JP2002332392A - Resin composition and sheet - Google Patents
Resin composition and sheetInfo
- Publication number
- JP2002332392A JP2002332392A JP2001139664A JP2001139664A JP2002332392A JP 2002332392 A JP2002332392 A JP 2002332392A JP 2001139664 A JP2001139664 A JP 2001139664A JP 2001139664 A JP2001139664 A JP 2001139664A JP 2002332392 A JP2002332392 A JP 2002332392A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- conjugated diene
- styrene
- resin composition
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は樹脂組成物ならびに
その組成物からなるシート、電子部品包装容器等に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition, a sheet comprising the composition, a packaging container for electronic parts, and the like.
【０００２】[0002]
【従来の技術】スチレン樹脂は成形しやすく、透明性お
よび耐水性に優れているため各種包装材料、容器および
成形物に広範囲に利用されている。しかしながら、スチ
レン樹脂は、フィルム、シートに成形した場合、硬く
て、割れやすく、さらに他のフィルム、シートとの接着
性に劣るという欠点がある。2. Description of the Related Art Styrene resins are widely used in various packaging materials, containers and molded articles because they are easy to mold and have excellent transparency and water resistance. However, the styrene resin, when formed into a film or sheet, has the drawback that it is hard and easily broken, and has poor adhesion to other films and sheets.
【０００３】[0003]
【発明が解決しようとする課題】本発明は成形性および
透明性に優れた樹脂組成物およびそれからなるシート等
を提供する。SUMMARY OF THE INVENTION The present invention provides a resin composition having excellent moldability and transparency, and a sheet and the like comprising the same.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）共役ジ
エン含有量が１０〜５０重量％であるスチレン−共役ジ
エンブロック共重合体と（Ｂ）ポリスチレン系樹脂を
（Ａ）と（Ｂ）の合計に対して（Ａ）２０〜８０重量
％、（Ｂ）８０〜２０重量％の割合で含有する樹脂組成
物である。また本発明は（Ａ１）共役ジエン含有量が３
０重量％を越えて５０重量％以下であるスチレン−共役
ジエンブロック共重合体、（Ａ２）共役ジエン含有量が
１０重量％以上３０重量％以下であるスチレン−共役ジ
エンブロック共重合体および（Ｂ）ポリスチレン系樹脂
を、（Ａ１）と（Ａ２）の合計に対して（Ａ１）１０〜
９０重量％、（Ａ２）９０〜１０重量％の範囲であり、
（Ａ１）、（Ａ２）および（Ｂ）の合計に対して（Ａ
１）と（Ａ２）の合計が２０〜８０重量％、（Ｂ）８０
〜２０重量％の割合で含有する樹脂組成物である。SUMMARY OF THE INVENTION The present invention relates to (A) a styrene-conjugated diene block copolymer having a conjugated diene content of 10 to 50% by weight and (B) a polystyrene-based resin as (A) and (B). (A) 20 to 80% by weight and (B) 80 to 20% by weight with respect to the total amount of the resin composition. Further, the present invention provides (A1) a conjugated diene content of 3
(A2) a styrene-conjugated diene block copolymer having a conjugated diene content of 10% by weight or more and 30% by weight or less; ) The polystyrene-based resin is (A1) 10 to 10 with respect to the sum of (A1) and (A2).
90% by weight, (A2) 90 to 10% by weight,
(A1), (A2) and (B)
20) to 80% by weight of the sum of (1) and (A2);
It is a resin composition containing up to 20% by weight.
【０００５】（Ａ）、（Ａ１）および（Ａ２）のスチレ
ン−共役ジエンブロック共重合体とは、スチレン系単量
体を主体とする重合体ブロックと共役ジエン単量体を主
体とする重合体ブロックをその構造に有するブロック共
重合体である。例えばスチレン系単量体を主体として重
合して得られる重合体ブロックと共役ジエン単量体を主
体として重合して得られる重合体ブロックをその構造に
有するブロック共重合体である。ここで主体とは５０重
量％を以上を意味し、各単量体のみからなる場合を含
む。スチレン系単量体としてはスチレン、ｏ−メチルス
チレン、ｐ−メチルスチレン、ｐ−ｔｅｒｔ−ブチルス
チレン、１，３−ジメチルスチレン、α−メチルスチレ
ン、ビニルナフタレン、ビニルアントラセン、１，１−
ジフェニルエチレン等があり、なかでもスチレンが好適
である。共役ジエン単量体とはその構造中に一対の共役
二重結合を有する化合物であり、例えば１，３−ブタジ
エン（ブタジエン）、２−メチル−１，３−ブタジエン
（イソプレン）、２，３−ジメチル−１，３−ブタジエ
ン、１，３−ペンタジエン、１，３−ヘキサジエン等が
あり、なかでもブタジエン、イソプレンが好適である。
共役ジエン単量体は１種類のみあるいは２種類以上併用
して使用することができる。The styrene-conjugated diene block copolymers (A), (A1) and (A2) are a polymer block mainly composed of a styrene monomer and a polymer mainly composed of a conjugated diene monomer. It is a block copolymer having a block in its structure. For example, it is a block copolymer having in its structure a polymer block obtained by polymerizing mainly a styrene-based monomer and a polymer block obtained by polymerizing mainly a conjugated diene monomer. Here, the term “mainly” means 50% by weight or more, and includes the case where each monomer is composed of only each monomer. Styrene-based monomers include styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-
Examples include diphenylethylene, and among them, styrene is preferred. A conjugated diene monomer is a compound having a pair of conjugated double bonds in its structure. For example, 1,3-butadiene (butadiene), 2-methyl-1,3-butadiene (isoprene), 2,3- There are dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, and the like. Of these, butadiene and isoprene are preferred.
The conjugated diene monomers can be used alone or in combination of two or more.
【０００６】（Ａ）のスチレン−共役ジエンブロック共
重合体の共役ジエン含有量は１０〜５０重量％好ましく
は３２〜４０重量％である。（Ａ）のスチレン−共役ジ
エンブロック共重合体は（Ａ１）共役ジエン含有量が３
０重量％を越えて５０重量％以下であるスチレン−共役
ジエンブロック共重合体と（Ａ２）共役ジエン含有量が
１０重量％以上３０重量％以下であるスチレン−共役ジ
エンブロック共重合体を（Ａ１）と（Ａ２）の合計に対
して（Ａ１）１０〜９０重量％、（Ａ２）９０〜１０重
量％の範囲で用いることが好ましい。これにより成形
性、透明性に更に優れた樹脂組成物およびシートを得る
ことができる。The styrene-conjugated diene block copolymer (A) has a conjugated diene content of 10 to 50% by weight, preferably 32 to 40% by weight. The styrene-conjugated diene block copolymer (A) has a (A1) conjugated diene content of 3
(A2) a styrene-conjugated diene block copolymer having a conjugated diene content of 10% by weight or more and 30% by weight or less (A1); ) And (A2) are preferably used in the range of (A1) 10 to 90% by weight and (A2) 90 to 10% by weight. This makes it possible to obtain a resin composition and a sheet having better moldability and transparency.
【０００７】（Ｂ）ポリスチレン系樹脂とはスチレン系
単量体の単独重合体、共重合体であり、例えばスチレン
樹脂（ＧＰＰＳ）、耐衝撃スチレン樹脂（ＨＩＰＳ）を
好適に用いることができる。ポリスチレン系樹脂は１種
類のみで使用することもできるが、２種類以上を併用す
ることも可能であり特に、ＧＰＰＳとＨＩＰＳのブレン
ド物が好適に用いられる。その比率は特に限定されない
が、ＧＰＰＳ：ＨＩＰＳを重量比で１５：８５〜８５：
１５の範囲が好適に用いられる。(B) The polystyrene resin is a homopolymer or a copolymer of a styrene monomer. For example, a styrene resin (GPPS) or a high-impact styrene resin (HIPS) can be suitably used. The polystyrene-based resin can be used alone, but two or more can be used in combination. In particular, a blend of GPPS and HIPS is suitably used. Although the ratio is not particularly limited, the weight ratio of GPPS: HIPS is 15:85 to 85:85.
A range of 15 is preferably used.
【０００８】（Ａ）もしくは（Ａ１）と（Ａ２）の総量
と、（Ｂ）の割合は重量で２０〜８０：８０〜２０であ
る。好適には重量で４０〜６０：６０〜４０の範囲が用
いられる。The ratio of (A) or the total amount of (A1) and (A2) and (B) is 20 to 80:80 to 20 by weight. Preferably, a range of 40 to 60:60 to 40 by weight is used.
【０００９】本発明の樹脂組成物を製造する方法は、上
記の（Ａ）、（Ｂ）成分を所定の割合で配合して、一般
的に使用されているタンブラーのような混合機を用いて
ドライブレンドしてもよく、あるいは、（Ａ）、（Ｂ）
成分のすべてもしくは一部をスクリュー押出機などによ
り混練りして、ペレット状コンパウンドにして用いても
良い。また、樹脂組成物の製造においては、（Ａ）、
（Ｂ）成分の添加順序に特別な制限はない。In the method for producing the resin composition of the present invention, the above components (A) and (B) are blended at a predetermined ratio, and the mixture is prepared using a generally used mixer such as a tumbler. It may be dry blended, or (A), (B)
All or a part of the components may be kneaded by a screw extruder or the like, and used as a pellet compound. In the production of the resin composition, (A)
There is no particular restriction on the order of adding the component (B).
【００１０】本発明のシートを製造する方法には特に限
定されない。例えば、押出成形法が用いられ、Ｔダイ法
等で製造される。シートの厚みは特に限定されないが、
５０〜２０００μｍのシートが好適に用いられる。[0010] The method for producing the sheet of the present invention is not particularly limited. For example, an extrusion molding method is used, and it is manufactured by a T-die method or the like. The thickness of the sheet is not particularly limited,
A sheet of 50 to 2000 μm is preferably used.
【００１１】樹脂組成物およびシートは成形して電子部
品包装容器として好適に用いることが出来る。電子部品
包装容器とは電子部品の包装容器であるが、電子部品と
しては特に限定されず、例えば、ＩＣ、抵抗、コンデン
サ、インダクタ、トランジスタ、ダイオード、ＬＥＤ
（発光ダイオード）、液晶、圧電素子レジスター、フィ
ルター、水晶発振子、水晶振動子、コネクター、スイッ
チ、ボリュウム、リレー等がある。ＩＣの形式にも特に
限定されず、例えばＳＯＰ、ＨＥＭＴ、ＳＱＦＰ、ＢＧ
Ａ、ＣＳＰ、ＳＯＪ、ＱＦＰ、ＰＬＣＣ等がある。シー
トに真空成形、圧空成形、熱板成形を行うことにより真
空成形トレー、マガジンチューブ、キャリアテープ（エ
ンボスキャリアテープ）等の包装形態の電子部品包装容
器が製造可能である。樹脂組成物を射出成形することに
よりインジェクショントレーの製造ができる。電子部品
包装容器に電子部品を収納することにより電子部品包装
体となる。この場合容器には必要に応じ蓋がされる。例
えばキャリアテープには、電子部品を収納した後にカバ
ーテープによるふたが施される。電子部品包装体にはこ
のようなものも含む。電子部品包装容器あるいは成形前
のシートの表面に帯電防止処理をすることができる。The resin composition and sheet can be molded and used suitably as a packaging container for electronic parts. The electronic component packaging container is a packaging container for electronic components, but is not particularly limited as an electronic component, and includes, for example, an IC, a resistor, a capacitor, an inductor, a transistor, a diode, and an LED.
(Light emitting diode), liquid crystal, piezoelectric element register, filter, crystal oscillator, crystal oscillator, connector, switch, volume, relay, etc. There is no particular limitation on the type of IC, for example, SOP, HEMT, SQFP, BG
A, CSP, SOJ, QFP, PLCC, etc. By performing vacuum forming, pressure forming, and hot plate forming on the sheet, an electronic component packaging container in a packaging form such as a vacuum forming tray, a magazine tube, and a carrier tape (embossed carrier tape) can be manufactured. By injection molding the resin composition, an injection tray can be manufactured. An electronic component package is obtained by storing the electronic component in the electronic component packaging container. In this case, the container is covered if necessary. For example, the carrier tape is covered with a cover tape after storing the electronic components. The electronic component package also includes such a component. The surface of the electronic component packaging container or the sheet before molding can be subjected to an antistatic treatment.
【００１２】[0012]
【実施例】本発明の実施例を示す。各種性能の評価は下
記の方法により行った。 （１）キャリアテープ成形性 シートを２７ｍｍ幅にスリットし、圧空成形機により成
形してキャリアテープとしその際のシートの賦形成を評
価した。 （２）透明性 ＪＩＳ Ｋ ７１０５に準拠し、ヘーズメーターを用い
て全光透過率、ヘーズを測定した。An embodiment of the present invention will be described. Evaluation of various performances was performed by the following methods. (1) Formability of Carrier Tape The sheet was slit to a width of 27 mm, formed into a carrier tape by a pressure forming machine, and the formation of the sheet at that time was evaluated. (2) Transparency Total light transmittance and haze were measured using a haze meter according to JIS K 7105.
【００１３】実施例１ （Ａ）スチレン−共役ジエンブロック共重合体（スチレ
ン含有量７４％、ブタジエンを主体とする重合体ブロッ
クの共役ジエン含有量３６重量％）５０重量％、（Ｂ）
ポリスチレン系樹脂としてポリスチレン樹脂３５重量
％、および耐衝撃性ポリスチレン樹脂１５重量％を配合
し、φ４０ｍｍ押出機（Ｌ／Ｄ＝２６）および６００ｍ
ｍ幅のＴダイにより製膜し、肉厚３００μｍのシートを
得た。このシートに対して評価試験を行った。評価結果
を表１、表２に示す。Example 1 (A) 50% by weight of a styrene-conjugated diene block copolymer (styrene content: 74%, conjugated diene content of a polymer block mainly composed of butadiene: 36% by weight), (B)
35% by weight of a polystyrene resin and 15% by weight of an impact-resistant polystyrene resin are compounded as a polystyrene resin, and a φ40 mm extruder (L / D = 26) and 600 m
A film having a thickness of 300 μm was obtained by forming a film with a T-die having a width of m. An evaluation test was performed on this sheet. The evaluation results are shown in Tables 1 and 2.
【００１４】実施例２〜３ （Ａ１）スチレン−共役ジエンブロック共重合体（スチ
レン含有量７４％、ブタジエンを主体とする重合体ブロ
ックの共役ジエン含有量３６重量％）、（Ａ２）スチレ
ン−共役ジエンブロック共重合体樹脂（スチレン含有量
８０％、ブタジエンを主体とする重合体ブロックの共役
ジエン含有量３０重量％）、（Ｂ）ポリスチレン系樹脂
として、ポリスチレン樹脂および耐衝撃性ポリスチレン
樹脂を表２に示す樹脂組成にて配合し、φ４０ｍｍ押出
機（Ｌ／Ｄ＝２６）および６００ｍｍ幅のＴダイにより
製膜し、肉厚３００μｍのシートを得た。このシートに
対して評価試験を行った。評価結果を表１、表２に示
す。Examples 2-3 (A1) Styrene-conjugated diene block copolymer (styrene content 74%, conjugated diene content of polymer block mainly composed of butadiene 36% by weight), (A2) styrene-conjugated Table 2 shows a diene block copolymer resin (styrene content 80%, a conjugated diene content of a polymer block mainly composed of butadiene 30% by weight), and (B) polystyrene resins and impact-resistant polystyrene resins as polystyrene resins. And a film was formed using a φ40 mm extruder (L / D = 26) and a T-die having a width of 600 mm to obtain a sheet having a thickness of 300 μm. An evaluation test was performed on this sheet. The evaluation results are shown in Tables 1 and 2.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【表２】 [Table 2]
【００１７】[0017]
【発明の効果】以上に示すとおり、特定の（Ａ）スチレ
ン−共役ジエンブロック共重合体、（Ｂ）ポリスチレン
系樹脂を特定範囲にすること、特定の（Ａ１）、（Ａ
２）スチレン−共役ジエンブロック共重合体をブレンド
して用いることによりキャリアテープ成形性および透明
性に優れたシート等の成形に適した樹脂組成物を得るこ
とが可能となる。As described above, the specific (A) styrene-conjugated diene block copolymer, (B) the specific range of the polystyrene resin, the specific (A1), the specific (A)
2) By blending and using a styrene-conjugated diene block copolymer, it becomes possible to obtain a resin composition suitable for molding a sheet or the like having excellent carrier tape moldability and transparency.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 25/04 Ｂ６５Ｄ 85/38 Ｎ Ｆターム(参考） 3E067 AA11 AB41 AC01 AC11 BA15A BA25A BB14A 3E086 AB01 AD05 AD30 BA02 BA15 BB22 BB90 CA31 3E096 AA06 BA08 CA11 CC01 FA07 4F071 AA12X AA22 AA22X AA75 AF23 AF30 AF36 AH12 BB03 BB06 BC01 BC04 4J002 BC02X BP01W GG01 GG02──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (reference) C08L 25/04 B65D 85/38 NF term (reference) 3E067 AA11 AB41 AC01 AC11 BA15A BA25A BB14A 3E086 AB01 AD05 AD30 BA02 BA15 BB22 BB90 CA31 3E096 AA06 BA08 CA11 CC01 FA07 4F071 AA12X AA22 AA22X AA75 AF23 AF30 AF36 AH12 BB03 BB06 BC01 BC04 4J002 BC02X BP01W GG01 GG02
Claims (7)
％であるスチレン−共役ジエンブロック共重合体と
（Ｂ）ポリスチレン系樹脂を、（Ａ）と（Ｂ）の合計に
対して（Ａ）２０〜８０重量％、（Ｂ）８０〜２０重量
％の割合で含有する樹脂組成物。(1) A styrene-conjugated diene block copolymer having a conjugated diene content of 10 to 50% by weight and (B) a polystyrene resin are added to the sum of (A) and (B). A) a resin composition containing 20 to 80% by weight and (B) 80 to 20% by weight.
越えて５０重量％以下であるスチレン−共役ジエンブロ
ック共重合体、（Ａ２）共役ジエン含有量が１０重量％
以上３０重量％以下であるスチレン−共役ジエンブロッ
ク共重合体および（Ｂ）ポリスチレン系樹脂を、（Ａ
１）と（Ａ２）の合計に対して（Ａ１）１０〜９０重量
％、（Ａ２）９０〜１０重量％の範囲であり、（Ａ
１）、（Ａ２）および（Ｂ）の合計に対して（Ａ１）と
（Ａ２）の合計が２０〜８０重量％、（Ｂ）８０〜２０
重量％の割合で含有する樹脂組成物。2. A styrene-conjugated diene block copolymer having a conjugated diene content of more than 30% by weight and not more than 50% by weight, and (A2) a conjugated diene content of 10% by weight.
The styrene-conjugated diene block copolymer and (B) a polystyrene-based resin in an amount of at least 30% by weight and
(A1) is in the range of 10 to 90% by weight and (A2) is in the range of 90 to 10% by weight with respect to the total of (1) and (A2);
1), the total of (A1) and (A2) is 20 to 80% by weight based on the total of (A2) and (B), and (B) 80 to 20% by weight.
A resin composition which is contained in a proportion of% by weight.
物を用いたシート。3. A sheet using the resin composition according to claim 1 or 2.
包装容器。4. An electronic component packaging container using the sheet according to claim 3.
キャリアテープ。5. An embossed carrier tape using the sheet according to claim 3.
物を用いたインジェクショントレー。6. An injection tray using the resin composition according to claim 1 or 2.
物からなる電子部品包装容器を用いた電子部品包装体。7. An electronic component package using the electronic component packaging container made of the resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001139664A JP2002332392A (en) | 2001-05-10 | 2001-05-10 | Resin composition and sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001139664A JP2002332392A (en) | 2001-05-10 | 2001-05-10 | Resin composition and sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002332392A true JP2002332392A (en) | 2002-11-22 |
Family
ID=18986403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001139664A Pending JP2002332392A (en) | 2001-05-10 | 2001-05-10 | Resin composition and sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002332392A (en) |
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| JP2006232914A (en) * | 2005-02-23 | 2006-09-07 | Shin Etsu Polymer Co Ltd | Styrene-based resin sheet and embossed carrier tape |
| JP2007031660A (en) * | 2005-07-29 | 2007-02-08 | Dainippon Ink & Chem Inc | Styrene-based resin composition and styrene-based resin sheet and molded product using the same composition |
| WO2008023400A1 (en) * | 2006-08-21 | 2008-02-28 | Shin-Etsu Polymer Co., Ltd. | Styrenic resin sheet and embossed carrier tape |
| JP2009191187A (en) * | 2008-02-15 | 2009-08-27 | Asahi Kasei Chemicals Corp | Vinyl aromatic hydrocarbon-based resin sheet |
| JP2011001074A (en) * | 2009-06-17 | 2011-01-06 | Denki Kagaku Kogyo Kk | Carrier tape and manufacturing method of the same |
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| KR20130130712A (en) | 2010-10-07 | 2013-12-02 | 덴끼 가가꾸 고교 가부시키가이샤 | Styrene resin composition, and molded article thereof |
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| JP2006232914A (en) * | 2005-02-23 | 2006-09-07 | Shin Etsu Polymer Co Ltd | Styrene-based resin sheet and embossed carrier tape |
| JP4708048B2 (en) * | 2005-02-23 | 2011-06-22 | 信越ポリマー株式会社 | Styrenic resin sheet and embossed carrier tape |
| JP2007031660A (en) * | 2005-07-29 | 2007-02-08 | Dainippon Ink & Chem Inc | Styrene-based resin composition and styrene-based resin sheet and molded product using the same composition |
| WO2008023400A1 (en) * | 2006-08-21 | 2008-02-28 | Shin-Etsu Polymer Co., Ltd. | Styrenic resin sheet and embossed carrier tape |
| JP2009191187A (en) * | 2008-02-15 | 2009-08-27 | Asahi Kasei Chemicals Corp | Vinyl aromatic hydrocarbon-based resin sheet |
| JP2011001074A (en) * | 2009-06-17 | 2011-01-06 | Denki Kagaku Kogyo Kk | Carrier tape and manufacturing method of the same |
| KR20130130712A (en) | 2010-10-07 | 2013-12-02 | 덴끼 가가꾸 고교 가부시키가이샤 | Styrene resin composition, and molded article thereof |
| US9028938B2 (en) | 2010-10-07 | 2015-05-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Styrene resin composition, and molded article thereof |
| US10202506B2 (en) | 2010-10-07 | 2019-02-12 | Denka Company Limited | Electronic component packaging sheet, and formed article thereof |
| CN103338931A (en) * | 2011-01-17 | 2013-10-02 | 电气化学工业株式会社 | Multilayer styrenic resin sheet |
| WO2012099068A1 (en) | 2011-01-17 | 2012-07-26 | 電気化学工業株式会社 | Multilayer styrenic resin sheet |
| US9646863B2 (en) | 2011-01-17 | 2017-05-09 | Denka Company Limited | Multilayer styrenic resin sheet |
| KR20200110311A (en) | 2018-01-24 | 2020-09-23 | 덴카 주식회사 | Laminated sheet and electronic component packaging container molded using it |
| US11292233B2 (en) | 2018-01-24 | 2022-04-05 | Denka Company Limited | Laminated sheet and electronic component packaging container molded using same |
| KR20220005474A (en) | 2019-04-26 | 2022-01-13 | 덴카 주식회사 | Laminated sheet and electronic component packaging container and electronic component packaging body |
| US11701874B2 (en) | 2019-04-26 | 2023-07-18 | Denka Company Limited | Layered sheet, electronic component packaging container, and electronic component packaging |
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