JP2008519904A - 有機材料の気化を制御するための方法と装置 - Google Patents
有機材料の気化を制御するための方法と装置 Download PDFInfo
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- 239000011368 organic material Substances 0.000 title claims abstract description 181
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000009834 vaporization Methods 0.000 title claims description 54
- 230000008016 vaporization Effects 0.000 title claims description 53
- 238000010438 heat treatment Methods 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 230000008021 deposition Effects 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims description 57
- 230000008020 evaporation Effects 0.000 claims description 57
- 238000000151 deposition Methods 0.000 claims description 32
- 238000005303 weighing Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 48
- 238000000354 decomposition reaction Methods 0.000 description 9
- 239000012159 carrier gas Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000002716 delivery method Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
a)基板表面に堆積させるために気化した有機材料を通過させる少なくとも1つの開口部を有するマニホールドを用意し;
b)ある体積の有機材料を供給し、第1の状態では、その有機材料の蒸気圧が、基板に層を有効に形成するのに必要であるよりも低い値になるようにその有機材料の温度を維持し、第2の状態では、加熱されたその有機材料の蒸気圧が、層を形成するのに十分な大きさになるようにその有機材料の初期体積の一部を加熱する操作を含む方法によって達成される。
20 有機材料
30 第1の温度制御領域
40 加熱装置
50 第2の温度制御領域
60 計量・供給装置
70 照射線
80 マニホールドの壁部
100 装置
110 マニホールド
120 有機材料
130 加熱装置
140 中空部材
150 開口部
160 基板
170 方向
200 装置
210 マニホールド
220 開口部
230 計量・供給装置
240 加熱装置
250 バルブ
260 流路
270 装置
280 不活性ガス入口
285 バルブ
290 流路
295 バルブ
300 装置
310 リザーバ
330 可動部材
340 可動部材
350 装置
Claims (9)
- 気化した有機材料の基板表面への堆積を制御する方法であって、
a)基板表面に堆積させるために気化した有機材料を通過させる少なくとも1つの開口部を有するマニホールドを用意し;
b)ある体積の有機材料を供給し、第1の状態では、その有機材料の蒸気圧が、基板に層を有効に形成するのに必要であるよりも低い値になるようにその有機材料の温度を維持し、第2の状態では、加熱されたその有機材料の蒸気圧が、層を形成するのに十分な大きさになるようにその有機材料の初期体積の一部を加熱する操作を含む方法。 - 有機材料の初期体積の一部を加熱する上記操作に、照射線をその有機材料の露出面に当てる操作が含まれる、請求項1に記載の方法。
- 加熱装置をさらに用意し、第1の状態の間を通じ、その加熱装置を有機材料から離す、またはその加熱装置に印加する電位を低下させる、またはその両方を実施する、請求項1に記載の方法。
- 温度制御領域に透過性加熱素子を設置して有機材料の初期体積の一部を加熱し、その加熱した透過性加熱素子を用いてその透過性加熱素子に隣接する有機材料を気化させ、気化した有機材料をその透過性加熱素子を通過させて上記マニホールドの中に入れた後、そのマニホールドの開口部を通じて外に出す操作をさらに含む、請求項1に記載の方法。
- 上記有機材料が気化するのに合わせ、有機材料を計量して上記温度制御領域に供給する操作をさらに含む、請求項4に記載の方法。
- 蒸発源の中にある有機材料の気化を制御して基板表面に堆積させるための装置であって、
a)第1の温度制御領域において、有機材料を、その有機材料の気化温度よりも低い温度になるまで加熱するための第1の加熱手段と;
b)第2の温度制御領域においてその有機材料を気化温度よりも高温に加熱するための第2の加熱手段と;
c)有機材料を計量して第1の温度制御領域から第2の温度制御領域に供給することにより、その有機材料を気化させて基板表面に形成する手段と;
d)第2の温度制御領域に与える温度を制御する手段を備える装置。 - 上記温度制御手段が、第2の加熱装置を上記有機材料から離す手段、または第2の加熱装置によって上記有機材料に加える熱を減らす手段、またはその両方を備える、請求項6に記載の装置。
- 第2の加熱装置が透過可能な加熱素子を備える、請求項6に記載の装置。
- 第2の加熱装置が、第2の温度制御領域において照射線を有機材料の表面に当てる手段を備える、請求項6に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/984,095 US20060099344A1 (en) | 2004-11-09 | 2004-11-09 | Controlling the vaporization of organic material |
US10/984,095 | 2004-11-09 | ||
PCT/US2005/040539 WO2006053017A1 (en) | 2004-11-09 | 2005-11-09 | Method and apparatus for controlling the vaporization of organic material |
Publications (3)
Publication Number | Publication Date |
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JP2008519904A true JP2008519904A (ja) | 2008-06-12 |
JP2008519904A5 JP2008519904A5 (ja) | 2008-12-04 |
JP5144268B2 JP5144268B2 (ja) | 2013-02-13 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007540188A Active JP5144268B2 (ja) | 2004-11-09 | 2005-11-09 | 有機材料の気化を制御するための方法と装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20060099344A1 (ja) |
EP (1) | EP1834364B1 (ja) |
JP (1) | JP5144268B2 (ja) |
KR (1) | KR101172410B1 (ja) |
CN (1) | CN101057349B (ja) |
DE (1) | DE602005025695D1 (ja) |
TW (1) | TWI382099B (ja) |
WO (1) | WO2006053017A1 (ja) |
Cited By (1)
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US8425801B2 (en) | 2009-04-10 | 2013-04-23 | Idemitsu Kosan Co., Ltd. | Composite organic electroluminescent material and production method thereof |
Families Citing this family (5)
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US7989021B2 (en) * | 2005-07-27 | 2011-08-02 | Global Oled Technology Llc | Vaporizing material at a uniform rate |
JP5325471B2 (ja) * | 2007-07-06 | 2013-10-23 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
EP2330653A4 (en) * | 2008-09-24 | 2012-07-04 | Idemitsu Kosan Co | ORGANIC ELECTROLUMINESCENT COMPOSITE MATERIAL |
DE102010007111B4 (de) * | 2010-02-05 | 2012-02-16 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Pulvermischung zur Beschichtung von Substraten aus der Dampfphase |
CN104711514B (zh) * | 2015-04-07 | 2017-05-31 | 合肥京东方光电科技有限公司 | 一种成膜装置及方法 |
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2004
- 2004-11-09 US US10/984,095 patent/US20060099344A1/en not_active Abandoned
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2005
- 2005-11-08 TW TW094139065A patent/TWI382099B/zh active
- 2005-11-09 CN CN2005800383864A patent/CN101057349B/zh active Active
- 2005-11-09 WO PCT/US2005/040539 patent/WO2006053017A1/en active Application Filing
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JPH055894B2 (ja) * | 1983-03-24 | 1993-01-25 | Matsushita Electric Ind Co Ltd | |
JP2001291589A (ja) * | 2000-03-03 | 2001-10-19 | Eastman Kodak Co | 熱物理蒸着源 |
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JPN5007020076; S. V. Slyke: 'Linear source deposition of organic layers for full-color OLED' 2002 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS V33 / 2, 2002, P886-889, SID * |
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US8425801B2 (en) | 2009-04-10 | 2013-04-23 | Idemitsu Kosan Co., Ltd. | Composite organic electroluminescent material and production method thereof |
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KR20070074616A (ko) | 2007-07-12 |
TW200624577A (en) | 2006-07-16 |
US20100233367A1 (en) | 2010-09-16 |
CN101057349A (zh) | 2007-10-17 |
US20060099344A1 (en) | 2006-05-11 |
DE602005025695D1 (de) | 2011-02-10 |
KR101172410B1 (ko) | 2012-08-09 |
US8012537B2 (en) | 2011-09-06 |
TWI382099B (zh) | 2013-01-11 |
EP1834364A1 (en) | 2007-09-19 |
JP5144268B2 (ja) | 2013-02-13 |
CN101057349B (zh) | 2010-06-23 |
WO2006053017A1 (en) | 2006-05-18 |
EP1834364B1 (en) | 2010-12-29 |
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