JP2010073592A - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP2010073592A JP2010073592A JP2008241901A JP2008241901A JP2010073592A JP 2010073592 A JP2010073592 A JP 2010073592A JP 2008241901 A JP2008241901 A JP 2008241901A JP 2008241901 A JP2008241901 A JP 2008241901A JP 2010073592 A JP2010073592 A JP 2010073592A
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- Japan
- Prior art keywords
- substrate
- phosphor layer
- heat
- led
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
- Led Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
Abstract
【解決手段】請求項1の発明は、第1の面及びこの面に平行な第2の面とこれら両面にわたる周面を有した電気絶縁性・透光性を有する基板部3を備える基板2と;素子電極を有して前記第1の面に配設された複数の半導体発光素子7と;前記複数の半導体発光素子を覆うように設けられた第1の蛍光体層18と;前記第1の蛍光体層の厚さよりも厚くなるように前記第2の面に設けられた第2の蛍光体層20と;を具備したことを特徴とする。
【選択図】図2
Description
本発明の目的は、半導体発光素子を基板の一面に配設したものであっても他方の面からも同等の光を得ることのできる照明装置を提供することにある。
以上のように照明装置1は、基板2の両面から白色光を取出すことができるので、こうした両面発光が必要な照明用途に好適に使用できる。
Claims (2)
- 第1の面及びこの面に平行な第2の面とこれら両面にわたる周面を有した電気絶縁性・透光性を有する基板部を備える基板と;
素子電極を有して前記第1の面に配設された複数の半導体発光素子と;
前記複数の半導体発光素子を覆うように設けられた第1の蛍光体層と;
前記第1の蛍光体層の厚さよりも厚くなるように前記第2の面に設けられた第2の蛍光体層と;
を具備したことを特徴とする照明装置。 - 前記基板は、前記基板部より熱伝導率が高い材料で形成された放熱部を備え、前記放熱部は、前記第2の面又は前記基板部の内部に配設された複数の排熱部材であることを特徴とする請求項1に記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008241901A JP5067631B2 (ja) | 2008-09-22 | 2008-09-22 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008241901A JP5067631B2 (ja) | 2008-09-22 | 2008-09-22 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010073592A true JP2010073592A (ja) | 2010-04-02 |
JP5067631B2 JP5067631B2 (ja) | 2012-11-07 |
Family
ID=42205172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008241901A Expired - Fee Related JP5067631B2 (ja) | 2008-09-22 | 2008-09-22 | 照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5067631B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012248687A (ja) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
CN103456870A (zh) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | 荧光粉胶涂覆的cob光源及其制造方法 |
JP2015012292A (ja) * | 2013-06-27 | 2015-01-19 | 廣▲ジャー▼光電股▲ふん▼有限公司 | 発光モジュール及びその製造方法 |
CN106169467A (zh) * | 2013-05-22 | 2016-11-30 | 晶元光电股份有限公司 | 发光装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9166116B2 (en) | 2012-05-29 | 2015-10-20 | Formosa Epitaxy Incorporation | Light emitting device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1032351A (ja) * | 1996-07-17 | 1998-02-03 | Toshiba Corp | 発光装置 |
JP2002280614A (ja) * | 2001-03-14 | 2002-09-27 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2003249692A (ja) * | 2002-02-25 | 2003-09-05 | Stanley Electric Co Ltd | 半導体発光装置 |
-
2008
- 2008-09-22 JP JP2008241901A patent/JP5067631B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1032351A (ja) * | 1996-07-17 | 1998-02-03 | Toshiba Corp | 発光装置 |
JP2002280614A (ja) * | 2001-03-14 | 2002-09-27 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2003249692A (ja) * | 2002-02-25 | 2003-09-05 | Stanley Electric Co Ltd | 半導体発光装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012248687A (ja) * | 2011-05-27 | 2012-12-13 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
CN106169467A (zh) * | 2013-05-22 | 2016-11-30 | 晶元光电股份有限公司 | 发光装置 |
JP2015012292A (ja) * | 2013-06-27 | 2015-01-19 | 廣▲ジャー▼光電股▲ふん▼有限公司 | 発光モジュール及びその製造方法 |
CN103456870A (zh) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | 荧光粉胶涂覆的cob光源及其制造方法 |
Also Published As
Publication number | Publication date |
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JP5067631B2 (ja) | 2012-11-07 |
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