JP2010153873A - 熱伝導部材、電子装置及び前記熱伝導部材の使用方法 - Google Patents
熱伝導部材、電子装置及び前記熱伝導部材の使用方法 Download PDFInfo
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Abstract
【解決手段】本発明の熱伝導部材は、保護温度が設定される熱源と放熱装置との間に設置され、前記熱源からの熱を前記放熱装置に伝えることに用いられ、基材と、該基材の中に分散された複数の第一熱伝導粒子とを含む。前記複数の第一熱伝導粒子の粒径が1〜100ナノメートルであり、その融点が前記熱源の保護温度より低い。前記複数の第一熱伝導粒子は溶融した後、少なくとも二つの前記第一熱伝導粒子が相互に結び付き、一つの大寸法の熱伝導粒子に形成され、該大寸法の熱伝導粒子の粒径が100ナノメートルより大きく、その融点が前記熱源の保護温度より高い。また、本発明は、前記熱伝導部材を含む電子装置及び該熱伝導部材の使用方法を提供する。
【選択図】図3
Description
図1〜図3を参照すると、本発明の実施例1における熱伝導部材30を利用した状態を示す図である。前記熱伝導部材30は、熱源10と放熱装置20との間に設置され、前記熱源10からの熱を前記放熱装置20に伝えることに用いられる。前記熱源10と、前記放熱装置20と前記熱伝導部材30とは、電子装置100に形成される。
図4と図5を参照すると、本発明の実施例2は、電子装置200に応用された熱伝導部材230を提供する。該電子装置200は、更に熱源210及び放熱装置220を含む。前記熱伝導部材230は、前記熱源210と前記放熱装置220との間に設置され、該熱源210からの熱を前記放熱装置220に伝えることに用いられる。
11 放熱表面
12 第一凹部
20 放熱装置
21 熱伝導表面
22 第二凹部
30 熱伝導部材
31 基材
32 第一熱伝導粒子
33 大寸法の熱伝導粒子
100、200 電子装置
210 熱源
220 放熱装置
230 熱伝導部材
231 基材
232 第一熱伝導粒子
233 第二熱伝導粒子
234 大寸法の複合熱伝導粒子
Claims (6)
- 保護温度が設定される熱源と放熱装置との間に設置され、前記熱源からの熱を前記放熱装置に伝えることに用いられる熱伝導部材において、
基材と、該基材の中に分散された複数の第一熱伝導粒子と、を含み、
前記複数の第一熱伝導粒子の粒径が1〜100ナノメートルであり、その融点が前記熱源の保護温度より低く、
前記複数の第一熱伝導粒子は溶融した後、少なくとも二つの前記第一熱伝導粒子が相互に結び付き、一つの大寸法の熱伝導粒子に形成され、該大寸法の熱伝導粒子の粒径が100ナノメートルより大きく、その融点が前記熱源の保護温度より高いことを特徴とする熱伝導部材。 - 前記熱伝導部材において、前記熱伝導部材に対する前記第一熱伝導粒子の質量比が15質量%〜95質量%であることを特徴とする、請求項1に記載の熱伝導部材。
- 前記熱伝導部材は第二熱伝導粒子を含み、
前記第二熱伝導粒子が、カーボンナノチューブ又は炭素繊維であることを特徴とする、請求項1〜2のいずれか一項に記載の熱伝導部材。 - 保護温度が設定される熱源と、放熱装置と、前記熱源及び放熱装置の間に設置される熱伝導部材と、を含む電子装置において、
前記熱伝導部材が基材と、該基材の中に分散された複数の第一熱伝導粒子と、を含み、
前記複数の第一熱伝導粒子の粒径が1〜100ナノメートルであり、その融点が前記熱源の保護温度より低く、
前記複数の第一熱伝導粒子は溶融した後、少なくとも二つの前記第一熱伝導粒子が相互に結び付き、一つの大寸法の熱伝導粒子に形成され、該大寸法の熱伝導粒子の粒径が100ナノメートルより大きく、その融点が前記熱源の保護温度より高いことを特徴とする電子装置。 - 熱伝導部材及び保護温度を有する熱源を提供して、前記熱伝導部材は基材と、該基材の中に分散された複数の第一熱伝導粒子とを含み、前記複数の第一熱伝導粒子の粒径が1〜100ナノメートルであり、その融点が前記保護温度より低いステップと、
前記熱伝導部材を前記熱源の一つ表面に設置するステップと、
前記熱源により、前記熱伝導部材を加熱し、該加熱温度が、前記第一熱伝導粒子の融点より高く、且つ前記熱源の保護温度以下であり、前記複数の第一熱伝導粒子を溶融させた後、少なくとも二つの前記第一熱伝導粒子が相互に結び付き、一つの大寸法の熱伝導粒子に形成され、該大寸法の熱伝導粒子の粒径が100ナノメートルより大きく、その融点が前記保護温度より高いステップと、
前記熱伝導部材を冷却するステップと、
を含むことを特徴とする熱伝導部材の使用方法。 - 前記熱源の保護温度が350℃以下であることを特徴とする、請求項5に記載の熱伝導部材の使用方法。
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