JP2010222030A - Conductive paper carrier tape and method for manufacturing the same - Google Patents
Conductive paper carrier tape and method for manufacturing the same Download PDFInfo
- Publication number
- JP2010222030A JP2010222030A JP2009070785A JP2009070785A JP2010222030A JP 2010222030 A JP2010222030 A JP 2010222030A JP 2009070785 A JP2009070785 A JP 2009070785A JP 2009070785 A JP2009070785 A JP 2009070785A JP 2010222030 A JP2010222030 A JP 2010222030A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- carrier tape
- conductive ink
- paper
- paper carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
本発明は、半導体や電子部品に使用されるマイクロチップなどのチップ状電子部品を輸送、保管し、組立て時に搬送できるようにしているキャリアテープに関するものであって、さらに詳しくは導電性の紙キャリアテープと、その製造方法に関するものである。 The present invention relates to a carrier tape that transports, stores, and transports chip-shaped electronic components such as microchips used in semiconductors and electronic components during assembly, and more particularly, a conductive paper carrier. The present invention relates to a tape and a manufacturing method thereof.
従来より、半導体や電子部品のマイクロチップの輸送、保管、そして実装基板への組立工程での搬送用としてキャリアテープが用いられている。このキャリアテープには、微細なマイクロチップを一個一個埋め込み等によって配設し、プラスチックのカバーテープを被覆した後に組立工程においてマウンターに搬送している。組立工程ではカバーテープを剥離した後にマウンターが個々のマイクロチップを識別してノズル吸引等により取出して実装組立するようにしている。 Conventionally, carrier tapes have been used for transporting, storing, and transporting microchips of semiconductors and electronic components and assembling processes onto a mounting substrate. In this carrier tape, fine microchips are arranged one by one by embedding and the like, and after covering with a plastic cover tape, they are conveyed to the mounter in the assembly process. In the assembly process, after the cover tape is peeled off, the mounter identifies individual microchips and takes them out by nozzle suction or the like for mounting and assembly.
従来、このようなキャリアテープとしては、その材質として紙を使用したものや、ポリスチレン樹脂、ポリエステル樹脂などの化成品を用いたエンボスキャリアテープが知られている。 Conventionally, as such carrier tapes, those using paper as the material, and embossed carrier tapes using chemical products such as polystyrene resin and polyester resin are known.
なかでも、操作性、安定性、コスト等の点からは紙を用いたキャリアテープがより一般的なものとされている。 Among these, a carrier tape using paper is more general in terms of operability, stability, cost, and the like.
だが、近年では、キャリアテープに配設する電子部品、マイクロチップがより微細化、小型化していることから、静電気の発生、特に組立工程においてカバーテープを剥がす時に発生する剥離帯電が大きな問題となっている。カバーテープを剥離する時に剥離帯電が発生するため、電子部品、マイクロチップが静電気によって踊ってしまい、マウンターが正確にこれらを識別してノズルで吸引する等により取出すことが難しくなり、実際的にプリント配線基板への実装組立が困難になるという問題が生じるからである。 However, in recent years, electronic components and microchips arranged on the carrier tape have become more miniaturized and miniaturized, so that generation of static electricity, particularly peeling charging that occurs when the cover tape is peeled off during the assembly process, has become a major problem. ing. Since peeling electrification occurs when the cover tape is peeled off, electronic parts and microchips are danced by static electricity, making it difficult for the mounter to accurately identify them and suck them out with a nozzle. This is because there arises a problem that it is difficult to mount and assemble the wiring board.
また、これ以外にもカバーテープの剥離帯電によりカバーテープへ直接チップ部品の付着という問題も生じており、カバーテープの剥離帯電による静電気の影響を低減するための方策としては、カーボン繊維を漉き込んだ紙をキャリアテープとすることが検討されてきているが、このような対策によっては、電子部品、マイクロチップの微細化、小型化の動向に対応して剥離帯電の影響を緩和するには十分ではない。しかも更なる問題点も生じてしまう。 In addition to this, there is also a problem that chip parts adhere directly to the cover tape due to the peeling charge of the cover tape. As a measure to reduce the influence of static electricity due to the peeling charge of the cover tape, carbon fiber is inserted. Although it has been considered to use the paper as a carrier tape, such measures are sufficient to mitigate the effects of peeling electrification in response to the trend toward miniaturization and miniaturization of electronic components and microchips. is not. In addition, further problems arise.
紙を用いたキャリアテープの場合、まず、基板上にカーボン粒子、カーボン繊維が脱落落下するという問題の他、その表層の紙の発塵が問題となる。すなわち電子部品、マイクロチップの微細化、小型化に対応して微細化しているこれらの取出し用のノズル内に、発塵による紙粉が詰らせてしまい、マウンターの運転を難しくするからである。また、紙に導電性のカーボンを複合化した場合、その製造コストの負担は大きく、キャリアテープとしての品質、性能の安定性、操作性等の点で改善の余地がある。また、キャリアテープが黒色になることから、センサーが電子部品、マイクロチップを識別しにくくなってマウンターの作動エラーが生じやすくなるからである。 In the case of a carrier tape using paper, first, in addition to the problem that carbon particles and carbon fibers fall off on the substrate, the dust generation of the paper on the surface layer becomes a problem. In other words, it is because it becomes difficult to operate the mounter because the paper nozzles due to dusting are clogged in the nozzles for taking out the electronic parts and microchips corresponding to miniaturization and miniaturization. . Further, when conductive carbon is combined with paper, the burden of the manufacturing cost is large, and there is room for improvement in terms of quality as a carrier tape, stability of performance, operability, and the like. In addition, since the carrier tape is black, it is difficult for the sensor to distinguish between the electronic component and the microchip, and an operation error of the mounter is likely to occur.
本発明は、以上のとおりの背景から、従来の問題点を解消して、カバーテープの剥離時の剥離帯電による静電気の影響を効果的に緩和し、微細化、小型化する電子部品、マイクロチップの識別、取り出しを正確に、そして容易に行うことで所定の組立実装工程を円滑に行うことを可能とする、品質、性能の均質性、安定性が良好であって、製造コストの負担も過大でない、改善された新しい紙キャリアテープとその製造方法を提供することを課題としている。 In light of the above background, the present invention eliminates the conventional problems, effectively mitigates the influence of static electricity due to peeling electrification at the time of peeling of the cover tape, and is miniaturized and miniaturized electronic component, microchip Accurate and easy identification and removal of the product enables smooth execution of the specified assembly and mounting process. Good quality, uniform performance and stability, and excessive manufacturing cost. However, it is an object to provide an improved new paper carrier tape and a manufacturing method thereof.
本発明は、前記の課題を解決するものとして、以下のことを特徴としている。
＜１＞キャリア台紙の両面または片面に導電性インキの印刷層を有し、静電気の発生が緩和されている導電性紙キャリアテープ。
＜２＞導電性インキの印刷層の厚みが０．１μｍ〜５μｍの範囲内であって、表面抵抗率が１０５Ω/sq.〜１０１０Ω/sq.の範囲内である前記の導電性紙キャリアテープ。
＜３＞導電性インキの印刷層には導電性金属酸化物並びに導電性ポリマーのうちの少なくとも１種が含まれている前記１または２の導電性紙キャリアテープ。
＜４＞キャリア台紙の両面または片面に導電性インキを印刷した原紙を用いた導電性紙キャリアテープの製造方法。
＜５＞導電性インキの印刷層の厚みを０．１μｍ〜５μｍの範囲内とし、表面抵抗率を１０５Ω/sq.〜１０１０Ω/sq.の範囲内とする前記４の導電性紙キャリアテープの製造方法。
＜６＞導電性インキは、導電性金属酸化物並びに導電性ポリマーのうちの少なくとも１種を含む前記４または５の導電性紙キャリアテープの製造方法。
＜７＞導電性インキは、酸化チタン粉末を１０〜５０質量％の範囲内で含む前記６の導電性紙キャリアテープの製造方法。
＜８＞導電性インキの粘度を１００〜１０００ ｍPa・sの範囲内とする前記４から７のうちのいずれかの導電性紙キャリアテープの製造方法。
＜９＞キャリア台紙は、抄造時密度が０．８〜１．０ｇ/ｃｍ３であり、含水率が、７％〜１２％の範囲内である前記４から８のうちのいずれかの導電性紙キャリア台紙の製造方法。
＜１０＞キャリア台紙をロール原反より送り出して導電性インキを印刷する前記４から９のうちのいずれかの導電性紙キャリア台紙の製造方法。
＜１１＞ロール原反より送り出したキャリア台紙に搬送速度２０〜８０ｍ／分において導電性インキを印刷し、５０〜１５０℃の乾燥温度で製造する前記１０の導電性紙キャリア台紙の製造方法。
The present invention is characterized by the following in order to solve the above problems.
<1> A conductive paper carrier tape having a printed layer of conductive ink on both sides or one side of a carrier mount, and the generation of static electricity is reduced.
<2> The conductive property described above, wherein the thickness of the printed layer of the conductive ink is in the range of 0.1 μm to 5 μm and the surface resistivity is in the range of 10 5 Ω / sq. To 10 10 Ω / sq. Paper carrier tape.
<3> The conductive paper carrier tape according to 1 or 2, wherein the printed layer of the conductive ink contains at least one of a conductive metal oxide and a conductive polymer.
<4> A method for producing a conductive paper carrier tape using a base paper having conductive ink printed on both sides or one side of a carrier mount.
<5> The conductive paper according to 4 above, wherein the thickness of the printed layer of the conductive ink is in the range of 0.1 μm to 5 μm and the surface resistivity is in the range of 10 5 Ω / sq. To 10 10 Ω / sq. Manufacturing method of carrier tape.
<6> The method for producing a conductive paper carrier tape according to 4 or 5, wherein the conductive ink contains at least one of a conductive metal oxide and a conductive polymer.
<7> The method for producing a conductive paper carrier tape according to 6, wherein the conductive ink contains titanium oxide powder in a range of 10 to 50% by mass.
<8> The method for producing a conductive paper carrier tape according to any one of 4 to 7, wherein the conductive ink has a viscosity of 100 to 1000 mPa · s.
<9> The carrier mount has a papermaking density of 0.8 to 1.0 g / cm 3 and a moisture content in the range of 7% to 12%. Manufacturing method of paper carrier mount.
<10> The method for producing a conductive paper carrier mount according to any one of 4 to 9, wherein the carrier mount is sent out from a raw roll and printed with a conductive ink.
<11> The method for producing a conductive paper carrier mount according to 10, wherein a conductive ink is printed on a carrier mount fed from a roll raw material at a conveyance speed of 20 to 80 m / min, and is produced at a drying temperature of 50 to 150 ° C.
前記第１の本発明の導電性紙キャリアテープによれば、キャリア台紙の表面または表裏面に導電性インキの印刷層を設ける導電加工によって、導電性のカーボンを内部複合化した紙の場合に比べて、輸送運搬時に部品との摩擦により発生する静電気は緩和され、はるかに効果的にカバーテープ剥離時の剥離帯電を防止することができる。しかも、導電性インキの印刷による導電加工であることから、製造は容易で、品質、性能の均質化、安定化が容易に図られ、製造コスト負担も過大なものとならない。これによって、微細化、小型化する電子部品、マイクロチップであってもその識別取出しを正確に、容易に行うことを可能とする。また、原紙の表層、表裏層を導電性インキの印刷層で封止しているので、従来の紙テープのように、表層の紙の発塵によるマウンター吸引（着）ノズルの詰りの発生という問題も生じにくく、ノズルの掃除の回数を減らすことができる。しかも導電性インキとして白色系のものを用いる場合には、マウンターセンターによる電子部品、マイクロチップの識別もより確実に行われることになる。 According to the conductive paper carrier tape of the first aspect of the present invention, compared to the case of paper in which conductive carbon is internally combined by conductive processing in which a conductive ink printing layer is provided on the front or back surface of the carrier mount. Thus, static electricity generated by friction with parts during transportation and transportation is alleviated, and it is possible to prevent peeling electrification when peeling the cover tape much more effectively. Moreover, since it is a conductive process by printing with conductive ink, the manufacture is easy, the quality and performance are easily homogenized and stabilized, and the manufacturing cost burden is not excessive. This makes it possible to accurately and easily identify and extract electronic components and microchips that are miniaturized and miniaturized. In addition, since the front and back layers of the base paper are sealed with a printed layer of conductive ink, there is a problem of clogging of the mounter suction (attachment) nozzle due to dust generation of the paper on the front layer, as with conventional paper tape. This is unlikely to occur and the number of nozzle cleanings can be reduced. In addition, when a white ink is used as the conductive ink, the electronic component and the microchip are more reliably identified by the mounter center.
第２、第３の発明によれば、以上のとおりの優れた効果は、より確実に安定して実現されることになる。
第４の発明の製造方法によれば、前記の優れた効果を有するキャリアテープが簡便な印刷加工の方法によって容易に製造される。品質、性能の制御も、導電性カーボンの複合化に比べてもはるかに容易に、かつ、確実に安定して実現される。
According to the second and third inventions, the excellent effects as described above are more reliably and stably realized.
According to the manufacturing method of 4th invention, the carrier tape which has the said outstanding effect is manufactured easily by the method of a simple printing process. Control of quality and performance can be realized much more easily, reliably and stably than the composite of conductive carbon.
第５から第１１の発明によれば、このような効果がより顕著に実現される。また、白色の酸化チタンを用いる第７の発明によれば、白色の印刷層が確実に得られることになる。そして、第１０、第１１の発明によれば、目的とする導電性紙キャリアテープに用いる印刷物を効率的に得ることができる。 According to the fifth to eleventh aspects, such an effect is realized more remarkably. Moreover, according to the 7th invention using a white titanium oxide, a white printing layer will be obtained reliably. And according to 10th, 11th invention, the printed matter used for the target conductive paper carrier tape can be obtained efficiently.
本発明の導電性紙キャリアテープは、たとえば、サイズ０６０３、０４０２、０２０１など（単位 ｍｍ/ｍｍ）のマイクロチップを輸送、保管し、組立て時に搬送できるようにするもので、図１および図２に例示したように、キャリア台紙（１）の表裏の両面もしくは表裏のいずれかの片面に導電性インキの印刷層（２）を設けて構成されている。 The conductive paper carrier tape of the present invention can transport, store, and transport microchips of size 0603, 0402, 0201, etc. (unit: mm / mm) during assembly, as shown in FIGS. As illustrated, a conductive ink printing layer (2) is provided on either the front or back of the carrier mount (1) or one of the front and back.
ここで、キャリア台紙（１）は、所要の長さ（Ｌ）と幅（Ｗ）並びに厚み（Ｔ）を有し、長さ（Ｌ）は、ロール状に巻取り可能な長尺であってもよいし、あるいは適宜な長さに切断されていてもよい。寸法としてはＴ＜Ｗ＜Ｌである。たとえば導電性インキの印刷を施す場合としては、厚み（Ｔ）が０．１ｍｍ〜１ｍｍ、幅（Ｗ）が４０ｍｍ〜１０００ｍｍ、１００ｍ〜３０００ｍ巻きの長尺とすることができる。 Here, the carrier mount (1) has a required length (L), width (W) and thickness (T), and the length (L) is a long length that can be wound into a roll. Alternatively, it may be cut to an appropriate length. The dimension is T <W <L. For example, when printing with conductive ink, the thickness (T) may be 0.1 mm to 1 mm, the width (W) may be 40 mm to 1000 mm, and the length may be 100 m to 3000 m.
キャリア台紙（１）に用いる原紙は、従来より紙キャリアテープに用いられている各種の紙素材であってよい。その素材の組成構成は、印刷のための導電性インキとの親和性、密着性等を考慮して選択することができるが、原紙の含水率をコントロールしておくことが好ましい。通常、この含水率は７％〜１２％の範囲である。 The base paper used for the carrier mount (1) may be various paper materials conventionally used for paper carrier tapes. The composition of the material can be selected in consideration of affinity with the conductive ink for printing, adhesion, etc., but it is preferable to control the moisture content of the base paper. Usually, this moisture content is in the range of 7% to 12%.
このようなキャリア台紙（１）に印刷する導電性インキとしては、一般的に密着性の良好な紙を基材原紙としていることから、公知のものをはじめとして各種のものであってよいが、印刷性、密着性とともに、カバーテープの剥離時の剥離帯電による静電気の影響を緩和するとの効果の点からは、導電性金属酸化物並びに導電性ポリマーのうちの少なくとも１種類が含まれているものが好ましい。このうちの金属酸化物としては酸化チタン、酸化錫、酸化亜鉛等の粒子や粉末が挙げられる。また、導電性ポリマーとしては、ポリピロール、ポリアニリン、ポリチオフェン等が挙げられる。なかでも、酸化チタンは、白色の印刷層を形成可能とすることから好適なものとして考慮される。 As the conductive ink to be printed on such a carrier mount (1), since the base paper is generally a paper having good adhesion, various types including a known one may be used. In view of the effect of alleviating the influence of static electricity due to peeling charging when peeling the cover tape, in addition to printability and adhesion, at least one kind of conductive metal oxide and conductive polymer is included. Is preferred. Of these, examples of the metal oxide include particles and powders of titanium oxide, tin oxide, zinc oxide and the like. Examples of the conductive polymer include polypyrrole, polyaniline, polythiophene and the like. Among these, titanium oxide is considered to be suitable because a white printed layer can be formed.
導電性インキの組成としては、前記のとおりの導電性成分とともに、バインダー樹脂、溶剤等により構成することができ、公知の組成であってもよい。もちろん、導電性インキは市販品であってもよい。ただ、印刷性、そして密着性を考慮すると、導電性インキの粘度は、１００〜１０００ ｍPa・ｓの範囲内とすることが好ましい。また、酸化チタン粉末を導電性主成分として含むインキにおいては、これを１０〜５０質量％の範囲内とすることが好ましい。１０質量％未満では、導電性の発現が難しくなり、５０質量％を超える場合には印刷性が悪くなりやすい。 The composition of the conductive ink can be composed of a binder resin, a solvent and the like together with the conductive component as described above, and may be a known composition. Of course, the conductive ink may be a commercial product. However, in consideration of printability and adhesiveness, the viscosity of the conductive ink is preferably in the range of 100 to 1000 mPa · s. Moreover, in the ink which contains a titanium oxide powder as an electroconductive main component, it is preferable to make this into the range of 10-50 mass%. If it is less than 10% by mass, it is difficult to develop the conductivity, and if it exceeds 50% by mass, the printability tends to deteriorate.
酸化チタン含有の白色導電性インキとしての組成は、たとえば表１のものとして例示することができる。ここで、合成樹脂はバインダー成分として用いられるもので、ポリエステル、アクリル樹脂、ウレタン樹脂等が代表的なものとして挙げられる。また、導電剤には金属酸化物である酸化チタンを用いた。 The composition of the titanium oxide-containing white conductive ink can be exemplified as that shown in Table 1. Here, the synthetic resin is used as a binder component, and examples thereof include polyester, acrylic resin, and urethane resin. Further, titanium oxide, which is a metal oxide, was used as the conductive agent.
上記の導電性インキの印刷に際しては、キャリアテープとしての品質、性能、つまり剥離帯電、摩擦帯電による静電気の影響の排除もしくは抑制と、テープとしての強度、柔軟性、耐久性等の観点から、印刷後の乾燥（硬化）された印刷層の厚みが０．１μｍ〜５μｍの範囲内になるようにし、表面抵抗率が１０５Ω/sq.〜１０１０Ω/sq.の範囲内になるようにするのが好ましい。表面抵抗率が１０１１Ω/sq.を超える場合では、静電気の緩和作用が必ずしも十分でなく、１０５Ω/sq.未満では、効果に対してのコストパフォーマンスが必要以上となりやすい。 When printing the above-mentioned conductive ink, the quality and performance as a carrier tape, that is, from the viewpoints of eliminating or suppressing the influence of static electricity due to peeling charging and frictional charging, and strength, flexibility, durability, etc. as a tape The thickness of the later dried (cured) printed layer is made to be in the range of 0.1 μm to 5 μm, and the surface resistivity is in the range of 10 5 Ω / sq. To 10 10 Ω / sq. It is preferable to do this. When the surface resistivity exceeds 10 11 Ω / sq., The static electricity mitigating action is not necessarily sufficient, and when it is less than 10 5 Ω / sq., The cost performance for the effect tends to be more than necessary.
以上のキャリア台紙に導電性インキを印刷した印刷物を、部品の大きさ、マウンターに合うようにスリット、パンチング、エンボス加工することによって導電性紙キャリアテープを作成することができる。 A conductive paper carrier tape can be produced by slitting, punching, or embossing a printed matter obtained by printing conductive ink on the carrier mount as described above so as to fit the size and mounter of the component.
本発明の実施例としては、厚みが約０．３ｍｍ、６４０ｍｍ幅、２，０００ｍ巻のロール原反の原紙を用いて、表１の組成の導電性インキを印刷機で印刷し、原紙の両面に、厚み１μｍの印刷層を設けた。 As an embodiment of the present invention, using a roll base paper having a thickness of about 0.3 mm, a width of 640 mm, and a roll of 2,000 m, a conductive ink having the composition shown in Table 1 is printed on a printing machine, and both sides of the base paper are printed. A printing layer having a thickness of 1 μm was provided.
印刷に際しては、あらかじめ、搬送速度７０ｍ／分で送り出して、８０℃の温度で加熱乾燥した。これにより原紙の含水率は７％〜１２％にコントロールした。導電性インキの粘度は２００〜２５０ ｍPa・Sとした。 In printing, the sheet was sent in advance at a conveyance speed of 70 m / min and dried by heating at a temperature of 80 ° C. This controlled the water content of the base paper to 7% to 12%. The viscosity of the conductive ink was 200 to 250 mPa · S.
この導電性紙シートの表面抵抗率は２．１３×１０５Ω/sq.であり、得られた導電性紙キャリアテープはマウンターにおいて０．２ｍｍ×０．４ｍｍの電子部品の実装に用いたが、カバーテープの剥離帯電による静電気の影響は見られなかった。しかるに、導電性インキの粘度、印刷速度、乾燥温度の組み合わせにより、表面抵抗率を１０５Ω/sq.〜１０１０Ω/sq.の範囲に自由にコントロールできる特性をもった導電紙である事が証明された。 The surface resistivity of this conductive paper sheet was 2.13 × 10 5 Ω / sq., And the obtained conductive paper carrier tape was used for mounting electronic components of 0.2 mm × 0.4 mm in the mounter. The effect of static electricity due to peeling charging of the cover tape was not observed. However, the conductive paper should have a characteristic that the surface resistivity can be freely controlled in the range of 10 5 Ω / sq. To 10 10 Ω / sq. By the combination of the viscosity, printing speed and drying temperature of the conductive ink. Proved.
１ キャリア台紙
２ 導電性インキ層
1
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009070785A JP2010222030A (en) | 2009-03-23 | 2009-03-23 | Conductive paper carrier tape and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009070785A JP2010222030A (en) | 2009-03-23 | 2009-03-23 | Conductive paper carrier tape and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2010222030A true JP2010222030A (en) | 2010-10-07 |
Family
ID=43039658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009070785A Pending JP2010222030A (en) | 2009-03-23 | 2009-03-23 | Conductive paper carrier tape and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010222030A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014009337A (en) * | 2012-07-02 | 2014-01-20 | Sumitomo Bakelite Co Ltd | Substrate sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component transportation body |
| JP2014227216A (en) * | 2013-05-24 | 2014-12-08 | 三徳商事株式会社 | Conductive carrier tape |
| JP6656450B1 (en) * | 2019-04-25 | 2020-03-04 | 株式会社マルアイ | Sheet for electronic component transport tray / carrier tape and electronic component transport tray / carrier tape using the same |
| JP7391442B1 (en) | 2023-08-31 | 2023-12-05 | 株式会社マルアイ | Tray or carrier tape for transporting electronic components, manufacturing method and recycling method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07156987A (en) * | 1993-11-29 | 1995-06-20 | Dainippon Printing Co Ltd | Bottom material for electronic component carrier and its manufacture |
| JPH0811932A (en) * | 1994-06-23 | 1996-01-16 | Tokujiro Okui | Conductive sheet for carrier tape |
| JPH09110071A (en) * | 1995-10-20 | 1997-04-28 | Tokushu Paper Mfg Co Ltd | Paper base material for carrier tape |
| JPH09188385A (en) * | 1996-01-08 | 1997-07-22 | Oji Paper Co Ltd | Carrier tape paper of electronic parts chip |
| JP2006347009A (en) * | 2005-06-16 | 2006-12-28 | Shin Etsu Polymer Co Ltd | Biodegradable conductive sheet, its manufacturing method and molded product |
| JP2007137432A (en) * | 2005-11-14 | 2007-06-07 | Tokyo Paper Mfg Co Ltd | Carrier tape mount for conveying electronic component |
| JP2008297009A (en) * | 2007-06-04 | 2008-12-11 | Oji Paper Co Ltd | Storage pasteboard for chip type electronic component |
-
2009
- 2009-03-23 JP JP2009070785A patent/JP2010222030A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07156987A (en) * | 1993-11-29 | 1995-06-20 | Dainippon Printing Co Ltd | Bottom material for electronic component carrier and its manufacture |
| JPH0811932A (en) * | 1994-06-23 | 1996-01-16 | Tokujiro Okui | Conductive sheet for carrier tape |
| JPH09110071A (en) * | 1995-10-20 | 1997-04-28 | Tokushu Paper Mfg Co Ltd | Paper base material for carrier tape |
| JPH09188385A (en) * | 1996-01-08 | 1997-07-22 | Oji Paper Co Ltd | Carrier tape paper of electronic parts chip |
| JP2006347009A (en) * | 2005-06-16 | 2006-12-28 | Shin Etsu Polymer Co Ltd | Biodegradable conductive sheet, its manufacturing method and molded product |
| JP2007137432A (en) * | 2005-11-14 | 2007-06-07 | Tokyo Paper Mfg Co Ltd | Carrier tape mount for conveying electronic component |
| JP2008297009A (en) * | 2007-06-04 | 2008-12-11 | Oji Paper Co Ltd | Storage pasteboard for chip type electronic component |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014009337A (en) * | 2012-07-02 | 2014-01-20 | Sumitomo Bakelite Co Ltd | Substrate sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component transportation body |
| JP2014227216A (en) * | 2013-05-24 | 2014-12-08 | 三徳商事株式会社 | Conductive carrier tape |
| JP6656450B1 (en) * | 2019-04-25 | 2020-03-04 | 株式会社マルアイ | Sheet for electronic component transport tray / carrier tape and electronic component transport tray / carrier tape using the same |
| JP2020179596A (en) * | 2019-04-25 | 2020-11-05 | 株式会社マルアイ | Sheet for tray/carrier tape for conveying electronic component, and tray/carrier tape for conveying electronic component using the same |
| JP7391442B1 (en) | 2023-08-31 | 2023-12-05 | 株式会社マルアイ | Tray or carrier tape for transporting electronic components, manufacturing method and recycling method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4974803B2 (en) | Shield film for printed wiring board and printed wiring board | |
| CN104582246B (en) | Electromagnetic shielding film and the flexible printed circuit board with electromagnetic shielding film | |
| JP5452443B2 (en) | Conductive pattern forming substrate | |
| US8984747B2 (en) | Method for manufacturing fabric type circuit board | |
| KR101961234B1 (en) | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board | |
| CN105612055A (en) | Fluorine resin base material, printed wiring board, and circuit module | |
| JP2010222030A (en) | Conductive paper carrier tape and method for manufacturing the same | |
| JP2009038278A5 (en) | ||
| JP2009049136A (en) | Wiring board, wiring pattern forming method, and manufacturing method of wiring board | |
| KR101051857B1 (en) | Method of adhering additional plate to fpc product | |
| JP2003101179A (en) | Copper foil with carrier and printed circuit board using the same | |
| WO2001015896A1 (en) | Releasing laminated film | |
| CN103517585B (en) | Rigid-flexible circuit board and preparation method thereof | |
| WO2017042617A1 (en) | Method for manufacturing laminate | |
| JP2014227216A (en) | Conductive carrier tape | |
| JP4276006B2 (en) | Epoxy resin laminate for reinforcement of flexible printed wiring boards | |
| CN103374204B (en) | epoxy resin composite material, film and circuit substrate | |
| JP3237659B2 (en) | Cleaning apparatus for thin plate surface and circuit board manufacturing apparatus using the same | |
| CN105282996B (en) | The manufacturing method of multilayer board | |
| JP2008074408A (en) | Plastic sheet and carrier tape | |
| CN104010436A (en) | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology | |
| JP5922079B2 (en) | Thin electromagnetic shielding gasket material | |
| JP7241734B2 (en) | copper ink | |
| JP2009172982A (en) | Double-sided metal clad laminate | |
| KR20200012578A (en) | Antibacterial Aramid Fiber With Excellent Flame Retardancy And Durability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120207 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130221 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130305 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130702 |