JP2010140939A - 炭化珪素半導体装置の製造方法 - Google Patents
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 239000010410 layer Substances 0.000 claims abstract description 148
- 239000002344 surface layer Substances 0.000 claims abstract description 31
- 238000000137 annealing Methods 0.000 claims abstract description 25
- 238000001312 dry etching Methods 0.000 claims abstract description 21
- 230000004913 activation Effects 0.000 claims abstract description 16
- 150000002500 ions Chemical class 0.000 claims abstract description 10
- 238000001039 wet etching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 42
- 229920002120 photoresistant polymer Polymers 0.000 claims description 35
- 238000005498 polishing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000000873 masking effect Effects 0.000 abstract description 5
- 238000005468 ion implantation Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 12
- 238000005530 etching Methods 0.000 description 9
- 238000002513 implantation Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000003213 activating effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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Abstract
【解決手段】この発明にかかる炭化珪素半導体装置の製造方法は、(a)炭化珪素基板1上に形成された炭化珪素層2上に選択的にイオン注入し、前記炭化珪素層2を活性化アニールする工程と、(b)前記イオン注入された領域であるイオン注入層3にフォトレジスト5でマスクする工程と、(c)前記フォトレジスト5をマスクとして、前記炭化珪素層2の表層をドライエッチングする工程と、(d)前記フォトレジスト5を除去する工程と、(e)前記工程(d)後、前記炭化珪素層2の表層全体に犠牲酸化膜7を形成する工程と、(f)前記犠牲酸化膜7をウエットエッチングにより除去する工程とを備える。
【選択図】図3
Description
以下、本実施の形態1に係る炭化珪素半導体装置の製造方法の一例として、炭化珪素ショットキダイオード(SiC−SBD)の製造工程を、図1〜図7に基づき説明する。
まず図1の様に、(0001)シリコン面を有する4H−SiCからなる例えば高濃度のn型の炭化珪素(SiC)基板1を準備する。炭化珪素基板1の抵抗率は、例えば0.02Ω・cm程度である。
次にこの変質層4を除去する方法を説明する。以下では、説明の便宜上、変質層4の厚さが150nmの場合を想定する。
次に図7の様に、炭化珪素(SiC)基板1の裏面の全面に、例えばNiシリサイドによるオーミック電極8を形成すると共に、変質層4の除去されたエピ層2の表面に、例えばTiメタルによるショットキ電極9を選択的に形成する。
この発明にかかる実施の形態1によれば、炭化珪素半導体装置の製造方法において、(a)エピタキシャル層(炭化珪素層)2に選択的にイオン注入した後、エピ層2を活性化アニールする工程と、(b)前記イオン注入された領域上であるp型イオン注入層3上にフォトレジスト5を形成する工程と、(c)前記フォトレジスト5をマスクとして、前記エピ層2の表層をドライエッチングする工程と、(d)前記フォトレジスト5を除去する工程と、(e)前記工程(d)後、前記エピ層2の表層全体に犠牲酸化膜7を形成する工程と、(f)前記犠牲酸化膜7をウエットエッチングにより除去する工程とを備えることにより、p型イオン注入層3上に写真製版によりフォトレジスト5でパターンを形成し、p型イオン注入層3を保護しているので、活性化アニールにより変質したエピ層(炭化珪素層)2の表層の変質層4をドライエッチングにより除去したとき、p型イオン注入層3の表面はエッチングされず、p型イオン注入層3の厚みの減少は発生しないという効果がある。
<B−1.変質層の除去方法>
実施の形態1では図5において、ドライエッチングによって新たに発生した表面変質層6bを除去するために犠牲酸化膜7を形成し除去した。この新たな表面変質層6bを除去するための方法は実施の形態1に示す方法に限らない。
この発明にかかる本実施の形態2によれば、炭化珪素半導体装置の製造方法において、(a)エピタキシャル層(炭化珪素層)2に選択的にイオン注入した後、エピ層2を活性化アニールする工程と、(b)前記イオン注入された領域上であるp型イオン注入層3上にフォトレジスト5を形成する工程と、(c)前記フォトレジスト5をマスクとして、前記エピ層2の表層をドライエッチングする工程と、(d)前記フォトレジスト5を除去する工程と、(e)前記工程(d)の後、前記エピ層2の表層全体を研磨する工程とを備えることにより、実施の形態1と同様に、p型イオン注入層3上に写真製版によりフォトレジスト5でパターンを形成し、p型イオン注入層3を保護しているので、活性化アニールにより変質したエピ層(炭化珪素層)2の表層の変質層4をドライエッチングにより除去したとき、p型イオン注入層3の表面はエッチングされず、さらに本実施の形態2においては、犠牲酸化膜7を形成する替わりに研磨するが、その際に、p型イオン注入層3の厚みの減少は小さく、実質的には実施の形態1と同様に発生しないという効果がある。
Claims (2)
- (a)炭化珪素層に選択的にイオン注入した後、前記炭化珪素層を活性化アニールする工程と、
(b)前記イオン注入された領域上にフォトレジストを形成する工程と、
(c)前記フォトレジストをマスクとして、前記炭化珪素層の表層をドライエッチングする工程と、
(d)前記フォトレジストを除去する工程と、
(e)前記工程(d)後、前記炭化珪素層の表層全体に犠牲酸化膜を形成する工程と、
(f)前記犠牲酸化膜をウエットエッチングにより除去する工程と、
を備える、炭化珪素半導体装置の製造方法。 - (a)炭化珪素層に選択的にイオン注入した後、前記炭化珪素層を活性化アニールする工程と、
(b)前記イオン注入された領域上にフォトレジストを形成する工程と、
(c)前記フォトレジストをマスクとして、前記炭化珪素層の表層をドライエッチングする工程と、
(d)前記フォトレジストを除去する工程と、
(e)前記工程(d)の後、前記炭化珪素層の表層全体を研磨する工程と、
を備える、炭化珪素半導体装置の製造方法。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150044840A1 (en) * | 2012-03-30 | 2015-02-12 | Hitachi, Ltd. | Method for producing silicon carbide semiconductor device |
JPWO2013145022A1 (ja) * | 2012-03-30 | 2015-08-03 | 株式会社日立製作所 | 炭化珪素半導体装置の製造方法 |
KR20170044478A (ko) * | 2015-10-15 | 2017-04-25 | 한국전기연구원 | 활성화 열처리 공정을 통한 탄화규소 다이오드 제조방법 |
KR20170044892A (ko) * | 2015-10-16 | 2017-04-26 | 한국전기연구원 | 아민계 폴리머를 포함한 다이오드 제조방법 |
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JP2001035838A (ja) * | 1999-07-22 | 2001-02-09 | Fuji Electric Co Ltd | 炭化珪素半導体素子の製造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150044840A1 (en) * | 2012-03-30 | 2015-02-12 | Hitachi, Ltd. | Method for producing silicon carbide semiconductor device |
JPWO2013145022A1 (ja) * | 2012-03-30 | 2015-08-03 | 株式会社日立製作所 | 炭化珪素半導体装置の製造方法 |
KR20170044478A (ko) * | 2015-10-15 | 2017-04-25 | 한국전기연구원 | 활성화 열처리 공정을 통한 탄화규소 다이오드 제조방법 |
KR102329479B1 (ko) * | 2015-10-15 | 2021-11-19 | 한국전기연구원 | 활성화 열처리 공정을 통한 탄화규소 다이오드 제조방법 |
KR20170044892A (ko) * | 2015-10-16 | 2017-04-26 | 한국전기연구원 | 아민계 폴리머를 포함한 다이오드 제조방법 |
KR102311791B1 (ko) * | 2015-10-16 | 2021-10-08 | 한국전기연구원 | 아민계 폴리머를 포함한 다이오드 제조방법 |
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