JP2010056130A - 液冷式冷却装置 - Google Patents
液冷式冷却装置 Download PDFInfo
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- JP2010056130A JP2010056130A JP2008216614A JP2008216614A JP2010056130A JP 2010056130 A JP2010056130 A JP 2010056130A JP 2008216614 A JP2008216614 A JP 2008216614A JP 2008216614 A JP2008216614 A JP 2008216614A JP 2010056130 A JP2010056130 A JP 2010056130A
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- protrusion
- fin
- liquid
- cooling
- casing
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- 238000001816 cooling Methods 0.000 title claims abstract description 72
- 239000000110 cooling liquid Substances 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002826 coolant Substances 0.000 description 23
- 230000002093 peripheral effect Effects 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/32—Safety or protection arrangements; Arrangements for preventing malfunction for limiting movements, e.g. stops, locking means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】液冷式冷却装置1は、後端部に冷却液入口11が形成されるとともに、前端部に冷却液出口12が形成されたケーシング2を備えている。ケーシング2内における冷却液入口11と冷却液出口12との間の位置に、冷却液が後方から前方に流れる複数の流路18を形成するコルゲートフィン17を配置する。ケーシング2の頂壁3外面に発熱体取付部10を設ける。ケーシング2の底壁4内面における発熱体取付部10と対向する部分から左右方向にずれた位置に、コルゲートフィン17の前後両端部に当接してコルゲートフィン17の前後方向の位置決めを行う突起23A,23Bを設ける。
【選択図】図3
Description
ケーシングの頂壁内面および/または底壁内面における発熱体取付部と対向する部分から左右方向にずれた位置に、フィンの前後両端部に当接してフィンの前後方向の位置決めを行う突起が設けられている液冷式冷却装置。
(2):ケーシング
(3):頂壁
(4):底壁
(10):発熱体取付部
(11):冷却液入口
(12):冷却液出口
(17):コルゲートフィン
(17a):波頂部
(17b):波底部
(17c):連結部
(18):流路
(23A)(23B):突起
Claims (8)
- 後端部に冷却液入口が形成されるとともに、前端部に冷却液出口が形成されたケーシングを備えており、ケーシング内における冷却液入口と冷却液出口との間の位置に、冷却液が後方から前方に流れる複数の流路を形成するフィンが配置されており、ケーシングの頂壁外面および/または底壁外面に発熱体取付部が設けられている液冷式冷却装置であって、
ケーシングの頂壁内面および/または底壁内面における発熱体取付部と対向する部分から左右方向にずれた位置に、フィンの前後両端部に当接してフィンの前後方向の位置決めを行う突起が設けられている液冷式冷却装置。 - フィンの前端部が当接する前側突起およびフィンの後端部が当接する後側突起が、それぞれ左右方向に間隔をおいて設けられており、前側突起と後側突起とが左右方向にずれている請求項1記載の液冷式冷却装置。
- フィンの前後方向の長さをLmm、左右方向の幅をWmmとし、L≧Wの場合に、前側突起および後側突起がそれぞれ左右両端部に1つずつ設けられている請求項2記載の液冷式冷却装置。
- フィンの前後方向の長さをLmm、左右方向の幅をWmmとし、W>Lの場合に、前側突起および後側突起がそれぞれ左右両端部に1つずつ設けられるとともに、左右方向の中間部に1つ以上設けられている請求項2記載の液冷式冷却装置。
- フィンが、波頂部、波底部および波頂部と波底部とを連結する連結部よりなるコルゲート状であり、前側突起および後側突起の左右方向の幅が、フィンの隣接する波頂部どうしおよび隣接する波底部どうしの間隔の2倍よりも小さく、かつフィンの隣接する波頂部と波底部との間隔よりも大きくなっている請求項1〜4のうちのいずれかに記載の液冷式冷却装置。
- 前側突起および後側突起の高さが、フィンの厚みよりも大きくかつフィンの高さの1/2以下である請求項5記載の液冷式冷却装置。
- 前側突起および後側突起がそれぞれ先端に向かって縮径された円錐状である請求項5または6記載の液冷式冷却装置。
- フィンの前後方向の長さをLmm、前側突起と後側突起との間の前後方向の最短直線距離をL1mm、前側突起および後側突起の基端の外径をDmmとした場合、0<L−L1<Dの関係を満たす請求項7記載の液冷式冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216614A JP5023020B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
US12/546,423 US9406585B2 (en) | 2008-08-26 | 2009-08-24 | Liquid-cooled-type cooling device |
KR1020090078446A KR101050326B1 (ko) | 2008-08-26 | 2009-08-25 | 액냉식 냉각 장치 |
CN200910163521.8A CN101661915B (zh) | 2008-08-26 | 2009-08-26 | 液冷式冷却装置 |
EP09168643A EP2159838B1 (en) | 2008-08-26 | 2009-08-26 | Liquid-cooled-type cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216614A JP5023020B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010056130A true JP2010056130A (ja) | 2010-03-11 |
JP5023020B2 JP5023020B2 (ja) | 2012-09-12 |
Family
ID=41392642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008216614A Active JP5023020B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9406585B2 (ja) |
EP (1) | EP2159838B1 (ja) |
JP (1) | JP5023020B2 (ja) |
KR (1) | KR101050326B1 (ja) |
CN (1) | CN101661915B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243608A (ja) * | 2010-05-14 | 2011-12-01 | Toyota Motor Corp | 冷却器 |
JP2011258755A (ja) * | 2010-06-09 | 2011-12-22 | Denso Corp | 熱拡散体および発熱体の冷却装置 |
JP2013225553A (ja) * | 2012-04-20 | 2013-10-31 | Sumitomo Light Metal Ind Ltd | 熱交換器及びその製造方法 |
JP2018037496A (ja) * | 2016-08-30 | 2018-03-08 | 本田技研工業株式会社 | 冷却器及びそれを備えた冷却装置 |
JP2018093115A (ja) * | 2016-12-06 | 2018-06-14 | 株式会社デンソー | 冷却器 |
JP2020047559A (ja) * | 2018-09-21 | 2020-03-26 | 株式会社デンソー | 冷却器 |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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US9190344B2 (en) * | 2007-11-26 | 2015-11-17 | Kabushiki Kaisha Toyota Jidoshokki | Liquid-cooled-type cooling device |
US8472193B2 (en) * | 2008-07-04 | 2013-06-25 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
JP2011091301A (ja) * | 2009-10-26 | 2011-05-06 | Toyota Industries Corp | 液冷式冷却装置 |
JP5813300B2 (ja) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | 冷却装置 |
EP2812769B1 (en) | 2012-02-09 | 2018-11-07 | Hewlett-Packard Enterprise Development LP | Heat dissipating system |
KR20140132333A (ko) | 2012-03-12 | 2014-11-17 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 액체 온도 제어 냉각 |
JP6189015B2 (ja) * | 2012-04-19 | 2017-08-30 | 昭和電工株式会社 | 放熱装置および放熱装置の製造方法 |
DE102012207305A1 (de) * | 2012-05-02 | 2013-11-07 | Webasto Ag | Heizvorrichtung für ein Fahrzeug und Verfahren zum Betreiben der Heizvorrichtung |
CN104685984A (zh) * | 2012-09-28 | 2015-06-03 | 惠普发展公司,有限责任合伙企业 | 冷却组件 |
US9788452B2 (en) | 2012-10-31 | 2017-10-10 | Hewlett Packard Enterprise Development Lp | Modular rack system |
US9803937B2 (en) | 2013-01-31 | 2017-10-31 | Hewlett Packard Enterprise Development Lp | Liquid cooling |
US20150144309A1 (en) * | 2013-03-13 | 2015-05-28 | Brayton Energy, Llc | Flattened Envelope Heat Exchanger |
KR102616490B1 (ko) * | 2016-07-21 | 2023-12-21 | 엘지전자 주식회사 | 직수식 냉수 생성 모듈 |
FR3054309B1 (fr) * | 2016-07-22 | 2018-07-13 | Safran Electronics & Defense | Echangeur thermique en materiau composite compose de la superposition d'un pli plan et d'un pli ondule |
US11284534B2 (en) * | 2016-09-23 | 2022-03-22 | Sumitomo Precision Products Co., Ltd. | Cooling device |
CN106486433B (zh) * | 2016-12-30 | 2019-01-18 | 株洲时代金属制造有限公司 | Igbt散热器 |
JP6948832B2 (ja) * | 2017-05-22 | 2021-10-13 | 株式会社Uacj鋳鍛 | 真空装置用伝熱板及びその製造方法 |
CN113395866B (zh) * | 2020-03-11 | 2023-04-28 | 苏州佳世达光电有限公司 | 散热装置 |
US11812582B2 (en) | 2020-11-09 | 2023-11-07 | Baidu Usa Llc | Symmetrical cold plate design |
US11528826B2 (en) * | 2020-11-11 | 2022-12-13 | Baidu Usa Llc | Internal channel design for liquid cooled device |
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2008
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2009
- 2009-08-24 US US12/546,423 patent/US9406585B2/en active Active
- 2009-08-25 KR KR1020090078446A patent/KR101050326B1/ko not_active IP Right Cessation
- 2009-08-26 EP EP09168643A patent/EP2159838B1/en not_active Not-in-force
- 2009-08-26 CN CN200910163521.8A patent/CN101661915B/zh not_active Expired - Fee Related
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JP2002164491A (ja) * | 2000-11-24 | 2002-06-07 | Denso Corp | 積層冷却器 |
WO2006075614A1 (ja) * | 2005-01-14 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | ヒートシンクおよびそれを用いた冷却ユニット |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011243608A (ja) * | 2010-05-14 | 2011-12-01 | Toyota Motor Corp | 冷却器 |
JP2011258755A (ja) * | 2010-06-09 | 2011-12-22 | Denso Corp | 熱拡散体および発熱体の冷却装置 |
JP2013225553A (ja) * | 2012-04-20 | 2013-10-31 | Sumitomo Light Metal Ind Ltd | 熱交換器及びその製造方法 |
JP2018037496A (ja) * | 2016-08-30 | 2018-03-08 | 本田技研工業株式会社 | 冷却器及びそれを備えた冷却装置 |
JP2018093115A (ja) * | 2016-12-06 | 2018-06-14 | 株式会社デンソー | 冷却器 |
JP2020047559A (ja) * | 2018-09-21 | 2020-03-26 | 株式会社デンソー | 冷却器 |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
Also Published As
Publication number | Publication date |
---|---|
US9406585B2 (en) | 2016-08-02 |
US20100051235A1 (en) | 2010-03-04 |
EP2159838B1 (en) | 2012-10-24 |
JP5023020B2 (ja) | 2012-09-12 |
EP2159838A3 (en) | 2010-09-08 |
KR101050326B1 (ko) | 2011-07-19 |
KR20100024902A (ko) | 2010-03-08 |
EP2159838A2 (en) | 2010-03-03 |
CN101661915A (zh) | 2010-03-03 |
CN101661915B (zh) | 2014-07-09 |
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