JP2010206514A - 撮像ユニット - Google Patents
撮像ユニット Download PDFInfo
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- JP2010206514A JP2010206514A JP2009049663A JP2009049663A JP2010206514A JP 2010206514 A JP2010206514 A JP 2010206514A JP 2009049663 A JP2009049663 A JP 2009049663A JP 2009049663 A JP2009049663 A JP 2009049663A JP 2010206514 A JP2010206514 A JP 2010206514A
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- lens
- image sensor
- rearmost
- optical system
- objective optical
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- 238000003384 imaging method Methods 0.000 title claims abstract description 68
- 230000003287 optical effect Effects 0.000 claims abstract description 93
- 239000000853 adhesive Substances 0.000 claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 claims description 53
- 238000000016 photochemical curing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 239000006059 cover glass Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002775 capsule Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00163—Optical arrangements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/041—Capsule endoscopes for imaging
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- A—HUMAN NECESSITIES
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/042—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by a proximal camera, e.g. a CCD camera
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
- B29C66/24245—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle forming a square
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H04N23/50—Constructional details
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- H—ELECTRICITY
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- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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Abstract
【解決手段】レンズ群4の内、光軸方向Zにおいて最もイメージセンサ2側に位置する最後端のレンズ5の脚部5mがUV接着剤9でイメージセンサ2に接着されることにより、イメージセンサ2の受光部3は、最後端のレンズ5と受光部3との間に密閉空間7を有して封止されていることを特徴とする。
【選択図】図1
Description
図1は、本実施の形態を示す撮像ユニットの部分断面図、図2は、図1の撮像ユニットの内、最後端のレンズを、イメージセンサ及びプリント基板とともに図1中のIIの方向からみた上面図である。
図4は、本実施の形態を示す撮像ユニットの部分断面図、図5は、図4の撮像ユニットの内、最後端のレンズを、イメージセンサ及びプリント基板とともに図4中のVの方向からみた上面図である。
2…イメージセンサ(撮像素子)
2a…イメージセンサの表面(一面)
3…受光部
4…レンズ群(対物光学系)
5…最後端のレンズ(最後端の対物光学系)
5m…脚部
7…密閉空間
9…UV接着剤(光硬化型接着剤)
10…遮光部材
11…プリント基板
20…撮像ユニット
40…レンズ群(対物光学系)
50…最後端のレンズ(最後端の対物光学系)
50f…フランジ部
50m…脚部
70…遮光部材
R…径方向
Z…光軸方向
Z1…レンズ群の光軸方向の長さ
Z2…レンズ群の光軸方向の長さ
Claims (8)
- 撮像素子と、該撮像素子よりも光軸方向前方に設けられた対物光学系とを具備する撮像ユニットであって、
前記対物光学系の内、前記光軸方向において最も前記撮像素子側に位置する最後端の対物光学系の少なくとも一部が光硬化型接着剤で前記撮像素子に接着されることにより、前記撮像素子の受光部は、前記最後端の対物光学系と前記受光部との間に密閉空間を有して封止されていることを特徴とする撮像ユニット。 - 前記最後端の対物光学系の少なくとも一部は、前記撮像素子の前記最後端の対物光学系側の一面に電気的に接続された基板に接着されていることを特徴とする請求項1に記載の撮像ユニット。
- 前記最後端の対物光学系の少なくとも一部は、前記最後端の対物光学系から前記撮像素子側に延出した脚部であることを特徴とする請求項1に記載の撮像ユニット。
- 前記脚部が前記撮像素子における前記最後端の対物光学系側の一面に突き当てられていることにより、前記対物光学系の前記光軸方向の長さが規定されていることを特徴とする請求項3に記載の撮像ユニット。
- 前記最後端の対物光学系の少なくとも一部は、前記最後端の対物光学系から該対物光学系の径方向に延出したフランジ部であることを特徴とする請求項1または2に記載の撮像ユニット。
- 前記最後端の対物光学系は、前記最後端の対物光学系から前記撮像素子側に延出した脚部をさらに具備し、
前記脚部が前記撮像素子の前記最後端の対物光学系側の一面に突き当てられていることにより、前記対物光学系の前記光軸方向の長さが規定されていることを特徴とする請求項5に記載の撮像ユニット。 - 前記最後端の対物光学系は、光透過性部材から形成されていることを特徴とする請求項1〜6のいずれか1項に記載の撮像ユニット。
- 前記対物光学系の径方向の外周は、遮光部材によって覆われていることを特徴とする請求項1〜7のいずれか1項に記載の撮像ユニット。
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US12/714,838 US20100225799A1 (en) | 2009-03-03 | 2010-03-01 | Image pickup unit, method of manufacturing image pickup unit and electronic apparatus provided with image pickup unit |
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JP2014527722A (ja) * | 2011-08-19 | 2014-10-16 | アイエムアイ ユーエスエー, インコーポレイテッドImi Usa, Inc. | フリップ・チップ実装された撮像チップ |
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JP5721981B2 (ja) | 2010-09-10 | 2015-05-20 | オリンパス株式会社 | 撮像ユニットおよび撮像ユニットを具備する内視鏡 |
US9723186B2 (en) * | 2014-02-19 | 2017-08-01 | Stmicroelectronics Pte Ltd | Low profile camera module with image compensation |
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JP2005323396A (ja) * | 2005-06-10 | 2005-11-17 | Mitsubishi Electric Corp | 撮像装置 |
WO2007043509A1 (ja) * | 2005-10-14 | 2007-04-19 | Konica Minolta Opto, Inc. | 撮像装置 |
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JP2003298888A (ja) * | 2002-04-02 | 2003-10-17 | Konica Corp | 撮像装置の製造方法 |
US20040061799A1 (en) * | 2002-09-27 | 2004-04-01 | Konica Corporation | Image pickup device and portable terminal equipped therewith |
JP2004200965A (ja) * | 2002-12-18 | 2004-07-15 | Sanyo Electric Co Ltd | カメラモジュール及びその製造方法 |
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US8049806B2 (en) * | 2004-09-27 | 2011-11-01 | Digitaloptics Corporation East | Thin camera and associated methods |
JP4308233B2 (ja) * | 2006-09-01 | 2009-08-05 | オリンパスメディカルシステムズ株式会社 | 内視鏡用撮像モジュール |
JP5047679B2 (ja) * | 2007-04-26 | 2012-10-10 | オリンパスメディカルシステムズ株式会社 | 撮像ユニットおよび、この撮像ユニットの製造方法 |
WO2009016949A1 (ja) * | 2007-07-27 | 2009-02-05 | Konica Minolta Opto, Inc. | 撮像装置 |
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JP2005323396A (ja) * | 2005-06-10 | 2005-11-17 | Mitsubishi Electric Corp | 撮像装置 |
WO2007043509A1 (ja) * | 2005-10-14 | 2007-04-19 | Konica Minolta Opto, Inc. | 撮像装置 |
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JP2014527722A (ja) * | 2011-08-19 | 2014-10-16 | アイエムアイ ユーエスエー, インコーポレイテッドImi Usa, Inc. | フリップ・チップ実装された撮像チップ |
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