JP2009081028A - Manufacturing method for low thermal expansion linear body - Google Patents

Manufacturing method for low thermal expansion linear body Download PDF

Info

Publication number
JP2009081028A
JP2009081028A JP2007248889A JP2007248889A JP2009081028A JP 2009081028 A JP2009081028 A JP 2009081028A JP 2007248889 A JP2007248889 A JP 2007248889A JP 2007248889 A JP2007248889 A JP 2007248889A JP 2009081028 A JP2009081028 A JP 2009081028A
Authority
JP
Japan
Prior art keywords
low thermal
thermal expansion
linear body
plating
fiber material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007248889A
Other languages
Japanese (ja)
Inventor
Hirotaka Kamijiyou
弘貴 上條
Koichi Inagi
功一 稲木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYOEI DENSHI KK
Railway Technical Research Institute
Original Assignee
KYOEI DENSHI KK
Railway Technical Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYOEI DENSHI KK, Railway Technical Research Institute filed Critical KYOEI DENSHI KK
Priority to JP2007248889A priority Critical patent/JP2009081028A/en
Publication of JP2009081028A publication Critical patent/JP2009081028A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a low thermal expansion linear body, wherein the low thermal expansion linear body in the continuous and long form can be simply manufactured. <P>SOLUTION: The manufacturing method for a low thermal expansion linear body prepares a fibrous material 11 with a low thermal expansion property or a linear expansion coefficient as a core material, and plates a conductive material 16 having the low thermal expansion property and the positive linear expansion coefficient greater than that of the fibrous material 11 on the fibrous material 11. The fibrous material 11 serving as a core material having the negative linear expansion coefficient is wound around a delivery bobbin 12 for delivery, and the delivered fibrous material is hung onto a plating fixture 15 arranged inside a plating bath 13 containing an electrolytic solution. The conductive material 16 with the positive linear expansion coefficient is plated on the fibrous material 11 within the plating bath 13, and then the low thermal expansion linear body 18 subjected to plating is wound around a winding bobbin 19. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

本発明は、低熱膨張線状体の製造方法、特に、低熱膨張線状体に連続的な長い(数十m〜数Km)めっきを施す低熱膨張線状体の製造方法に関するものである。   The present invention relates to a method for producing a low thermal expansion linear body, and more particularly to a method for producing a low thermal expansion linear body in which continuous long (several tens to several kilometers) plating is applied to a low thermal expansion linear body.

従来、低熱膨張線状体の製造方法としては、下記の特許文献1に示すような方法が提案されていた。   Conventionally, as a manufacturing method of a low thermal expansion linear body, the method as shown in the following patent document 1 has been proposed.

図5は従来の低熱膨張線状体の製造方法を示す図である。   FIG. 5 is a diagram illustrating a conventional method for producing a low thermal expansion linear body.

この図に示すように、(1)まず、図5(a)に示すように、負の線膨張係数を有する繊維材料101に撚りをかけたものを芯材として用意する。(2)次に、図5(b)に示すように、その繊維材料101をめっき槽102に浸して、正の線膨張係数を持つ導電性材料105をめっきする。つまり、めっき槽102では、電着させようとする金属103と負の線膨張係数を有する繊維材料101を電解液104中に浸す。次いで、この繊維材料101を陰極とし、金属103を陽極として直流電流を流すと、図5(c)に示すように、負の線膨張係数を有する繊維材料101上に正の線膨張係数を持つ導電性材料105をめっきすることができる。
特開2006−085915号公報
As shown in this figure, (1) First, as shown in FIG. 5A, a fiber material 101 having a negative linear expansion coefficient is twisted and prepared as a core material. (2) Next, as shown in FIG. 5 (b), the fibrous material 101 is immersed in a plating tank 102, and the conductive material 105 having a positive linear expansion coefficient is plated. That is, in the plating tank 102, the metal 103 to be electrodeposited and the fiber material 101 having a negative linear expansion coefficient are immersed in the electrolytic solution 104. Next, when a direct current is passed using the fiber material 101 as a cathode and the metal 103 as an anode, as shown in FIG. 5C, the fiber material 101 having a negative coefficient of linear expansion has a positive coefficient of linear expansion. The conductive material 105 can be plated.
JP 2006-085915 A

しかしながら、上記した低熱膨張線状体の製造方法では、めっき槽102の幅寸法に制限されて、長い連続した導電性を有する低熱膨張線状体を製造することはできなかった。   However, in the above-described method for producing a low thermal expansion linear body, the low thermal expansion linear body having a long continuous conductivity cannot be produced due to the limitation of the width dimension of the plating tank 102.

一方、低熱膨張線状体はその使用用途から長いもの(数十m〜数Km)が必要であり、連続的にめっきを施す技術が望まれていた。   On the other hand, a low thermal expansion linear body requires a long one (several tens to several kilometers) because of its intended use, and a technique for continuously plating has been desired.

本発明は、上記状況に鑑みて、連続した長い導電性を有する低熱膨張線状体を簡便に製造することができる低熱膨張線状体の製造方法を提供することを目的とする。   In view of the above situation, an object of the present invention is to provide a method for producing a low thermal expansion linear body that can easily produce a low thermal expansion linear body having continuous long conductivity.

本発明は、上記目的を達成するために、
〔1〕芯材として低熱膨張特性乃至負の線膨張係数を有する繊維材料を用意し、この繊維材料上に前記低熱膨張特性を有する、繊維材料よりは大きな線膨張係数で正の線膨張係数を持つ導電性材料をめっきする低熱膨張線状体の製造方法において、前記低熱膨張特性乃至負の線膨張係数を有する芯材としての繊維材料を送り出し用のボビンに巻いて送り出し、この送り出された前記繊維材料を電解液が入っためっき槽内に配置されるめっき治具に掛け渡し、前記めっき槽内で前記繊維材料に正の線膨張係数を持つ導電性材料をめっきし、このめっきされた低熱膨張線状体を巻取り用のボビンに巻き取ることを特徴とする。
In order to achieve the above object, the present invention provides
[1] A fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared as a core material, and a positive linear expansion coefficient having a low thermal expansion characteristic and a larger linear expansion coefficient than that of the fiber material is provided on the fiber material. In the method of manufacturing a low thermal expansion linear body for plating a conductive material having, the fiber material as a core material having a low thermal expansion characteristic or a negative linear expansion coefficient is wound around a bobbin for feeding out, and the fed out The fiber material is passed over a plating jig disposed in a plating tank containing an electrolytic solution, and a conductive material having a positive linear expansion coefficient is plated on the fiber material in the plating tank. The expanded linear body is wound around a bobbin for winding.

〔2〕上記〔1〕記載の低熱膨張線状体の製造方法において、前記めっき治具は、前記めっき槽内に配置される第1のローラと、第2のローラと、これらの第1のローラ及び第2のローラを回転自在に支持するローラの支持軸とを備えることを特徴とする。   [2] In the method for producing a low thermal expansion linear body according to [1], the plating jig includes a first roller, a second roller, and a first of these, which are disposed in the plating tank. And a roller support shaft for rotatably supporting the roller and the second roller.

〔3〕上記〔2〕記載の低熱膨張線状体の製造方法において、前記めっき槽内に前記繊維材料に正の線膨張係数を持つ導電性材料をめっきする金属板を備えることを特徴とする。   [3] In the method for producing a low thermal expansion linear body according to [2], a metal plate for plating a conductive material having a positive linear expansion coefficient on the fiber material is provided in the plating tank. .

〔4〕上記〔3〕記載の低熱膨張線状体の製造方法において、前記金属板に正電極を備え、前記ローラを接地電極とすることを特徴とする。   [4] The method for producing a low thermal expansion linear body according to [3], wherein the metal plate is provided with a positive electrode, and the roller is a ground electrode.

〔5〕上記〔2〕記載の低熱膨張線状体の製造方法において、前記ローラと前記繊維材料の接触圧を高め、電気的導通を確保することを特徴とする。   [5] The method for producing a low thermal expansion linear body according to [2], wherein the contact pressure between the roller and the fiber material is increased to ensure electrical conduction.

〔6〕上記〔3〕記載の低熱膨張線状体の製造方法において、前記金属板が銅であることを特徴とする。   [6] In the method for producing a low thermal expansion linear body according to [3], the metal plate is copper.

〔7〕上記〔1〕記載の低熱膨張線状体の製造方法において、前記繊維材料としてザイロンを用いることを特徴とする。   [7] The method for producing a low thermal expansion linear body according to [1], wherein zylon is used as the fiber material.

〔8〕上記〔1〕記載の低熱膨張線状体の製造方法において、前記繊維材料としてダイニーマを用いることを特徴とする。   [8] The method for producing a low thermal expansion linear body according to [1], wherein a dyneema is used as the fiber material.

〔9〕上記〔1〕記載の低熱膨張線状体の製造方法において、前記繊維材料に連続的な長い(数十m〜数Km)めっきを施すことを特徴とする。   [9] The method for producing a low thermal expansion linear body according to [1], wherein the fiber material is subjected to continuous long (several tens to several kilometers) plating.

〔10〕上記〔1〕記載の低熱膨張線状体の製造方法において、前記めっきは、無電解めっきを行った後に、電気めっきを行うことを特徴とする。   [10] The method for producing a low thermal expansion linear body according to [1], wherein the plating is performed after electroless plating.

本発明によれば、有機系新材料に導電性金属を連続的にめっきすることにより、数十m〜数Kmの長い導電性を有する低熱膨張線状体を得ることができる。   According to the present invention, a low thermal expansion linear body having a long conductivity of several tens to several kilometers can be obtained by continuously plating a conductive metal on a new organic material.

本発明の低熱膨張線状体の製造方法は、芯材として低熱膨張特性乃至負の線膨張係数を有する繊維材料を用意し、この繊維材料上に前記低熱膨張特性を有する、繊維材料よりは大きな線膨張係数で正の線膨張特性を持つ導電性材料をめっきする低熱膨張線状体の製造方法において、前記低熱膨張特性乃至負の線膨張係数を有する芯材としての繊維材料を送り出し用ボビンに巻いて送り出し、この送り出された前記繊維材料を電解液が入っためっき槽内に配置されるめっき治具に掛け渡し、前記めっき槽内で前記繊維材料に正の線膨張係数を持つ導電性材料をめっきし、このめっきされた低熱膨張線状体を巻取り用ボビンに巻き取る。   The method for producing a low thermal expansion linear body of the present invention is prepared by preparing a fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient as a core material, and having the low thermal expansion characteristic on the fiber material, which is larger than the fiber material. In a method for producing a low thermal expansion linear body that is plated with a conductive material having a positive linear expansion characteristic with a linear expansion coefficient, the fiber material as a core material having the low thermal expansion characteristic or a negative linear expansion coefficient is fed to a delivery bobbin. The conductive material having a positive linear expansion coefficient for the fiber material in the plating tank is wound around and delivered to the plating jig disposed in the plating tank containing the electrolytic solution. And the plated low thermal expansion linear body is wound on a winding bobbin.

以下、本発明の実施の形態について詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail.

図1は本発明の実施例を示す低熱膨張線状体の断面図である。   FIG. 1 is a sectional view of a low thermal expansion linear body showing an embodiment of the present invention.

この図において、1は負の線膨張係数を有する芯材としての繊維材料であり、例えばザイロンまたはダイニーマを用いることができる。2はその繊維材料1にめっきされる正の線膨張係数を持つ導電性材料であり、例えば銅が用いられる。   In this figure, 1 is a fiber material as a core material having a negative linear expansion coefficient, and for example, xylon or dyneema can be used. 2 is a conductive material having a positive linear expansion coefficient plated on the fiber material 1, and copper is used, for example.

図2は本発明の実施例を示す低熱膨張線状体の製造に用いる負の線膨張係数を有する芯材としての繊維材料を示す図、図3は本発明の実施例を示す低熱膨張線状体の製造装置を示す図、図4はその低熱膨張線状体の製造装置を用いて製造された低熱膨張線状体を示す図である。   FIG. 2 is a diagram showing a fiber material as a core material having a negative linear expansion coefficient used for manufacturing a low thermal expansion linear body showing an embodiment of the present invention, and FIG. 3 is a low thermal expansion linear configuration showing an embodiment of the present invention. The figure which shows the manufacturing apparatus of a body, FIG. 4 is a figure which shows the low thermal expansion linear body manufactured using the manufacturing apparatus of the low thermal expansion linear body.

図3において、11は送り出し用ボビン12に巻かれた負の線膨張係数を有する芯材としての繊維材料、13はめっき槽、14は電解液、15はめっき槽13内に配置されるめっき治具であり、このめっき治具15は、第1のローラ15Aと、第2のローラ15Bと、これらの第1のローラ15Aと第2のローラ15Bを回転自在に支持するローラの支持軸15Cとからなり、第1のローラ15Aと第2のローラ15Bはローラの支持軸15Cで支持されて電解液(例えば、Cu)14中に浸され上下に平行に配置される。16は正の線膨張係数を持つ導電性材料であるめっき用金属板(銅の板状体)であり、このめっき用金属板(銅の板状体)16には+の電圧が印加されるとともに、ローラの支持軸15Cは接地線17により接地される。19は、図4に示すように負の線膨張係数を有する芯材としての繊維材料11にCuめっき21が施された低熱膨張線状体18を巻き取る巻取り用ボビンである。また、20は繊維材料11とめっき治具15の接触部である。   In FIG. 3, 11 is a fiber material as a core material having a negative linear expansion coefficient wound around a delivery bobbin 12, 13 is a plating tank, 14 is an electrolytic solution, and 15 is a plating treatment disposed in the plating tank 13. The plating jig 15 includes a first roller 15A, a second roller 15B, and a support shaft 15C for a roller that rotatably supports the first roller 15A and the second roller 15B. The first roller 15A and the second roller 15B are supported by a support shaft 15C of the roller and are immersed in an electrolytic solution (for example, Cu) 14 and are arranged vertically in parallel. Reference numeral 16 denotes a plating metal plate (copper plate-like body) which is a conductive material having a positive linear expansion coefficient, and a positive voltage is applied to the plating metal plate (copper plate-like body) 16. At the same time, the roller support shaft 15 </ b> C is grounded by the ground wire 17. Reference numeral 19 denotes a winding bobbin that winds up the low thermal expansion linear body 18 in which the Cu plating 21 is applied to the fiber material 11 as a core material having a negative linear expansion coefficient as shown in FIG. Reference numeral 20 denotes a contact portion between the fiber material 11 and the plating jig 15.

なお、ここで、低熱膨張線状体の製造においては、電解液が入っためっき槽内に配置されるめっき用金属板16を正電極(電圧を印加)とし、第1のローラ15Aおよび第2のローラ15Bは接地電極とする。   Here, in the production of the low thermal expansion linear body, the plating metal plate 16 disposed in the plating tank containing the electrolytic solution is used as a positive electrode (voltage is applied), and the first roller 15A and the second roller The roller 15B is a ground electrode.

また、第1のローラ15Aおよび第2のローラ15Bと繊維材料11の接触圧を高め、導通を確保するようにしている。   Further, the contact pressure between the first roller 15A and the second roller 15B and the fiber material 11 is increased to ensure conduction.

そこで、(1)まず、図2に示すように、負の線膨張係数を有する繊維材料(例えば、ザイロンまたはダイニーマ)11を芯材として用意する。   Therefore, (1) First, as shown in FIG. 2, a fiber material (for example, Zyron or Dyneema) 11 having a negative linear expansion coefficient is prepared as a core material.

(2)次に、図3に示すように、その繊維材料11をめっき治具15にセットする。このとき、繊維材料11に捩れが起こらないようにする。捩れが起こったままめっき治具15にセットされると、単繊維の状態にめっきすることができなくなってしまうので注意が必要である。   (2) Next, as shown in FIG. 3, the fiber material 11 is set on a plating jig 15. At this time, the fiber material 11 is prevented from being twisted. If it is set on the plating jig 15 with twisting, it becomes impossible to plate in a single fiber state, so care must be taken.

(3)次いで、めっき治具15にセットされた負の膨張係数を有する繊維材料11をめっき槽13に浸して、正の線膨張係数を持つ導電性材料であるめっき用金属板(例えば、銅板状体)16をめっきする。つまり、めっき槽13では、電着させようとするめっき用金属板16(ここでは銅の板状体)と繊維材料11を電解液14中に浸す。次いで、めっき治具15を陰極、めっき用金属板16を陽極として、繊維材料11とめっき治具15の接触部20を回転させながら直流電流を流す。すると、図4に示すように、繊維材料11上にCuメッキ21を連続的に施すことが可能になり、任意の長さの低熱膨張線状体18が巻取り用ボビン19に巻き取られる。   (3) Next, the metal material for plating (for example, copper plate) which is a conductive material having a positive linear expansion coefficient is immersed in the plating tank 13 by immersing the fiber material 11 having a negative expansion coefficient set in the plating jig 15. (Shape) 16 is plated. That is, in the plating tank 13, the metal plate 16 for plating (here, a copper plate) and the fiber material 11 to be electrodeposited are immersed in the electrolytic solution 14. Next, using the plating jig 15 as a cathode and the plating metal plate 16 as an anode, a direct current is passed while rotating the contact portion 20 between the fiber material 11 and the plating jig 15. Then, as shown in FIG. 4, the Cu plating 21 can be continuously applied on the fiber material 11, and the low thermal expansion linear body 18 having an arbitrary length is wound on the winding bobbin 19.

ここで、めっきを行う際の条件としては、例えば電流密度を0.5〜3.0A/dm2 とする。 Here, as conditions for performing plating, for example, the current density is set to 0.5 to 3.0 A / dm 2 .

また、繊維材料11とめっき治具15の接触点20の回転により移動させる繊維材料の送り速度は、100〜300mm/minとする。   The feeding speed of the fiber material that is moved by the rotation of the contact point 20 between the fiber material 11 and the plating jig 15 is 100 to 300 mm / min.

このように、この実施例では、低熱膨張線状体の製造方法として、低熱膨張特性乃至負の線膨張係数を有する、芯材としての繊維材料を用意し、この繊維材料上に、この繊維材料よりは大きな線膨張係数で正の線膨張係数を持つ導電性材料を連続的にめっきする。   Thus, in this embodiment, as a method for producing a low thermal expansion linear body, a fiber material as a core material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared, and the fiber material is formed on the fiber material. A conductive material having a larger linear expansion coefficient and a positive linear expansion coefficient is continuously plated.

なお、上記実施例では、めっき槽13で直接めっきを行う例を示したが、あらかじめ無電解めっきを行った後に、電気めっきを行うようにしてもよい。   In the above embodiment, the example in which the plating is directly performed in the plating tank 13 has been described. However, electroplating may be performed after performing electroless plating in advance.

また、本発明は上記実施例に限定されるものではなく、本発明の趣旨に基づき種々の変形が可能であり、これらを本発明の範囲から排除するものではない。   Further, the present invention is not limited to the above-described embodiments, and various modifications can be made based on the gist of the present invention, and these are not excluded from the scope of the present invention.

本発明の低熱膨張線状体の製造方法は、トロリ線、ちょう吊線、電線、ケーブルやレールなどの線状体として利用される導電性を有する低熱膨張線状体の製造方法として利用可能である。   The method for producing a low thermal expansion linear body of the present invention can be used as a method for producing a low thermal expansion linear body having conductivity used as a linear body such as a trolley wire, a hanging wire, an electric wire, a cable or a rail. .

本発明の実施例を示す低熱膨張線状体の断面図である。It is sectional drawing of the low thermal expansion linear body which shows the Example of this invention. 本発明の実施例を示す低熱膨張線状体の製造に用いる負の線膨張係数を有する芯材としての繊維材料を示す図である。It is a figure which shows the fiber material as a core material which has a negative linear expansion coefficient used for manufacture of the low thermal expansion linear body which shows the Example of this invention. 本発明の実施例を示す低熱膨張線状体の製造装置を示す図である。It is a figure which shows the manufacturing apparatus of the low thermal expansion linear body which shows the Example of this invention. 本発明の低熱膨張線状体の製造装置を用いて製造された低熱膨張線状体を示す図である。It is a figure which shows the low thermal expansion linear body manufactured using the manufacturing apparatus of the low thermal expansion linear body of this invention. 従来の低熱膨張線状体の製造方法を示す図である。It is a figure which shows the manufacturing method of the conventional low thermal expansion linear body.

符号の説明Explanation of symbols

1 繊維材料(ザイロン、ダイニーマ)
2 繊維材料にめっきされる正の線膨張係数を持つ導電性材料(例えば銅)
11 負の線膨張係数を有する芯材としての繊維材料
12 送り出し用のボビン
13 めっき槽
14 電解液
15 めっき治具
15A 第1のローラ
15B 第2のローラ
15C ローラの支持軸
16 めっき用金属板(銅の板状体)
17 接地線
18 低熱膨張線状体
19 巻取り用ボビン
20 繊維材料とめっき治具の接触部
21 Cuメッキ
1 Textile materials (Zylon, Dyneema)
2 Conductive material with positive coefficient of linear expansion plated on fiber material (eg copper)
DESCRIPTION OF SYMBOLS 11 Fiber material as a core material which has a negative linear expansion coefficient 12 Bobbin for delivery 13 Plating tank 14 Electrolytic solution 15 Plating jig 15A 1st roller 15B 2nd roller 15C Roller support shaft 16 Metal plate for plating ( Copper plate)
17 Grounding wire 18 Low thermal expansion linear body 19 Winding bobbin 20 Contact portion between fiber material and plating jig 21 Cu plating

Claims (10)

芯材として低熱膨張特性乃至負の線膨張係数を有する繊維材料を用意し、該繊維材料上に前記低熱膨張特性を有する、繊維材料よりは大きな線膨張係数で正の線膨張係数を持つ導電性材料をめっきする低熱膨張線状体の製造方法において、
(a)前記低熱膨張特性乃至負の線膨張係数を有する芯材としての繊維材料を送り出し用のボビンに巻いて送り出し、
(b)該送り出された前記繊維材料を電解液が入っためっき槽内に配置されるめっき治具に掛け渡し、
(c)前記めっき槽内で前記繊維材料に正の線膨張係数を持つ導電性材料をめっきし、
(d)該めっきされた低熱膨張線状体を巻取り用ボビンに巻き取ることを特徴とする低熱膨張線状体の製造方法。
A fiber material having a low thermal expansion characteristic or a negative linear expansion coefficient is prepared as a core material, and the conductive material having the low thermal expansion characteristic on the fiber material and having a positive linear expansion coefficient with a larger linear expansion coefficient than the fiber material. In the manufacturing method of the low thermal expansion linear body plating the material,
(A) A fiber material as a core material having a low thermal expansion characteristic or a negative linear expansion coefficient is wound around a bobbin for sending out and sent out,
(B) The delivered fiber material is passed over a plating jig disposed in a plating tank containing an electrolytic solution,
(C) plating the fiber material with a conductive material having a positive coefficient of linear expansion in the plating tank;
(D) A method for producing a low thermal expansion linear body, wherein the plated low thermal expansion linear body is wound on a winding bobbin.
請求項1記載の低熱膨張線状体の製造方法において、前記めっき治具は、前記めっき槽内に配置される第1のローラと、第2のローラと、これらの第1のローラ及び第2のローラを回転自在に支持するローラの支持軸とを備えることを特徴とする低熱膨張線状体の製造方法。   2. The method for manufacturing a low thermal expansion linear body according to claim 1, wherein the plating jig includes a first roller, a second roller, a first roller, and a second roller disposed in the plating tank. A method for producing a low thermal expansion linear body, comprising: a support shaft of a roller that rotatably supports the roller. 請求項2記載の低熱膨張線状体の製造方法において、前記めっき槽内に前記繊維材料に正の線膨張係数を持つ導電性材料をめっきする金属板を備えることを特徴とする低熱膨張線状体の製造方法。   3. The method of manufacturing a low thermal expansion linear body according to claim 2, comprising a metal plate for plating a conductive material having a positive linear expansion coefficient on the fiber material in the plating tank. Body manufacturing method. 請求項3記載の低熱膨張線状体の製造方法において、前記金属板に正電極を備え、前記ローラを接地電極とすることを特徴とする低熱膨張線状体の製造方法。   4. The method for manufacturing a low thermal expansion linear body according to claim 3, wherein the metal plate is provided with a positive electrode, and the roller is used as a ground electrode. 請求項2記載の低熱膨張線状体の製造方法において、前記ローラと前記繊維材料の接触圧を高め、電気的導通を確保することを特徴とする低熱膨張線状体の製造方法。   The method for producing a low thermal expansion linear body according to claim 2, wherein the contact pressure between the roller and the fiber material is increased to ensure electrical conduction. 請求項3記載の低熱膨張線状体の製造方法において、前記金属板が銅であることを特徴とする低熱膨張線状体の製造方法。   4. The method for manufacturing a low thermal expansion linear body according to claim 3, wherein the metal plate is copper. 請求項1記載の低熱膨張線状体の製造方法において、前記繊維材料としてザイロンを用いることを特徴とする低熱膨張線状体の製造方法。   2. The method for producing a low thermal expansion linear body according to claim 1, wherein zylon is used as the fiber material. 請求項1記載の低熱膨張線状体の製造方法において、前記繊維材料としてダイニーマを用いることを特徴とする低熱膨張線状体の製造方法。   2. The method for producing a low thermal expansion linear body according to claim 1, wherein dynea is used as the fiber material. 請求項1記載の低熱膨張線状体の製造方法において、前記繊維材料に連続的な長い(数十m〜数Km)めっきを施すことを特徴とする低熱膨張線状体の製造方法。   2. The method for producing a low thermal expansion linear body according to claim 1, wherein the fiber material is subjected to continuous long (several tens to several kilometers) plating. 請求項1記載の低熱膨張線状体の製造方法において、前記めっきは、無電解めっきを行った後に、電気めっきを行うことを特徴とする低熱膨張線状体の製造方法。   2. The method for producing a low thermal expansion linear body according to claim 1, wherein the plating is performed by electroless plating after electroless plating.
JP2007248889A 2007-09-26 2007-09-26 Manufacturing method for low thermal expansion linear body Pending JP2009081028A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007248889A JP2009081028A (en) 2007-09-26 2007-09-26 Manufacturing method for low thermal expansion linear body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007248889A JP2009081028A (en) 2007-09-26 2007-09-26 Manufacturing method for low thermal expansion linear body

Publications (1)

Publication Number Publication Date
JP2009081028A true JP2009081028A (en) 2009-04-16

Family

ID=40655623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007248889A Pending JP2009081028A (en) 2007-09-26 2007-09-26 Manufacturing method for low thermal expansion linear body

Country Status (1)

Country Link
JP (1) JP2009081028A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129092A (en) * 2010-12-16 2012-07-05 Railway Technical Research Institute Method for manufacturing composite electric wire

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117243A (en) * 1976-03-29 1977-10-01 Showa Electric Wire & Cable Co Device for electoplating metal wire
JPH01142449U (en) * 1988-03-25 1989-09-29
JP2003129373A (en) * 2001-10-22 2003-05-08 Mitsubishi Materials Corp Metal-coated fiber article and method for producing the same
JP2006085915A (en) * 2004-09-14 2006-03-30 Railway Technical Res Inst Linear body whose thermal expansion is small and manufacturing method therefor
JP2006085914A (en) * 2004-09-14 2006-03-30 Railway Technical Res Inst Linear body with small thermal expansion and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117243A (en) * 1976-03-29 1977-10-01 Showa Electric Wire & Cable Co Device for electoplating metal wire
JPH01142449U (en) * 1988-03-25 1989-09-29
JP2003129373A (en) * 2001-10-22 2003-05-08 Mitsubishi Materials Corp Metal-coated fiber article and method for producing the same
JP2006085915A (en) * 2004-09-14 2006-03-30 Railway Technical Res Inst Linear body whose thermal expansion is small and manufacturing method therefor
JP2006085914A (en) * 2004-09-14 2006-03-30 Railway Technical Res Inst Linear body with small thermal expansion and manufacturing method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129092A (en) * 2010-12-16 2012-07-05 Railway Technical Research Institute Method for manufacturing composite electric wire

Similar Documents

Publication Publication Date Title
KR19990022736A (en) Wire manufacturing method
TW201515748A (en) Electrode wire for wire electric discharge machining, and method for producing same
JPS629679B2 (en)
RU2136787C1 (en) Copper wire and method of production of copper wire
JP2009081028A (en) Manufacturing method for low thermal expansion linear body
JP2019049077A (en) Method of producing carbon nanotube wire
JP6399668B1 (en) Fiber conductor, fiber electric wire and manufacturing method thereof
KR101271980B1 (en) Method of manufacturing iron and nickel alloy substrate having cnt and resin layers for oled
JP5888732B2 (en) Electroplating method and plating apparatus
US20220223314A1 (en) Carbon-nanotubes copper composite conductors
JP2017526105A (en) Manufacturing of litz wire
JP2011113848A (en) Flat type electric wire, method of manufacturing flat type electric wire, flat type insulated wire, and method of manufacturing flat type insulated wire
JPH01255686A (en) Production of metallic porous body
CN209097918U (en) A kind of electro-deposition diamond wire equipment bobbin winder device
KR101353619B1 (en) Method of manufacturing iron and nickel alloy substrate coated with resin for oled
JP5619591B2 (en) Magnet wire manufacturing method and magnet wire manufacturing apparatus
TW201124565A (en) Device for plating carbon fiber and method the same
TWI640652B (en) Process for producing a wire made of a first metal and having a sheath layer made of a second metal
JP2001355091A (en) Electrolytic copper foil manufacturing device
CN210030923U (en) Tool for processing aluminum plate
CN210237828U (en) Auxiliary anode hanger with double leads
JP7194658B2 (en) conductive wire
CN213691547U (en) Tinned copper foil wire stranded wire
JP2637493B2 (en) Metal fiber and method for producing the same
JPH02189811A (en) Conductor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100219

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121010

A131 Notification of reasons for refusal

Effective date: 20121106

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121225

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130507