JP2009545862A - 2面冷却集積化トランジスタモジュール及びその製造方法 - Google Patents
2面冷却集積化トランジスタモジュール及びその製造方法 Download PDFInfo
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- JP2009545862A JP2009545862A JP2009511260A JP2009511260A JP2009545862A JP 2009545862 A JP2009545862 A JP 2009545862A JP 2009511260 A JP2009511260 A JP 2009511260A JP 2009511260 A JP2009511260 A JP 2009511260A JP 2009545862 A JP2009545862 A JP 2009545862A
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- 238000000034 method Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000005669 field effect Effects 0.000 claims 3
- 229910044991 metal oxide Inorganic materials 0.000 claims 3
- 150000004706 metal oxides Chemical class 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000013461 design Methods 0.000 description 5
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- 230000001360 synchronised effect Effects 0.000 description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
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- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80218106P | 2006-05-19 | 2006-05-19 | |
US11/740,475 US7777315B2 (en) | 2006-05-19 | 2007-04-26 | Dual side cooling integrated power device module and methods of manufacture |
US91699407P | 2007-05-09 | 2007-05-09 | |
PCT/US2007/069362 WO2007137221A2 (en) | 2006-05-19 | 2007-05-21 | Dual side cooling integrated transistor module and methods of manufacture |
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JP2009545862A true JP2009545862A (ja) | 2009-12-24 |
JP2009545862A5 JP2009545862A5 (ko) | 2011-10-06 |
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JP2009511260A Pending JP2009545862A (ja) | 2006-05-19 | 2007-05-21 | 2面冷却集積化トランジスタモジュール及びその製造方法 |
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JP (1) | JP2009545862A (ko) |
KR (1) | KR101157305B1 (ko) |
CN (1) | CN101473423B (ko) |
DE (1) | DE112007001240T5 (ko) |
TW (1) | TWI452662B (ko) |
WO (1) | WO2007137221A2 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012146765A (ja) * | 2011-01-11 | 2012-08-02 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
WO2013157172A1 (ja) * | 2012-04-20 | 2013-10-24 | パナソニック株式会社 | 半導体パッケージ及びその製造方法、半導体モジュール、並びに半導体装置 |
Families Citing this family (6)
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CN102832190B (zh) * | 2011-06-14 | 2015-02-04 | 万国半导体股份有限公司 | 一种倒装芯片的半导体器件及制造方法 |
US9355942B2 (en) * | 2014-05-15 | 2016-05-31 | Texas Instruments Incorporated | Gang clips having distributed-function tie bars |
US10438900B1 (en) * | 2018-03-29 | 2019-10-08 | Alpha And Omega Semiconductor (Cayman) Ltd. | HV converter with reduced EMI |
US11309233B2 (en) * | 2019-09-18 | 2022-04-19 | Alpha And Omega Semiconductor (Cayman), Ltd. | Power semiconductor package having integrated inductor, resistor and capacitor |
US20210082790A1 (en) * | 2019-09-18 | 2021-03-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power semiconductor package having integrated inductor and method of making the same |
CN113410185B (zh) * | 2021-06-04 | 2021-12-14 | 深圳真茂佳半导体有限公司 | 功率半导体器件封装结构及其制造方法 |
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JP2004266096A (ja) * | 2003-02-28 | 2004-09-24 | Renesas Technology Corp | 半導体装置及びその製造方法、並びに電子装置 |
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US5877555A (en) * | 1996-12-20 | 1999-03-02 | Ericsson, Inc. | Direct contact die attach |
TWI265611B (en) * | 2003-03-11 | 2006-11-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with heatsink |
WO2005122249A2 (en) * | 2004-06-03 | 2005-12-22 | International Rectifier Corporation | Semiconductor device module with flip chip devices on a common lead frame |
JP2006073655A (ja) * | 2004-08-31 | 2006-03-16 | Toshiba Corp | 半導体モジュール |
US7476976B2 (en) * | 2005-02-23 | 2009-01-13 | Texas Instruments Incorporated | Flip chip package with advanced electrical and thermal properties for high current designs |
US7504733B2 (en) * | 2005-08-17 | 2009-03-17 | Ciclon Semiconductor Device Corp. | Semiconductor die package |
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2007
- 2007-05-18 TW TW096117812A patent/TWI452662B/zh active
- 2007-05-21 DE DE112007001240T patent/DE112007001240T5/de not_active Withdrawn
- 2007-05-21 CN CN2007800230340A patent/CN101473423B/zh not_active Expired - Fee Related
- 2007-05-21 WO PCT/US2007/069362 patent/WO2007137221A2/en active Search and Examination
- 2007-05-21 KR KR1020087028221A patent/KR101157305B1/ko active IP Right Grant
- 2007-05-21 JP JP2009511260A patent/JP2009545862A/ja active Pending
Patent Citations (3)
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JP2004266096A (ja) * | 2003-02-28 | 2004-09-24 | Renesas Technology Corp | 半導体装置及びその製造方法、並びに電子装置 |
JP2005217072A (ja) * | 2004-01-28 | 2005-08-11 | Renesas Technology Corp | 半導体装置 |
WO2007067998A2 (en) * | 2005-12-09 | 2007-06-14 | Fairchild Semiconductor Corporation | Device and method for assembling a top and bottom exposed packaged semiconductor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012146765A (ja) * | 2011-01-11 | 2012-08-02 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
WO2013157172A1 (ja) * | 2012-04-20 | 2013-10-24 | パナソニック株式会社 | 半導体パッケージ及びその製造方法、半導体モジュール、並びに半導体装置 |
Also Published As
Publication number | Publication date |
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CN101473423B (zh) | 2011-04-13 |
DE112007001240T5 (de) | 2009-04-23 |
KR20090009882A (ko) | 2009-01-23 |
CN101473423A (zh) | 2009-07-01 |
WO2007137221A2 (en) | 2007-11-29 |
TW200810069A (en) | 2008-02-16 |
WO2007137221A3 (en) | 2008-10-02 |
TWI452662B (zh) | 2014-09-11 |
KR101157305B1 (ko) | 2012-06-15 |
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