JP2009544201A - 電気モジュール - Google Patents
電気モジュール Download PDFInfo
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- JP2009544201A JP2009544201A JP2009519791A JP2009519791A JP2009544201A JP 2009544201 A JP2009544201 A JP 2009544201A JP 2009519791 A JP2009519791 A JP 2009519791A JP 2009519791 A JP2009519791 A JP 2009519791A JP 2009544201 A JP2009544201 A JP 2009544201A
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- 230000005540 biological transmission Effects 0.000 claims description 43
- 239000004020 conductor Substances 0.000 claims description 25
- 238000004804 winding Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 102100032533 ADP/ATP translocase 1 Human genes 0.000 description 2
- 101000768061 Escherichia phage P1 Antirepressor protein 1 Proteins 0.000 description 2
- 101000796932 Homo sapiens ADP/ATP translocase 1 Proteins 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003534 oscillatory effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 101100399946 Arabidopsis thaliana LRX2 gene Proteins 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
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- H—ELECTRICITY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
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- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
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- H03—ELECTRONIC CIRCUITRY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- Toxicology (AREA)
- Electromagnetism (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Transceivers (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
ル基板で初めて行われることによって、ゼロ位置の周波数位置に及ぼされる、送受切換器とは異なる機能単位の影響を低減することができ、このことは利点であるとみなされる。それによって特に、それぞれの信号経路の阻止帯域でゼロ位置を生成することができる。阻止帯域は隣接帯域を含むことができる。
第2の基板11と、シールド面13を有するカバーとは、チップ12のためのハウジング(パッケージ)を共同で形成している。シールド面13は、デバイス1の局所アースであるとみなすことができる。ただしデバイスの内部では、デバイスの局所アースへの分路枝の(直接的な)結合は行われない。送受切換器2の分路枝とデバイス1の局所アースとの導電接続は、モジュール基板すなわち第1の基板3で初めて行われる。
ュールの基準電位、71 スイッチ、72 スイッチ、81,81’ 出力増幅器、82,82’ 低雑音増幅器、91,92 モジュールの接続部、ANT アンテナ、LANT,LRX1,LRX2,LTXI,LTX2,LP,LC インダクタンス 、RX,RX’ 受信経路、TX,TX’ 送信経路。
Claims (15)
- 電気モジュールであって、
第1の基板(3)と、
第2の基板(11)および前記第2の基板の上に配置されたチップ(12)を含む、前記第1の基板(3)に実装されたデバイス(1)と、
前記チップに配置されたそれぞれ少なくとも1つの並列共振器(41,42)を備える、アースにつながれた分路枝を含んでいるフィルタ回路とを有しており、
少なくとも2つの前記分路枝相互のアース側の接続は前記チップ(12)および前記第2の基板(11)の外部で行われている電気モジュール - 少なくとも2つの前記分路枝のアース側の接続は前記第1の基板(3)で行われる、請求項1に記載のモジュール。
- 少なくとも2つの前記分路枝のアース側の接続は前記第1の基板(3)が実装された配線板で行われる、請求項1または2に記載のモジュール。
- 前記第2の基板(11)の内部では前記分路枝のアース側の接続は行われない、請求項1から3のいずれか1項に記載のモジュール。
- 前記分路枝は、部分的に前記第2の基板(11)に配置された電気接続部を介して、前記第1の基板(3)に配置されたアース面(64)と導電接続されている、請求項1,2または4に記載のモジュール。
- 前記フィルタ回路は送信フィルタ(21)および受信フィルタ(22)を有する送受切換器を含んでおり、
アース側で前記チップ(12)および前記第2の基板(11)の外部で相互に接続された前記分路枝は前記送信フィルタ(21)または前記受信フィルタ(22)に属している、請求項1から5のいずれか1項に記載のモジュール。 - 前記フィルタ回路は送信フィルタ(21)および受信フィルタ(22)を有する送受切換器を含んでおり、
アース側で前記チップ(12)および前記第2の基板(11)の外部で相互に接続された前記分路枝のうち1つの枝は送信フィルタに属するとともに、少なくとも1つの別の枝は前記送受切換器の受信フィルタに属している、請求項1から5のいずれか1項に記載のモジュール。 - 前記送受切換器(2)は、部分的に前記第2の基板(11)に配置された第1の電気接続部を介してアースと接続されたアンテナ接続部(20)を含んでおり、
前記第1の電気接続部のアース結合は前記第2の基板(11)ではなく前記第1の基板(3)で行われる、請求項6または7に記載のモジュール。 - 前記第1の電気接続部はインダクタンス(LANT’)を含んでいる、請求項8に記載のモジュール。
- 前記デバイス(1)はシールド面(13)を有しており、
前記シールド面(13)のアース結合は前記第2の基板(11)ではなく前記第1の基板(3)で行われる、請求項1から9のいずれか1項に記載のモジュール。 - 前記シールド面(13)は、前記第1の基板(3)に配置された第2の電気接続部を介
して、前記受信フィルタ(22)の並列共振器(44)のうちの1つと導電接続されており、
前記第2の電気接続部は、前記フィルタ(21,22)の前記分路枝が配置された前記第1の基板(3)に配置されているアース面(64)と導電接続されている、請求項10に記載のモジュール。 - 前記受信フィルタ(22)の並列共振器(44)のうちの1つは前記チップ(12)または前記第2の基板(11)に配置された電気接続部によって前記シールド面(13)と導電接続されており、
前記シールド面(13)は第3の導電接続部によって、前記フィルタ(21,22)の前記分路枝がつながれている前記第1の基板(3)に配置されたアース面(64)と導電接続されている、請求項10に記載のモジュール。 - 前記第1および/または前記第2の基板(3,11)に配置された電気接続部のうち少なくとも1つは、少なくとも1つの部分巻線を有する、または折り畳まれた、少なくとも1つの条導体を含んでいる、請求項1から12のいずれか1項に記載のモジュール。
- 前記第1の基板(3)には少なくとも1つの別の電気デバイス(1’,1’’)が配置されており、そのアース接続部は前記アース面(64)につながれている、請求項5から13のいずれか1項に記載のモジュール。
- 前記第1の基板(3)には前記デバイス(1,1’,1’’)と電気接続された少なくとも1つの回路が統合されている、請求項14に記載のモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006033709A DE102006033709B4 (de) | 2006-07-20 | 2006-07-20 | Elektrisches Modul |
DE102006033709.3 | 2006-07-20 | ||
PCT/DE2007/001294 WO2008009281A2 (de) | 2006-07-20 | 2007-07-19 | Elektrisches modul |
Publications (2)
Publication Number | Publication Date |
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JP2009544201A true JP2009544201A (ja) | 2009-12-10 |
JP5219295B2 JP5219295B2 (ja) | 2013-06-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009519791A Active JP5219295B2 (ja) | 2006-07-20 | 2007-07-19 | 電気モジュール |
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Country | Link |
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US (1) | US7944325B2 (ja) |
JP (1) | JP5219295B2 (ja) |
DE (1) | DE102006033709B4 (ja) |
WO (1) | WO2008009281A2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2012144229A1 (ja) * | 2011-04-22 | 2012-10-26 | 株式会社村田製作所 | 分波器およびこれを備える回路モジュール |
WO2013118239A1 (ja) * | 2012-02-06 | 2013-08-15 | 太陽誘電株式会社 | 分波器およびモジュール |
WO2014045726A1 (ja) * | 2012-09-19 | 2014-03-27 | 株式会社村田製作所 | フィルタ装置 |
JP2016012796A (ja) * | 2014-06-27 | 2016-01-21 | 太陽誘電株式会社 | フィルタ、デュプレクサおよびモジュール。 |
WO2016024559A1 (ja) * | 2014-08-12 | 2016-02-18 | 株式会社村田製作所 | 高周波モジュール |
JPWO2017138405A1 (ja) * | 2016-02-10 | 2018-11-08 | 株式会社村田製作所 | ダイプレクサ |
WO2018212105A1 (ja) * | 2017-05-15 | 2018-11-22 | 株式会社村田製作所 | マルチプレクサ、送信装置および受信装置 |
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DE102006059996B4 (de) | 2006-12-19 | 2015-02-26 | Epcos Ag | Anordnung mit einem HF Bauelement und Verfahren zur Kompensation der Anbindungsinduktivität |
DE102010011651B4 (de) * | 2010-03-17 | 2018-11-08 | Snaptrack, Inc. | Frontend-Schaltung mit erhöhter Flexibilität bei der Anordnung der Schaltungskomponenten |
US8725085B2 (en) | 2010-06-03 | 2014-05-13 | Broadcom Corporation | RF front-end module |
US8565710B2 (en) | 2010-06-03 | 2013-10-22 | Broadcom Corporation | Wireless transmitter having frequency translated bandpass filter |
US8666351B2 (en) | 2010-06-03 | 2014-03-04 | Broadcom Corporation | Multiple band saw-less receiver including a frequency translated BPF |
US8761710B2 (en) | 2010-06-03 | 2014-06-24 | Broadcom Corporation | Portable computing device with a saw-less transceiver |
US8565711B2 (en) | 2010-06-03 | 2013-10-22 | Broadcom Corporation | SAW-less receiver including an IF frequency translated BPF |
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JP5219295B2 (ja) | 2013-06-26 |
DE102006033709B4 (de) | 2010-01-14 |
DE102006033709A1 (de) | 2008-01-24 |
WO2008009281A2 (de) | 2008-01-24 |
US7944325B2 (en) | 2011-05-17 |
WO2008009281A3 (de) | 2008-03-27 |
US20090174497A1 (en) | 2009-07-09 |
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