JP2010003907A5 - - Google Patents
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- Publication number
- JP2010003907A5 JP2010003907A5 JP2008161845A JP2008161845A JP2010003907A5 JP 2010003907 A5 JP2010003907 A5 JP 2010003907A5 JP 2008161845 A JP2008161845 A JP 2008161845A JP 2008161845 A JP2008161845 A JP 2008161845A JP 2010003907 A5 JP2010003907 A5 JP 2010003907A5
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- JP
- Japan
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008161845A JP4781400B2 (ja) | 2008-06-20 | 2008-06-20 | 半導体装置 |
| US12/251,845 US8039936B2 (en) | 2008-06-20 | 2008-10-15 | Semiconductor device |
| DE102008054307.1A DE102008054307B4 (de) | 2008-06-20 | 2008-11-03 | Halbleitervorrichtung mit Leistungsvorrichtung |
| KR1020080125059A KR101249694B1 (ko) | 2008-06-20 | 2008-12-10 | 반도체 장치 |
| KR1020110090080A KR101098399B1 (ko) | 2008-06-20 | 2011-09-06 | 반도체 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008161845A JP4781400B2 (ja) | 2008-06-20 | 2008-06-20 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011148234A Division JP5209090B2 (ja) | 2011-07-04 | 2011-07-04 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010003907A JP2010003907A (ja) | 2010-01-07 |
| JP2010003907A5 true JP2010003907A5 (ja) | 2010-06-24 |
| JP4781400B2 JP4781400B2 (ja) | 2011-09-28 |
Family
ID=41430600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008161845A Active JP4781400B2 (ja) | 2008-06-20 | 2008-06-20 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8039936B2 (ja) |
| JP (1) | JP4781400B2 (ja) |
| KR (2) | KR101249694B1 (ja) |
| DE (1) | DE102008054307B4 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101218989B1 (ko) * | 2011-07-15 | 2013-01-21 | 삼성전기주식회사 | 반도체 패키지 및 그 제조방법 |
| JP2014120657A (ja) * | 2012-12-18 | 2014-06-30 | Toshiba Corp | 半導体装置 |
| US9269642B2 (en) * | 2013-06-12 | 2016-02-23 | Globalfoundries Inc. | Methods for testing integrated circuits of wafer and testing structures for integrated circuits |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3713101A (en) | 1971-05-19 | 1973-01-23 | Gen Electric | Thyristor turn-on circuit |
| US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
| JPH06140996A (ja) * | 1992-10-23 | 1994-05-20 | Hitachi Ltd | 光受信器 |
| JPH07273685A (ja) * | 1994-03-30 | 1995-10-20 | Canon Inc | 無線装置の筺体 |
| US5701037A (en) * | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
| JPH08186630A (ja) * | 1994-12-27 | 1996-07-16 | Casio Comput Co Ltd | 無線回路部のシールド構造 |
| JPH1168033A (ja) * | 1997-08-15 | 1999-03-09 | Matsushita Electric Ind Co Ltd | マルチチップモジュール |
| JPH11164483A (ja) * | 1997-11-28 | 1999-06-18 | Nissin Electric Co Ltd | 電力設備用のインバータ運転装置 |
| JP2000020665A (ja) | 1998-06-30 | 2000-01-21 | Toshiba Corp | 半導体装置 |
| JP2001110658A (ja) | 1999-10-04 | 2001-04-20 | Aichi Electric Co Ltd | 非接触給電装置 |
| WO2002082542A1 (fr) | 2001-04-02 | 2002-10-17 | Mitsubishi Denki Kabushiki Kaisha | Dispositif de puissance à semi-conducteurs |
| DE10232566B4 (de) * | 2001-07-23 | 2015-11-12 | Fuji Electric Co., Ltd. | Halbleiterbauteil |
| JP2003218315A (ja) * | 2002-01-21 | 2003-07-31 | Denso Corp | 半導体装置 |
| DE10217580A1 (de) | 2002-04-19 | 2003-11-06 | Eupec Gmbh & Co Kg | Leistungshalbleitermodul |
| JP2004087871A (ja) * | 2002-08-28 | 2004-03-18 | Fuji Electric Holdings Co Ltd | 半導体スイッチ素子の温度検出装置 |
| US6970023B2 (en) * | 2003-12-17 | 2005-11-29 | Texas Instruments Incorporated | Modulated transistor gate driver with planar pulse transformer |
| JP4295124B2 (ja) * | 2004-01-19 | 2009-07-15 | 株式会社エイアールテック | 半導体装置 |
| US7019390B2 (en) * | 2004-02-03 | 2006-03-28 | Visteon Global Technologies, Inc. | Silicon nitride insulating substrate for power semiconductor module |
| JP4608916B2 (ja) * | 2004-03-15 | 2011-01-12 | カシオ計算機株式会社 | 腕時計 |
| DE102005024900B4 (de) * | 2004-06-08 | 2012-08-16 | Fuji Electric Co., Ltd. | Leistungsmodul |
| JP2006324525A (ja) | 2005-05-19 | 2006-11-30 | Hiroshima Univ | 信号伝達方法 |
| JP4842017B2 (ja) | 2005-05-30 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2006333328A (ja) | 2005-05-30 | 2006-12-07 | Semiconductor Energy Lab Co Ltd | 無線チップ及びそれを用いたセンサ |
| JP4784773B2 (ja) * | 2005-09-02 | 2011-10-05 | 日本電気株式会社 | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
| JP4957183B2 (ja) * | 2006-10-30 | 2012-06-20 | 三菱電機株式会社 | 裏面高耐圧集積回路を用いた半導体装置 |
| DE102007042444A1 (de) | 2007-09-06 | 2009-03-12 | Siemens Ag | Elektronisches Bauelement mit Empfangs- und Ansteuereinrichtung, insbesondere drahtlosem Steuerkontakt |
| US7800222B2 (en) | 2007-11-29 | 2010-09-21 | Infineon Technologies Ag | Semiconductor module with switching components and driver electronics |
-
2008
- 2008-06-20 JP JP2008161845A patent/JP4781400B2/ja active Active
- 2008-10-15 US US12/251,845 patent/US8039936B2/en not_active Expired - Fee Related
- 2008-11-03 DE DE102008054307.1A patent/DE102008054307B4/de active Active
- 2008-12-10 KR KR1020080125059A patent/KR101249694B1/ko active IP Right Grant
-
2011
- 2011-09-06 KR KR1020110090080A patent/KR101098399B1/ko active IP Right Grant