JP2009044770A - Multilayer wiring board, and imaging device - Google Patents

Multilayer wiring board, and imaging device Download PDF

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JP2009044770A
JP2009044770A JP2008289635A JP2008289635A JP2009044770A JP 2009044770 A JP2009044770 A JP 2009044770A JP 2008289635 A JP2008289635 A JP 2008289635A JP 2008289635 A JP2008289635 A JP 2008289635A JP 2009044770 A JP2009044770 A JP 2009044770A
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wiring board
multilayer wiring
light
image sensor
surface portion
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JP4828592B2 (en
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Mamoru Miyashita
守 宮下
Hiroki Ota
宏樹 太田
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Fujifilm Corp
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Fujifilm Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board on which multiple components are overlappingly mounted with suppressed influence of noise, and an imaging device provided with the multilayer wiring board. <P>SOLUTION: A CCD image sensor 52 is disposed on a second surface 46 and is electrically connected to the second surface 46 by terminals 52A. The CCD image sensor 52, which is sufficiently large to cover a light-transmitting window 48, is disposed to cover the light-transmitting window 48, with a light-receiving surface 53 facing the second surface 46, to receiving light coming in from the light-transmitting window 48. A first circuit 54 is disposed at one corner of a first surface 44 and is electrically connected to the first surface 44 by terminals 54. The first circuit 54 is disposed so as to partly overlap the CCD image sensor 52. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、多層配線基板、及び撮像装置に係り、特に複数の部品が重ねて実装される多層配線基板、及び前記多層配線基板を備えた撮像装置に関する。   The present invention relates to a multilayer wiring board and an imaging apparatus, and more particularly to a multilayer wiring board on which a plurality of components are stacked and mounted, and an imaging apparatus including the multilayer wiring board.

従来より、基板にＩＣなどの部品を実装する場合、限られた基板面に複数の部品を実装するために、部品を２段、３段に重ねて実装することが行われている。（特許文献１、２参照）。しかしながら、特許文献１、２にも示されているように、部品を２段、３段に重ねて実装する際には、上に重ねた部品の端子を基板までワイヤーなどで配線する必要がある。したがって、ワイヤへのノイズの影響が問題となる。
特開２０００−１５０６９９号公報 特開平６−３４２８７５号公報 Conventionally, when a component such as an IC is mounted on a substrate, in order to mount a plurality of components on a limited substrate surface, the components are stacked in two or three stages. (See Patent Documents 1 and 2). However, as shown in Patent Documents 1 and 2, when mounting components in two or three stages, it is necessary to wire the terminals of the superimposed components to the board with a wire or the like. . Therefore, the influence of noise on the wire becomes a problem.
JP 2000-150699 A JP-A-6-342875

本発明は、上記事実を考慮して成されたものであり、複数の部品を重ねて基板に実装する際におけるノイズの影響を抑制可能な多層配線基板、この多層配線基板への部品実装方法、及びこの多層配線基板を備えた撮像装置を提供することを目的とする。   The present invention has been made in consideration of the above facts, a multilayer wiring board capable of suppressing the influence of noise when a plurality of components are stacked and mounted on the board, a component mounting method on this multilayer wiring board, An object of the present invention is to provide an imaging device including the multilayer wiring board.

上記課題を解決するために、本発明の多層配線基板は、請求項１に記載のように、光を透過可能な光透過窓の形成された第１の積層部と、前記第１の積層部に重ねて配置されると共に前記光透過窓からの光を透過可能とする位置に開口部が形成され、前記第１の積層部との間で段差を構成する第２の積層部と、を含んで構成されている。   In order to solve the above-described problems, a multilayer wiring board according to the present invention includes, as described in claim 1, a first laminated portion in which a light transmission window capable of transmitting light is formed, and the first laminated portion. And an opening is formed at a position that allows light from the light transmission window to pass therethrough, and a second stacked portion that forms a step with the first stacked portion. It consists of

この構成では、光透過窓と開口部とにより第１の積層部と第２の積層部との間に段差が構成され、互いに向き合う側の少なくとも一方の面が露出される。したがって、露出した面に部品を配置できると共に、段差を利用して外側の段を構成する面にこの部品と重なるように他の部品を実装することができる。これにより、複数の部品をワイヤなどによる配線なしで基板面に接続することができ、複数の部品を重ねて多層配線基板に実装する際におけるノイズの影響を抑制することができる。また、第１の積層部には、光透過窓が構成されているので、第１の積層部にイメージセンサなどの受光が必要な部品を実装しても光透過窓から当該部品の受光面へ光を入射させることができる。また、第１の積層部、第１の積層部に部品を実装した後の、部品を含めた多層配線基板の厚みを薄くすることができる。また、複数の部品を重ねて多層配線基板に実装することにより、複数の部品を平置きした場合と比較して、多層配線基板の面積を小さくすることができる。   In this configuration, a step is formed between the first laminated portion and the second laminated portion by the light transmission window and the opening, and at least one surface on the side facing each other is exposed. Therefore, the components can be arranged on the exposed surface, and other components can be mounted on the surface constituting the outer step by using the step so as to overlap the component. As a result, a plurality of components can be connected to the substrate surface without wires such as wires, and the influence of noise when the plurality of components are stacked and mounted on the multilayer wiring substrate can be suppressed. In addition, since the light transmission window is configured in the first laminated portion, even if a component that needs to receive light such as an image sensor is mounted on the first laminated portion, the light transmission window leads to the light receiving surface of the component. Light can be incident. Moreover, the thickness of the multilayer wiring board including the components after mounting the components on the first stacked portion and the first stacked portion can be reduced. In addition, by stacking a plurality of components and mounting them on the multilayer wiring board, the area of the multilayer wiring board can be reduced as compared with the case where the plurality of components are placed flat.

なお、第１の積層部及び第２の積層部は、各々、複数の基板を積層して構成されたものでも、単層で構成されたものでもよい。   Each of the first stacked unit and the second stacked unit may be configured by stacking a plurality of substrates or may be configured by a single layer.

請求項２に記載の撮像装置は、光を透過可能な光透過窓の形成された第１の積層部と、前記第１の積層部に重ねて配置されると共に前記光透過窓からの光を透過可能とする位置に開口部が形成され、前記第１の積層部との間で段差を構成する第２の積層部と、を含む多層配線基板と、前記第１の積層部または第２の積層部に前記光透過窓及び開口部からの光を受光可能に実装されたイメージセンサと、前記光透過窓を通して前記イメージセンサの受光面へ被写体からの光を結合可能な位置に配置されたレンズユニットと、を備えている。   The imaging apparatus according to claim 2, wherein the first laminated portion in which a light transmissive window capable of transmitting light is formed and the first laminated portion are arranged so as to overlap with the first laminated portion, and light from the light transmissive window is received. A multilayer wiring board including an opening formed at a position where transmission is possible, and a second stacked unit that forms a step with the first stacked unit, and the first stacked unit or the second stacked unit An image sensor mounted on the laminated portion so as to be able to receive light from the light transmission window and the opening, and a lens disposed at a position where light from a subject can be coupled to the light receiving surface of the image sensor through the light transmission window And a unit.

本発明の撮像装置には、多層配線基板が用いられている。この多層配線基板の第１の積層部または第２の積層部には光透過窓及び開口部からの光を受光可能にイメージセンサが実装されている。そして、レンズユニットは、光透過窓を通してイメージセンサの受光面へ被写体からの光を結合可能な位置、すなわち、多層配線基板の光透過窓を挟んでイメージセンサと反対側に配置されている。   The imaging device of the present invention uses a multilayer wiring board. An image sensor is mounted on the first laminated portion or the second laminated portion of the multilayer wiring board so as to receive light from the light transmission window and the opening. The lens unit is disposed at a position where the light from the subject can be coupled to the light receiving surface of the image sensor through the light transmission window, that is, on the side opposite to the image sensor across the light transmission window of the multilayer wiring board.

この構成によれば、第１の積層部と第２の積層部との間の段差を利用してイメージセンサに他の部品を重ねてワイヤなどによる配線なしで実装することができる。したがって、複数の部品を重ねて多層配線基板に実装する際におけるノイズの影響を抑制することができる。また、第１の積層部及び第２の積層部には光透過窓及び開口部が構成されているので、光透過窓及び開口部からイメージセンサの受光面へ光を入射させることができる。   According to this configuration, it is possible to mount another component on the image sensor by using the step between the first stacked unit and the second stacked unit without wiring using a wire or the like. Therefore, it is possible to suppress the influence of noise when a plurality of components are stacked and mounted on the multilayer wiring board. In addition, since the light transmissive window and the opening are formed in the first laminated portion and the second laminated portion, light can be incident on the light receiving surface of the image sensor from the light transmissive window and the opened portion.

さらに、部品、イメージセンサ、及びレンズユニットを実装した後の部品を含めた多層配線基板の厚みを薄くすることができる。また、複数の部品を重ねて多層配線基板に実装することにより、複数の部品を平置きした場合と比較して、多層配線基板の面積を小さくすることができる。   Furthermore, the thickness of the multilayer wiring board including the parts after mounting the parts, the image sensor, and the lens unit can be reduced. In addition, by stacking a plurality of components and mounting them on the multilayer wiring board, the area of the multilayer wiring board can be reduced as compared with the case where the plurality of components are placed flat.

以上説明したように、本発明の多層配線基板、及び、撮像装置によれば、複数の部品を重ねて多層配線基板に実装する際に、ワイヤなどによる配線が不要なので、ワイヤなどへのノイズの影響を回避することができる。また、第１の積層部には、光透過窓が構成されているので、第１の積層部にイメージセンサなどの受光が必要な部品を実装しても光透過窓から当該部品の受光面へ光を入射させることができる。また、複数の部品を重ねて多層配線基板に実装する際におけるノイズの影響を抑制することができ、さらに、複数の部品を重ねて多層配線基板に実装することにより、複数の部品を平置きした場合と比較して、多層配線基板の面積を小さくすることができる。   As described above, according to the multilayer wiring board and the imaging apparatus of the present invention, when a plurality of components are stacked and mounted on the multilayer wiring board, wiring by a wire or the like is not necessary, so that noise to the wire or the like is reduced. The influence can be avoided. In addition, since the light transmission window is configured in the first laminated portion, even if a component that needs to receive light such as an image sensor is mounted on the first laminated portion, the light transmission window leads to the light receiving surface of the component. Light can be incident. In addition, it is possible to suppress the influence of noise when mounting multiple components on a multilayer wiring board, and by mounting multiple components on a multilayer wiring board, multiple components are placed flat Compared to the case, the area of the multilayer wiring board can be reduced.

［第１実施形態］
以下、図面を参照して本発明の多層配線基板、部品実装方法、及び、撮像装置の第１実施形態について説明する。本実施形態では、撮像装置としてデジタルカメラを例に説明する。 [First Embodiment]
Hereinafter, a multilayer wiring board, a component mounting method, and a first embodiment of an imaging apparatus according to the present invention will be described with reference to the drawings. In the present embodiment, a digital camera will be described as an example of the imaging device.

本発明に係るデジタルカメラ１０は、図１に示すように、筐体１２を備え、前面にレンズ１３を含んで構成されるレンズユニット１４、上面にシャッタボタン１６を備える。図２に、デジタルカメラ１０の制御系の概略ブロック図を示す。デジタルカメラ１０は、操作部２０、ＣＣＤイメージセンサ５２、ＬＣＤ２４、ＣＰＵ２６、ドライバ回路２８、メディアＩ／Ｆ３０（外部メディア３１にアクセス可能とされている）、内蔵メモリ３２、通信Ｉ／Ｆ３４を備える。ドライバ回路２８は、レンズユニット１４と接続されており、レンズユニット１４を駆動させる駆動信号を送信可能とされている。操作部２０、ＣＣＤイメージセンサ５２、ＬＣＤ２４、ＣＰＵ２６、ドライバ回路２８、メディアＩ／Ｆ３０、内蔵メモリ３２、通信Ｉ／Ｆ３４、及びシャッタボタン１６は、バス３６を介して各々接続されている。   As shown in FIG. 1, the digital camera 10 according to the present invention includes a housing 12, a lens unit 14 including a lens 13 on the front surface, and a shutter button 16 on the upper surface. FIG. 2 is a schematic block diagram of the control system of the digital camera 10. The digital camera 10 includes an operation unit 20, a CCD image sensor 52, an LCD 24, a CPU 26, a driver circuit 28, a media I / F 30 (accessible to the external media 31), a built-in memory 32, and a communication I / F 34. The driver circuit 28 is connected to the lens unit 14 and can transmit a drive signal for driving the lens unit 14. The operation unit 20, CCD image sensor 52, LCD 24, CPU 26, driver circuit 28, media I / F 30, built-in memory 32, communication I / F 34, and shutter button 16 are connected via a bus 36.

デジタルカメラ１０の内部には、多層配線基板４０が備えられている。多層配線基板４０は、図３に示すように、片側の面に、板厚方向の最も外側の面を構成する四角枠状の最外側面部４２、最外側面部４２の枠の内側に構成され、最外側面部４２よりも多層配線基板４０の板厚方向の内側に位置する四角枠状の第１面部４４、第１面部４４の枠の内側に構成され、第１面部４４よりも多層配線基板４０の板厚方向の内側に位置する四角枠状の第２面部４６を備える。したがって、多層配線基板４０の片側面には、最外側面部４２、第１面部４４及び第２面部４６が各々段差を有し、階段状の層構造とされている。この段差は、後述するＣＣＤイメージセンサ５２の厚みよりも高い段差とされている。第２面部４６には、第２面部４６の中央部が貫通された光透過窓４８が構成されている。また、多層配線基板４０の最外側面部４２、第１面部４４、第２面部４６の背面側には、裏面部５０が構成されている。   Inside the digital camera 10, a multilayer wiring board 40 is provided. As shown in FIG. 3, the multilayer wiring board 40 is configured on the inner side of the frame of the outermost surface portion 42 in the form of a square frame that forms the outermost surface in the thickness direction on one surface, A rectangular frame-shaped first surface portion 44 located on the inner side in the plate thickness direction of the multilayer wiring board 40 with respect to the outermost surface portion 42, is configured inside the frame of the first surface portion 44, and the multilayer wiring substrate 40 is more than the first surface portion 44. A square frame-like second surface portion 46 located inside the plate thickness direction is provided. Accordingly, the outermost surface portion 42, the first surface portion 44, and the second surface portion 46 are stepped on one side surface of the multilayer wiring board 40, thereby forming a stepped layer structure. This step is higher than the thickness of the CCD image sensor 52 described later. The second surface portion 46 includes a light transmission window 48 through which the central portion of the second surface portion 46 passes. Further, a back surface portion 50 is formed on the back surface side of the outermost surface portion 42, the first surface portion 44, and the second surface portion 46 of the multilayer wiring board 40.

図４、図５、及び図６に示すように、多層配線基板４０には、ＣＣＤイメージセンサ５２、第１回路５４、ドライバ回路２８、レンズユニット１４、フレキシブル基板５６、複数の抵抗やコンデンサなどを含む表面部品５８、及び複数の抵抗やコンデンサなどを含む裏面部品６０が実装されている。   4, 5, and 6, the multilayer wiring board 40 includes a CCD image sensor 52, a first circuit 54, a driver circuit 28, a lens unit 14, a flexible board 56, a plurality of resistors and capacitors, and the like. A front surface component 58 including a back surface component 60 including a plurality of resistors and capacitors is mounted.

ＣＣＤイメージセンサ５２は、第２面部４６に配置され、その端子５２Ａは第２面部４６で電気的に接続されている。ＣＣＤイメージセンサ５２は、光透過窓４８をカバー可能なサイズとされ、その受光面５３が第２面部４６と向き合う方向で光透過窓４８を塞ぐように配置され、光透過窓４８からの光を受光可能とされている。   The CCD image sensor 52 is disposed on the second surface portion 46, and the terminal 52 </ b> A is electrically connected to the second surface portion 46. The CCD image sensor 52 is sized to cover the light transmission window 48, and is disposed so that the light receiving surface 53 closes the light transmission window 48 in a direction facing the second surface portion 46. Light reception is possible.

第１回路５４は、第１面部４４の１つの角に配置され、その端子５４Ａは第１面部４４で電気的に接続されている。端子５４Ａは、第１回路５４の一端領域に配置され、他端領域は、ＣＣＤイメージセンサ５２とは非接触でＣＣＤイメージセンサ５２と重なり合う位置に配置されている。   The first circuit 54 is disposed at one corner of the first surface portion 44, and the terminal 54 </ b> A is electrically connected to the first surface portion 44. The terminal 54 </ b> A is disposed in one end region of the first circuit 54, and the other end region is disposed in a position where it does not contact the CCD image sensor 52 and overlaps the CCD image sensor 52.

ドライバ回路２８は、第１面部４４の第１回路５４が配置された角の対角線上にある角に配置され、その端子２８Ａは第１面部４４で電気的に接続されている。端子２８Ａは、ドライバ回路２８の一端領域に配置され、他端領域は、ＣＣＤイメージセンサ５２とは非接触でＣＣＤイメージセンサ５２と重なり合う位置に配置されている。   The driver circuit 28 is disposed at a corner on a diagonal line of the corner where the first circuit 54 of the first surface portion 44 is disposed, and the terminal 28 </ b> A is electrically connected to the first surface portion 44. The terminal 28 </ b> A is disposed in one end region of the driver circuit 28, and the other end region is disposed in a position where it does not contact the CCD image sensor 52 and overlaps the CCD image sensor 52.

フレキシブル基板５６は、最外側面部４２に、第１面部４４及び第２面部４６を覆うように配置され、その一端部端子（図示省略）は最外側面部４２で電気的に接続されている。フレキシブル基板５６の最外側面部４２と逆側の面は、アルミ層５７でシールドされている。フレキシブル基板５６の他端部端子（図示省略）は、他の基板（図示省略）やＬＣＤと接続されている。   The flexible substrate 56 is disposed on the outermost surface portion 42 so as to cover the first surface portion 44 and the second surface portion 46, and one end terminal (not shown) is electrically connected to the outermost surface portion 42. The surface opposite to the outermost surface portion 42 of the flexible substrate 56 is shielded by an aluminum layer 57. The other end terminal (not shown) of the flexible substrate 56 is connected to another substrate (not shown) and the LCD.

レンズユニット１４は、裏面部５０の光透過窓４８を挟んでＣＣＤイメージセンサ５２と向き合う位置に配置されており、その端子（図示省略）は裏面部５０で電気的に接続されている。レンズユニット１４から出力される光は、光透過窓４８を透過してＣＣＤイメージセンサ５２の受光面５３に結像可能とされている。光透過窓４８のレンズユニット１４側には、光透過窓４８を覆うように、光を透過可能なカバーガラス４９が配置されている。   The lens unit 14 is disposed at a position facing the CCD image sensor 52 across the light transmission window 48 of the back surface portion 50, and its terminal (not shown) is electrically connected at the back surface portion 50. The light output from the lens unit 14 can pass through the light transmission window 48 and form an image on the light receiving surface 53 of the CCD image sensor 52. A cover glass 49 capable of transmitting light is arranged on the lens unit 14 side of the light transmission window 48 so as to cover the light transmission window 48.

表面部品５８は、第１面部４４の、第１回路５４及びドライバ回路２８が配置されていない位置に配置され、その端子（図示省略）は第１面部４４に電気的に接続されている。また、裏面部品６０は、裏面部５０に配置され、その端子（図示省略）は裏面部５０に電気的に接続されている。   The surface component 58 is disposed on the first surface portion 44 at a position where the first circuit 54 and the driver circuit 28 are not disposed, and its terminal (not shown) is electrically connected to the first surface portion 44. Further, the back surface component 60 is disposed on the back surface portion 50, and its terminal (not shown) is electrically connected to the back surface portion 50.

上記構成の多層配線基板４０への各部品の実装は、図７示す手順で行うことにより、容易に複数の部品を重ねて実装することができる。   Each component can be mounted on the multilayer wiring board 40 having the above configuration by the procedure shown in FIG.

まず、図７（Ａ）に示すように、多層配線基板４０の第２面部４６へ、光透過窓４８を塞ぐようにＣＣＤイメージセンサ５２を実装する。このとき、ＣＣＤイメージセンサ５２の受光面を光透過窓４８側へ向ける。次に、図７（Ｂ）に示すように、裏面部５０へ裏面部品６０を実装すると共に、カバーガラス４９を光透過窓４８を塞ぐように配置し、ＣＣＤイメージセンサ５２の受光面を封止する。次に、図７（Ｃ）に示すように、第１面部４４へ第１回路５４及びドライバ回路２８を実装する。次に、最外側面部４２へフレキシブル基板を配置し、その外側をアルミ層５７でシールドする。そして、図７（Ｄ）に示すように、裏面部５０へレンズユニット１４を実装する。   First, as shown in FIG. 7A, a CCD image sensor 52 is mounted on the second surface portion 46 of the multilayer wiring board 40 so as to close the light transmission window 48. At this time, the light receiving surface of the CCD image sensor 52 is directed to the light transmission window 48 side. Next, as shown in FIG. 7B, the back surface component 60 is mounted on the back surface portion 50, and the cover glass 49 is disposed so as to close the light transmission window 48, and the light receiving surface of the CCD image sensor 52 is sealed. To do. Next, as shown in FIG. 7C, the first circuit 54 and the driver circuit 28 are mounted on the first surface portion 44. Next, a flexible substrate is disposed on the outermost surface portion 42, and the outside is shielded with the aluminum layer 57. Then, as shown in FIG. 7D, the lens unit 14 is mounted on the back surface portion 50.

上記構成によれば、第１面部４４と第２面部４６との間に段差が付けられているので、第１回路５４及びドライバ回路２８の一部分を第１面部４４上に配置しながら他部分をＣＣＤイメージセンサ５２に非接触で重ねて配置することができ、第１回路５４及びドライバ回路２８の端子をワイヤなしで第１面部４４と電気的に接続させることができる。したがって、第１回路５４及びドライバ回路２８の端子を第２面部４６まで配線する必要がなく、配線に用いられるワイヤなどへのノイズの影響も回避できる。   According to the above configuration, a step is provided between the first surface portion 44 and the second surface portion 46, so that other portions are disposed while part of the first circuit 54 and the driver circuit 28 are disposed on the first surface portion 44. The terminals of the first circuit 54 and the driver circuit 28 can be electrically connected to the first surface portion 44 without wires. Therefore, it is not necessary to wire the terminals of the first circuit 54 and the driver circuit 28 to the second surface portion 46, and the influence of noise on the wires used for the wiring can be avoided.

また、上記構成によれば、複数の部品が重ねて多層配線基板４０に実装されるので、複数の部品を平置きした場合と比較して、多層配線基板４０の面積を小さくすることができる。   Further, according to the above configuration, since a plurality of components are stacked and mounted on the multilayer wiring substrate 40, the area of the multilayer wiring substrate 40 can be reduced as compared with the case where the plurality of components are placed flat.

また、上記構成によれば、多層配線基板４０の厚み方向の内側にＣＣＤイメージセンサ５２、第１回路５４、及びドライバ回路２８を配置したので、これらを多層配線基板４０の最外側面部４２に配置した場合と比較して、第１回路５４やドライバ回路などの実装部品を含めた多層配線基板４０の厚みを薄くすることができる。   Further, according to the above configuration, the CCD image sensor 52, the first circuit 54, and the driver circuit 28 are disposed inside the multilayer wiring board 40 in the thickness direction, so that these are disposed on the outermost surface portion 42 of the multilayer wiring board 40. Compared with the case where it does, the thickness of the multilayer wiring board 40 including mounting components, such as the 1st circuit 54 and a driver circuit, can be made thin.

また、上記構成によれば、多層配線基板４０に光透過窓４８を構成し、ＣＣＤイメージセンサ５２を多層配線基板４０の光透過窓４８を挟んで光の入射される方向と逆側に配置したので、ＣＣＤイメージセンサ５２は多層配線基板４０の第２面部４６部分の厚み分だけレンズ１３から離れた位置に配置されることになる。ここで、デジタルカメラ１０において、レンズ１３とＣＣＤイメージセンサ５２の受光面５３との間の距離は、受光面５３のサイズに依存して決定されている。そこで、前述のように、ＣＣＤイメージセンサ５２を配置すると、多層配線基板４０の第１面部４４部分の厚み分がこの距離に吸収される。したがって、レンズユニット１４を含めた部品実装後の多層配線基板４０の厚みを、ＣＣＤイメージセンサ５２を多層配線基板４０の裏面部５０側に配置した場合と比較して、薄くすることができる。このような配置とすることで、レンズユニット１４の樹脂部を特殊形状としてレンズ１３とＣＣＤイメージセンサ５２との距離を短くする必要がなく、汎用のレンズユニットを容易に利用することができる。   Further, according to the above configuration, the light transmission window 48 is formed on the multilayer wiring board 40, and the CCD image sensor 52 is arranged on the opposite side to the light incident direction with the light transmission window 48 of the multilayer wiring board 40 interposed therebetween. Therefore, the CCD image sensor 52 is arranged at a position away from the lens 13 by the thickness of the second surface portion 46 portion of the multilayer wiring board 40. Here, in the digital camera 10, the distance between the lens 13 and the light receiving surface 53 of the CCD image sensor 52 is determined depending on the size of the light receiving surface 53. Therefore, as described above, when the CCD image sensor 52 is arranged, the thickness of the first surface portion 44 portion of the multilayer wiring board 40 is absorbed by this distance. Therefore, the thickness of the multilayer wiring board 40 after mounting the components including the lens unit 14 can be made thinner as compared with the case where the CCD image sensor 52 is arranged on the back surface portion 50 side of the multilayer wiring board 40. With such an arrangement, it is not necessary to shorten the distance between the lens 13 and the CCD image sensor 52 with the resin portion of the lens unit 14 having a special shape, and a general-purpose lens unit can be easily used.

また、本実施形態では、最外側面部４２を設け、第１回路５４及びドライバ回路２８の厚みも吸収しているので、最外側面部４２に容易にアルミ層５７でシールドすることができる。   In this embodiment, since the outermost surface portion 42 is provided and the thicknesses of the first circuit 54 and the driver circuit 28 are absorbed, the outermost surface portion 42 can be easily shielded by the aluminum layer 57.

なお、本実施形態では、デジタルカメラ１０を例にして説明したが、本発明に係る撮像装置としてはデジタルカメラに限定されるものではなく、デジタルビデオカメラや、カメラ付き携帯電話なども含まれる。カメラ付き携帯電話としては、例えば図８に示すように、ディスプレイ８１、スピーカ８２、マイク８３、各種操作ボタン８４、カメラ８５等を備えた一般的なものに、本発明の多層配線基板４０を適用することができる。   In the present embodiment, the digital camera 10 has been described as an example. However, the imaging apparatus according to the present invention is not limited to a digital camera, and includes a digital video camera, a mobile phone with a camera, and the like. As a mobile phone with a camera, for example, as shown in FIG. 8, the multilayer wiring board 40 of the present invention is applied to a general phone having a display 81, a speaker 82, a microphone 83, various operation buttons 84, a camera 85, and the like. can do.

また、本実施形態では、イメージセンサとしてＣＣＤイメージセンサ５２を用いた例について説明したが、イメージセンサとしてはＣＣＤイメージセンサに限定されるものではない。ＣＭＯＳイメージセンサなど、他のデバイスであってもよい。   In this embodiment, an example in which the CCD image sensor 52 is used as the image sensor has been described. However, the image sensor is not limited to the CCD image sensor. Other devices such as a CMOS image sensor may be used.

また、本実施形態では、多層配線基板４０に、最外側面部４２、第１面部４４、及び第２面部４６の３つの面部を構成した例について説明したが、面部は２つでも、４つ以上でもよい。   Further, in the present embodiment, the example in which the three surface portions of the outermost surface portion 42, the first surface portion 44, and the second surface portion 46 are configured on the multilayer wiring board 40 has been described. However, the number of the surface portions is two or four or more. But you can.

なお、本発明の多層配線基板は、セラミック基板であることが好ましい。ガラスエポキシ基板の場合には、板状の基板の面を削って凹部を形成する必要があり、このようにして形成された凹部の断面からは、削りゴミが発生しやすい。セラミック基板であれば、成形の自由度が高いため型抜きにより凹部を形成することができ、削りゴミの発生を防止できるからである。   The multilayer wiring board of the present invention is preferably a ceramic substrate. In the case of a glass epoxy substrate, it is necessary to scrape the surface of the plate-shaped substrate to form a recess, and scraped dust is likely to be generated from the cross section of the recess thus formed. This is because if the ceramic substrate is used, the degree of freedom in forming is high, so that the concave portion can be formed by punching, and the generation of shaving dust can be prevented.

［第２実施形態］
次に、本発明の多層配線基板、部品実装方法、及び、撮像装置の第２実施形態について説明する。本実施形態では、第１実施形態と同様の部分については同一の符号を付して、詳細な説明は省略する。 [Second Embodiment]
Next, a multilayer wiring board, a component mounting method, and a second embodiment of the imaging apparatus according to the present invention will be described. In the present embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

本実施形態の多層配線基板は、第１実施形態の多層配線基板と同様に、デジタルカメラ、デジタルビデオカメラ、カメラ付携帯電話などの、撮像装置に使用することができる。   The multilayer wiring board of this embodiment can be used for an imaging device such as a digital camera, a digital video camera, a camera-equipped mobile phone, and the like, similarly to the multilayer wiring board of the first embodiment.

図９に示すように、多層配線基板６１は、９つの層（図９の上側から順に、第１層６２Ａ〜第９層６２Ｉ）が積層されて構成されている。   As shown in FIG. 9, the multilayer wiring board 61 is configured by stacking nine layers (first layer 62A to ninth layer 62I in order from the upper side of FIG. 9).

第１層６２Ａ及び第２層６２Ｂは同一形状とされ（以下これらをまとめて「第１段６２α」という）、これらの中央部に光を透過可能な光透過窓４８が構成されている。第１層６２Ａの第２層６２Ｂの重ねられていない側には、裏面部５０が構成されている。   The first layer 62A and the second layer 62B have the same shape (hereinafter collectively referred to as “first stage 62α”), and a light transmission window 48 capable of transmitting light is formed in the central portion thereof. A back surface portion 50 is formed on the side of the first layer 62A where the second layer 62B is not overlapped.

第３層６２Ｃ、第４層６２Ｄ、及び第５層６２Ｅは同一形状とされ（以下これらをまとめて「第２段６２β」という）、これらの中央部には第１開口６４が構成されている。第１開口６４は光透過窓４８よりも大きい開口とされ、その外縁は光透過窓４８の外縁よりも外側に配置され、第１段６２αと第２段６２βとの間で光透過窓４８から外側に向かって段差（第１段６２αと第２段６２βとの間の段差の高さを「段差Ｄ１」という）が形成されている。第１段６２αの第２段６２β側の第１露出面６８には、ＣＣＤイメージセンサ５２を実装可能とされている。段差Ｄ１は、ＣＣＤイメージセンサ５２の厚みよりも大きくなっている。   The third layer 62C, the fourth layer 62D, and the fifth layer 62E have the same shape (hereinafter, these are collectively referred to as “second stage 62β”), and a first opening 64 is formed in the central portion thereof. . The first opening 64 is an opening larger than the light transmission window 48, and the outer edge thereof is disposed outside the outer edge of the light transmission window 48, and the light transmission window 48 is between the first stage 62α and the second stage 62β. A step is formed toward the outside (the height of the step between the first step 62α and the second step 62β is referred to as “step D1”). The CCD image sensor 52 can be mounted on the first exposed surface 68 on the second stage 62β side of the first stage 62α. The step D 1 is larger than the thickness of the CCD image sensor 52.

第６層６２Ｆ、第７層６２Ｇ、第８層６２Ｈ、及び第９層６２Ｉは同一形状とされ（以下これらをまとめて「第３段６２γ」という）、これらの中央部には第２開口６６が構成されている。第２開口６４は第１開口６４よりも大きい開口とされ、その外縁は第１開口６４の外縁よりも外側に配置され、第２段６２βと第３段６２γとの間にも光透過窓４８から外側に向かって段差（第２段６２βと第３段６２γとの間の段差の高さを「段差Ｄ２」という）が形成されている。第２段６２βの第３段６２γ側の第２露出面７０には、第１回路５４及びドライバ回路２８を実装可能とされている。段差Ｄ２は、第１回路５４及びドライバ回路２８の厚みよりも大きくなっている。また、第３段６２γの第２段６２βと反対側には第３露出面７２が構成されている。   The sixth layer 62F, the seventh layer 62G, the eighth layer 62H, and the ninth layer 62I have the same shape (hereinafter, these are collectively referred to as “third stage 62γ”), and a second opening 66 is formed at the center thereof. Is configured. The second opening 64 is an opening larger than the first opening 64, the outer edge thereof is disposed outside the outer edge of the first opening 64, and the light transmission window 48 is also provided between the second stage 62β and the third stage 62γ. A level difference (the height of the level difference between the second level 62β and the third level 62γ is referred to as “level difference D2”) is formed from the outside toward the outside. The first circuit 54 and the driver circuit 28 can be mounted on the second exposed surface 70 on the third stage 62γ side of the second stage 62β. The step D2 is larger than the thickness of the first circuit 54 and the driver circuit 28. A third exposed surface 72 is formed on the opposite side of the third step 62γ to the second step 62β.

上記のように構成される多層配線基板６１の、第１露出面６８、第２露出面７０、及び第３露出面７２は、第１実施形態の第２面部４６、第１面部４４、及び最外側面部４２に、各々対応している。第１露出面６８にはＣＣＤイメージセンサ５２が、第２露出面７０には第１回路５４、ドライバ回路２８、及び表面部品５８が、第３露出面７２には、フレキシブル基板５６が、そして、裏面部５０にはレンズユニット１４及び裏面部品６０が、第１実施形態と同様にして実装されている。   The first exposed surface 68, the second exposed surface 70, and the third exposed surface 72 of the multilayer wiring board 61 configured as described above are the second surface portion 46, the first surface portion 44, and the outermost surface of the first embodiment. Each corresponds to the outer side surface portion 42. The CCD image sensor 52 is provided on the first exposed surface 68, the first circuit 54, the driver circuit 28, and the surface component 58 are provided on the second exposed surface 70, the flexible substrate 56 is provided on the third exposed surface 72, and The lens unit 14 and the back surface component 60 are mounted on the back surface portion 50 in the same manner as in the first embodiment.

上記構成の多層配線基板６１への各部品の実装は、図１０に示す手順で行うことにより、容易に複数の部品を重ねて実装することができる。   Each component is mounted on the multilayer wiring board 61 having the above-described configuration by performing the procedure shown in FIG.

まず、図１０（Ａ）に示すように、多層配線基板４０の第１露出面６８へ、光透過窓４８を塞ぐようにＣＣＤイメージセンサ５２を実装する。このとき、ＣＣＤイメージセンサ５２の受光面５３を光透過窓４８側へ向ける。次に、図１０（Ｂ）に示すように、裏面部５０へ裏面部品６０を実装すると共に、カバーガラス４９を光透過窓４８を塞ぐように配置し、ＣＣＤイメージセンサ５２の受光面を封止する。次に、図１０（Ｃ）に示すように、第２露出面７０へ第１回路５４及びドライバ回路２８を実装する。このとき、ＣＣＤイメージセンサ５２と第１回路５４及びドライバ回路２８とが重なり合う部分にアンダーフィル（接着材）５５を塗布する。これにより、各部品の固定を強固にすることができる。次に、第３露出面７２へフレキシブル基板を配置し、その外側をアルミ層５７でシールドする。そして、図１０（Ｄ）に示すように、裏面部５０へレンズユニット１４を実装する。   First, as shown in FIG. 10A, the CCD image sensor 52 is mounted on the first exposed surface 68 of the multilayer wiring board 40 so as to close the light transmission window 48. At this time, the light receiving surface 53 of the CCD image sensor 52 is directed to the light transmission window 48 side. Next, as shown in FIG. 10B, the back surface component 60 is mounted on the back surface 50, and the cover glass 49 is disposed so as to close the light transmission window 48, and the light receiving surface of the CCD image sensor 52 is sealed. To do. Next, as shown in FIG. 10C, the first circuit 54 and the driver circuit 28 are mounted on the second exposed surface 70. At this time, an underfill (adhesive) 55 is applied to a portion where the CCD image sensor 52 overlaps the first circuit 54 and the driver circuit 28. Thereby, fixation of each component can be strengthened. Next, a flexible substrate is disposed on the third exposed surface 72 and the outside is shielded by the aluminum layer 57. Then, as shown in FIG. 10D, the lens unit 14 is mounted on the back surface portion 50.

本実施形態の多層配線基板６１によれば、第１実施形態と同様の効果を得ることができる。また、積層する層の枚数を変更することにより、容易に段差Ｄ１、Ｄ２の高さを変更することができるので、実装する部品に応じた多層配線基板６１の製造を容易に行うことができる。   According to the multilayer wiring board 61 of the present embodiment, the same effects as those of the first embodiment can be obtained. Moreover, since the height of the steps D1 and D2 can be easily changed by changing the number of layers to be stacked, the multilayer wiring board 61 corresponding to the component to be mounted can be easily manufactured.

第１実施形態のデジタルカメラの斜視図である。1 is a perspective view of a digital camera according to a first embodiment. 第１実施形態のデジタルカメラの制御系の概略ブロック図である。It is a schematic block diagram of the control system of the digital camera of 1st Embodiment. 第１実施形態の多層配線基板の斜視図である。1 is a perspective view of a multilayer wiring board according to a first embodiment. 第１実施形態の部品が実装された多層配線基板の断面図である。It is sectional drawing of the multilayer wiring board by which the component of 1st Embodiment was mounted. 第１実施形態の多層配線基板を最外側面部側からみた図である。It is the figure which looked at the multilayer wiring board of a 1st embodiment from the outermost surface side. 第１実施形態の多層配線基板を裏面部側からみた図である。It is the figure which looked at the multilayer wiring board of a 1st embodiment from the back part side. 第１実施形態の多層配線基板への部品実装のプロセスを説明する図面である。It is drawing explaining the process of component mounting to the multilayer wiring board of 1st Embodiment. 第１実施形態の多層配線基板が適用されるカメラ付携帯電話の例である。It is an example of the mobile phone with a camera to which the multilayer wiring board of 1st Embodiment is applied. 第２実施形態の部品が実装された多層配線基板の断面図である。It is sectional drawing of the multilayer wiring board by which the component of 2nd Embodiment was mounted. 第２実施形態の多層配線基板への部品実装のプロセスを説明する図面である。It is drawing explaining the process of component mounting to the multilayer wiring board of 2nd Embodiment. 本発明の多層配線基板の一例を示す（Ａ）は側断面図であり、（Ｂ）は上面図である。(A) which shows an example of the multilayer wiring board of this invention is a sectional side view, (B) is a top view.

符号の説明Explanation of symbols

１０ デジタルカメラ（撮像装置）
１４ レンズユニット
２８ ドライバ回路
４０ 多層配線基板
４２ 最外側面部
４４ 第２面部
４６ 第１面部
４８ 光透過窓
５２ ＣＣＤイメージセンサ（第２部品、イメージセンサ）
５３ 受光面
５４ 第１回路（第１部品）
６１ 多層配線基板
６２α 第１段（第１の積層部）
６２β 第２段（第２の積層部）
６４ 開口（開口部）
６８ 第１露出面（第２面部）
７０ 第２露出面（第１面部）
８０ カメラ付携帯電話（撮像装置） 10 Digital camera (imaging device)
14 lens unit 28 driver circuit 40 multilayer wiring board 42 outermost surface portion 44 second surface portion 46 first surface portion 48 light transmission window 52 CCD image sensor (second component, image sensor)
53 Light-receiving surface 54 First circuit (first component)
61 Multilayer wiring board 62α First stage (first laminated portion)
62β 2nd stage (second laminated part)
64 opening (opening)
68 First exposed surface (second surface portion)
70 Second exposed surface (first surface portion)
80 Mobile phone with camera (imaging device)

Claims (2)

光を透過可能な光透過窓の形成された第１の積層部と、
前記第１の積層部に重ねて配置されると共に前記光透過窓からの光を透過可能とする位置に開口部が形成され、前記第１の積層部との間で段差を構成する第２の積層部と、
を備えた多層配線基板。 A first laminated portion in which a light transmission window capable of transmitting light is formed;
An opening is formed at a position where the light is transmitted from the light transmission window while being overlapped with the first stacked portion, and a second step is formed between the first stacked portion and the first stacked portion. A laminated part;
Multi-layer wiring board with 光を透過可能な光透過窓の形成された第１の積層部と、前記第１の積層部に重ねて配置されると共に前記光透過窓からの光を透過可能とする位置に開口部が形成され、前記第１の積層部との間で段差を構成する第２の積層部と、を含む多層配線基板と、
前記第１の積層部または第２の積層部に前記光透過窓及び開口部からの光を受光可能に実装されたイメージセンサと、
前記光透過窓を通して前記イメージセンサの受光面へ被写体からの光を結合可能な位置に配置されたレンズユニットと、
を備えた撮像装置。 A first laminated portion in which a light transmissive window capable of transmitting light is formed, and an opening is formed at a position where the light is transmitted from the light transmissive window while being superimposed on the first laminated portion. A multilayer wiring board comprising: a second laminated portion that forms a step with the first laminated portion;
An image sensor mounted on the first laminated portion or the second laminated portion so as to receive light from the light transmission window and the opening; and
A lens unit disposed at a position where light from a subject can be coupled to the light receiving surface of the image sensor through the light transmission window;
An imaging apparatus comprising:
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