JP2010212402A - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- JP2010212402A JP2010212402A JP2009056086A JP2009056086A JP2010212402A JP 2010212402 A JP2010212402 A JP 2010212402A JP 2009056086 A JP2009056086 A JP 2009056086A JP 2009056086 A JP2009056086 A JP 2009056086A JP 2010212402 A JP2010212402 A JP 2010212402A
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- JP
- Japan
- Prior art keywords
- cooling
- channel
- fin
- cooling channel
- boiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】発熱体を冷却する沸騰冷却装置において、鉛直方向に下段チャネル2、中段チャネル3、上段チャネル4の複数の冷却チャネルを有し、各冷却チャネルは鉛直方向に冷媒を流す冷却フィン12と、冷却フィン12の発熱体当接側と反対側に形成された蒸気排出流路16とを有する。さらに、各冷却チャネル間に、発生した気泡が次の冷却チャネルに進行することを阻害し蒸気排出流路16へと導く流路仕切板兼蒸気排出ガイド板18を備える。
【選択図】図1
Description
Claims (5)
- 発熱体を冷却する沸騰冷却装置において、
鉛直方向に配置された少なくとも第1及び第2の冷却チャネルを有し、
前記第1冷却チャネル及び第2冷却チャネルは、
鉛直方向に冷媒を流す冷却フィンと、
前記冷却フィンの、発熱体当接側と反対側に形成された蒸気排出流路と、
を有し、さらに、
前記第1冷却チャネルと前記第2冷却チャネル間に、前記第1冷却チャネルで発生した気泡の前記第2冷却チャネルへの進行を阻害し前記蒸気排出流路へと導くガイド部を有する
ことを特徴とする沸騰冷却装置。 - 請求項1記載の装置において、さらに、
前記冷却フィンと前記蒸気排出流路との間に配置される仕切板
を有し、前記ガイド部は前記仕切板の一部として形成される
ことを特徴とする沸騰冷却装置。 - 請求項2記載の装置において、
前記仕切板は、前記第1冷却チャネルと前記第2冷却チャネル間に対応する位置に開口部を有し、前記ガイド部は前記開口部の縁部から前記冷却フィンの前記発熱体当接側に向けて突出形成される
ことを特徴とする沸騰冷却装置。 - 請求項3記載の装置において、さらに、
前記第1冷却チャネルと前記第2冷却チャネル間に設けられ前記第2冷却チャネルに冷媒を供給する給液管
を有し、前記ガイド部の先端部は前記給液管に当接することを特徴とする沸騰冷却装置。 - 請求項3記載の装置において、
前記第1冷却チャネルは前記第2冷却チャネルの鉛直下方に配置され、
前記ガイド部は、前記第2冷却チャネルの前記冷却フィンから前記第1冷却チャネルの前記冷却フィンに向けて傾斜形成される
ことを特徴とする沸騰冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009056086A JP4766132B2 (ja) | 2009-03-10 | 2009-03-10 | 沸騰冷却装置 |
PCT/JP2010/053910 WO2010104080A1 (ja) | 2009-03-10 | 2010-03-09 | 沸騰冷却装置 |
US13/254,680 US20120111550A1 (en) | 2009-03-10 | 2010-03-09 | Ebullient cooling device |
CN201080011212.XA CN102349152B (zh) | 2009-03-10 | 2010-03-09 | 沸腾冷却装置 |
DE112010001158T DE112010001158B8 (de) | 2009-03-10 | 2010-03-09 | Heisswasserkühlvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009056086A JP4766132B2 (ja) | 2009-03-10 | 2009-03-10 | 沸騰冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010212402A true JP2010212402A (ja) | 2010-09-24 |
JP4766132B2 JP4766132B2 (ja) | 2011-09-07 |
Family
ID=42728369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009056086A Expired - Fee Related JP4766132B2 (ja) | 2009-03-10 | 2009-03-10 | 沸騰冷却装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120111550A1 (ja) |
JP (1) | JP4766132B2 (ja) |
CN (1) | CN102349152B (ja) |
DE (1) | DE112010001158B8 (ja) |
WO (1) | WO2010104080A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013008850A (ja) * | 2011-06-24 | 2013-01-10 | Toyota Central R&D Labs Inc | 沸騰冷却装置 |
WO2016117342A1 (ja) * | 2015-01-21 | 2016-07-28 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
WO2017046986A1 (ja) * | 2015-09-15 | 2017-03-23 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103796494B (zh) * | 2014-01-28 | 2016-02-03 | 华进半导体封装先导技术研发中心有限公司 | 密闭性温度控制装置 |
WO2016117094A1 (ja) * | 2015-01-22 | 2016-07-28 | 三菱電機株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0923081A (ja) * | 1995-07-05 | 1997-01-21 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH09139453A (ja) * | 1995-11-16 | 1997-05-27 | Toshiba Corp | 半導体冷却装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0223081A (ja) * | 1988-07-11 | 1990-01-25 | Matsushita Electric Ind Co Ltd | 速度制御装置 |
JPH0339453A (ja) * | 1989-07-06 | 1991-02-20 | Sumitomo Light Metal Ind Ltd | Vtrシリンダー用アルミニウム合金鋳造棒の製造方法 |
JP2005268658A (ja) * | 2004-03-19 | 2005-09-29 | Denso Corp | 沸騰冷却装置 |
JP4699820B2 (ja) | 2005-06-28 | 2011-06-15 | 本田技研工業株式会社 | パワー半導体モジュール |
-
2009
- 2009-03-10 JP JP2009056086A patent/JP4766132B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-09 US US13/254,680 patent/US20120111550A1/en not_active Abandoned
- 2010-03-09 WO PCT/JP2010/053910 patent/WO2010104080A1/ja active Application Filing
- 2010-03-09 DE DE112010001158T patent/DE112010001158B8/de not_active Expired - Fee Related
- 2010-03-09 CN CN201080011212.XA patent/CN102349152B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0923081A (ja) * | 1995-07-05 | 1997-01-21 | Nippondenso Co Ltd | 沸騰冷却装置 |
JPH09139453A (ja) * | 1995-11-16 | 1997-05-27 | Toshiba Corp | 半導体冷却装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013008850A (ja) * | 2011-06-24 | 2013-01-10 | Toyota Central R&D Labs Inc | 沸騰冷却装置 |
WO2016117342A1 (ja) * | 2015-01-21 | 2016-07-28 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
WO2017046986A1 (ja) * | 2015-09-15 | 2017-03-23 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
Also Published As
Publication number | Publication date |
---|---|
DE112010001158T5 (de) | 2012-05-10 |
JP4766132B2 (ja) | 2011-09-07 |
CN102349152B (zh) | 2013-01-09 |
CN102349152A (zh) | 2012-02-08 |
DE112010001158B4 (de) | 2013-01-31 |
DE112010001158B8 (de) | 2013-04-18 |
US20120111550A1 (en) | 2012-05-10 |
WO2010104080A1 (ja) | 2010-09-16 |
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