JP2000269472A - Image pickup device - Google Patents
Image pickup deviceInfo
- Publication number
- JP2000269472A JP2000269472A JP11068751A JP6875199A JP2000269472A JP 2000269472 A JP2000269472 A JP 2000269472A JP 11068751 A JP11068751 A JP 11068751A JP 6875199 A JP6875199 A JP 6875199A JP 2000269472 A JP2000269472 A JP 2000269472A
- Authority
- JP
- Japan
- Prior art keywords
- image pickup
- pickup device
- substrate
- wiring board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は撮像装置に係わり、
特に、撮像素子を、接続用端子を設けた基板に前記撮像
素子の素子形成面を向かい合わせ接続部材により接続す
る撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device,
In particular, the present invention relates to an image pickup apparatus in which an image pickup device is connected to a substrate provided with connection terminals by a connecting member with the element formation surface of the image pickup device facing each other.
【０００２】[0002]
【従来の技術】従来、ビデオカメラ、デジタルカメラ等
はセラミックパッケージに入れたマルチメディア携帯機
器対応を考慮した撮像装置として、「NIKKEI MICRODEVI
CES １９９７年９月号」に掲載された松下電子工業製の
携帯機器向けワンチップカメラが知られている。2. Description of the Related Art Conventionally, video cameras, digital cameras and the like have been developed as "NIKKEI MICRODEVI
A one-chip camera for a portable device manufactured by Matsushita Electronics Corporation, which is published in the September 1997 issue of CES, is known.
【０００３】その構成は、シリコン配線基板上にＣＣ
Ｄ、周辺ＩＣ（駆動回路、雑音低減回路（ＣＤＳ回
路）、ＤＳＰ（画像信号処理等））を搭載し、それぞれ
のチップとシリコン配線基板をワイヤーボンディングで
接続している。[0003] The structure is such that a CC
D, peripheral ICs (drive circuit, noise reduction circuit (CDS circuit), DSP (image signal processing, etc.)) are mounted, and each chip and the silicon wiring board are connected by wire bonding.
【０００４】そして、それぞれのチップを搭載した前記
シリコン基板をセラミックパッケージ内に入れ接着後、
さらにパッケージ端子と該シリコン基板端子をワイヤー
ボンディングで接続している。[0004] Then, after the silicon substrate on which each chip is mounted is put in a ceramic package and bonded,
Further, the package terminal and the silicon substrate terminal are connected by wire bonding.
【０００５】最後に、ＣＣＤの受光部に映像光が入射す
るよう受光部のみに保護ガラスをはめ込んだセラミック
蓋で接着剤を用い封止しパッケージ化している。[0005] Finally, the CCD is sealed and packaged with an adhesive using a ceramic lid in which a protective glass is fitted only to the light receiving portion so that the image light enters the light receiving portion of the CCD.
【０００６】図４は上記撮像装置の構成を示す断面図で
ある。同図において、１は撮像素子、２は周辺ＩＣ、３
は配線基板、４は保護ガラス、１５はセラミックパッケ
ージ下蓋、１６はセラミックパッケージ上蓋、１７はリ
ード電極、１８はボンディングワイヤーである。FIG. 4 is a sectional view showing the structure of the above-mentioned image pickup apparatus. In the figure, 1 is an image sensor, 2 is a peripheral IC, 3
Is a wiring board, 4 is a protective glass, 15 is a lower lid of a ceramic package, 16 is an upper lid of a ceramic package, 17 is a lead electrode, and 18 is a bonding wire.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記従
来例では次のような問題点があった。However, the above conventional example has the following problems.
【０００８】セラミックパッケージに撮像素子や周辺
ＩＣを実装した配線基板を乗せた積み重ね構造であるこ
とと、ワイヤーボンディングを用いているため高さ方向
の空間さらに横方向の空間が必要となりモジュールのサ
イズが大きくなる。[0008] A stacked structure in which an image pickup element and a peripheral IC are mounted on a ceramic package is mounted, and a space in a height direction and a space in a lateral direction are required because wire bonding is used. growing.
【０００９】セラミックパッケージに撮像素子を実装
した配線基板を積み重ねた構造であるため、積み重ねる
ごとにＣＣＤとセラミックパッケージ外形の位置ずれが
大きくなる。また、セラミックパッケージそのものも成
型時のばらつきが大きいため寸法精度の向上が困難であ
る。したがって、撮像モジュールを製品に組み込む際、
レンズ等の光学系との位置合わせ、光軸合わせ、あおり
調整が必要になり製品内に調整機構を設けることが求め
られる。Since the wiring board having the image pickup device mounted on the ceramic package is stacked, the positional displacement between the CCD and the outer shape of the ceramic package increases with each stack. In addition, since the ceramic package itself has a large variation during molding, it is difficult to improve the dimensional accuracy. Therefore, when incorporating the imaging module into a product,
Positioning with an optical system such as a lens, optical axis alignment, and tilt adjustment are required, and it is required to provide an adjustment mechanism in the product.
【００１０】このような問題点により従来の撮像モジュ
ールを搭載する製品では製品の小型化が困難であり、し
かも組立工程での光軸調整、あおり調整など調整コスト
が必要であったため低価格化も困難であった。Due to these problems, it is difficult to reduce the size of a product equipped with a conventional image pickup module, and the cost of adjustment such as optical axis adjustment and tilt adjustment in the assembly process is required. It was difficult.
【００１１】本発明の目的は上記問題点を解決し、デジ
タルカメラ、ビデオカメラ、カメラ付携帯端末などの製
品に搭載できる、小型かつ低コストの撮像装置を提供す
ることにある。An object of the present invention is to solve the above problems and to provide a small-sized and low-cost imaging device that can be mounted on products such as digital cameras, video cameras, and camera-equipped mobile terminals.
【００１２】[0012]
【課題を解決するための手段及び作用】上記目的を達成
するため、本発明は、撮像素子を、接続用端子を設けた
基板に前記撮像素子の素子形成面を向かい合わせ接続部
材により接続する撮像装置において、前記撮像素子の受
光領域部に対応する前記基板の領域に貫通穴を設けたこ
とを特徴とする。In order to achieve the above-mentioned object, the present invention provides an image pickup device in which an image pickup device is connected to a substrate provided with connection terminals with an element formation surface of the image pickup device facing each other by a connecting member. In the apparatus, a through hole may be provided in a region of the substrate corresponding to a light receiving region of the imaging device.
【００１３】本発明者は、撮像素子と配線基板の結線方
法がワイヤーボンディングであった場合、高さ方向、横
方向の空間が必要であるため空間を必要としないフェイ
スダウン実装が望ましいと考えた。The inventor of the present invention considered that when the method of connecting the image pickup device and the wiring board was wire bonding, a space in the height direction and in the horizontal direction was required, so that a face-down mounting that did not require a space was desirable. .
【００１４】しかしながら、撮像素子を不透明な配線基
板にフェイスダウン実装した場合、撮像素子の受光部に
入射するべき映像が配線基板により遮られてしまうこと
になる。However, when the image sensor is mounted face-down on an opaque wiring board, an image to be incident on the light receiving portion of the image sensor is blocked by the wiring board.
【００１５】そこで、本発明は配線基板に貫通穴を設け
ることで、撮像素子の機能と実装面積の削減を両立し
た。Accordingly, the present invention provides both the function of the image sensor and the reduction of the mounting area by providing a through hole in the wiring board.
【００１６】また、フェイスダウン実装の場合、撮像素
子と配線基板はＸ、Ｙ、Ｚ、θ、あおり方向とも数十ミ
クロンの精度でアライメントしているため配線基板の外
形で精度よく投げ込みで製品に組み込むことができる。
従って、製品のレンズ光学系との位置合わせは必要でな
くなるため調整機構用部品、調整のための工数が不要で
小型化、低コスト化が実現できる。In the case of face-down mounting, the image sensor and the wiring board are aligned with an accuracy of several tens of microns in the X, Y, Z, θ, and tilt directions, so that they can be accurately thrown into a product by the outer shape of the wiring board. Can be incorporated.
Therefore, since it is not necessary to align the product with the lens optical system, there is no need for an adjustment mechanism component and man-hours for adjustment, so that downsizing and cost reduction can be realized.
【００１７】また本発明によれば、貫通穴を設けた配線
基板を不透明なシリコン基板とすることで、撮像素子の
非受光部及び周辺ＩＣの遮光を兼ねることができ、さら
に熱膨張差などからフェイスダウン実装や素子の作り込
みに適した材質で基板を構成することができる。さら
に、半導体プロセスを利用できることから高精度の配線
基板が容易に製作でき、またシリコン自体の厚みも高精
度であり、配線基板を基準に撮像装置を投げ込み組立て
するためにも優れている。Further, according to the present invention, the wiring substrate provided with the through holes is made of an opaque silicon substrate, so that the non-light receiving portion of the image sensor and the peripheral IC can be shielded from light. The substrate can be made of a material suitable for face-down mounting and element fabrication. Furthermore, since a semiconductor process can be used, a high-precision wiring board can be easily manufactured, and the thickness of silicon itself is also high-precision, which is excellent for throwing and assembling an imaging device with reference to the wiring board.
【００１８】また本発明によれば、貫通穴を設けた配線
基板に撮像素子以外の周辺ＩＣ（駆動回路、雑音低減回
路、画像信号処理等）などを実装することにより、効率
よく各素子の配置（いわゆるマルチチップモジュール）
が可能となり製品の小型化を図ることができる。Further, according to the present invention, by mounting peripheral ICs (drive circuit, noise reduction circuit, image signal processing, etc.) other than the image pickup device on the wiring board provided with the through hole, the arrangement of each device can be efficiently performed. (So-called multi-chip module)
And the size of the product can be reduced.
【００１９】また本発明によれば、貫通穴を設けた配線
基板をガラスエポキシからなる材質で構成することによ
り、コストの低減をすることができる。According to the present invention, the cost can be reduced by forming the wiring board provided with the through holes with a material made of glass epoxy.
【００２０】本発明の撮像装置を、マルチメディア携帯
機器製品等に搭載される撮像モジュールとして用い、を
小型かつ調整不要のパッケージにすることで更なる小型
化、低コスト化された製品を供給することができる。The image pickup apparatus of the present invention is used as an image pickup module to be mounted on a product of a multimedia portable device, etc., and is provided in a smaller and less adjustment-free package, thereby providing a product which is further reduced in size and cost. be able to.
【００２１】[0021]
【実施例】以下、本発明の実施例について図面を用いて
詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００２２】図１は本発明における撮像素子を搭載した
撮像装置の断面図、図２（ａ），（ｂ）は本撮像装置の
保護ガラス搭載側および撮像素子搭載側から見た斜視
図、図３は本撮像装置をレンズに組み込んだ形態を示す
断面図および斜視図である。FIG. 1 is a sectional view of an image pickup device having an image pickup device according to the present invention, and FIGS. 2A and 2B are perspective views of the image pickup device as viewed from a protective glass mounting side and an image pickup device mounting side. FIG. 3 is a cross-sectional view and a perspective view showing a mode in which the imaging apparatus is incorporated in a lens.
【００２３】図１において、１は撮像素子、１００は撮
像素子１の端子に形成されたスタッドバンプ、２は周辺
の信号処理ＩＣ、３は貫通穴３００を施した基板で片面
には配線が形成されている配線基板である。また、４は
撮像素子１を保護する保護ガラス、５はＦＰＣ（フレキ
シブルプリント配線基板）で撮像装置と外部基板との電
源、信号の入出力の経路となる。６は前記撮像素子１お
よび信号処理ＩＣ２などを保護する封止剤、７はＦＰＣ
５と配線基板３とを接続する異方性導電接着剤、８は配
線基板３と保護ガラスとを接着する保護ガラス接着剤で
ある。In FIG. 1, reference numeral 1 denotes an image sensor, 100 denotes a stud bump formed on a terminal of the image sensor 1, 2 denotes a peripheral signal processing IC, and 3 denotes a substrate provided with a through hole 300, and wiring is formed on one surface. Wiring board. Reference numeral 4 denotes a protective glass for protecting the image sensor 1, and reference numeral 5 denotes an FPC (Flexible Printed Wiring Board), which serves as a power supply and a signal input / output path between the image pickup device and an external substrate. Reference numeral 6 denotes a sealant for protecting the image sensor 1 and the signal processing IC 2 and the like. Reference numeral 7 denotes an FPC.
Reference numeral 5 denotes an anisotropic conductive adhesive for connecting the wiring substrate 3 to the wiring substrate 3, and reference numeral 8 denotes a protective glass adhesive for bonding the wiring substrate 3 to the protective glass.
【００２４】ここで、配線基板３は結晶方位１１０のＳ
ｉ基板を用い表面に熱酸化膜を１００００Å形成し、更
に配線層を形成、パターン加工する。更に絶縁を兼ねて
ＳｉＯ2 を形成し、接続端子部に開口部を形成する。前
記配線の材料としては、薄膜のＡｌ、Ｃｕ、厚膜のＡｕ
ペースト、Ａｇペースト等があり、接続端子部の開口部
にＡｕめっき、或いは厚膜Ａｕを印刷する場合もある。Here, the wiring board 3 is made of S
Using an i-substrate, a thermal oxide film is formed on the surface at a thickness of 10000, a wiring layer is further formed, and pattern processing is performed. Further, SiO 2 is formed also for insulation, and an opening is formed in the connection terminal portion. Examples of the material of the wiring include thin film Al and Cu, and thick film Au.
There is a paste, an Ag paste, or the like, and Au plating or a thick film Au may be printed on the opening of the connection terminal.
【００２５】なお、配線のパターニングや成膜等はウェ
ハー状態で形成された後にダイシィング装置にて切断す
る。その際、切断用アライメントマークにそって切断す
るがこのアライメントマークは配線パターンと同じ焼き
付けマスクにより形成されているため、配線パターンと
配線基板の外形は±１０μｍ以内の精度で切断できる。The wiring patterning, film formation, and the like are cut in a dicing device after being formed in a wafer state. At this time, cutting is performed along the cutting alignment mark, but since the alignment mark is formed using the same baking mask as the wiring pattern, the outer shape of the wiring pattern and the wiring substrate can be cut with an accuracy of ± 10 μm or less.
【００２６】次に撮像素子に映像光が入射するように配
線基板３の開口部に貫通穴３００を設ける。Next, a through hole 300 is provided in the opening of the wiring board 3 so that the image light is incident on the image sensor.
【００２７】その方法としては、配線基板３がシリコン
であるため精度よく加工できるエッチング法を採用し
た。エッチング液としてはテトラメチルアンモニウムハ
イドライド（ＴＭＡＨ）水溶液を用いた。このエッチン
グ液としてはＫＯＨ等のシリコンとＳｉＯ2 との選択比
が十分取れるものであれば特に限定されない。As the method, an etching method which can be processed with high precision because the wiring substrate 3 is made of silicon was employed. An aqueous solution of tetramethylammonium hydride (TMAH) was used as an etching solution. The etchant is not particularly limited as long as it has a sufficient selectivity between silicon such as KOH and SiO 2 .
【００２８】なお、配線基板３の配線面には接続端子部
を除きＳｉＯ2 膜を成膜し、配線基板３の配線面の反対
側の面にも同様に全面ＳｉＯ2 膜を成膜するものの貫通
穴を設けたい部分のＳｉＯ2 膜はフォトリソグラフィに
て除去する。[0028] Note that although the wiring surface of the wiring board 3 by forming a SiO 2 film except the connection terminal portions, forming the opposite side likewise entirely SiO 2 film to the surface of the wiring surface of the wiring board 3 The portion of the SiO 2 film where a through hole is to be provided is removed by photolithography.
【００２９】配線基板３の配線面、側面及び配線面と反
対側の面の角部をシリコーンゴム、テフロン、ＳＵＳと
いったＴＭＡＨ水溶液に耐食性の材料で更に保護しエッ
チング液に投入する。The wiring surface, the side surface, and the corners of the surface opposite to the wiring surface of the wiring substrate 3 are further protected by a corrosion-resistant material in a TMAH aqueous solution such as silicone rubber, Teflon, or SUS, and then put into an etching solution.
【００３０】エッチング条件は、ＴＭＡＨ２２％水溶液
を９０℃で熱し１０時間である。シリコン層のエッチン
グが進行するが、配線側のＳｉＯ2 膜によりエッチング
の進行が停止される。また、配線側のＳｉＯ2 膜により
配線側へのエッチング液侵入を防いでいる。The etching condition is that a 22% aqueous solution of TMAH is heated at 90 ° C. for 10 hours. The etching of the silicon layer proceeds, but the etching is stopped by the SiO 2 film on the wiring side. The SiO 2 film on the wiring side prevents the etchant from entering the wiring side.
【００３１】最後に残った薄いＳｉＯ2 膜をエアーガン
や水流の機械的圧力で除去し貫通穴３００を完成させ
る。Finally, the remaining thin SiO 2 film is removed by an air gun or the mechanical pressure of a water stream to complete the through hole 300.
【００３２】撮像素子１の端子にバンプを形成する場
合、カラーフィルター、マイクロレンズ等耐熱性の低い
材料を用いている構成であるため、バリアメタルの薄膜
工程、めっき後の熱処理工程等、高温にさらされるた
め、めっきバンプが用いることは困難である。When bumps are formed on the terminals of the image sensor 1, since a material having low heat resistance such as a color filter and a microlens is used, the bumps may be exposed to a high temperature such as a barrier metal thin film process and a heat treatment process after plating. It is difficult to use plated bumps due to exposure.
【００３３】従って、ボールボンディングのボール部の
みを端子につけるスタッドバンプを用いることになる。Therefore, a stud bump for attaching only the ball portion of the ball bonding to the terminal is used.
【００３４】ボールを端子部に超音波と熱で付けた後、
切断したワーヤーの再結晶部が短く残り凸形状になり基
板との接合するためには不都合なので、上面を別のツー
ルで押しつぶすフラットニングを行う。After attaching the ball to the terminal portion with ultrasonic waves and heat,
Since the recrystallized portion of the cut wire is short and remains in a convex shape, which is inconvenient for bonding to the substrate, flattening is performed by crushing the upper surface with another tool.
【００３５】また、同一基板上に搭載する画像処理等の
ＩＣのバンプについては、めっき、或いは撮像素子１と
同様にスタッドバンプで形成されている。Further, bumps of an IC mounted on the same substrate for image processing or the like are formed by plating or stud bumps as in the case of the image pickup device 1.
【００３６】前記スタッドバンプ、めっきバンプを形成
したＩＣチップを基板上にＡＣＦ（異方性導電フィル
ム）、あるいはＡＣＰ（異方性導電ペースト）でフェイ
スダウン実装を行う。The IC chip on which the stud bumps and plating bumps are formed is mounted face-down on a substrate using ACF (anisotropic conductive film) or ACP (anisotropic conductive paste).
【００３７】フェイスダウン実装の手順としては、撮像
素子１のボンディングにＡＣＦを用いる場合、あらかじ
め、配線基板３のくり貫き穴部３００を除き、端子部に
かかる形状にＡＣＦを型抜きした状態で低温下で低圧着
する。また、ＡＣＰを用いる場合は、あらかじめデスペ
ンサー等で基板の端子部にＡＣＰを塗布する。As a procedure for face-down mounting, when an ACF is used for bonding of the image pickup device 1, the ACF is cut into a shape corresponding to a terminal portion except for the cutout hole portion 300 of the wiring board 3 in advance and a low temperature is applied. Apply low pressure underneath. When the ACP is used, the terminal portion of the substrate is coated with the ACP in advance using a dispenser or the like.
【００３８】更に、前記ＡＣＦを仮圧着した部分、或い
はＡＣＰを塗布した部分に撮像素子裏面からボンディン
グツールで吸着し、撮像素子と加熱圧着を行う。Further, the ACF is temporarily adhered to the portion where the ACF has been temporarily compressed or the portion where the ACP has been applied from the back surface of the image sensor with a bonding tool, and the image sensor is heated and pressed.
【００３９】なお、撮像素子１上のバンプと配線基板接
続用端子は画像処理装置を用いアライメントするため±
５μｍ程度の精度で接着される。It should be noted that the bumps on the image pickup device 1 and the terminals for connecting the wiring board are not aligned for alignment using an image processing apparatus.
Bonded with an accuracy of about 5 μm.
【００４０】従って、配線基板３も前述したように接続
端子と配線基板の外形精度が高いことから配線基板の外
形から撮像素子の位置が高精度で配置されることにな
る。Therefore, the wiring board 3 also has high accuracy in the outer shape of the connection terminals and the wiring board as described above, so that the position of the image pickup device is arranged with high accuracy from the outer shape of the wiring board.
【００４１】加熱条件としては、ＡＣＦ、ＡＣＰの樹脂
成分が硬化する条件、例えば、温度条件は、１５０℃，
８０ｓｅｃで、圧力条件は端子数によって異なるが、端
子当たり７０〜１２０ｇになるように適宜装置側の荷重
を設定する。The heating conditions are such that the resin components of ACF and ACP are cured, for example, the temperature condition is 150 ° C.
At 80 sec, the pressure condition varies depending on the number of terminals, but the load on the device side is appropriately set so as to be 70 to 120 g per terminal.
【００４２】周辺ＩＣ２の場合、装置側の加熱ツールに
ＩＣチップの裏面側を吸着し画像処理により配線板端子
とＩＣチップの端子の位置あわせを行いツールにより加
熱圧着を行う。In the case of the peripheral IC 2, the back side of the IC chip is attracted to a heating tool on the apparatus side, the wiring board terminals and the terminals of the IC chip are aligned by image processing, and the tool is heated and pressed.
【００４３】本構成の場合、周辺のＩＣと比較し撮像素
子は耐熱性が劣るため、より低温で接続する必要性を考
慮し、周辺ＩＣを先に熱圧着し、その後、電気チェック
を行い、周辺ＩＣが確実に実装されていることを確認し
てから撮像素子を実装するのが望ましい。In the case of this configuration, since the image pickup device is inferior in heat resistance to the peripheral ICs, the peripheral ICs are thermocompression-bonded first, and then an electrical check is performed in consideration of the necessity of connecting at a lower temperature. It is desirable to mount the image sensor after confirming that the peripheral IC has been securely mounted.
【００４４】撮像素子、周辺ＩＣを実装した後、外部か
ら電源供給、信号入出力用のＦＰＣ５を熱圧着し、更に
端子部、素子部を保護するために樹脂封止、配線基板の
素子搭載面に対向する面側の貫通窓部に赤外カットフィ
ルターを設けたガラス４を貼り合わせ、本発明の撮像装
置が形成される。After mounting the image pickup device and peripheral ICs, the FPC 5 for supplying power and inputting / outputting signals from the outside is thermocompression-bonded, and furthermore, resin sealing is performed to protect the terminal portion and the device portion. The glass 4 provided with the infrared cut filter is attached to the through window on the surface side facing the above, so that the imaging device of the present invention is formed.
【００４５】図３（ａ），（ｂ）は本発明の撮像モジュ
ールをレンズが搭載された光学筐体に組み込んだ状態を
示す断面図および斜視図である。図３において、１０は
レンズ、１１はレンズ筐体、１２は撮像素子モジュール
（撮像装置）である。図３のように光学筐体を撮像モジ
ュールの外形に合わせ形成しておけば光軸合わせ、あお
り調整することなく高精度でレンズ光学系との組立てが
可能となる。FIGS. 3A and 3B are a sectional view and a perspective view showing a state in which the image pickup module of the present invention is incorporated in an optical housing on which a lens is mounted. In FIG. 3, reference numeral 10 denotes a lens, 11 denotes a lens housing, and 12 denotes an image sensor module (image pickup device). If the optical housing is formed so as to match the outer shape of the imaging module as shown in FIG. 3, it is possible to assemble the lens optical system with high accuracy without adjusting the optical axis and adjusting the tilt.
【００４６】[0046]
【発明の効果】以上説明したように、本発明によれば撮
像素子を接続用の端子を設けた基板に前記撮像素子の素
子形成面を向かい合わせバンプ等により接続するいわゆ
るフェイスダウン実装した撮像装置において、前記撮像
素子の受光領域部に対する前記基板側に貫通穴を設ける
ことにより、 実装面積を削減したフェイスダウン実装を採用するこ
とができる。これにより格段に撮像装置のサイズを小型
化することができる。As described above, according to the present invention, a so-called face-down mounted image pickup device in which the element forming surface of the image pickup device is connected to a substrate provided with connection terminals by bumps or the like. In the above, face-down mounting with a reduced mounting area can be adopted by providing a through hole on the substrate side with respect to the light receiving area of the image sensor. Thereby, the size of the imaging device can be significantly reduced.
【００４７】フェイスダウン実装を採用することで撮
像素子と配線基板はＸ、Ｙ、Ｚ、θ、あおり方向とも高
精度でアライメントしているため配線基板の外形で精度
よく無調整で製品に組み込むことができる。従って、調
整機構用の部品、調整のための工数が不要で小型化、低
コスト化が実現できる。By adopting face-down mounting, the image pickup element and the wiring board are aligned with high precision in the X, Y, Z, θ, and tilt directions. Can be. Therefore, components for the adjustment mechanism and man-hours for adjustment are not required, and downsizing and cost reduction can be realized.
【００４８】また本発明は、マルチメディア携帯機器製
品等に搭載される撮像装置を小型かつ、調整不要のパッ
ケージにすることで更なる小型化、低コスト化された製
品を供給することができる。さらに、撮像素子と撮像素
子の周辺回路を一体化し小型化、薄型化した撮像装置を
構成することができる。Further, according to the present invention, an image pickup device mounted on a multimedia portable device product or the like can be provided in a smaller and less adjustment-free package, thereby providing a product that is further reduced in size and cost. Further, the image pickup device and peripheral circuits of the image pickup device are integrated, so that a compact and thin image pickup device can be configured.
【図１】本発明の撮像装置の断面図である。FIG. 1 is a cross-sectional view of an imaging device of the present invention.
【図２】本発明の撮像装置の保護ガラス搭載側および撮
像素子搭載側から見た斜視図である。FIG. 2 is a perspective view of the imaging device of the present invention as viewed from a protective glass mounting side and an imaging element mounting side.
【図３】本発明の撮像装置をレンズに組み込んだ形態を
示す断面図および斜視図である。FIGS. 3A and 3B are a cross-sectional view and a perspective view showing a form in which the imaging device of the present invention is incorporated in a lens. FIGS.
【図４】従来の１チップカメラモジュールの断面図であ
る。FIG. 4 is a sectional view of a conventional one-chip camera module.
１ 撮像素子 ２ 周辺ＩＣ ３ 配線基板 ４ 保護ガラス ５ ＦＰＣ ６ 封止樹脂 ７ 異方性導電接着剤 ８ 保護ガラス接着剤 １０ レンズ １１ レンズ筐体 １２ 撮像モジュール １５ セラミックパッケージ下蓋 １６ セラミックパッケージ上蓋 １７ リード電極 １８ ボンディングワイヤー １００ スタッドバンプ １１０ 受光素子部 ３００ 貫通穴 DESCRIPTION OF SYMBOLS 1 Image sensor 2 Peripheral IC 3 Wiring board 4 Protective glass 5 FPC 6 Sealing resin 7 Anisotropic conductive adhesive 8 Protective glass adhesive 10 Lens 11 Lens housing 12 Imaging module 15 Ceramic package lower lid 16 Ceramic package upper lid 17 Lead Electrode 18 Bonding wire 100 Stud bump 110 Light receiving element 300 Through hole
Claims (5)
前記撮像素子の素子形成面を向かい合わせ接続部材によ
り接続する撮像装置において、 前記撮像素子の受光領域部に対応する前記基板の領域に
貫通穴を設けたことを特徴とする撮像装置。1. An image pickup apparatus for connecting an image pickup device to a substrate provided with connection terminals with an element formation surface of the image pickup device facing each other by a connecting member, wherein a region of the substrate corresponding to a light receiving region of the image pickup device An imaging device, characterized in that a through hole is provided in the imaging device.
とする請求項１に記載の撮像装置。2. The imaging device according to claim 1, wherein the substrate is a semiconductor substrate.
搭載させたことを特徴とする請求項１又は請求項２に記
載の撮像装置。3. The imaging device according to claim 1, wherein an IC other than the imaging element is mounted on the substrate.
とを特徴とする請求項１〜３のいずれかの請求項に記載
の撮像装置。4. The imaging device according to claim 1, wherein the connection member is a stud bump.
１又は請求項２に記載の撮像装置。5. The imaging device according to claim 1, wherein the substrate is a non-light-transmitting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11068751A JP2000269472A (en) | 1999-03-15 | 1999-03-15 | Image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11068751A JP2000269472A (en) | 1999-03-15 | 1999-03-15 | Image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000269472A true JP2000269472A (en) | 2000-09-29 |
Family
ID=13382797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11068751A Pending JP2000269472A (en) | 1999-03-15 | 1999-03-15 | Image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000269472A (en) |
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| KR100494044B1 (en) * | 2001-02-02 | 2005-06-13 | 샤프 가부시키가이샤 | Image pickup device and process for producing the same |
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