JP2009040914A - Styrenic resin composition - Google Patents
Styrenic resin composition Download PDFInfo
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- JP2009040914A JP2009040914A JP2007208289A JP2007208289A JP2009040914A JP 2009040914 A JP2009040914 A JP 2009040914A JP 2007208289 A JP2007208289 A JP 2007208289A JP 2007208289 A JP2007208289 A JP 2007208289A JP 2009040914 A JP2009040914 A JP 2009040914A
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- 239000011342 resin composition Substances 0.000 title claims abstract description 31
- 229920001890 Novodur Polymers 0.000 title abstract description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 59
- 150000001993 dienes Chemical class 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 16
- -1 pyridinium derivative salt Chemical class 0.000 claims abstract description 15
- 229920001400 block copolymer Polymers 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 14
- 239000002344 surface layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000007429 general method Methods 0.000 description 3
- 239000002608 ionic liquid Substances 0.000 description 3
- 238000007666 vacuum forming Methods 0.000 description 3
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 2
- ZMYIIHDQURVDRB-UHFFFAOYSA-N 1-phenylethenylbenzene Chemical group C=1C=CC=CC=1C(=C)C1=CC=CC=C1 ZMYIIHDQURVDRB-UHFFFAOYSA-N 0.000 description 2
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- APMOEFCWQRJOPS-UHFFFAOYSA-N 5-ethenyl-1,5-dimethylcyclohexa-1,3-diene Chemical compound CC1=CC=CC(C)(C=C)C1 APMOEFCWQRJOPS-UHFFFAOYSA-N 0.000 description 2
- 239000004605 External Lubricant Substances 0.000 description 2
- 239000004610 Internal Lubricant Substances 0.000 description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- RCJMVGJKROQDCB-UHFFFAOYSA-N 2-methylpenta-1,3-diene Chemical compound CC=CC(C)=C RCJMVGJKROQDCB-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Packages (AREA)
- Wrappers (AREA)
Abstract
Description
本発明は、電子部品の包装容器として用いられる樹脂組成物に関する。 The present invention relates to a resin composition used as a packaging container for electronic components.
一般に、ポリスチレン樹脂は成形しやすく、透明性および耐水性に優れているため各種包装材料、容器および成形物に適している。特に、ポリスチレン樹脂にスチレン−共役ジエンブロック共重合体をブレンドすることにより物性改良が行われおり、キャリアテープやトレー等の電子部品包装容器として広く使用されている。 In general, polystyrene resins are suitable for various packaging materials, containers, and molded products because they are easy to mold and have excellent transparency and water resistance. In particular, physical properties are improved by blending a polystyrene resin with a styrene-conjugated diene block copolymer, and it is widely used as an electronic component packaging container such as a carrier tape or a tray.
電子部品の中でICやLSI等の半導体は静電気による破壊が生じる等の理由から各種の手法で導電化処理された包装容器が使用されているが、抵抗、コンデンサー、コネクター等の静電気による破壊の懸念がない電子部品については、収容された電子部品を外から観察できるように、導電化処理されていない透明又は半透明の包装容器が使用されてきた。しかしながら、近年の電子部品の小型化に伴い、これら静電気による破壊の懸念がない電子部品についても、静電気による電子部品の付着や飛び出しといった問題が顕在化しつつあり、透明性と帯電防止性能を有する包装材料が望まれている。帯電防止性能を付与する一般的な手法としてカチオン性、アニオン性、両性等のイオン性界面活性剤を添加若しくは表面に塗布する方法が提案されているが（特許文献１）、これらイオン性界面活性剤を使用した包装材料は表面抵抗率の湿度依存性が高く、低湿度環境下では十分な帯電防止効果が得られず、また耐熱性に乏しく、包装容器へ熱成形する際に性能が低下してしまうといった課題があった。
本発明は、表面抵抗率の湿度依存性が低く、低湿度環境下でも十分な帯電防止効果を有するスチレン系樹脂組成物を提供すること、およびその樹脂組成物を用いたキャリアテープ等の電子部品包装容器を提供することを目的とする。 The present invention provides a styrene-based resin composition having low humidity dependency of surface resistivity and sufficient antistatic effect even in a low humidity environment, and electronic components such as carrier tapes using the resin composition The purpose is to provide a packaging container.
本発明者等は、前記課題を解決すべく鋭意検討した結果、スチレン及び共役ジエンよりなるブロック共重合体とポリスチレン樹脂の混合物に、特定量の後述するイオン性液体である有機塩を添加した樹脂組成物を用いて電子部品包装容器を作成することにより、低湿度環境下でも表面抵抗率の上昇を抑制することができ、十分な帯電防止効果が得られることを見出し、本発明に至った。
即ち本発明は、（Ａ），（Ｂ）および（Ｃ）成分の合計を１００質量％としたときに、（Ａ）スチレン及び共役ジエンよりなるブロック共重合体を６〜８９質量％、（Ｂ）ポリスチレン樹脂を６〜８９質量％、（C）ピリジウム誘導体塩、イミダゾリウム誘導体塩、及び脂肪族アミン誘導体塩の群から選ばれる１種以上の有機塩を１〜１０質量％含有してなるスチレン系樹脂組成物である。（Ｂ）ブロック共重合体中の共役ジエン含有量が１０〜６０質量％であることが好ましい。また、本発明は前記樹脂組成物を用いたシートおよびキャリアテープ等の電子部品包装容器を含む。
As a result of diligent studies to solve the above problems, the present inventors have added a specific amount of an organic salt which is an ionic liquid described later to a mixture of a block copolymer composed of styrene and a conjugated diene and a polystyrene resin. It has been found that by producing an electronic component packaging container using the composition, an increase in surface resistivity can be suppressed even in a low humidity environment, and a sufficient antistatic effect can be obtained, leading to the present invention.
That is, according to the present invention, when the total of the components (A), (B) and (C) is 100% by mass, the block copolymer comprising (A) styrene and conjugated diene is 6 to 89% by mass, (B Styrene containing 6 to 89% by mass of polystyrene resin and 1 to 10% by mass of one or more organic salts selected from the group consisting of (C) pyridium derivative salts, imidazolium derivative salts and aliphatic amine derivative salts System resin composition. (B) It is preferable that conjugated diene content in a block copolymer is 10-60 mass%. The present invention also includes electronic component packaging containers such as sheets and carrier tapes using the resin composition.
本発明のスチレン系樹脂組成物は良好な成形性を有し、本発明のスチレン系樹脂組成物を用いたキャリアテープ等の電子部品包装容器は低湿度環境下でも表面抵抗率の増加が抑制され、良好な帯電防止性能が得られ、小型の電子部品を包装しても静電気による付着や飛び出しを生じ難く、電子部品包装容器として好適に用いることができる。 The styrenic resin composition of the present invention has good moldability, and an electronic component packaging container such as a carrier tape using the styrenic resin composition of the present invention can suppress an increase in surface resistivity even in a low humidity environment. Thus, good antistatic performance is obtained, and even when a small electronic component is packaged, it is difficult to cause sticking or popping out due to static electricity, and can be suitably used as an electronic component packaging container.
以下、本発明を詳細に説明する。
（Ａ）スチレン及び共役ジエンより製造されるブロック共重合体とは、その構造中にスチレン系単量体を主体とする重合体ブロックと共役ジエン単量体を主体とする重合体ブロックを含有する重合体である。スチレン系単量体としてはスチレン、ｏ−メチルスチレン、ｐ−メチルスチレン、ｐ−ｔｅｒｔ−ブチルスチレン、１，３−ジメチルスチレン、α−メチルスチレン、ビニルナフタレン、ビニルアントラセン、１，１−ジフェニルエチレン等があり、なかでもスチレンは好適である。スチレン系単量体は一種類あるいは二種類以上を用いることができる。共役ジエン単量体とはその構造中に共役二重結合を有する化合物であり、例えば１，３−ブタジエン（ブタジエン）、２−メチル−１，３−ブタジエン（イソプレン）、２，３−ジメチル−１，３−ブタジエン、１，３−ペンタジエン、１，３−ヘキサジエン、２−メチルペンタジエン等があり、なかでもブタジエン、イソプレンは好適である。共役ジエン単量体は一種類あるいは二種類以上を用いることができる。
Hereinafter, the present invention will be described in detail.
(A) The block copolymer produced from styrene and a conjugated diene contains in its structure a polymer block mainly composed of a styrene monomer and a polymer block mainly composed of a conjugated diene monomer. It is a polymer. Styrene monomers include styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-diphenylethylene Among them, styrene is preferable. One or more styrenic monomers can be used. The conjugated diene monomer is a compound having a conjugated double bond in its structure, such as 1,3-butadiene (butadiene), 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl- There are 1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, 2-methylpentadiene, etc., among which butadiene and isoprene are preferred. One type or two or more types of conjugated diene monomers can be used.
スチレン系単量体を主体とする重合体ブロックとは、スチレン系単量体に由来する構造のみからなる重合体ブロック、スチレン系単量体に由来する構造を５０質量％以上含有する重合体ブロックのいずれをも意味する。共役ジエン単量体を主体とする重合体ブロックとは共役ジエン単量体に由来する構造のみからなる重合体ブロック、共役ジエン単量体に由来する構造を５０質量％以上含有する重合体ブロックのいずれをも意味する。 The polymer block mainly composed of a styrene monomer is a polymer block consisting only of a structure derived from a styrene monomer, and a polymer block containing 50% by mass or more of a structure derived from a styrene monomer. Means either. A polymer block mainly composed of a conjugated diene monomer is a polymer block consisting only of a structure derived from a conjugated diene monomer, or a polymer block containing 50% by mass or more of a structure derived from a conjugated diene monomer. It means both.
（Ａ）スチレン−共役ジエンブロック共重合体中の共役ジエン含有量は、（Ａ）成分を１００質量％としたときに１０〜６０質量％が好ましい。１０質量％未満では樹脂組成物の強度が低下していまい、６０質量％を超えると樹脂の耐熱性が乏しくなることから、包装容器等への熱成形時の熱劣化が生じる場合がある。 (A) The conjugated diene content in the styrene-conjugated diene block copolymer is preferably 10 to 60% by mass when the component (A) is 100% by mass. If the amount is less than 10% by mass, the strength of the resin composition does not decrease. If the amount exceeds 60% by mass, the heat resistance of the resin becomes poor, and thus thermal degradation may occur during thermoforming to a packaging container or the like.
（Ｂ）ポリスチレン樹脂とは、一般のポリスチレン樹脂、耐衝撃性ポリスチレン樹脂 （ＨＩＰＳ）、及びＨＩＰＳとＧＰＰＳの混合物である。一般のポリスチレン樹脂 （ＧＰＰＳ） とは、スチレン、ｏ−メチルスチレン、ｐ−メチルスチレン、ｐ−ｔｅｒｔ−ブチルスチレン、１，３−ジメチルスチレン、α−メチルスチレン、ビニルナフタレン、ビニルアントラセン、１，１−ジフェニルエチレン等の芳香族ビニル化合物を単量体とするポリマーを主成分とする樹脂である。また耐衝撃性ポリスチレン樹脂 （ＨＩＰＳ） とは、ポリブタジエン等のゴムにスチレン等の芳香族ビニルをグラフト重合したグラフトゴムを含有するスチレン系樹脂であって、一般に耐衝撃性ポリスチレン樹脂と呼ばれている樹脂である。これらＧＰＰＳ及びＨＩＰＳは、電子部品包装容器の形態や用途において要求される強度特性によって、それぞれ単独で用いることもできるし、２種類以上を併用してもよい。 (B) Polystyrene resin is a general polystyrene resin, impact-resistant polystyrene resin (HIPS), and a mixture of HIPS and GPPS. General polystyrene resin (GPPS) means styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1 -A resin mainly composed of a polymer containing an aromatic vinyl compound such as diphenylethylene as a monomer. The impact-resistant polystyrene resin (HIPS) is a styrene resin containing a graft rubber obtained by graft-polymerizing an aromatic vinyl such as styrene to a rubber such as polybutadiene, and is generally called an impact-resistant polystyrene resin. Resin. These GPPS and HIPS can be used alone or in combination of two or more depending on the strength characteristics required in the form and application of the electronic component packaging container.
本発明のスチレン系樹脂組成物において、（Ａ）、（Ｂ）および（Ｃ）成分の合計を１００質量％としたときの（Ａ）成分と（Ｂ）成分の含有量は、それぞれ６〜８９質量％である。（Ａ）成分が６質量％未満では、１〜６質量％の（Ｃ）成分を含有させた時に強度特性が低下し、それを用いた電子部品包装容器の衝撃強度が不十分なものになる。また、（Ａ）成分が８９質量％を超えた場合は、この樹脂組成物の成形加工性が著しく低下し、良好な成形体が得られない。一方で（Ｂ）成分が６質量％未満では、前記と同様に樹脂組成物の成形加工性が著しく低下し、８９質量％を超えると、得られた電子部品容器の耐衝撃強度が不十分となる。 In the styrene resin composition of the present invention, the content of the component (A) and the component (B) when the total of the components (A), (B), and (C) is 100% by mass is 6 to 89, respectively. % By mass. When the component (A) is less than 6% by mass, the strength characteristics are lowered when 1 to 6% by mass of the component (C) is contained, and the impact strength of the electronic component packaging container using the component is insufficient. . Moreover, when (A) component exceeds 89 mass%, the moldability of this resin composition will fall remarkably, and a favorable molded object will not be obtained. On the other hand, when the component (B) is less than 6% by mass, the molding processability of the resin composition is remarkably reduced as described above, and when it exceeds 89% by mass, the impact strength of the obtained electronic component container is insufficient. Become.
本発明においてイオン性液体とは、以下の（１）〜（３）の化合物のことで、その構造式は化１〜３で表される。
（１）ピリジウム誘導体塩
In the present invention, the ionic liquid refers to the following compounds (1) to (3), and the structural formula thereof is represented by chemical formulas 1 to 3.
(1) Pyridium derivative salt
（２）イミダゾリウム誘導体塩
(2) Imidazolium derivative salt
（３）脂肪族アミン誘導体塩
(3) Aliphatic amine derivative salt
本発明においてはこれらのうち少なくとも１種類の有機塩を用いればよく、また複数を併用することも可能である。 式中のＸ−は陰イオン成分を示し、陰イオン成分の代表例としてはNO3 -、CH3CO2 -、BF4 -、PF6 -、CF3CO2 -、CF3SO2 -、ＨＳＯ４ −、(CF3SO2)2N-が挙げられ、好ましくは(CF3SO2)2N- が用いられる。
式中のＲおよびＲ’は、アルキル基、アルケニル基又は下記の（４）の化学式で表されるアルキルオキシエトキシエチル基のいずれかであり、互いに同じであっても異なったものであっても良い。
Ｒ’’ＯＣＨ2ＣＨ2ＯＣＨ2ＣＨ2− （４）
（式中、Ｒ’’はメチル基又はエチル基である。）
In the present invention, at least one of these organic salts may be used, and a plurality of them may be used in combination. X − in the formula represents an anion component, and typical examples of the anion component are NO 3 − , CH 3 CO 2 − , BF 4 − , PF 6 − , CF 3 CO 2 − , CF 3 SO 2 − , HSO 4 -, (CF 3 SO 2) 2 N - and the like, preferably (CF 3 SO 2) 2 N - is used.
R and R ′ in the formula are either an alkyl group, an alkenyl group or an alkyloxyethoxyethyl group represented by the following chemical formula (4), and may be the same or different from each other: good.
R ″ OCH 2 CH 2 OCH 2 CH 2 − (4)
(In the formula, R ″ is a methyl group or an ethyl group.)
本発明のスチレン系樹脂組成物中でこれら（Ｃ）成分の占める割合は１〜１０質量％であり、好ましくは２〜６質量％である。（Ｃ）成分の割合が１質量％未満では十分な帯電防止効果が得られない。また、１０％を超えて添加しても帯電防止の大きな効果は得られず、成形加工することが困難となる。 The proportion of the component (C) in the styrene resin composition of the present invention is 1 to 10% by mass, preferably 2 to 6% by mass. When the proportion of the component (C) is less than 1% by mass, a sufficient antistatic effect cannot be obtained. Moreover, even if added over 10%, a great effect of preventing charging cannot be obtained, and it becomes difficult to perform molding.
このスチレン系樹脂組成物を製造するには、まず、それぞれの成分を所定の割合で配合して、一般的に使用されているタンブラーのような混合機を用いてドライブレンドし、二軸押出機などの公知の方法によって混練りしてコンパウンドを得るか、あるいは、その成分の一部を二軸押出機などにより混練りし、その混練りの過程において残された成分を添加してもよく、ペレット状コンパウンドを得る際に、各成分の添加順序に特別な制限はない。また、本発明の樹脂組成物は所定の割合で配合したブレンド物としてシートや包装容器の製造工程に用いることも可能である。 In order to produce this styrenic resin composition, first, the respective components are blended at a predetermined ratio, and dry blended using a generally used mixer such as a tumbler. Knead by a known method such as to obtain a compound, or part of its components may be kneaded by a twin screw extruder or the like, and the components left in the kneading process may be added, When obtaining a pellet-like compound, there is no particular limitation on the order of addition of each component. In addition, the resin composition of the present invention can be used in a manufacturing process of a sheet or a packaging container as a blend blended at a predetermined ratio.
このスチレン系樹脂組成物には必要に応じて、酸化防止剤、紫外線吸収剤等の劣化抑制剤や内潤剤、外潤剤等の滑剤に代表される加工助剤の他、改質剤として少量他の樹脂成分を添加することも可能である。 If necessary, the styrene-based resin composition can be used as a modifier, in addition to a deterioration inhibitor such as an antioxidant and an ultraviolet absorber, a processing aid represented by a lubricant such as an internal lubricant, and an external lubricant. It is also possible to add a small amount of other resin components.
シートは本発明のスチレン系樹脂組成物の一つの使用形態である。押出成形によって該樹脂組成物を、一般的に行われている押出成形によってシート状に成形し、そのシートを真空成形等の熱成形（Thermo-Forming）によって、キャリアテープ等の電子部品包装容器に成形して用いられる。本発明のシートは単層構成とすることもできるが、その用途において必要な機械的特性を得るために、熱可塑性樹脂からなる基材層の少なくとも片面に、前記のイオン性液体を含有する本発明の樹脂組成物からなる表面層を設けた多層構成とすることも可能である。その構成としては例えば表面層／基材層／表面層のような多層構成や、あるいは、表面層と基材層の間に別の層を挿入した構成も可能で、成形性や剛性等を目的に合わせて調整したり、表面層と基材層の密着を高めることが可能である。 The sheet is one use form of the styrenic resin composition of the present invention. The resin composition is formed into a sheet by extrusion molding, and the sheet is formed into an electronic component packaging container such as a carrier tape by thermoforming such as vacuum forming. Used by molding. Although the sheet of the present invention may have a single-layer structure, in order to obtain the mechanical properties necessary for its use, a book containing the ionic liquid on at least one side of a base material layer made of a thermoplastic resin. It is also possible to have a multilayer structure provided with a surface layer made of the resin composition of the invention. As the configuration, for example, a multilayer configuration such as surface layer / base material layer / surface layer or a configuration in which another layer is inserted between the surface layer and the base material layer is possible. It is possible to adjust according to the above, or to enhance the adhesion between the surface layer and the base material layer.
前記のような基材層を有する多層構成とする場合、に用いる熱可塑性樹脂としては特に制限はないが、（B）ポリスチレン樹脂、あるいは（Ａ）スチレン及び共役ジエンよりなるブロック共重合体と（Ｂ）ポリスチレン樹脂からなる組成物が好適である。前記基材層として各成分の割合は、（Ａ）成分１０〜９０質量％、（Ｂ）成分１０〜９０質量％が好ましく、より好ましくは（Ａ）成分２０〜８０質量％、（Ｂ）成分２０〜８０質量％である。（Ａ）成分が１０質量％未満では十分な効果が得られず、９０質量％を超えるとシートの剛性(引張弾性率)が低下してしまう。 When the multilayer structure having the base material layer as described above is used, the thermoplastic resin used is not particularly limited, but (B) a polystyrene resin or (A) a block copolymer made of styrene and a conjugated diene ( B) A composition comprising a polystyrene resin is preferred. The proportion of each component as the substrate layer is preferably (A) component 10 to 90 mass%, (B) component 10 to 90 mass%, more preferably (A) component 20 to 80 mass%, (B) component. It is 20-80 mass%. When the component (A) is less than 10% by mass, a sufficient effect cannot be obtained, and when it exceeds 90% by mass, the rigidity (tensile modulus) of the sheet is lowered.
前記基材層には必要に応じて、酸化防止剤、紫外線吸収剤等の劣化抑制剤や内潤剤、外潤剤等の滑剤に代表される加工助剤の他、改質剤として少量他の樹脂成分を添加することも可能である。 If necessary, the base material layer may include a deterioration inhibitor such as an antioxidant and an ultraviolet absorber, a processing aid represented by a lubricant such as an internal lubricant and an external lubricant, and a small amount as a modifier. It is also possible to add the resin component.
前記のシートは、押出成形やカレンダー成形等を用いた公知の一般的な方法によって得ることができる。多層シートを製造するには、押出機により各層のシートもしくはフィルムをそれぞれ個別に成形しておいて、熱ラミネート法、ドライラミネート法および押出ラミネート法等により積層して製造する方法、予め成形した基材層のシートの上に、押出コーティング等により他の層を積層する方法、またマルチマニホールドダイやフィードブロックを用いた多層共押出法等の一般的な方法により積層シートを得ることができるが、その生産性の観点から、多層共押出法により一括して積層シートを得ることが好ましい。 The sheet can be obtained by a known general method using extrusion molding, calendar molding, or the like. In order to produce a multilayer sheet, a sheet or film of each layer is individually formed by an extruder and laminated by a heat lamination method, a dry lamination method, an extrusion lamination method, or the like. A laminated sheet can be obtained by a general method such as a multilayer coextrusion method using a multi-manifold die or a feed block, and a method of laminating other layers on the material layer sheet by extrusion coating or the like. From the viewpoint of productivity, it is preferable to obtain a laminated sheet all at once by a multilayer coextrusion method.
本発明のシートの平均厚さは、単層、多層に拘わらず、その使用用途に合わせて適宜調整することができ、特に制限されるものではないが、一般的には５０〜２０００μｍのものが用いられる。また、多層シートにする場合、シート全体の厚さに占める表面層の厚さの割合は片側にそれぞれが２％以上であることが好ましい。表面層の厚さがこの範囲より少ないとシートを真空成形等により包装容器等に成形した際に、十分な表面抵抗率が得られ難くなってしまう。 The average thickness of the sheet of the present invention can be appropriately adjusted according to the intended use regardless of whether it is a single layer or multiple layers, and is not particularly limited, but generally has a thickness of 50 to 2000 μm. Used. Moreover, when making it a multilayer sheet, it is preferable that the ratio of the thickness of the surface layer to the thickness of the whole sheet is 2% or more on each side. When the thickness of the surface layer is less than this range, it is difficult to obtain a sufficient surface resistivity when the sheet is formed into a packaging container or the like by vacuum forming or the like.
シートから真空成形、圧空成型、プレス成形等公知のシートの成形方法を利用することにより、キャリアテープ（エンボスキャリアテープ）、トレイ等の自由な形状の電子部品包装容器を得ることができる。 By using a known sheet forming method such as vacuum forming, pressure forming, press forming or the like from a sheet, it is possible to obtain a free-form electronic component packaging container such as a carrier tape (embossed carrier tape) or a tray.
電子部品包装体とは、キャリアテープ、トレイ等の包装形態の電子部品包装容器に電子部品を収納したものである。キャリアテープについては、電子部品を収納した後にフィルムによる蓋を施したものを含む。 The electronic component package is one in which an electronic component is stored in an electronic component packaging container in a packaging form such as a carrier tape or a tray. About a carrier tape, the thing which gave the lid | cover with a film after accommodating an electronic component is included.
包装する電子部品としては特に限定はなく、例えばＩＣ、ＬＥＤ（発光ダイオード）、抵抗、液晶、コンデンサー、トランジスター、圧電素子レジスター、フィルター、水晶発振子、水晶振動子、ダイオード、コネクター、スイッチ、ボリュウム、リレー、インダクタ等がある。ＩＣの形式は特に限定はなく、例えばＳＯＰ、ＨＥＭＴ、ＳＱＦＰ、ＢＧＡ、ＣＳＰ、ＳＯＪ、ＱＦＰ、ＰＬＣＣ等がある。また、これら電子部品を使用した中間製品や最終製品も包装の対象となる。 There are no particular limitations on the electronic components to be packaged. For example, IC, LED (light emitting diode), resistor, liquid crystal, capacitor, transistor, piezoelectric element register, filter, crystal oscillator, crystal resonator, diode, connector, switch, volume, There are relays and inductors. The format of the IC is not particularly limited, and examples thereof include SOP, HEMT, SQFP, BGA, CSP, SOJ, QFP, and PLCC. In addition, intermediate products and final products using these electronic components are also subject to packaging.
本発明の実施例および比較例を示す。なお、これらの例において各種性能の評価は下記の方法により行った。
（１） 表面抵抗率
ＪＩＳ Ｋ ６９１１に準拠し２３℃×５０％ＲＨ環境下で測定。また、低湿度環境下での表面抵抗率については２３℃×２０％ＲＨ環境下で同様の測定を行った。
帯電防止性能は、測定した表面抵抗率が１０１２〜１０１３Ω/sqでは静的状態での障害防止(ほこり付着防止)に有効であり、１０１０〜１０１２Ω/sqでは動的状態での障害防止(常に摩擦等で静電気発生下での帯電防止)に有効である。
（２） ５０％破壊エネルギー
東洋精機社製デュポン式衝撃試験機にて、１／２インチ半球状撃芯を用い荷重５００ｇで行った以外は、ＪＩＳ Ｋ ７２１１に準拠して落錘試験を行い、５０％破壊エネルギー（Ｊ）の測定を行った。なお、環境温度は２３℃、試験片は１５０ｍｍ×１５０ｍｍの形状で行った。
（３） キャリアテープへの賦形性
シートを２４ｍｍ幅にスリットし、EDG社製圧空成形機により成形を行い、キャリアテープへのシートの賦形性の評価を行った。評価は、連続的にポケットの形状が得られる場合を「良好」とし、それ以外を「不良」とした。
The Example and comparative example of this invention are shown. In these examples, various performances were evaluated by the following methods.
(1) Surface resistivity Measured in an environment of 23 ° C. × 50% RH in accordance with JIS K 6911. Moreover, about the surface resistivity in a low humidity environment, the same measurement was performed in 23 degreeC x 20% RH environment.
The antistatic performance is effective for preventing failure in the static state (preventing dust adhesion) when the measured surface resistivity is 10 12 to 10 13 Ω / sq, and is effective in the dynamic state when 10 10 to 10 12 Ω / sq. It is effective for preventing the failure of the battery (preventing charging under the occurrence of static electricity due to friction).
(2) 50% fracture energy A drop weight test was performed in accordance with JIS K 7211, except that the load was 500 g using a 1/2 inch hemispherical core with a DuPont impact tester manufactured by Toyo Seiki Co., Ltd. The 50% fracture energy (J) was measured. The environmental temperature was 23 ° C., and the test piece was 150 mm × 150 mm in shape.
(3) The formable sheet to the carrier tape was slit into a width of 24 mm, and molded by a pressure forming machine manufactured by EDG, and the formability of the sheet to the carrier tape was evaluated. In the evaluation, “good” was obtained when the pocket shape was continuously obtained, and “bad” was obtained otherwise.
（実施例１〜７）
一般のポリスチレン樹脂（ＧＰＰＳ）として東洋スチレン社ＨＲＭ２１、耐衝撃性ポリスチレン樹脂（ＨＩＰＳ）として東洋スチレン社 Ｈ８５０を用いた。
スチレンと共役ジエンからなるブロック共重合体としては以下の３種類の樹脂を用いた。
（１）スチレン含有量：７０質量％、 共役ジエン含有量：３０質量％
（２）スチレン含有量：７４質量％、 共役ジエン含有量：２６質量％
（３）スチレン含有量：８３．３質量％、共役ジエン含有量：１６．７質量％
上記の樹脂成分および脂肪族アミン誘導体塩（広栄化学工業社 ＩＬ−Ａ２）を、表１に示す組成割合にて各々タンブラーにてブレンド後φ４５ｍｍ二軸押出機により混練し各樹脂組成物のコンパウンドを得た。
次にφ４０ｍｍ押出機（Ｌ／Ｄ＝２６）、４８０ｍｍ幅のＴダイにより肉厚１ｍｍの単層シートを得た。
これらのシートの２３℃×５０％ＲＨ、および２３℃×２０％ＲＨ環境下の表面抵抗率を、前記の方法により測定した。これらの実施例においては、低湿度環境下においても10乗台を得ることができた。
(Examples 1-7)
Toyostyrene Co., Ltd. HRM21 was used as a general polystyrene resin (GPPS), and Toyo Styrene Co., Ltd. H850 was used as an impact resistant polystyrene resin (HIPS).
The following three types of resins were used as the block copolymer composed of styrene and conjugated diene.
(1) Styrene content: 70% by mass, conjugated diene content: 30% by mass
(2) Styrene content: 74% by mass, conjugated diene content: 26% by mass
(3) Styrene content: 83.3 mass%, conjugated diene content: 16.7 mass%
The above resin component and aliphatic amine derivative salt (Guangei Chemical Industry Co., Ltd. IL-A2) were blended in a tumbler at the composition ratio shown in Table 1 and then kneaded with a φ45 mm twin screw extruder to obtain a compound of each resin composition. Obtained.
Next, a single-layer sheet having a thickness of 1 mm was obtained using a φ40 mm extruder (L / D = 26) and a T-die having a width of 480 mm.
The surface resistivity of these sheets in an environment of 23 ° C. × 50% RH and 23 ° C. × 20% RH was measured by the method described above. In these examples, the 10th rank could be obtained even in a low humidity environment.
（比較例１〜３）
肪族アミン誘導体塩（広栄化学工業社 ＩＬ−Ａ２）を表２に示す配合とした以外は実施例と同様の操作を行い、単層シートを作製した。（スチレンと共役ジエンからなるブロック共重合体としては前記実施例の（２）の樹脂を用いた。）
評価結果を表２に示すとおりで、比較例１では５０％ＲＨ、２０％ＲＨのいずれの条件の評価においても１０１３Ωオーダーの表面抵抗率となり十分な帯電防止効果が得られず、比較例２においては実用的な衝撃強度がえられず、又比較例３においてはキャリアテープへの賦形性が不良であった。
(Comparative Examples 1-3)
A single-layer sheet was produced in the same manner as in Example except that the aliphatic amine derivative salt (Guangei Chemical Industry Co., Ltd. IL-A2) was blended as shown in Table 2. (As the block copolymer composed of styrene and conjugated diene, the resin (2) in the above example was used.)
The evaluation results are as shown in Table 2, and in Comparative Example 1, the surface resistivity is on the order of 10 13 Ω in any evaluation of 50% RH and 20% RH, and a sufficient antistatic effect cannot be obtained. In No. 2, practical impact strength was not obtained, and in Comparative Example 3, formability to the carrier tape was poor.
(実施例８ および 比較例４）
スチレンと共役ジエンからなるブロック共重合体としては、前記の（２）の樹脂（スチレン含有量：７４質量％、共役ジエン含有量：２６質量％）を用いて、実施例８では脂肪族アミン誘導体塩（IL―A2）を、比較例４ではアニオン性界面活性剤（エレクトロストリッパーを用いて、表３および４に記載した組成の基材層原料および表面層原料を、各々タンブラーにてブレンド後φ４５ｍｍ二軸押出機により混練し各樹脂組成物を得た。次にこれらの樹脂組成物を用いて、φ６５ｍｍ押出機（Ｌ／Ｄ＝３２）１台、φ４０ｍｍ押出機（Ｌ／Ｄ＝２６）２台および６００ｍｍ幅のＴダイによりＦＢブロック法にて、平均肉厚１ｍｍ、表面層／基材層／表面層 ： ５／９０／５５の２種３層構成のシートを得た。
実施例８のシートの２３℃×５０％RHおよび２３℃×２０％ＲＨでの表面抵抗率は、いずれも１０10Ω/sqオーダーであり良好であった。また、このシートの衝撃強度は０．７Jであり、キャリアテープへの賦形性も良好であった。
一方で比較例４のシートは、湿度５０％ＲＨでは１０１０Ωオーダーであったが、２０％ＲＨでは１０１３Ωオーダーとなり、十分な帯電防止効果が得られなかった。
(Example 8 and Comparative Example 4)
As the block copolymer composed of styrene and conjugated diene, aliphatic amine derivative was used in Example 8 by using the above-mentioned resin (2) (styrene content: 74 mass%, conjugated diene content: 26 mass%). The salt (IL-A2) was mixed with a base layer raw material and a surface layer raw material having the composition described in Tables 3 and 4 using a tumbler in Comparative Example 4 using an anionic surfactant (electrostripper). Each resin composition was obtained by kneading with a twin screw extruder, and then using these resin compositions, one φ65 mm extruder (L / D = 32), φ40 mm extruder (L / D = 26) 2 A sheet having an average thickness of 1 mm and a surface layer / base material layer / surface layer of 5/90/55 was obtained by a FB block method using a table and a 600 mm wide T-die.
The surface resistivity of the sheet of Example 8 at 23 ° C. × 50% RH and 23 ° C. × 20% RH was good on the order of 10 10 Ω / sq. Moreover, the impact strength of this sheet | seat was 0.7 J, and the shaping property to a carrier tape was also favorable.
On the other hand, the sheet of Comparative Example 4 was on the order of 10 10 Ω at a humidity of 50% RH, but on the order of 10 13 Ω at 20% RH, and a sufficient antistatic effect was not obtained.
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