用ヒートパイプと、
前記伝熱用ヒートパイプの少なくとも一方の端部に熱的に接続された放熱フィンと
を備えたことを特徴とする冷却装置。 A heat receiving section thermally connected to the heat generating element, and a heat receiving block including a heat storage section for temporarily storing heat of the heat generating element;
A heat transfer heat pipe thermally connected to the heat receiving block;
A cooling device comprising: a heat dissipating fin thermally connected to at least one end of the heat transfer heat pipe. 前記受熱ブロックは、容積比熱が２．０Ｊ／ｃｍ３・Ｋ以上、かつ、熱伝導率が５０Ｗ
／ｍＫ以上の材料からなることを特徴とする請求項１に記載の冷却装置。 The heat receiving block has a volume specific heat of 2.0 J / cm 3 · K or more and a thermal conductivity of 50 W.
The cooling device according to claim 1, wherein the cooling device is made of a material of at least / mK. 前記受熱ブロックは、少なくとも一方の主面に前記伝熱用ヒートパイプを収容する溝部
を備えた平板形状であることを特徴とする請求項１または２に記載の冷却装置。 The cooling device according to claim 1, wherein the heat receiving block has a flat plate shape including a groove portion that accommodates the heat transfer heat pipe on at least one main surface. 前記伝熱用ヒートパイプは、一方の端部が前記受熱ブロックの前記溝部に収容されて、
前記受熱ブロックに熱的に接続され、かつ、他方の端部が前記受熱ブロックの前記主面に
対して平行に延伸し、前記放熱フィンに熱的に接続されていることを特徴とする請求項１
ないし請求項３のいずれか１項に記載の冷却装置。 One end of the heat transfer heat pipe is accommodated in the groove of the heat receiving block,
The heat receiving block is thermally connected, and the other end extends in parallel to the main surface of the heat receiving block and is thermally connected to the radiation fin. 1
The cooling device according to any one of claims 3 to 3. 前記伝熱用ヒートパイプは、中央部が前記受熱ブロックの前記溝部に収容されて、前記
受熱ブロックに熱的に接続され、一方の端部が前記受熱ブロックの前記主面に対して平行
に延伸し、他方の端部が前記一方の端部の逆方向に延伸して、前記放熱フィンに熱的に接
続されていることを特徴とする請求項１ないし請求項３のいずれか１項に記載の冷却装置
。 The heat transfer heat pipe is accommodated in the groove portion of the heat receiving block at the center and is thermally connected to the heat receiving block, and one end of the heat transfer heat pipe extends parallel to the main surface of the heat receiving block. The other end portion extends in a direction opposite to the one end portion and is thermally connected to the heat radiating fin. 5. Cooling system. 前記受熱ブロックは、前記溝部の形成方向と交わる方向に配置され、前記受熱部と前記
蓄熱部とを熱的に接続する均熱用ヒートパイプを備えることを特徴とする請求項３ないし
請求項５のいずれか１項に記載の冷却装置。 6. The heat receiving block is disposed in a direction intersecting with a direction in which the groove is formed, and includes a heat equalizing heat pipe that thermally connects the heat receiving unit and the heat storage unit. The cooling device according to any one of the above. 前記均熱用ヒートパイプは、前記受熱ブロックの内部に配置されていることを特徴とす
る請求項６に記載の冷却装置。 The cooling device according to claim 6, wherein the heat equalizing heat pipe is disposed inside the heat receiving block.
JP2009119971A 2009-05-18 2009-05-18 Cooling device Pending JP2010267912A (en)

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Cited By (15)

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Publication number Priority date Publication date Assignee Title
JP2013036718A (en) * 2011-08-10 2013-02-21 Kiko Kagi Kofun Yugenkoshi Radiation unit structure and method of manufacturing the same
CN107072121A (en) * 2017-05-18 2017-08-18 平湖阿莱德实业有限公司 A kind of quick soaking energy storage radiator structure for eliminating heat wave peak
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