JP2009270092A - Pressure-sensitive adhesive composition, surface protective film, and mother glass surface protective film for flat-panel display - Google Patents
Pressure-sensitive adhesive composition, surface protective film, and mother glass surface protective film for flat-panel display Download PDFInfo
- Publication number
- JP2009270092A JP2009270092A JP2009053842A JP2009053842A JP2009270092A JP 2009270092 A JP2009270092 A JP 2009270092A JP 2009053842 A JP2009053842 A JP 2009053842A JP 2009053842 A JP2009053842 A JP 2009053842A JP 2009270092 A JP2009270092 A JP 2009270092A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- surface protective
- sensitive adhesive
- pressure
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 66
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 50
- 239000011521 glass Substances 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 14
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 64
- 239000012790 adhesive layer Substances 0.000 abstract description 13
- -1 polyethylene Polymers 0.000 description 64
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 35
- 229920001577 copolymer Polymers 0.000 description 28
- 238000004140 cleaning Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 19
- 229920001684 low density polyethylene Polymers 0.000 description 19
- 239000004702 low-density polyethylene Substances 0.000 description 19
- 239000005977 Ethylene Substances 0.000 description 18
- 238000000465 moulding Methods 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 229920001451 polypropylene glycol Polymers 0.000 description 9
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- QZXSMBBFBXPQHI-UHFFFAOYSA-N N-(dodecanoyl)ethanolamine Chemical compound CCCCCCCCCCCC(=O)NCCO QZXSMBBFBXPQHI-UHFFFAOYSA-N 0.000 description 5
- 229920000092 linear low density polyethylene Polymers 0.000 description 5
- 239000004707 linear low-density polyethylene Substances 0.000 description 5
- 229920005672 polyolefin resin Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- LTSWUFKUZPPYEG-UHFFFAOYSA-N 1-decoxydecane Chemical compound CCCCCCCCCCOCCCCCCCCCC LTSWUFKUZPPYEG-UHFFFAOYSA-N 0.000 description 4
- 239000004166 Lanolin Substances 0.000 description 4
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 4
- 239000004359 castor oil Substances 0.000 description 4
- 235000019438 castor oil Nutrition 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 4
- 229940039717 lanolin Drugs 0.000 description 4
- 235000019388 lanolin Nutrition 0.000 description 4
- 229920013716 polyethylene resin Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920003355 Novatec® Polymers 0.000 description 3
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920001214 Polysorbate 60 Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000003240 coconut oil Substances 0.000 description 2
- 235000019864 coconut oil Nutrition 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N n-hexene Natural products CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/005—Dendritic macromolecules
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本発明は、粘着剤組成物に関する。さらに詳細には、それを用いた粘着剤層およびこれらを用いたフラットパネルディスプレイ用マザーガラス表面保護フィルムに関する。 The present invention relates to a pressure-sensitive adhesive composition. More specifically, the present invention relates to a pressure-sensitive adhesive layer using the same and a mother glass surface protective film for a flat panel display using the same.
液晶ディスプレイ、プラズマディスプレイパネル、有機ELディスプレイ等のフラットパネルディスプレイの製造には、ガラス基板が使用されるが、工場で製造されたガラス板は、マザーガラスとして流通(運搬)し、これがガラス基板に加工される。マザーガラスの搬送や、保管、更に出荷の伴う輸送、顧客での保管などで、ガラス表面に傷がつくと、歩留りの低下、品質面への悪影響をおよぼす原因となる為、通常ガラス表面に表面保護フィルムが貼付されている。 Glass substrates are used to manufacture flat panel displays such as liquid crystal displays, plasma display panels, and organic EL displays. Glass plates manufactured at the factory are distributed (carried) as mother glass, which is used as glass substrates. Processed. If the glass surface is damaged during transportation or storage of the mother glass, further transportation with shipping, or storage at the customer, it may cause a decrease in yield and adversely affect the quality. A protective film is attached.
表面保護フィルムを貼付したフラットパネルディスプレイ用マザーガラスは、パネルメーカーに納入され、そこで、表面保護フィルムを剥離する作業が行われるが、剥離が重い(剥離しにくい)場合には、作業性が悪化し、剥離が不完全になると剥離不良の問題が生じている。 Mother glass for flat panel displays with a surface protective film attached is delivered to a panel manufacturer, where the work to peel off the surface protective film is performed, but if the peeling is heavy (hard to peel), workability deteriorates. However, when peeling is incomplete, a problem of peeling failure occurs.
また、剥離後、洗浄液等を用いて、表面保護フィルムの残渣物の洗浄・除去が行われるが、残渣物がガラス表面から落ち難くいという問題も生じている。 In addition, after the peeling, the residue of the surface protective film is washed and removed using a cleaning solution or the like, but there is also a problem that the residue is not easily removed from the glass surface.
更に、表面保護フィルムに起因する残渣物により、TFT基盤の製造工程中に、品質を低下させるなどの問題が生じており、洗浄工程における残渣物の洗浄・除去の向上が求められている。 Furthermore, the residue resulting from the surface protective film causes problems such as deterioration in quality during the manufacturing process of the TFT substrate, and there is a demand for improved cleaning and removal of the residue in the cleaning process.
このような中、特許文献1には、ポリエチレンからなる基材層の表面に、密度が0.91〜0.93g/cm3の低密度ポリエチレンを50重量%以上含有し、中心線平均粗さRaが0.05μm以下である粘着剤層を積層した表面保護フィルムが提案されている。 Under such circumstances, Patent Document 1 includes 50% by weight or more of low density polyethylene having a density of 0.91 to 0.93 g / cm 3 on the surface of the base material layer made of polyethylene, and has a center line average roughness. A surface protective film in which an adhesive layer having an Ra of 0.05 μm or less is laminated has been proposed.
しかし、特許文献1記載の表面保護フィルムは、ガラスの貼付後、剥離が重く、作業性が悪いという問題や、ガラスに付着(転写)した残渣物が、洗浄により落ち難いなどの問題を抱えている。 However, the surface protective film described in Patent Document 1 has problems such as heavy peeling after application of glass and poor workability, and residue that adheres (transferred) to glass is difficult to be removed by washing. Yes.
特許文献2には、熱可塑性樹脂からなる基材層の片面に、エチレン・酢酸ビニル共重合体からなる粘着剤層が形成される二層フィルムや、特許文献3には、基材層の片面に、ブチルアクリレート及びアクリル酸の共重合体からなるアクリル系粘着及び架橋剤として芳香族イソシアネートにより架橋された粘着剤層からなる表面保護用粘着テープが開示されている。 Patent Document 2 discloses a two-layer film in which an adhesive layer composed of an ethylene / vinyl acetate copolymer is formed on one surface of a base material layer composed of a thermoplastic resin, and Patent Document 3 describes one surface of a base material layer. Furthermore, an adhesive tape for surface protection comprising an acrylic adhesive comprising a copolymer of butyl acrylate and acrylic acid and an adhesive layer crosslinked with an aromatic isocyanate as a crosslinking agent is disclosed.
しかし上記二層フィルムや粘着テープについても、同様の問題が懸念されている。 However, the same problem is concerned about the two-layer film and the adhesive tape.
そこで、本発明の目的は、従来の表面保護フィルム(シート)における上記問題点を解消すべく、ガラス表面に表面保護フィルムを貼付することが容易であり、その後、表面保護フィルムを剥離した後に、表面保護フィルム(中の粘着剤層)に起因する残渣物を容易に洗浄・除去することができる粘着剤組成物、粘着剤層、これらを用いたフラットパネルディスプレイ用マザーガラス表面保護フィルムを提供することにある。 Therefore, the purpose of the present invention is to easily attach the surface protective film to the glass surface in order to eliminate the above-mentioned problems in the conventional surface protective film (sheet), and then after peeling the surface protective film, Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive layer, and a mother glass surface protective film for a flat panel display using the same, which can easily wash and remove residues resulting from the surface protective film (the pressure-sensitive adhesive layer therein). There is.
本発明者らは、上記目的を達成するため、鋭意検討した結果、以下に示す粘着剤組成物、粘着剤層、これらを用いたフラットパネルディスプレイ用マザーガラス表面保護フィルムを見出し、本発明を完成するに至った。 As a result of intensive studies to achieve the above object, the present inventors have found the following pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and a mother glass surface protective film for flat panel displays using these, and completed the present invention. It came to do.
即ち、本発明の粘着剤組成物は、熱可塑性樹脂100重量部に対して、アルキレンオキサイド基含有化合物を0.01〜2重量部含有してなることを特徴とする。熱可塑性樹脂とともにアルキレンオキサイド基含有化合物を添加することにより、これを表面保護フィルムの粘着剤層として用いた場合に、詳細は明らかではないが、ガラス表面への貼付が容易となり、表面保護フィルム(中の粘着剤層)に起因する残渣物、例えば、粘着剤層起因の低分子化合物とアルキレンオキサイド基含有化合物が置き換わることにより、残渣物の低減を図ることができる。更に、表面保護フィルムの剥離後の洗浄工程においても、容易に残渣物を洗浄・除去することができ、有用である。 That is, the pressure-sensitive adhesive composition of the present invention comprises 0.01 to 2 parts by weight of an alkylene oxide group-containing compound with respect to 100 parts by weight of a thermoplastic resin. By adding the alkylene oxide group-containing compound together with the thermoplastic resin, when this is used as the pressure-sensitive adhesive layer of the surface protective film, the details are not clear, but it becomes easy to stick to the glass surface, and the surface protective film ( The residue can be reduced by replacing the residue resulting from the pressure-sensitive adhesive layer), for example, the low molecular weight compound resulting from the pressure-sensitive adhesive layer and the alkylene oxide group-containing compound. Furthermore, the residue can be easily washed and removed in the washing step after the surface protective film is peeled off, which is useful.
また、本発明の粘着剤組成物は、前記アルキレンオキサイド基含有化合物が、界面活性剤であることが好ましい。界面活性剤を添加することにより、これを表面保護フィルムの粘着剤層として用いた場合に、詳細は明らかではないが、ガラス表面への貼付が容易となり、表面保護フィルム(中の粘着剤層)に起因する残渣物、例えば、粘着剤層起因の低分子化合物と界面活性剤が置き換わり、残渣物の低減を図ることができる。更に、表面保護フィルムの剥離後の洗浄工程においても、界面活性剤の添加により、容易に残渣物を洗浄・除去することができ、有用である。 In the pressure-sensitive adhesive composition of the present invention, the alkylene oxide group-containing compound is preferably a surfactant. By adding a surfactant, when this is used as a pressure-sensitive adhesive layer of a surface protective film, the details are not clear, but it becomes easy to attach to the glass surface, and the surface protective film (the pressure-sensitive adhesive layer inside) The residue resulting from the above, for example, the low molecular weight compound resulting from the pressure-sensitive adhesive layer and the surfactant are replaced, and the residue can be reduced. Further, even in the cleaning step after the surface protective film is peeled off, the residue can be easily cleaned and removed by the addition of a surfactant, which is useful.
本発明の表面保護フィルムは、前記粘着剤組成物を用いてなることが好ましい。粘着剤組成物を用いて得られる表面保護フィルムは、フィルム状やシート状、テープ状等に加工することが容易で、有用である。 The surface protective film of the present invention is preferably formed using the pressure-sensitive adhesive composition. The surface protective film obtained using the pressure-sensitive adhesive composition is useful because it can be easily processed into a film shape, a sheet shape, a tape shape or the like.
本発明のフラットパネルディスプレイ用マザーガラス表面保護フィルムは、前記粘着剤組成物を用いて形成した単一の層からなることが好ましい。粘着剤組成物を用いて形成した単一の層それ自体が、フラットパネルディスプレイ用マザーガラス表面保護フィルムとして機能するため、製造工程が少なく、作業性に優れている。 The mother glass surface protective film for a flat panel display of the present invention is preferably composed of a single layer formed using the pressure-sensitive adhesive composition. Since the single layer itself formed using the pressure-sensitive adhesive composition functions as a mother glass surface protective film for a flat panel display, the number of manufacturing steps is small and the workability is excellent.
本発明のフラットパネルディスプレイ用マザーガラス表面保護フィルムは、前記粘着剤組成物を、基材の片面または両面に形成してなることが好ましい。基材上に粘着剤組成物を用いて形成したフラットパネルディスプレイ用マザーガラス表面保護フィルムを用いることにより、被着体(ガラス)表面を汚染から保護し、傷等の発生を防止することができ、有用である。 The mother glass surface protective film for a flat panel display of the present invention is preferably formed by forming the pressure-sensitive adhesive composition on one side or both sides of a substrate. By using a mother glass surface protective film for flat panel displays formed using a pressure-sensitive adhesive composition on a substrate, the surface of the adherend (glass) can be protected from contamination, and scratches can be prevented. Is useful.
なお、本発明において、「フラットパネルディスプレイ用マザーガラス」とは、各種製品に加工される前の流通に置かれ得る状態のガラス板であって、フラットパネルディスプレイの製造に使用されるものを指す。フラットパネルディスプレイとしては、液晶ディスプレイ、プラズマディスプレイパネル、有機ELディスプレイ等の表示装置が例示される。 In the present invention, the “mother glass for flat panel display” refers to a glass plate that can be placed in circulation before being processed into various products, and is used for manufacturing a flat panel display. . Examples of the flat panel display include display devices such as a liquid crystal display, a plasma display panel, and an organic EL display.
以下、本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
本発明の粘着剤組成物は、熱可塑性樹脂100重量部に対して、アルキレンオキサイド基含有化合物を0.01〜2重量部含有してなることを特徴とする。 The pressure-sensitive adhesive composition of the present invention comprises 0.01 to 2 parts by weight of an alkylene oxide group-containing compound with respect to 100 parts by weight of a thermoplastic resin.
本発明に用いられる粘着剤組成物のベースポリマーとして熱可塑性樹脂が用いられる。 A thermoplastic resin is used as the base polymer of the pressure-sensitive adhesive composition used in the present invention.
前記熱可塑性樹脂として、粘着性を発揮する熱可塑性樹脂であれば適宜使用でき、たとえば、ポリエチレン系樹脂、ポリプロピレン系樹脂、プロピレン−エチレンのブロック系、ランダム系、グラフト系ポリマーや、ポリスチレン系樹脂、アクリル系樹脂などの公知の熱可塑性粘着樹脂をあげることができる。これらは単独または2種以上を混合して、使用することができる。 As the thermoplastic resin, any thermoplastic resin that exhibits adhesiveness can be used as appropriate. For example, polyethylene resin, polypropylene resin, propylene-ethylene block system, random system, graft polymer, polystyrene resin, Known thermoplastic adhesive resins such as acrylic resins can be mentioned. These can be used individually or in mixture of 2 or more types.
前記ポリエチレン系樹脂としては、たとえば、低密度ポリエチレン、直鎖状低密度ポリエチレン、ポリプロピレン、ポリ−1−ブテン、ポリ−4−メチル−1−ペンテン、エチレン・プロピレン共重合体、エチレン・1−ブテン共重合体、エチレン・1−ヘキセン共重合体、エチレン・4−メチル−1−ペンテン共重合体、エチレン・1−オクテン共重合体、エチレン・アクリル酸メチル共重合体、エチレン・メタクリル酸メチル共重合体、エチレン・酢酸ビニル共重合体、エチレン・エチルアクリレート共重合体、エチレン・ビニルアルコール共重合体などのポリオレフィン樹脂などがあげられる。 Examples of the polyethylene resin include low density polyethylene, linear low density polyethylene, polypropylene, poly-1-butene, poly-4-methyl-1-pentene, ethylene / propylene copolymer, and ethylene / 1-butene. Copolymer, ethylene / 1-hexene copolymer, ethylene-4-methyl-1-pentene copolymer, ethylene / 1-octene copolymer, ethylene / methyl acrylate copolymer, ethylene / methyl methacrylate copolymer Examples thereof include polyolefin resins such as polymers, ethylene / vinyl acetate copolymers, ethylene / ethyl acrylate copolymers, and ethylene / vinyl alcohol copolymers.
前記ポリスチレン系樹脂としては、たとえば、スチレン・ブタジエン(SB)、スチレン・イソプレン(SI)、スチレン・エチレン−ブチレン共重合体(SEB)、スチレン・エチレン−プロピレン共重合体(SEP)などのA−B型ジブロックポリマー、スチレン・ブタジエン・スチレン(SBS)、スチレン・イソプレン・スチレン(SIS)、スチレン・エチレン−ブチレン共重合体・スチレン(SEBS)、スチレン・エチレン−プロピレン共重合体・スチレン(SEPS)などのA−B−A型トリブロックまたはA−B−A−B型テトラブロック以上のマルチブロックポリマー、スチレン・ブタジエンラバー(SBR)などのスチレン系ランダム共重合体、スチレン・エチレン−ブチレン共重合体・オレフィン結晶(SEBC)などのA−B−C型のスチレン・オレフィン結晶系ブロックポリマー等があげられる。 Examples of the polystyrene resin include A- such as styrene-butadiene (SB), styrene-isoprene (SI), styrene-ethylene-butylene copolymer (SEB), and styrene-ethylene-propylene copolymer (SEP). B-type diblock polymer, styrene / butadiene / styrene (SBS), styrene / isoprene / styrene (SIS), styrene / ethylene-butylene copolymer / styrene (SEBS), styrene / ethylene-propylene copolymer / styrene (SEPS) A-B-A type triblock or A-B-A-B type tetrablock or higher multi-block polymer, styrene-butadiene rubber (SBR), etc., styrene-ethylene-butylene copolymer Polymer / Olefin Crystal (SEBC) Which A-B-C type styrene-olefin crystalline block polymers of the like.
熱可塑性樹脂として、前記ポリエチレン系樹脂を使用する場合、密度が0.880〜0.950g/cm3である低密度ポリエチレン系樹脂が好ましく、0.880〜0.923g/cm3であることがより好ましく、0.880〜0.915g/cm3であることがさらに好ましい。前記低密度のポリエチレン系樹脂は、柔軟性に優れており、実用的である。なお、本発明における密度(g/cm3)とはISO 1183に準拠して測定された値をいう。 When the polyethylene resin is used as the thermoplastic resin, a low density polyethylene resin having a density of 0.880 to 0.950 g / cm 3 is preferable, and 0.880 to 0.923 g / cm 3 is preferable. More preferably, it is 0.880-0.915 g / cm < 3 >. The low-density polyethylene-based resin is excellent in flexibility and practical. In addition, the density (g / cm < 3 >) in this invention means the value measured based on ISO1183.
本発明の粘着剤組成物には、前記熱可塑性樹脂100重量部に対して、アルキレンオキサイド基含有化合物を0.01〜2重量部含有され、好ましくは0.05〜1.5重量部、より好ましくは、0.1〜1重量部である。0.01重量部未満であると、洗浄工程における残渣物の除去性能が低下し、2重量部を超えると、表面保護フィルム製造時(押出成形した場合)に成形不良を引き起こすことがある。その原因として、低粘度のアルキレンオキサイド基含有化合物が多量に混在することにより、熱可塑性樹脂との流動性が不均一となり、成形不良となる。また、フィルムが成形されても、洗浄工程の際に用いられる洗浄液で残渣物を除去する際に、洗浄液をより多く使用する必要があり、コスト面において好ましくない。 The pressure-sensitive adhesive composition of the present invention contains 0.01 to 2 parts by weight, preferably 0.05 to 1.5 parts by weight, of an alkylene oxide group-containing compound with respect to 100 parts by weight of the thermoplastic resin. Preferably, it is 0.1 to 1 part by weight. When the amount is less than 0.01 part by weight, the residue removal performance in the washing step is deteriorated. When the amount exceeds 2 parts by weight, a molding defect may be caused during the production of the surface protective film (when extrusion molding). As a cause thereof, when a large amount of low-viscosity alkylene oxide group-containing compound is mixed, the fluidity with the thermoplastic resin becomes non-uniform, resulting in poor molding. Further, even if the film is formed, it is necessary to use a larger amount of the cleaning liquid when removing the residue with the cleaning liquid used in the cleaning step, which is not preferable in terms of cost.
前記アルキレンオキサイド基含有化合物としては、エチレングリコール、プロピレングリコール、ブチレングリコール、サリチル酸グリコール、プロピレングリコールモノ脂肪酸エステル、ポリオキシエチレン・ポリオキシプロピレングリコール、ポリオキシアルキレンデシルエーテル、ポリオキシエチレンスチリルフェニルエーテル、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンラノリンアルコールエーテル、ポリオキシエチレンアルキルアミンエーテル、ポリオキシエチレン(2)ラウリン酸モノエタノールアミド、ポリオキシエチレン(5)ヤシ油脂肪酸モノエタノールアミド、ポリオキシエチレンラウリル硫酸ナトリウム、ポリオキシエチレンソルビタン脂肪酸エステル、ソルビタン脂肪酸エステル、ポリオキシエチレンヒマシ油、ポリオキシエチレン高硬ヒマシ油、ポリオキシエチレンラノリン脂肪酸エステル等の化合物を用いることができる。また、前記化合物は、乳化剤、分散剤、潤滑剤、懸濁剤、防触剤、界面活性剤、帯電防止剤等として使用されるものであり、特に、界面活性剤であることが好ましい。 Examples of the alkylene oxide group-containing compound include ethylene glycol, propylene glycol, butylene glycol, salicylic acid glycol, propylene glycol monofatty acid ester, polyoxyethylene / polyoxypropylene glycol, polyoxyalkylene decyl ether, polyoxyethylene styryl phenyl ether, polyoxyethylene Oxyethylene alkyl ether, polyoxyethylene lauryl ether, polyoxyethylene lanolin alcohol ether, polyoxyethylene alkylamine ether, polyoxyethylene (2) lauric acid monoethanolamide, polyoxyethylene (5) coconut oil fatty acid monoethanolamide, Sodium polyoxyethylene lauryl sulfate, polyoxyethylene sorbitan fatty acid ester, sorbi Emissions fatty acid esters, polyoxyethylene castor oil, polyoxyethylene Takakata castor oil, may be used compounds such as polyoxyethylene lanolin fatty acid esters. Moreover, the said compound is used as an emulsifier, a dispersing agent, a lubricant, a suspension agent, an anticorrosive agent, surfactant, an antistatic agent etc., and it is preferable that it is surfactant especially.
前記界面活性剤として、アルキレンオキサイド基含有化合物であれば、特に限定されないが、具体的には、エーテル系の前記化合物としては、ポリオキシエチレン・ポリオキシプロピレングリコール、ポリオキシアルキレンデシルエーテル、ポリオキシエチレンスチリルフェニルエーテル、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンラノリンアルコールエーテル、ポリオキシエチレンアルキルアミンエーテルが好ましい。また、アミド系の前記化合物としては、ポリオキシエチレン(2)ラウリン酸モノエタノールアミド、ポリオキシエチレン(5)ヤシ油脂肪酸モノエタノールアミド、ポリオキシエチレンラウリル硫酸ナトリウムなどが好ましい。また、エステル系の前記化合物としては、ポリオキシエチレンソルビタン脂肪酸エステル、ソルビタン脂肪酸エステル、ポリオキシエチレンヒマシ油、ポリオキシエチレン高硬ヒマシ油、ポリオキシエチレンラノリン脂肪酸エステル等が好ましい。 The surfactant is not particularly limited as long as it is an alkylene oxide group-containing compound. Specifically, examples of the ether-based compound include polyoxyethylene / polyoxypropylene glycol, polyoxyalkylene decyl ether, polyoxyethylene. Ethylene styryl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene lauryl ether, polyoxyethylene lanolin alcohol ether, and polyoxyethylene alkylamine ether are preferred. As the amide-based compound, polyoxyethylene (2) lauric acid monoethanolamide, polyoxyethylene (5) coconut oil fatty acid monoethanolamide, sodium polyoxyethylene lauryl sulfate and the like are preferable. The ester-based compound is preferably polyoxyethylene sorbitan fatty acid ester, sorbitan fatty acid ester, polyoxyethylene castor oil, polyoxyethylene hardened castor oil, polyoxyethylene lanolin fatty acid ester or the like.
さらに本発明の表面保護フィルムに用いられる粘着剤層には、粘着特性の制御等を目的に、従来公知の各種の軟化剤、粘着付与剤、基材層に用いることができるオレフィン系樹脂、シリコーン系ポリマー、液状アクリル系共重合体、リン酸エステル系化合物、老化防止剤、ヒンダードアミン系光安定剤、紫外線吸収剤、表面潤滑剤、レベリング剤、可塑剤、低分子ポリマー、酸化防止剤、腐食防止剤、重合禁止剤、シランカップリング剤、無機および有機の充填剤(たとえば、酸化カルシウム、酸化マグネシウム、シリカ、酸化亜鉛、酸化チタン等)、金属粉、着色剤、顔料などの粉体、粒子状、箔状物、耐熱安定剤などの従来公知の各種の添加剤を使用する用途に応じて適宜添加することができる。 Furthermore, the adhesive layer used in the surface protective film of the present invention has various known softeners, tackifiers, olefinic resins that can be used in the base material layer, silicone for the purpose of controlling adhesive properties, etc. Polymer, liquid acrylic copolymer, phosphate ester compound, anti-aging agent, hindered amine light stabilizer, UV absorber, surface lubricant, leveling agent, plasticizer, low molecular weight polymer, antioxidant, corrosion prevention Agent, polymerization inhibitor, silane coupling agent, inorganic and organic fillers (for example, calcium oxide, magnesium oxide, silica, zinc oxide, titanium oxide, etc.), powders such as metal powders, colorants, pigments, particulates In addition, various conventionally known additives such as foils and heat stabilizers can be appropriately added depending on the use.
また、前記粘着剤組成物を溶融加熱することにより、粘着剤層を製造することができる。粘着剤組成物を溶融加熱することにより得られる粘着剤層は、フィルム状やシート状、テープ状等に加工することが容易で、有用である。 Moreover, an adhesive layer can be manufactured by melt-heating the said adhesive composition. The pressure-sensitive adhesive layer obtained by melting and heating the pressure-sensitive adhesive composition can be easily processed into a film shape, a sheet shape, a tape shape or the like, and is useful.
前記粘着剤層の形成方法であるが、公知の方法を特に限定なく、使用することができるが、例えば、溶融押出成形、カレンダー法などが挙げられる。 Although it is a formation method of the said adhesive layer, Although a well-known method can be used without a particular limitation, For example, melt extrusion molding, a calendar method, etc. are mentioned.
なお、粘着剤層の表面には、たとえば、コロナ放電処理、紫外線照射処理、火炎処理、プラズマ処理やスパッタエッチング処理などの、粘着性の制御や貼付作業性等を目的とした表面処理を必要に応じて施すこともできる。 In addition, the surface of the pressure-sensitive adhesive layer requires surface treatment for the purpose of adhesiveness control and pasting workability, such as corona discharge treatment, ultraviolet irradiation treatment, flame treatment, plasma treatment and sputter etching treatment. It can also be applied accordingly.
さらに、粘着剤層には必要に応じて、実用に供されるまでの間、セパレータなどを仮着して保護することもできる。 Furthermore, a separator or the like can be temporarily attached to the pressure-sensitive adhesive layer as needed until it is put to practical use.
本発明の表面保護フィルムにおいて、粘着剤層の厚さは、通常1〜50μm程度であり、好ましくは2〜40μm、さらに好ましくは3〜20μmである。厚さが1μm未満であると、粘着性を発揮することが困難となり、50μmを超えると、剥離が困難になったり、粘着剤層に添加するアルキレンオキサイド基含有化合物の使用量が多くなり、コスト面で不利となるため、好ましくない。 In the surface protective film of the present invention, the thickness of the pressure-sensitive adhesive layer is usually about 1 to 50 μm, preferably 2 to 40 μm, more preferably 3 to 20 μm. When the thickness is less than 1 μm, it becomes difficult to exert adhesiveness, and when it exceeds 50 μm, peeling becomes difficult or the amount of the alkylene oxide group-containing compound added to the pressure-sensitive adhesive layer increases. This is not preferable because it is disadvantageous.
前記粘着剤層の単一層を用いることにより、表面保護フィルム、特にフラットパネルディスプレイ用マザーガラス表面保護フィルムを製造することができる。粘着剤層それ自体が、表面保護フィルムとして機能するため、製造工程が少なく、有用である。 By using a single layer of the pressure-sensitive adhesive layer, a surface protective film, particularly a mother glass surface protective film for a flat panel display can be produced. Since the pressure-sensitive adhesive layer itself functions as a surface protective film, the production process is few and useful.
また、前記粘着剤層を、基材の片面または両面に形成して、フラットパネルディスプレイ用マザーガラス表面保護フィルムを形成することができる。基材上に粘着剤層を形成した表面保護フィルムを用いることにより、被着体(ガラス)表面を汚染から保護し、傷等の発生を防止することができ、有用である。 Moreover, the said adhesive layer can be formed in the single side | surface or both surfaces of a base material, and the mother glass surface protection film for flat panel displays can be formed. By using a surface protective film having a pressure-sensitive adhesive layer formed on a substrate, the surface of the adherend (glass) can be protected from contamination, and the occurrence of scratches and the like can be prevented, which is useful.
本発明に用いられる基材(層)は、シート状やフィルム状、テープ状等に形成できるものであれば、特に限定されないが、例えば、ポリオレフィン系樹脂であれば、耐熱性および耐溶剤性を有すると共に、可とう性を有するため好ましい。基材層が可とう性を有することにより、ロール状に巻き取ることもでき、各種の加工を適宜おこなうことができる。 The substrate (layer) used in the present invention is not particularly limited as long as it can be formed into a sheet shape, a film shape, a tape shape, etc. For example, if it is a polyolefin-based resin, it has heat resistance and solvent resistance. It is preferable because it has flexibility and flexibility. When the base material layer has flexibility, it can be wound into a roll and various processes can be appropriately performed.
前記ポリオレフィン系樹脂は、たとえば、ポリエチレン系樹脂、プロピレンまたはプロピレン成分とエチレン成分からなるプロピレン系樹脂、エチレン酢酸ビニル共重合体などがあげられる。 Examples of the polyolefin resin include a polyethylene resin, propylene or a propylene resin composed of a propylene component and an ethylene component, and an ethylene vinyl acetate copolymer.
具体的には、たとえば、低密度ポリエチレン、直鎖状低密度ポリエチレン、ポリプロピレン、ポリ−1−ブテン、ポリ−4−メチル−1−ペンテン、エチレン・プロピレン共重合体、エチレン・1−ブテン共重合体、エチレン・1−ヘキセン共重合体、エチレン・4−メチル−1−ペンテン共重合体、エチレン・1−オクテン共重合体、エチレン・アクリル酸メチル共重合体、エチレン・メタクリル酸メチル共重合体、エチレン・酢酸ビニル共重合体、エチレン・エチルアクリレート共重合体、エチレン・ビニルアルコール共重合体などのポリオレフィン樹脂などがあげられる。 Specifically, for example, low density polyethylene, linear low density polyethylene, polypropylene, poly-1-butene, poly-4-methyl-1-pentene, ethylene / propylene copolymer, ethylene / 1-butene copolymer Copolymer, ethylene / 1-hexene copolymer, ethylene-4-methyl-1-pentene copolymer, ethylene / 1-octene copolymer, ethylene / methyl acrylate copolymer, ethylene / methyl methacrylate copolymer And polyolefin resins such as ethylene / vinyl acetate copolymer, ethylene / ethyl acrylate copolymer, and ethylene / vinyl alcohol copolymer.
本発明において、上記基材層には、この種のフィルムやシート、テープ等の基材に一般に用いられる公知の各種添加剤を適宜含有していてもよい。たとえば、各種の充填剤、顔料、紫外線吸収剤、酸化防止剤、耐熱安定剤、滑剤などがあげられる。 In the present invention, the base material layer may appropriately contain various known additives generally used for base materials such as films, sheets and tapes of this type. For example, various fillers, pigments, ultraviolet absorbers, antioxidants, heat stabilizers, lubricants and the like can be mentioned.
前記基材層の厚みは、通常20〜300μm程度が好ましく、より好ましくは20〜250μm程度、更に好ましくは25〜200μm程度である。基材層が20μm未満では剥離時に基材が破れたり、裂けたりする場合があり、300μmを超える場合には基材のコシが大きくなり、貼付後に浮き等が発生しやすい。 The thickness of the base material layer is usually preferably about 20 to 300 μm, more preferably about 20 to 250 μm, and still more preferably about 25 to 200 μm. If the substrate layer is less than 20 μm, the substrate may be torn or torn during peeling, and if it exceeds 300 μm, the stiffness of the substrate becomes large, and floating or the like tends to occur after sticking.
また、表面保護フィルムの基材層側には、手切れ性や耐スリップ性付与のために、エンボス加工や凹凸加工等を施しても構わない。 Moreover, you may give an embossing, an uneven | corrugated process, etc. to the base-material layer side of a surface protective film for hand cutting property or slip resistance provision.
本発明における表面保護フィルムの製造方法としては、ポリオレフィン系樹脂からなる基材層、および熱可塑性樹脂からなる粘着剤層を構成する素材を、それぞれ溶融加熱して共押出し成形し、基材層の片面にまたは両面に粘着剤層を一体に形成し、所定の厚さを有する2層構造(もしくは3層以上の多層)のフィルムを製造する方法が、高効率かつ安価に本発明の表面保護フィルムを製造できる点で好ましい。 As the method for producing the surface protective film in the present invention, the base material layer made of polyolefin resin and the material constituting the pressure-sensitive adhesive layer made of thermoplastic resin are melt-heated and co-extruded to form the base material layer. A method for producing a film of a two-layer structure (or a multilayer of three or more layers) having a predetermined thickness by integrally forming a pressure-sensitive adhesive layer on one side or both sides is highly efficient and inexpensive. Is preferable in that it can be produced.
前記共押出成形としては、フィルム、シート等の製造などに一般に用いられる方法を採用することができ、特に限定されるものではない。たとえば、インフレーション法、共押出T−ダイ法などを用いることができる。これらの共押出成形を用いることは、コスト面や生産性の面で好ましい。 As the coextrusion molding, a method generally used in the production of films, sheets and the like can be employed, and is not particularly limited. For example, an inflation method, a coextrusion T-die method, or the like can be used. Use of these coextrusion moldings is preferable in terms of cost and productivity.
また、前記各層それぞれにおいて積層する層の数は特に限定されるものではなく、前記基材層、および前記粘着剤層はそれぞれ単層であってもよいし、必要に応じて複数層の積層構造としてもよい。 Further, the number of layers to be laminated in each of the layers is not particularly limited, and the base material layer and the pressure-sensitive adhesive layer may each be a single layer, or a laminated structure of a plurality of layers as necessary. It is good.
また、本発明の表面保護フィルムの全体の厚さは、20〜150μmが好ましく、30〜100μm程度であることがより好ましい。全体の厚さが20μm未満であると、剥離の際の作業性が悪く、破れるなど問題が生じやすくなり、150μmを超えると、貼付後の浮きの問題や、コスト面で不利となり、好ましくない。 Moreover, 20-150 micrometers is preferable and, as for the whole thickness of the surface protection film of this invention, it is more preferable that it is about 30-100 micrometers. When the total thickness is less than 20 μm, workability at the time of peeling is poor and problems such as tearing tend to occur, and when it exceeds 150 μm, the problem of floating after pasting and disadvantages in cost are undesirable.
以下、本発明の構成と効果を具体的に示す実施例等について説明するが、本発明はこれらに限定されるものではない。なお、実施例等における評価項目は下記のようにして測定を行った。 Hereinafter, examples and the like specifically showing the configuration and effects of the present invention will be described, but the present invention is not limited to these. In addition, the evaluation item in an Example etc. measured as follows.
1)剥離力
液晶基板用マザーガラス(NHテクノグラス製、NA35)に表面保護フィルムを貼付後、圧着(0.2MPa、1.0m/分)して、23℃で1日間保管し、引張試験機(ミネベア社製、TCM−5KNB−3、引張速度0.3m/分、角度180°)で表面保護フィルムを剥離した時の剥離力(N/20mm)を測定した。なお、剥離力は0.02N/20mm以下が好ましく、0.015N/20mm以下がより好ましい。また、剥離力としては、密着性、試験機での測定限界値の観点から、0.001N/20mm以上が好ましい。剥離力が高い場合、剥離作業性が悪化し、表面保護フィルムに起因する残渣物が増加しやすい。
1) Peeling force After applying a surface protective film to mother glass for liquid crystal substrates (NH Techno Glass, NA35), press bonding (0.2 MPa, 1.0 m / min), storing at 23 ° C. for 1 day, tensile test The peeling force (N / 20 mm) when the surface protective film was peeled with a machine (Minebea Corporation, TCM-5KNB-3, tensile speed 0.3 m / min, angle 180 °) was measured. The peeling force is preferably 0.02 N / 20 mm or less, and more preferably 0.015 N / 20 mm or less. Further, the peeling force is preferably 0.001 N / 20 mm or more from the viewpoint of adhesion and a measurement limit value with a testing machine. When the peeling force is high, the peeling workability deteriorates, and the residue resulting from the surface protective film tends to increase.
2)接触角
ガラス(NHテクノグラス製、NA35)に表面保護フィルムを貼付後、圧着(0.2MPa、1.0m/分)し、40℃×4日間経過後、洗浄前の接触角を測定し、その後、前記ガラス表面を、無機アルカリ洗浄剤(横浜油脂工業製、KG)2.0%水溶液を用いて超音波洗浄を2分間行い、更に蒸留水により3分間リンスした。)し、洗浄後の接触角を測定した。
2) Contact angle After applying a surface protective film to glass (made by NH Techno Glass, NA35), press-bond (0.2 MPa, 1.0 m / min), measure the contact angle before washing after 40 ° C. × 4 days. Thereafter, the glass surface was subjected to ultrasonic cleaning for 2 minutes using a 2.0% aqueous solution of an inorganic alkaline cleaner (manufactured by Yokohama Oil & Fats Industry Co., Ltd., KG), and further rinsed with distilled water for 3 minutes. The contact angle after washing was measured.
3)洗浄効果(洗浄率)
洗浄効果(洗浄率)は次式により計算した。なお、洗浄効果は65%以上が好ましく、より好ましくは70%以上である。洗浄効果が65%未満であると、残渣物による剥離不良の原因となるため、好ましくない。
洗浄効果(洗浄率)(%)=100×[(洗浄前の接触角−洗浄後の接触角)/(洗浄前の接触角)]
3) Cleaning effect (cleaning rate)
The cleaning effect (cleaning rate) was calculated by the following formula. The cleaning effect is preferably 65% or more, more preferably 70% or more. If the cleaning effect is less than 65%, it causes unsatisfactory peeling due to residue, which is not preferable.
Cleaning effect (cleaning rate) (%) = 100 × [(contact angle before cleaning−contact angle after cleaning) / (contact angle before cleaning)]
4)成形条件
各実施例(実施例10を除く)、比較例において、インフレーション法によって成形した。なお、溶融温度は、基材層および粘着剤層、ダイス温度および共押出温度すべて180℃に設定した。また、実施例10においては、Tダイ法により成形した。溶融温度は押出機温度、ダイス温度共に190℃に設定した。
4) Molding conditions Molding was performed by an inflation method in each of the examples (excluding Example 10) and the comparative example. The melting temperature was set to 180 ° C. for the base material layer and the pressure-sensitive adhesive layer, the die temperature and the coextrusion temperature. Moreover, in Example 10, it shape | molded by the T-die method. The melting temperature was set to 190 ° C. for both the extruder temperature and the die temperature.
〔実施例1〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)、及び直鎖状低密度ポリエチレン(LLDPE)(住友化学製、スミカセン EFV402)100重量部に対して、ポリオキシエチレン・ポリオキシプロピレングリコール(第一工業製薬社製、エパン485)0.06重量部を含有する粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
[Example 1]
Base material layer (thickness: 26 μm) composed of low density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183) and linear low density polyethylene (LLDPE) (Sumitomo Chemical, Sumikasen EFV402) 100 parts by weight , Using an adhesive layer (thickness: 4 μm) containing 0.06 part by weight of polyoxyethylene / polyoxypropylene glycol (Daiichi Kogyo Seiyaku Co., Ltd., Epan 485) by an inflation method using the above molding conditions A two-layer surface protective film (thickness: 30 μm) was obtained.
〔実施例2〕
ポリオキシエチレン・ポリオキシプロピレングリコールの添加量を0.36重量部にしたこと以外は、実施例1と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
[Example 2]
A surface protective film (thickness: 30 μm) was obtained in the same manner as in Example 1 except that the amount of polyoxyethylene / polyoxypropylene glycol added was 0.36 parts by weight.
〔実施例3〕
ポリオキシエチレン・ポリオキシプロピレングリコールの添加量を0.6重量部にしたこと以外は、実施例1と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
Example 3
A surface protective film (thickness: 30 μm) was obtained in the same manner as in Example 1 except that the amount of polyoxyethylene / polyoxypropylene glycol added was 0.6 parts by weight.
〔実施例4〕
ポリオキシエチレン・ポリオキシプロピレングリコールの添加量を0.9重量部にしたこと以外は、実施例1と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
Example 4
A surface protective film (thickness: 30 μm) was obtained in the same manner as in Example 1 except that the amount of polyoxyethylene / polyoxypropylene glycol added was 0.9 parts by weight.
〔実施例5〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)、及び直鎖状低密度ポリエチレン(プライムポリマー製、エボリューSP1540)100重量部に対して、ポリオキシエチレン(2)ラウリン酸モノエタノールアミド(川研ファインケミカル製、アミゼット2L−Y)0.06重量部を含有する粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
Example 5
Polyoxygen with respect to 100 parts by weight of a base layer (thickness: 26 μm) made of low density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183) and linear low density polyethylene (prime polymer, Evolve SP1540). By using an adhesive layer (thickness: 4 μm) containing 0.06 part by weight of ethylene (2) lauric acid monoethanolamide (manufactured by Kawaken Fine Chemicals, amidette 2L-Y) by an inflation method using the above molding conditions A two-layer surface protective film (thickness: 30 μm) was obtained.
〔実施例6〕
実施例5のポリオキシエチレン(2)ラウリン酸モノエタノールアミドの代わりに、ポリオキシアルキレンデシルエーテル(第一工業製薬製、ノイゲンXL−400)を0.18重量部添加したこと以外は、実施例5と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
Example 6
Example except that 0.18 part by weight of polyoxyalkylene decyl ether (Daiichi Kogyo Seiyaku, Neugen XL-400) was added in place of the polyoxyethylene (2) lauric acid monoethanolamide of Example 5. 5 was used to obtain a surface protective film (thickness: 30 μm).
〔実施例7〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)、及び直鎖状低密度ポリエチレン(プライムポリマー製、エボリューSP1540)50重量部及び直鎖状低密度ポリエチレン(LLDPE)(住友化学製、スミカセン EFV402)50重量部の合計100重量部に対して、ポリオキシエチレンスチリルフェニルエーテル(第一工業製薬製、ノイゲンEA−177)0.06重量部を含有する粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
Example 7
A base layer (thickness: 26 μm) made of low density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183), and 50 parts by weight of linear low density polyethylene (prime polymer, Evolve SP1540) and linear low density Polyoxyethylene styryl phenyl ether (Daiichi Kogyo Seiyaku Co., Ltd., Neugen EA-177) 0.06 parts by weight is contained with respect to a total of 100 parts by weight of polyethylene (LLDPE) (Sumitomo Chemical, Sumikasen EFV402). Using a pressure-sensitive adhesive layer (thickness: 4 μm), a two-layer surface protective film (thickness: 30 μm) was obtained by an inflation method using the above molding conditions.
〔実施例8〕
ポリオキシエチレンスチリルフェニルエーテルの添加量を0.18重量部にしたこと以外は、実施例7と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
Example 8
A surface protective film (thickness: 30 μm) was obtained in the same manner as in Example 7 except that the amount of polyoxyethylene styryl phenyl ether added was 0.18 parts by weight.
〔実施例9〕
ポリオキシエチレンスチリルフェニルエーテルの添加量を0.36重量部にしたこと以外は、実施例7と同様の方法で、表面保護フィルム(厚さ:30μm)を得た。
Example 9
A surface protective film (thickness: 30 μm) was obtained in the same manner as in Example 7 except that the amount of polyoxyethylene styryl phenyl ether added was 0.36 parts by weight.
〔実施例10〕
エチレン・ビニルアルコール共重合体(EVA)(JPE製、ノバテックLV440)100重量部に対して、ポリオキシエチレン・ポリオキシプロピレングリコール(第一工業製薬製、エパン485)1.2重量部を含有する粘着剤層の単一層を用いて、Tダイ法により、単一構造の表面保護フィルム(厚さ:35μm)を得た。
Example 10
Contains 1.2 parts by weight of polyoxyethylene / polyoxypropylene glycol (Daiichi Kogyo Seiyaku, Epan 485) per 100 parts by weight of ethylene / vinyl alcohol copolymer (EVA) (manufactured by JPE, Novatec LV440) A single-layer surface protective film (thickness: 35 μm) was obtained by a T-die method using a single adhesive layer.
〔実施例11〕
エチレン・ビニルアルコール共重合体(EVA)(JPE製、ノバテックLV440)からなる基材層(厚さ:26μm)、及びスチレン−エチレン・ブチレン-エチレンブロック共重合体(SEBC)(JSR製、DYNARON4600P)100重量部に対して、ポリオキシエチレン・ポリオキシプロピレングリコール(第一工業製薬製、エパン485)1.8重量部を含有する粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
Example 11
Base material layer (thickness: 26 μm) made of ethylene-vinyl alcohol copolymer (EVA) (manufactured by JPE, Novatec LV440), and styrene-ethylene-butylene-ethylene block copolymer (SEBC) (manufactured by JSR, DYNARON 4600P) The pressure-sensitive adhesive layer (thickness: 4 μm) containing 1.8 parts by weight of polyoxyethylene / polyoxypropylene glycol (Daiichi Kogyo Seiyaku, Epan 485) with respect to 100 parts by weight A two-layer surface protective film (thickness: 30 μm) was obtained by the inflation method used.
〔比較例1〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)、及び直鎖状低密度ポリエチレン(LLDPE)(住友化学製、スミカセン EFV402)からなる粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
[Comparative Example 1]
A base material layer (thickness: 26 μm) made of low-density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183) and an adhesive layer made of linear low-density polyethylene (LLDPE) (Sumitomo Chemical, Sumikasen EFV402) (Thickness: 4 μm) was used to obtain a two-layer surface protection film (thickness: 30 μm) by an inflation method using the above molding conditions.
〔比較例2〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)、及びエチレン・ビニルアルコール共重合体(EVA)(JPE製、ノバテックLV440)からなる粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。
[Comparative Example 2]
A base material layer (thickness: 26 μm) made of low density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183), and an adhesive layer made of ethylene / vinyl alcohol copolymer (EVA) (manufactured by JPE, Novatec LV440) (Thickness: 4 μm) was used to obtain a two-layer surface protection film (thickness: 30 μm) by an inflation method using the above molding conditions.
〔比較例3〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)の片面に、ブチレンアクリレイト94重量部とアクリル酸6重量部、イソシアネート系架橋剤(日本ポリウレタン製、コロネートL)30重量部を重合してなる粘着剤溶液を塗布して粘着剤層(厚さ:4μm)を形成することにより、2層構造の表面保護フィルム(厚さ:30μm)を得た。
[Comparative Example 3]
94 parts by weight of butylene acrylate and 6 parts by weight of acrylic acid, isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane) are formed on one side of a base material layer (thickness: 26 μm) made of low density polyethylene (LDPE) (manufactured by Tosoh Corporation, Petrocene 183). The surface protective film (thickness: 30 μm) having a two-layer structure was obtained by applying a pressure-sensitive adhesive solution obtained by polymerizing 30 parts by weight of Coronate L) to form a pressure-sensitive adhesive layer (thickness: 4 μm). .
〔比較例4〕
低密度ポリエチレン(LDPE)(東ソー社製、ペトロセン 183)からなる基材層(厚さ:26μm)の片面に、直鎖状低密度ポリエチレン(LLDPE)(プライムポリマー社製、エボリューSP1540)50重量部、及び直鎖状低密度ポリエチレン(LLDPE)(住友化学製、スミカセン EFV402)50重量部に対して、ポリオキシエチレンスチリルフェニルエーテル(第一工業製薬社製、ノイゲンEA−17 7)2.5重量部を含有する粘着剤層(厚さ:4μm)を用いて、前記成形条件を用いたインフレーション法により、2層構造の表面保護フィルム(厚さ:30μm)を得た。但し、この表面保護フィルムについては、製膜不良が発生し、厚さのバラツキも大きく、特性の評価を行うことができなかった。製膜不良の原因としては、前記ポリオキシエチレンスチリルフェニルエーテルの含有量が過剰であるため、熱可塑性樹脂との流動性が不均一となることが考えられる。
[Comparative Example 4]
50 parts by weight of linear low density polyethylene (LLDPE) (Evolue SP1540, Prime Polymer Co., Ltd.) on one side of a base layer (thickness: 26 μm) made of low density polyethylene (LDPE) (Tosoh Corp., Petrocene 183) , And linear low density polyethylene (LLDPE) (Sumitomo Chemical, Sumikacene EFV402) 50 parts by weight, polyoxyethylene styryl phenyl ether (Daiichi Kogyo Seiyaku Co., Ltd., Neugen EA-177) 2.5 weight Using a pressure-sensitive adhesive layer containing a part (thickness: 4 μm), a two-layer surface protective film (thickness: 30 μm) was obtained by an inflation method using the above molding conditions. However, the surface protective film had a poor film formation and had a large thickness variation, and the characteristics could not be evaluated. A possible cause of film formation is that the content of the polyoxyethylene styryl phenyl ether is excessive, and the fluidity with the thermoplastic resin becomes non-uniform.
上記方法に従い、作製した表面保護フィルムの測定・評価を行った。得られた結果を表1に示す。 According to the said method, the produced surface protection film was measured and evaluated. The obtained results are shown in Table 1.
注)表1中のA:ポリオキシエチレン・ポリオキシプロピレングリコール、B:ポリオキシエチレン(2)ラウリン酸モノエタノールアミド、C:ポリオキシアルキレンデシルエーテル、D:ポリオキシエチレンスチリルフェニルエーテルである。
Note) In Table 1, A: polyoxyethylene / polyoxypropylene glycol, B: polyoxyethylene (2) lauric acid monoethanolamide, C: polyoxyalkylene decyl ether, D: polyoxyethylene styryl phenyl ether.
上記表1の結果より、本発明によって作製された表面保護フィルムを用いた実施例では、いずれの場合においても、剥離力が抑えられ剥離作業性が良好であり、洗浄効果(洗浄率)もきわめて高いことが確認できた。 From the results of Table 1 above, in the examples using the surface protective film prepared according to the present invention, in any case, the peeling force is suppressed, the peeling workability is good, and the cleaning effect (cleaning rate) is extremely high. It was confirmed that it was expensive.
一方、アルキレンオキサイド基含有化合物を用いなかった比較例では、剥離力が高く、剥離作業性に劣ることが確認され、洗浄効果も劣るものであった。 On the other hand, in the comparative example in which the alkylene oxide group-containing compound was not used, it was confirmed that the peeling force was high, the peeling workability was poor, and the cleaning effect was also poor.
以上より、本発明の表面保護フィルムは、ガラス表面に表面保護フィルムを貼付後、表面保護フィルムの剥離が容易であり、その後、表面保護フィルムに起因する残渣物を、容易に洗浄・除去することができることが確認された。 From the above, the surface protective film of the present invention can be easily peeled off after the surface protective film is pasted on the glass surface, and then the residue resulting from the surface protective film can be easily washed and removed. It was confirmed that
Claims (5)
A mother glass surface protective film for flat panel displays, comprising the pressure-sensitive adhesive composition according to claim 1 or 2 formed on one or both sides of a substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009053842A JP5592615B2 (en) | 2008-04-07 | 2009-03-06 | Adhesive composition, surface protective film, and mother glass surface protective film for flat panel display |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008099596 | 2008-04-07 | ||
JP2008099596 | 2008-04-07 | ||
JP2009053842A JP5592615B2 (en) | 2008-04-07 | 2009-03-06 | Adhesive composition, surface protective film, and mother glass surface protective film for flat panel display |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009270092A true JP2009270092A (en) | 2009-11-19 |
JP5592615B2 JP5592615B2 (en) | 2014-09-17 |
Family
ID=41161806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009053842A Active JP5592615B2 (en) | 2008-04-07 | 2009-03-06 | Adhesive composition, surface protective film, and mother glass surface protective film for flat panel display |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5592615B2 (en) |
KR (1) | KR101553090B1 (en) |
CN (1) | CN101970593B (en) |
TW (1) | TWI434909B (en) |
WO (1) | WO2009125672A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010150498A (en) * | 2008-06-05 | 2010-07-08 | Nitto Denko Corp | Protective sheet and use thereof |
JP2012054006A (en) * | 2010-08-31 | 2012-03-15 | Gunze Ltd | Transparent conductive gas barrier film and method for producing the same |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5588361B2 (en) * | 2011-01-06 | 2014-09-10 | 日東電工株式会社 | Surface protection sheet |
WO2012169481A1 (en) * | 2011-06-10 | 2012-12-13 | 住友化学株式会社 | Aqueous adhesive and laminate structure |
WO2012169482A1 (en) * | 2011-06-10 | 2012-12-13 | 住友化学株式会社 | Aqueous adhesive and laminate structure |
WO2012169479A1 (en) * | 2011-06-10 | 2012-12-13 | 住友化学株式会社 | Aqueous adhesive and laminate structure |
WO2012169480A1 (en) * | 2011-06-10 | 2012-12-13 | 住友化学株式会社 | Aqueous adhesive and laminate structure |
KR101123268B1 (en) * | 2012-01-06 | 2012-03-21 | 주식회사 아이.엠.텍 | Large-area film wrinkle removal device that is attached to a glass |
CN107207330B (en) | 2014-11-28 | 2020-06-09 | 康宁股份有限公司 | Method for producing shaped glass articles |
KR102584782B1 (en) * | 2021-12-28 | 2023-10-10 | 한국성전(주) | printed circuit board for processing having protection cover |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005023143A (en) * | 2003-06-30 | 2005-01-27 | Soken Chem & Eng Co Ltd | Pressure-sensitive adhesive for surface protective film and surface protective film |
JP2005306996A (en) * | 2004-04-21 | 2005-11-04 | Nitto Denko Corp | Protective film for mother glass for flat panel display and its use |
JP2006052379A (en) * | 2004-07-16 | 2006-02-23 | Nitto Denko Corp | Adhesive composition, adhesive sheets and surface-protecting film |
JP2007063298A (en) * | 2005-08-29 | 2007-03-15 | Nippon Carbide Ind Co Inc | Pressure-sensitive adhesive solution composition and surface protective film |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4138098B2 (en) * | 1998-10-01 | 2008-08-20 | コニシ株式会社 | One-part aqueous adhesive composition |
JP2001066430A (en) * | 1999-08-25 | 2001-03-16 | Nitto Denko Corp | Surface protective film, optical member and liquid crystal display device |
-
2009
- 2009-03-06 JP JP2009053842A patent/JP5592615B2/en active Active
- 2009-03-25 WO PCT/JP2009/055956 patent/WO2009125672A1/en active Application Filing
- 2009-03-25 KR KR1020107024926A patent/KR101553090B1/en active IP Right Grant
- 2009-03-25 CN CN200980108717.5A patent/CN101970593B/en active Active
- 2009-03-30 TW TW098110348A patent/TWI434909B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005023143A (en) * | 2003-06-30 | 2005-01-27 | Soken Chem & Eng Co Ltd | Pressure-sensitive adhesive for surface protective film and surface protective film |
JP2005306996A (en) * | 2004-04-21 | 2005-11-04 | Nitto Denko Corp | Protective film for mother glass for flat panel display and its use |
JP2006052379A (en) * | 2004-07-16 | 2006-02-23 | Nitto Denko Corp | Adhesive composition, adhesive sheets and surface-protecting film |
JP2007063298A (en) * | 2005-08-29 | 2007-03-15 | Nippon Carbide Ind Co Inc | Pressure-sensitive adhesive solution composition and surface protective film |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010150498A (en) * | 2008-06-05 | 2010-07-08 | Nitto Denko Corp | Protective sheet and use thereof |
JP2012054006A (en) * | 2010-08-31 | 2012-03-15 | Gunze Ltd | Transparent conductive gas barrier film and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
KR20100134096A (en) | 2010-12-22 |
CN101970593B (en) | 2015-09-02 |
JP5592615B2 (en) | 2014-09-17 |
WO2009125672A1 (en) | 2009-10-15 |
TWI434909B (en) | 2014-04-21 |
CN101970593A (en) | 2011-02-09 |
KR101553090B1 (en) | 2015-09-14 |
TW201005062A (en) | 2010-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5592615B2 (en) | Adhesive composition, surface protective film, and mother glass surface protective film for flat panel display | |
JP5148816B2 (en) | Surface protection sheet and manufacturing method thereof | |
TWI405663B (en) | Surface protection sheet | |
WO2013099778A1 (en) | Substrate for stealth dicing film, film for stealth dicing, and method for manufacturing electronic component | |
JP5483713B2 (en) | Surface protection film | |
KR101946322B1 (en) | Laminated film | |
JP4943372B2 (en) | Surface protection film | |
JP5916386B2 (en) | Surface protection film | |
JP2011243613A (en) | Semiconductor wafer protective adhesive film and semiconductor wafer protective adhesive film roll | |
JP6901665B2 (en) | Laminate | |
WO2011096350A1 (en) | Surface protective film | |
JP6323690B2 (en) | Self-adhesive surface protective film | |
JP2009263510A (en) | Surface protective film | |
JP4574526B2 (en) | Surface protective film substrate, surface protective adhesive film, and method for producing the same | |
JP2013124293A (en) | Surface protective film | |
JP2018119138A (en) | Laminate film | |
WO2015194059A1 (en) | Self-adhesive surface-protection film | |
JP2013181073A (en) | Surface protective film | |
WO2013121884A1 (en) | Surface-protecting sheet | |
JP2008308559A (en) | Surface-protecting film | |
JP7287863B2 (en) | laminated film | |
JP2010006927A (en) | Surface protective film | |
JP2011037956A (en) | Resin composition and surface protective film obtained from the same | |
WO2014050490A1 (en) | Surface protective sheet | |
JP2010132889A (en) | Surface protection sheet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120123 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130905 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140718 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140801 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5592615 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |