JP2009277923A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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Abstract
【解決手段】絶縁性基板2と、前記絶縁性基板2の上面に実装された第1半導体チップ10と、前記第1半導体チップ10と電気的に接続されたリードフレーム6と、前記絶縁性基板2の下面に設けられ、前記第1半導体チップ10と電気的に接続された外部接続端子16と、前記絶縁性基板2の下面と前記リードフレームの6上面とが露出するように、前記絶縁性基板2と前記半導体チップ10と前記リードフレーム6とを封止する樹脂部4と、を具備することを特徴とする半導体装置。
【選択図】図2
Description
樹脂部 4、24
リードフレーム 6、26、34、38
第1半導体チップ 10
外部接続端子 16
第2半導体チップ 18
第3半導体チップ 20
半田 30
第4半導体チップ 36
半導体装置 100、300、500、600、800
上部半導体装置 200、400、700
Claims (8)
- 絶縁性基板と、
前記絶縁性基板の上面に実装された第1半導体チップと、
前記第1半導体チップと電気的に接続されたリードフレームと、
前記絶縁性基板の下面に設けられ、前記第1半導体チップと電気的に接続された外部接続端子と、
前記絶縁性基板の下面と前記リードフレームの上面とが露出するように、前記絶縁性基板と前記半導体チップと前記リードフレームとを封止する樹脂部と、を具備することを特徴とする半導体装置。 - 第2半導体チップと、前記第2半導体チップと電気的に接続され、下面が露出した端子とを有する上部半導体装置を具備し、
前記リードフレームの上面と前記端子の下面とが接続されるように、積層されていることを特徴とする請求項1記載の半導体装置。 - 前記リードフレームの上面と前記端子の下面とは、半田を介して接続されていることを特徴とする請求項2記載の半導体装置。
- 前記リードフレームの側面は前記樹脂部から露出していることを特徴とする請求項1から3いずれか一項記載の半導体装置の製造方法。
- 絶縁性基板の上面に第1半導体チップを実装する工程と、
前記第1半導体チップとリードフレームとを電気的に接続する工程と、
前記絶縁性基板の下面と前記リードフレームの上面とが露出するように、前記前記絶縁性基板と前記第1半導体チップと前記リードフレームとを樹脂部により封止する工程と、
前記絶縁性基板の下面に、前記第1半導体チップと電気的に接続されるように、外部接続端子を設ける工程と、を有することを特徴とする半導体装置の製造方法。 - 第2半導体チップと、前記第2半導体チップと電気的に接続され、下面が露出した端子と、を有する上部半導体装置を、
前記リードフレームの上面と前記端子の下面とが接続されるように、積層する工程を有することを特徴とする請求項5記載の半導体装置の製造方法。 - 前記上部半導体装置を積層する工程は、前記リードフレームの上面と前記端子の下面とが半田を介して接続されるように、積層する工程であることを特徴とする請求項6記載の半導体装置の製造方法。
- 前記樹脂部により封止する工程は、前記リードフレームの側面が露出するように封止する工程であることを特徴とする請求項5から7いずれか一項記載の半導体装置の製造方法。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284637A (ja) * | 1997-04-11 | 1998-10-23 | Nec Corp | 半導体パッケージ |
JP2000133767A (ja) * | 1998-10-24 | 2000-05-12 | Hyundai Electronics Ind Co Ltd | 積層化半導体パッケ―ジ及びその製造方法 |
JP2002083902A (ja) * | 2000-09-05 | 2002-03-22 | Sharp Corp | 半導体装置 |
JP2007141994A (ja) * | 2005-11-16 | 2007-06-07 | Kyushu Institute Of Technology | 両面電極パッケージ及びその製造方法 |
JP2008060562A (ja) * | 2006-08-04 | 2008-03-13 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とその製造方法、半導体装置用基材、および積層型樹脂封止型半導体装置 |
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- 2008-05-15 JP JP2008128361A patent/JP5149694B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284637A (ja) * | 1997-04-11 | 1998-10-23 | Nec Corp | 半導体パッケージ |
JP2000133767A (ja) * | 1998-10-24 | 2000-05-12 | Hyundai Electronics Ind Co Ltd | 積層化半導体パッケ―ジ及びその製造方法 |
JP2002083902A (ja) * | 2000-09-05 | 2002-03-22 | Sharp Corp | 半導体装置 |
JP2007141994A (ja) * | 2005-11-16 | 2007-06-07 | Kyushu Institute Of Technology | 両面電極パッケージ及びその製造方法 |
JP2008060562A (ja) * | 2006-08-04 | 2008-03-13 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とその製造方法、半導体装置用基材、および積層型樹脂封止型半導体装置 |
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