JP2007141994A - 両面電極パッケージ及びその製造方法 - Google Patents
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Abstract
【解決手段】LSIチップをモールド樹脂により封止すると共に、おもて面側と裏面側の両面に外部接続用の電極を備える。少なくとも裏面側にアウターリード部を裏面側電極として露出させたリードフレームのダイパッド上にLSIチップを接着して、該LSIチップとリードフレームの複数のインナーリード部の間で配線を行なう。この複数のインナーリード部の少なくとも一部には、さらに、リードフレームの一部を絞り加工することによりおもて面電極を一体に形成し、そのおもて面電極の頭部面或いはそれに接続されたバンプ電極を他の基板、素子等と接続するための外部接続用電極として構成する。
【選択図】図1
Description
Claims (5)
- LSIチップをモールド樹脂により封止すると共に、おもて面側と裏面側の両面に外部接続用の電極を備える両面電極パッケージにおいて、
少なくとも裏面側にアウターリード部を裏面側電極として露出させたリードフレームのダイパッド上にLSIチップを接着して、該LSIチップとリードフレームの複数のインナーリード部の間で配線を行い、
前記複数のインナーリード部の少なくとも一部には、さらに、リードフレームの一部を絞り加工することによりおもて面電極を一体に形成し、そのおもて面電極の頭部面或いはそれに接続されたバンプ電極を他の基板、素子等と接続するための外部接続用電極として構成した、
ことを特徴とする両面電極パッケージ。 - LSIチップをモールド樹脂により封止すると共に、おもて面側と裏面側の両面に外部接続用の電極を備える両面電極パッケージにおいて、
裏面側に備えたバンプ又はランドを裏面側電極として露出させた有機基板のおもて面上にLSIチップを接着して、該LSIチップとの間で配線を行い、
前記有機基板のおもて面上には、さらに、おもて面電極として金属突起物を接続し、その金属突起物の頭部面或いはそれに接続されたバンプ電極を他の基板、素子等と接続するための外部接続用電極として構成した、
ことを特徴とする両面電極パッケージ。 - 前記バンプ電極は、インクジェットあるいは印刷技術により再配線することにより、おもて面電極の頭部露出位置と異なったところに配置した請求項1又は2に記載の両面電極パッケージ。
- LSIチップをモールド樹脂により封止すると共に、おもて面側と裏面側の両面に外部接続用の電極を備える両面電極パッケージの製造方法において、
少なくとも裏面側にアウターリード部を裏面側電極として露出させたリードフレームを多数個同時に形成し、
前記リードフレームの複数のインナーリード部の少なくとも一部には、リードフレームの一部を絞り加工することによりおもて面電極を一体に形成し、
それぞれのダイパッド上にLSIチップを接着して、該LSIチップとリードフレームの複数のインナーリード部の間で配線を行い、
モールド樹脂により一括封止し、
おもて面電極の頭部面或いはそれに接続されたバンプ電極をモールド樹脂上に露出させて、他の基板、素子等と接続するための外部接続用電極として構成した後、個片化のための切断を行う、
ことを特徴とする両面電極パッケージの製造方法。 - LSIチップをモールド樹脂により封止すると共に、おもて面側と裏面側の両面に外部接続用の電極を備える両面電極パッケージの製造方法において、
裏面側に備えたバンプ又はランドを裏面側電極として露出させた有機基板を多数個同時に形成し、
前記有機基板のおもて面上にはLSIチップを接着して、該LSIチップとの間で配線を行い、かつ、このおもて面上には、おもて面電極として金属突起物を接続し、
モールド樹脂により一括封止し、
おもて面電極の頭部面或いはそれに接続されたバンプ電極をモールド樹脂上に露出させて、他の基板、素子等と接続するための外部接続用電極として構成した後、個片化のための切断を行う、
ことを特徴とする両面電極パッケージの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005331156A JP3941877B2 (ja) | 2005-11-16 | 2005-11-16 | 両面電極パッケージ及びその製造方法 |
CN2006800425359A CN101313402B (zh) | 2005-11-16 | 2006-11-02 | 双面电极插件及其制造方法 |
PCT/JP2006/321956 WO2007058074A1 (ja) | 2005-11-16 | 2006-11-02 | 両面電極パッケージ及びその製造方法 |
US12/093,708 US8154110B2 (en) | 2005-11-16 | 2006-11-02 | Double-faced electrode package and its manufacturing method |
KR1020087011640A KR100970855B1 (ko) | 2005-11-16 | 2006-11-02 | 양면 전극 패키지 및 그 제조방법 |
US13/412,128 US8501542B2 (en) | 2005-11-16 | 2012-03-05 | Double-faced electrode package, and its manufacturing method |
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JP2005331156A JP3941877B2 (ja) | 2005-11-16 | 2005-11-16 | 両面電極パッケージ及びその製造方法 |
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JP2007141994A true JP2007141994A (ja) | 2007-06-07 |
JP3941877B2 JP3941877B2 (ja) | 2007-07-04 |
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US (2) | US8154110B2 (ja) |
JP (1) | JP3941877B2 (ja) |
KR (1) | KR100970855B1 (ja) |
CN (1) | CN101313402B (ja) |
WO (1) | WO2007058074A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091418A (ja) * | 2006-09-29 | 2008-04-17 | Elpida Memory Inc | 半導体装置及びその製造方法 |
JP2009277923A (ja) * | 2008-05-15 | 2009-11-26 | Spansion Llc | 半導体装置及びその製造方法 |
US7993980B2 (en) | 2007-10-04 | 2011-08-09 | Panasonic Corporation | Lead frame, electronic component including the lead frame, and manufacturing method thereof |
CN102165582A (zh) * | 2008-09-29 | 2011-08-24 | 凸版印刷株式会社 | 引线框基板及其制造方法以及半导体装置 |
JP2014013947A (ja) * | 2007-09-18 | 2014-01-23 | Olympus Corp | 積層実装構造体の製造方法 |
US8749049B2 (en) | 2009-10-09 | 2014-06-10 | St-Ericsson Sa | Chip package with a chip embedded in a wiring body |
JP2014216466A (ja) * | 2013-04-25 | 2014-11-17 | アオイ電子株式会社 | 半導体パッケージおよびその製造方法 |
JP6283131B1 (ja) * | 2017-01-31 | 2018-02-21 | 株式会社加藤電器製作所 | 電子デバイス及び電子デバイスの製造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US8421210B2 (en) | 2010-05-24 | 2013-04-16 | Stats Chippac Ltd. | Integrated circuit packaging system with dual side connection and method of manufacture thereof |
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JP2018125403A (ja) * | 2017-01-31 | 2018-08-09 | 株式会社加藤電器製作所 | 電子デバイス及び電子デバイスの製造方法 |
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CN101313402B (zh) | 2011-05-18 |
JP3941877B2 (ja) | 2007-07-04 |
US8501542B2 (en) | 2013-08-06 |
US20120164790A1 (en) | 2012-06-28 |
KR100970855B1 (ko) | 2010-07-20 |
US20090224381A1 (en) | 2009-09-10 |
CN101313402A (zh) | 2008-11-26 |
WO2007058074A1 (ja) | 2007-05-24 |
US8154110B2 (en) | 2012-04-10 |
KR20080058491A (ko) | 2008-06-25 |
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